CN215991354U - Printed circuit board and electronic product - Google Patents
Printed circuit board and electronic product Download PDFInfo
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- CN215991354U CN215991354U CN202121459025.XU CN202121459025U CN215991354U CN 215991354 U CN215991354 U CN 215991354U CN 202121459025 U CN202121459025 U CN 202121459025U CN 215991354 U CN215991354 U CN 215991354U
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Abstract
The disclosure relates to the technical field of electronic products, in particular to a printed circuit board and an electronic product. A printed circuit board comprising: the multilayer circuit board is sequentially stacked; at least one buried hole opened in the multilayer circuit board; the blind hole is arranged on the multilayer circuit board, and the projection of the blind hole on the circuit board plane and the projection of the buried hole on the circuit board plane are at least partially overlapped. The printed circuit board reduces occupation of a circuit board space, improves design flexibility and is beneficial to miniaturization design.
Description
Technical Field
The disclosure relates to the technical field of electronic products, in particular to a printed circuit board and an electronic product.
Background
In the field of electronic products, along with the trend that products are gradually miniaturized, High in performance, safe and reliable, higher requirements are also put forward on Printed Circuit Board (PCB) boards of electronic products, and thus a new High Density Interconnection (HDI) technology is widely applied to various electronic products.
For the multi-stage HDI plate, laser holes are formed by utilizing a laser technology after multiple times of lamination, the process is complex, the processing difficulty is high, and the yield is low.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem that a multi-stage HDI board in the related art is complex in process, the disclosed embodiment provides a printed circuit board and an electronic product.
In a first aspect, the disclosed embodiments provide a printed circuit board, including:
the multilayer circuit board is sequentially stacked;
at least one buried hole opened in the multilayer circuit board;
the blind hole is arranged on the multilayer circuit board, and the projection of the blind hole on the circuit board plane and the projection of the buried hole on the circuit board plane are at least partially overlapped.
In some embodiments, the buried via is a mechanical drill and the blind via is a laser via.
In some embodiments, the multilayer wiring board includes a core board located in a middle layer, middle layer boards sequentially stacked on both sides of the core board, and outer layer boards located in outer layers of the middle layer boards;
the buried hole is formed in the middle layer plate, and the blind hole is formed in the outer layer plate.
In some embodiments, an insulating layer is disposed between two adjacent circuit boards in the multilayer circuit board.
In some embodiments, the printed circuit board further comprises:
at least one through hole, the through hole penetrates through the multilayer circuit board.
In some embodiments, the at least one blind hole comprises a first blind hole and a second blind hole;
the first blind hole penetrates through the outermost layer circuit board of the multilayer circuit board and is used for connecting the outermost layer circuit board and the secondary outer layer circuit board;
and the second blind hole penetrates through the secondary outer layer circuit board and is used for connecting the secondary outer layer circuit board and the third layer circuit board.
In some embodiments, a projection of the first blind hole on the circuit board plane at least partially coincides with a projection of the second blind hole on the circuit board plane.
In some embodiments, a projection of the first blind hole on the circuit board plane, a projection of the second blind hole on the circuit board plane, and a projection of the buried via on the circuit board plane at least partially coincide.
In some embodiments, the multilayer wiring board comprises at least 12 layers of wiring boards.
In a second aspect, the embodiments of the present disclosure provide an electronic product, which includes the printed circuit board according to any one of the embodiments of the first aspect.
The printed circuit board of the embodiment of the disclosure comprises a circuit board with a plurality of layers arranged in a stacked mode, at least one buried hole formed in the multilayer circuit board and at least one blind hole formed in the multilayer circuit board, wherein the projection of the blind hole on the plane of the circuit board is at least partially overlapped with the buried hole. In the embodiment of the disclosure, the blind holes in the outer layer and the buried holes in the middle layer are overlapped, so that the blind holes and the buried holes occupy the design space in the horizontal direction, and the flexibility of the design of the circuit board is improved. In addition, the blind holes and the buried holes are arranged in an overlapped mode, arrangement of connecting signal lines is reduced, occupied space of wiring on a circuit board is further reduced, and signal transmission quality is improved.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic cross-sectional view of a printed circuit board according to the related art.
Fig. 2 is a schematic cross-sectional view of a printed circuit board according to some embodiments of the present disclosure.
Description of reference numerals:
101-a first layer of wiring board; 102-a second layer of wiring board; 103-a third layer of circuit board; 110-a core board; 120-middle layer plate; 130-outer laminates; 210-a via; 221-a first blind hole; 222-a second blind hole; 230-buried via.
