CN216248700U

CN216248700U - Double-sided display

Info

Publication number: CN216248700U
Application number: CN202122876854.4U
Authority: CN
Inventors: 罗俊琴; 魏忠景; 叶伦峰; 刘进楠
Original assignee: Fujian Huajiacai Co Ltd
Current assignee: Fujian Huajiacai Co Ltd
Priority date: 2021-11-19
Filing date: 2021-11-19
Publication date: 2022-04-08
Anticipated expiration: 2031-11-19

Abstract

The utility model discloses a double-sided display, which comprises a glass substrate, wherein the upper surface of the glass substrate is provided with an ITO (indium tin oxide) thin film layer, the ITO thin film layer forms a transparent ITO etching circuit through an etching process, and a plurality of LED chips are bound on the upper surface of the glass substrate and are electrically connected with the transparent ITO etching circuit; an optical diaphragm is arranged on the upper surface of the LED chip and the lower surface of the glass substrate respectively, and a display panel is arranged on the outer side of the optical diaphragm. The ultrathin double-sided liquid crystal display can realize the functions of regional dimming and switching between the main screen and the auxiliary screen, and can be used for direct-type double-sided displays of various sizes.

Description

Double-sided display

Technical Field

The utility model relates to the technical field of displays, in particular to a double-sided display.

Background

The traditional thin film transistor liquid crystal (TFT-LCD) display needs an external light source to display, and the backlight sources on the market at present are single-sided light emitting, so that the display carried by the traditional TFT-LCD display only has a single-sided display function. With the development of society and the advancement of technology, the lcd with single-sided display function can not meet the requirements of industrial and commercial environments, and in some charging and office platforms, both sides of the lcd need to be able to see the screen displayed simultaneously, while the dual-sided display is the current development direction. However, most of the existing double-sided display devices realize the double-sided display function by assembling two independent displays back to back, and the double-sided display adopts two backlight modules, so that the double-sided display is just the combination of two liquid crystal display modules in thickness, and the problem of overlarge thickness exists in the matching process, and the requirements of industrial and commercial users cannot be met.

Disclosure of Invention

The utility model aims to provide a double-sided display.

The technical scheme adopted by the utility model is as follows:

a double-sided display comprises a glass substrate, wherein an ITO thin film layer is arranged on the upper surface of the glass substrate and forms a transparent ITO etching circuit through an etching process, and a plurality of LED chips are bound on the upper surface of the glass substrate and are electrically connected with the transparent ITO etching circuit; an optical diaphragm is arranged on the upper surface of the LED chip and the lower surface of the glass substrate respectively, and a display panel is arranged on the outer side of the optical diaphragm.

Furthermore, the optical film comprises an upper light intensifying sheet, a lower light intensifying sheet, a diffusion sheet, an upper light splitting sheet and a lower light splitting sheet which are sequentially arranged from outside to inside.

Further, the flip LED bare chip is directly bonded on the glass substrate.

Further, an ITO thin film layer is formed on the glass substrate by a sputtering process.

Further, the ITO thin film layer is formed on the glass substrate by a spray coating process.

Further, connection electrodes are provided at both ends of the glass substrate.

Further, it still includes the center, and the center is equipped with the mounting groove corresponding glass substrate and display panel, and glass substrate and display panel both ends are spacing to be installed in the mounting groove.

Further, the glass substrate and the display panel are installed in the installation groove of the middle frame through the foam pad.

Furthermore, the display panel further comprises a front frame, the front frame is sleeved on the upper surface and the lower surface of the middle frame, and the front frame wraps the side edge of the display panel and the outer side of the middle frame so as to relatively fix the display panel and the middle frame.

According to the technical scheme, the LED chips are directly bound on the glass substrate to form the glass lamp panel with the LED arrangement, and the transparent ITO etching circuit is used on the substrate. The front and back surfaces of the glass can emit light by utilizing the 360-degree light emitting characteristic of the LED chip, and the front and back surfaces of the glass are matched with the upper optical film to obtain a double-sided light emitting backlight source. And fixing the glass lamp panel and the optical diaphragm on a structural middle frame (made of metal material), and matching two panels on the double-sided backlight source to obtain the ultrathin double-sided liquid crystal display. The circuit controls the LED to drive and dim light, and the ultrathin double-sided liquid crystal display can realize the functions of local dimming and switching between a main screen and an auxiliary screen.

Drawings

The utility model is described in further detail below with reference to the accompanying drawings and the detailed description;

FIG. 1 is a schematic diagram of a dual-sided light emission display according to the present invention;

fig. 2 is a schematic structural diagram of a dual-sided display according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

As shown in fig. 1 or 2, the utility model discloses a double-sided display, which comprises a glass substrate 1, wherein an ITO thin film layer is arranged on the upper surface of the glass substrate 1, a transparent ITO etching circuit is formed on the ITO thin film layer through an etching process, and a plurality of LED chips 2 are bound on the upper surface of the glass substrate 1 and electrically connected with the transparent ITO etching circuit; an optical film 3 is respectively arranged on the upper surface of the LED chip 2 and the lower surface of the glass substrate 1, and a display panel 4 is arranged on the outer side of the optical film 3.

