CN216118654U - HTPC case with efficient heat dissipation function - Google Patents

Abstract

The utility model relates to the technical field of chassis heat dissipation, and discloses an HTPC chassis with high-efficiency heat dissipation, which comprises a chassis body, wherein an installation space for installing electronic elements is arranged in the chassis body; through set up heat abstractor in the box, support the heat dissipation fan by the PCI support for form an air exhaust space between heat dissipation fan and the louvre, and then improve the efficiency of taking a breath, promote the radiating effect, improve user's use impression, reduce the potential safety hazard.

Description

HTPC case with efficient heat dissipation function

Technical Field

The utility model relates to the technical field of case heat dissipation, in particular to an HTPC case with high-efficiency heat dissipation.

Background

With the popularization of 5G, more intelligent devices enter thousands of households, and the intelligent devices are generally provided with a processor and a mainboard and are operated through program setting, so that the purpose of interconnection of everything is achieved. Present intelligent equipment for example intelligent audio amplifier, domestic equipment such as intelligent STB adopt HTPC machine case to assemble mostly, and present HTPC machine case reaches the volume less, so can set up the louvre on the surface of the machine case to the heat dissipation, but general radiating effect is not obvious, piles up when the heat and come the circumstances such as cause treater crash or mainboard burn out easily when not in time dissipating heat, influences the use and has great potential safety hazard simultaneously, consequently needs to improve.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide an HTPC case capable of efficiently dissipating heat, and aims to improve the heat dissipation capability of the HTPC case, enhance the heat dissipation effect and reduce potential safety hazards.

In order to achieve the purpose, the utility model provides an HTPC case with high-efficiency heat dissipation, which comprises a case body, wherein an installation space for installing electronic components is arranged in the case body, heat dissipation holes communicated with the installation space are formed in the case body, a heat dissipation device is arranged on one side, close to the heat dissipation holes, of the installation space, the heat dissipation device comprises a heat dissipation fan and a PCI support, the PCI support is arranged between the heat dissipation fan and the heat dissipation holes, the PCI support is provided with a heat dissipation groove with an upward opening, a plurality of heat dissipation holes communicated with the heat dissipation holes are formed in the heat dissipation groove, and the heat dissipation fan is arranged above the heat dissipation groove.

Specifically, the radiating groove is the rectangle form, and the top of radiating groove is equipped with a plurality of installation pieces, and the edge of radiating groove is located to the installation piece equipartition, and installation piece department is equipped with the mounting hole, and the heat dissipation fan passes through the mounting hole and fixes and locate the radiating groove top.

Specifically, the quantity of installation piece is four, and the installation piece orientation set up in the radiating groove, the installation piece forms with the radiating groove is integrative.

Specifically, one side of PCI support be equipped with be used for with the fixed stationary blade of box, stationary blade department is equipped with the fixed orifices, and the PCI support passes through the stationary blade and can dismantle with the box and be connected.

Specifically, one side of PCI support be equipped with be used for with the inserted sheet of box grafting, the tip of inserted sheet is equipped with the plug, the PCI support passes through the inserted sheet and can dismantle with the box and be connected.

Specifically, the PCI bracket is made of a metal material.

Specifically, the heat dissipation holes are honeycomb-shaped, and the heat dissipation holes are waist-shaped holes.

Specifically, the box includes U type case portion, and U type case portion is equipped with the ascending assembly opening of an opening, and the top of U type case portion is equipped with one and closes the apron with the assembly opening lid, and the apron can be dismantled with U type case portion and be connected the formation installation space.

Specifically, apron department equipartition is equipped with a plurality of ventilation holes, the ventilation hole with installation space intercommunication.

Specifically, the box body is made of a metal material.

According to the technical scheme, the heat dissipation device is arranged in the box body, and the heat dissipation fan is supported by the PCI support, so that an air exhaust space is formed between the heat dissipation fan and the heat dissipation holes, the air exchange efficiency is improved, the heat dissipation effect is improved, the use experience of a user is improved, and the potential safety hazard is reduced.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic diagram of a partial explosion state of the present invention.

FIG. 3 is a diagram of a PCI rack of the present invention.