Detailed Description
The technical solutions of the present disclosure will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only some embodiments of the present disclosure, but not all embodiments. All other embodiments, which can be derived by one of ordinary skill in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure. In addition, technical features involved in different embodiments of the present disclosure described below may be combined with each other as long as they do not conflict with each other.
HDI (High Density interconnect) Circuit boards are the most advanced manufacturing process in the field of manufacturing PCB (Printed Circuit Board) boards. The high density of the HDI board depends on the micro via holes connected between layers, particularly for a multilayer and multi-order HDI board, the design of the laminated and multi-order HDI board is complex, and the wiring on the circuit board must be connected with the circuits of all layers through the micro via holes, so the micro via hole technology is one of the key technologies for manufacturing the HDI board.
The micro via hole of the HDI board mainly comprises a through hole, a buried hole and a blind hole. As shown in fig. 1, fig. 1 shows a cross-sectional view of a 2+2+2 6-layer two-step HDI board, in which a plurality of circuit layers 10 are sequentially stacked and laminated, and an insulating layer, such as PP (high polymer polypropylene), is disposed between two adjacent circuit layers 10 for insulation.
As shown in fig. 1, the micro via of the HDI board includes a through hole 21, a buried hole 22, and a blind hole 23. The through holes 21 are mechanical holes penetrating through all the circuit layers 10, and can be formed by drilling with a mechanical drill after all the circuit layers 10 are laminated, and the through holes 21 can be connected with 1-6 circuit layers. The buried holes 22 are mechanical holes penetrating through 2-5 layers of circuit boards, the mechanical holes can be drilled and formed by a mechanical drill after the 2-5 layers of circuit boards are pressed, 1-6 layers of circuit boards are pressed after the buried holes are formed, and the buried holes 22 can be connected with the 2-5 layers of circuit boards in the inner layer.
The blind holes 23 are laser holes connecting the outer layer to the inner layer, for example, in the example of fig. 1, the blind holes 23 are formed in the outermost layer (1, 6 layers) and the secondary outer layer (2, 5 layers), when the blind holes are processed, 2-5 circuit layers can be firstly pressed, and then the blind holes 23 are formed in the secondary outer layer (2, 5 layers) by using a laser hole forming technology, so that 2-3, 4-5 circuit layers can be connected. And then, laminating the outermost (1, 6) circuit layers, and then, forming blind holes 23 in the outermost (1, 6) layers by using a laser drilling technology, so that 1-2, 5-6 circuit layers can be connected. It can be seen that in the example of fig. 1, the laser holes are formed twice in the co-press, so that the HDI board in the example of fig. 1 is a 2-step HDI board. By analogy, 3-order and 4-order HDI plates can be provided.
For a high-density PCB design scene, because many fan-out wires are arranged on the PCB and the through holes cannot meet the requirements, the layout of the wires needs to be realized by using the blind holes 23 (laser holes) and the buried holes 22 (mechanical holes). Moreover, for a complex PCB design scenario, the number of layers and the order of the HDI board are also greater, for example, the number of layers can reach more than 12, and the order can reach 4, 5, or even any order.
For high-order or any-order HDI board design, for example, any-order HDI boards with more than 12 layers, the production difficulty is high due to the fact that multiple times of pressing and via hole electroplating are needed, and the yield of the HDI board is low. In addition, as shown in fig. 1, in the HDI board in the prior art, the blind holes 23 and the mechanical buried holes 22 are arranged in a staggered manner, so that the design space of a circuit layer is occupied, and the design difficulty of the high-density HDI board is improved.
Based on the defects, the embodiment of the disclosure provides a printed circuit board and an electronic product with the printed circuit board, aiming at optimizing the design of an HDI board, reducing the design difficulty and realizing the miniaturization design of the PCB board.
In a first aspect, the disclosed embodiments provide a printed circuit board, which may be a PCB board for an electronic device, such as a motherboard of a smart phone, a motherboard of a tablet computer, a motherboard of a computing power box, and so on, which are not enumerated in this disclosure.
In some embodiments, a printed circuit board of an example of the present disclosure includes a multilayer wiring board, which is sequentially stacked. Specifically, in the process of processing the printed circuit board, a multilayer circuit board, an insulating layer, an ink layer and other layer structures are laminated and molded. For the specific processing technology and flow of the PCB, those skilled in the art can refer to the related technology, and the details of the disclosure are not repeated.
The printed circuit board of the disclosed embodiment comprises at least one buried hole and at least one blind hole which are arranged on the multilayer circuit board. In some embodiments, the buried via may be a mechanical via machined using a mechanical via forming process and the blind via may be a laser via machined using a laser via forming process.