Specifically, because the glass substrate 1 is adopted, the LED chip really realizes 360-degree light emitting, and the light emitting effect is greatly improved.

The material adopts ITO (indium tin oxide) which has excellent electrical conduction and optical transparency, and is widely applied as a transparent conductive coating. In addition, the resistivity of the ITO material is far greater than that of metals such as copper, so that the ITO material can be directly deposited on the circuit layer to form a resistor, a resistor element does not need to be welded, and the consistency and the stability of the resistor element are ensured.

Further, the optical film 3 includes an upper light intensifying sheet 5, a lower light intensifying sheet 6, a diffusion sheet 7, an upper light splitting sheet 8 and a lower light splitting sheet 9, which are sequentially arranged from outside to inside.

Further, the flip LED bare chip is directly bonded to the glass substrate 1.

Further, an ITO thin film layer is formed on the glass substrate 1 by a sputtering process.

Further, an ITO thin film layer is formed on the glass substrate 1 by a spray coating process.

Further, connection electrodes are provided at both ends of the glass substrate 1.

Further, it still includes center 10, and center 10 corresponds glass substrate 1 and display panel 4 and is equipped with mounting groove 11, and glass substrate 1 and display panel 4 both ends are spacing to be installed in mounting groove 11.

Further, the glass substrate 1 and the display panel 4 are mounted in the mounting groove 11 of the middle frame 10 through the foam pad 13.

Further, the display panel further comprises a front frame 12, the front frame 12 is sleeved on the upper surface and the lower surface of the middle frame 10, and the front frame 12 wraps the side edge of the display panel 4 and the outer side of the middle frame 10 so as to relatively fix the display panel 4 and the middle frame 10.

According to the technical scheme, the LED chip 2 is directly bound on the glass substrate 1 to form the glass lamp panel with the LED arrangement, and the transparent ITO etching circuit is used on the substrate. The characteristic that the LED chip 2360 degrees is luminous is utilized, so that the front side and the back side of the glass can both emit light, and the front side and the back side of the glass are matched with the upper optical film 3 to obtain a double-sided luminous backlight source. Then, the glass lamp panel and the optical diaphragm 3 are fixed on a structural middle frame 10 (made of metal material), and two panels are matched on the double-sided backlight source, so that the ultrathin double-sided liquid crystal display is obtained. The circuit controls the LED to drive and dim light, and the ultrathin double-sided liquid crystal display can realize the functions of local dimming and switching between a main screen and an auxiliary screen. The utility model can realize the ultrathin double-sided display effect, reduces the thickness of one LED lamp bead and the number of half LED lamp beads compared with the direct type single PCB substrate front and back double-sided SMD packaging LED lamp beads, and can reduce the thickness of one light guide plate compared with a side-in type double-sided display with two light guide plates.

It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. The embodiments and features of the embodiments in the present application may be combined with each other without conflict. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the detailed description of the embodiments of the present application is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Claims

1. A dual-sided display, characterized by: the LED chip comprises a glass substrate, wherein an ITO thin film layer is arranged on the upper surface of the glass substrate and forms a transparent ITO etching circuit through an etching process, and a plurality of LED chips are bound on the upper surface of the glass substrate and are electrically connected with the transparent ITO etching circuit; an optical diaphragm is arranged on the upper surface of the LED chip and the lower surface of the glass substrate respectively, and a display panel is arranged on the outer side of the optical diaphragm.

2. A dual sided display as claimed in claim 1, wherein: the optical film comprises an upper light increasing sheet, a lower light increasing sheet, a diffusion sheet, an upper light splitting sheet and a lower light splitting sheet which are sequentially arranged from outside to inside.

3. A dual sided display as claimed in claim 1, wherein: the LED bare chip is directly bonded on the glass substrate by adopting a flip chip.

4. A dual sided display as claimed in claim 1, wherein: the ITO thin film layer is formed on the glass substrate through a sputtering process.

5. A dual sided display as claimed in claim 1, wherein: the ITO thin film layer is formed on the glass substrate through a spraying process.

6. A dual sided display as claimed in claim 1, wherein: the two ends of the glass substrate are provided with connecting electrodes and are connected with the main board circuit through the connecting electrodes.

7. A dual sided display as claimed in claim 1, wherein: the glass substrate and the display panel are installed in the installation grooves in a limiting mode.

8. A dual sided display as claimed in claim 7, wherein: the glass substrate and the display panel are installed in the installation groove of the middle frame through the foam pad.

9. A dual sided display as claimed in claim 7, wherein: the display panel further comprises a front frame, the front frame is sleeved on the upper surface and the lower surface of the middle frame, and the side edge of the display panel and the outer side of the middle frame are wrapped by the front frame part so as to relatively fix the display panel and the middle frame.