FIG. 4 is a second schematic diagram of a PCI rack of the present invention.

The reference numerals include: 10. a box body; a U-shaped box section; 12. a cover plate; 13. a vent hole; 14. heat dissipation holes; 20. a heat dissipation fan; a PCI rack; 31. a heat sink; 32. a heat dissipation port; 33. mounting blocks; 34. mounting holes; 35. a fixing sheet; 36. a fixing hole; 37. inserting sheets; 38. and (4) a plug.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that if directional indications (such as … …, which is up, down, left, right, front, back, top, bottom, inner, outer, vertical, transverse, longitudinal, counterclockwise, clockwise, circumferential, radial, axial) are provided in the embodiments of the present invention, the directional indications are only used for explaining the relative position relationship, motion condition, etc. of the components at a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first" or "second", etc. in the embodiments of the present invention, the description of "first" or "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

As shown in fig. 1 to 4, an HTPC case with high heat dissipation efficiency includes a case body 10, a mounting space for mounting electronic components is provided in the case body 10, heat dissipation holes 14 communicated with the mounting space are provided at the case body, a heat dissipation device is provided at one side of the mounting space close to the heat dissipation holes 14, the heat dissipation device includes a heat dissipation fan 20 and a PCI bracket 30, the PCI bracket 30 is provided between the heat dissipation fan 20 and the heat dissipation holes 14, the PCI bracket 30 is provided with a heat dissipation groove 31 with an upward opening, a plurality of heat dissipation ports 32 communicated with the heat dissipation holes 14 are provided in the heat dissipation groove 31, and the heat dissipation fan 20 is provided above the heat dissipation groove 31. Through set up heat abstractor in installation space, constitute heat abstractor by PCI support 30 and heat dissipation fan 20 and dispel the heat to box 10, support heat dissipation fan 20 through PCI support 30 for form an air exhaust space between heat dissipation fan 20 and the PCI support 30, form pressure differential by the air exhaust space, drive the interior gas of installation space toward 14 directions fast movements of louvre, and then realize high-efficient heat dissipation, promote the radiating effect, improve user's use impression, reduce the potential safety hazard.

The heat dissipation groove 31 is rectangular, a plurality of mounting blocks 33 are arranged above the heat dissipation groove 31, the mounting blocks 33 are uniformly distributed at the corners of the heat dissipation groove 31, mounting holes 34 are formed in the mounting blocks 33, and the heat dissipation fan 20 is fixedly arranged above the heat dissipation groove 31 through the mounting holes 34; the number of the mounting blocks 33 is four, the mounting blocks 33 are disposed toward the heat dissipation groove 31, and the mounting blocks 33 are formed integrally with the heat dissipation groove 31. In this embodiment, the PCI bracket 30 is rectangular so as to adapt to the heat dissipation fan 20 produced under the common process, and when assembling, the heat dissipation fan 20 is fixed at the mounting hole 34 of the mounting block 33 by the fixing screw, so that the heat dissipation fan 20 is disposed right above the heat dissipation slot 31, and an air exhaust space is formed between the heat dissipation fan 20 and the heat dissipation slot 31, so as to facilitate installation and improve heat dissipation efficiency.

One side of the PCI support 30 is provided with a fixing sheet 35 used for being fixed with the box body 10, a fixing hole 36 is arranged at the position of the fixing sheet 35, and the PCI support 30 is detachably connected with the box body 10 through the fixing sheet 35; one side of the PCI bracket 30 is provided with an insert 37 for inserting with the box 10, the end of the insert 37 is provided with a plug 38, and the PCI bracket 30 is detachably connected with the box 10 through the insert 37. By arranging the fixing sheet 35 and the inserting sheet 37 at the PCI bracket 30, the PCI bracket 30 is connected with the box body 10 through the fixing hole 36 and the plug 38, and the separation of the PCI bracket 30 from the box body 10 is also facilitated.

The PCI bracket 30 is made of metal material; the heat dissipation holes 14 are honeycomb-shaped, and the heat dissipation openings 32 are waist-shaped holes. Adopt metallic aluminum to make PCI support 30 in this embodiment to improve PCI support 30's intensity, thereby improve PCI support 30's life, in addition, also can use high temperature resistant plastics material to make PCI support 30, with reduction in production cost, simultaneously, set heat dissipation hole 14 into honeycomb, set heat dissipation hole 14 into waist type poroid and be favorable to improving the radiating effect, also can carry out other design according to the demand to the shape of heat dissipation hole 14 and thermovent 32 in addition.

The box body 10 comprises a U-shaped box part 11, the U-shaped box part 11 is provided with an assembly opening with an upward opening, a cover plate 12 covered with the assembly opening is arranged above the U-shaped box part 11, and the cover plate 12 and the U-shaped box part 11 are detachably connected to form an installation space. Can dismantle the connection through apron 12 and U type box portion 11 to in electronic components such as mainboard, treater put installation space by the assembly opening, closed the assembly opening lid by apron 12 again, so that protect the electronic components in the installation space, improve electronic components's life.

A plurality of vent holes 13 are uniformly distributed at the position of the cover plate 12, and the vent holes 13 are communicated with the installation space. By providing the plurality of vent holes 13 at the cover plate 12, external cool air can enter the installation space through the vent holes, further improving heat dissipation efficiency.

The case 10 is made of a metal material. In the embodiment, the box body 10 is made of iron alloy, so that the overall strength of the box body 10 is improved, and the service life of the box body 10 is prolonged; in addition, the box body 10 can be made of other metal materials, and the box body 10 can be made of plastic materials, so that the production cost is reduced.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the technical solutions of the present invention, which are made by using the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. The utility model provides a high-efficient radiating HTPC machine case, a serial communication port, including the box, be equipped with the installation space that is used for installing electronic component in the box, quick-witted case department is equipped with the louvre with the installation space intercommunication, one side that installation space is close to the louvre is equipped with heat abstractor, heat abstractor includes heat dissipation fan and PCI support, the PCI support is located between heat dissipation fan and the louvre, the PCI support is equipped with the ascending radiating groove of an opening, be equipped with a plurality of and the communicating thermovents of louvre in the radiating groove, the radiating fan is located the radiating groove top.

2. The HTPC case with high heat dissipation efficiency as recited in claim 1, wherein the heat sink is rectangular, a plurality of mounting blocks are disposed above the heat sink, the mounting blocks are uniformly disposed at corners of the heat sink, mounting holes are disposed at the mounting blocks, and the heat dissipation fan is fixedly disposed above the heat sink through the mounting holes.

3. An HTPC case with high heat dissipation efficiency as recited in claim 2, wherein the number of the mounting blocks is four, the mounting blocks are arranged towards the heat dissipation groove, and the mounting blocks are integrated with the heat dissipation groove.

4. The HTPC case with high heat dissipation efficiency as recited in claim 1, wherein a fixing plate for fixing with the case body is provided at one side of the PCI support, a fixing hole is provided at the fixing plate, and the PCI support is detachably connected with the case body through the fixing plate.

5. The HTPC case with the efficient heat dissipation function as claimed in claim 1, wherein a plug for plugging with the case body is arranged on one side of the PCI support, a plug is arranged at the end of the plug, and the PCI support is detachably connected with the case body through the plug.

6. The HTPC case with high heat dissipation efficiency as recited in claim 1, wherein said PCI frame is made of metal.

7. The HTPC case according to claim 1, wherein the heat dissipation holes are honeycomb-shaped, and the heat dissipation openings are waist-shaped holes.

8. The HTPC case with high heat dissipation efficiency as recited in claim 1, wherein the case body comprises a U-shaped case portion, the U-shaped case portion is provided with a mounting opening with an upward opening, a cover plate covering the mounting opening is arranged above the U-shaped case portion, and the cover plate is detachably connected with the U-shaped case portion to form the mounting space.

9. An HTPC case with high heat dissipation efficiency as recited in claim 8, wherein a plurality of vent holes are uniformly distributed on the cover plate, and the vent holes are communicated with the installation space.

10. An efficient heat dissipating HTPC case according to claim 1, wherein the case is made of a metallic material.

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