In the disclosed example, the blind hole and the buried hole are designed in a stacked hole manner, that is, the projection of the blind hole on the plane of the circuit board and the projection of the buried hole on the plane of the circuit board are partially or completely overlapped. It can be understood that the circuit board is in a plate-shaped structure, the plane of the circuit board refers to the plane of the plate-shaped structure, the projection of the blind hole and the buried hole on the plane also means the opening position of the hole, and when the projection of the blind hole and the buried hole on the plane of the circuit board are completely overlapped, the coaxial opening of the blind hole and the buried hole is indicated, that is, the hole is overlapped. The present disclosure will be specifically explained in the following embodiments, and will not be described in detail here.
According to the HDI board, the buried holes and the blind holes are overlapped, the buried holes are mechanical holes, the processing technology is simple, the cost is low, and the yield is high, so that the buried holes can be adopted to connect all circuit layers of the inner layer, and the production cost is reduced compared with HDI boards of any order. At the same time. The buried holes and the blind holes are arranged in a hole overlapping mode, so that the occupied space of the circuit board is reduced, the flexibility of wiring design of the circuit board is improved, and the miniaturization design of the PCB is realized.
Fig. 2 illustrates some embodiments of the printed circuit board of the present disclosure, which are described below in conjunction with fig. 2.
In some embodiments, as shown in fig. 2, the printed circuit board comprises multiple layers of circuit boards, which are stacked and pressed together in sequence. For example, two adjacent layers of circuit boards are bonded and pressed together by insulating glue, and the insulating glue between the two layers of circuit boards forms an insulating layer. In one example, the insulating layer may be an anisotropic glue layer.
In the example of fig. 2, the printed circuit board is a 16-layer 2-step HDI board, and the 16-layer printed circuit board can be divided into a core board 110, a middle layer board 120 and an outer layer board 130 from inside to outside. It is understood that the printed circuit board of the present disclosure is a symmetrical double-sided PCB board, and thus only one side of the symmetrical structure is taken as an example for illustration.
In this example, the core board 110 is a double-sided board, and the middle layer boards 120 are respectively laminated and disposed on two sides of the core board 110. The core board 110 includes two layers of circuit boards, and the thickness of the insulating layer between the two layers of circuit boards may be greater than that of other insulating layers, thereby facilitating the symmetrical structural boundary of the PCB board.
The core plate 110 has two intermediate layer plates 120 on two sides, each intermediate layer plate 120 includes 5 layers of circuit boards laminated together, the outer layer plate 130 includes two layers of circuit boards laminated together, and the two outer layer plates 130 are respectively laminated outside the two intermediate layer plates 120.
In some embodiments, the printed circuit board defines at least one through hole. For example, in the example of fig. 2, the multilayer printed circuit board is provided with a through hole 210, and the through hole 210 penetrates from one side of the printed circuit board to the other side, that is, completely penetrates through the printed circuit board.
In the disclosed embodiment, the printed circuit board further includes a buried via 230. For example, in the example of fig. 2, buried via 230 extends through intermediate layer plate 120 and core plate 110. The buried via 230 is a mechanical drilled via, and when the buried via 230 is processed, the intermediate layer board 120 and the chip 110 may be first pressed together, then the buried via 230 is opened by using a mechanical drilling process, and then the outer layer board 130 is pressed together. Vias 230 may connect the interlayer board 120 to the various layers of the circuit board of the chip 110.
It should be noted that the printed circuit board according to the embodiment of the present disclosure is a 2-step HDI board, that is, the laser holes are formed in a pressing manner twice. Specifically, after the interlayer board 120 and the chip 110 are laminated, the second layer circuit board 102 is firstly laminated on the outer side of the interlayer board 120 (i.e. the third layer circuit board 103), and then the second blind via 222 is formed on the second layer circuit board 102 by using a laser hole forming technique, wherein the second blind via 222 can connect the second layer circuit board 102 and the third layer circuit board 103. And then, pressing the first layer of circuit board 101 on the outer side of the second layer of circuit board 102, and then opening a first blind hole 221 on the first layer of circuit board 101 by using a laser hole forming technology, wherein the first blind hole 221 can connect the first layer of circuit board 101 and the second layer of circuit board 102.
As shown in fig. 2, in the present example, the first blind hole 221 and the second blind hole 222 are arranged in a stacked manner, that is, a projection of the first blind hole 221 on the circuit board plane at least partially coincides with a projection of the second blind hole 222 on the circuit board plane. The design of folding the hole can reduce the space occupation of blind hole on two-layer circuit board, improves the flexibility of HDI design.
It is worth mentioning that, in the hole folding design, laser drilling and electroplating need to be carried out on the blind hole position during production, and the problem of hole position correction also needs to be solved, and in the circuit board pressing process, the problems of electroplating fracture, board explosion and the like easily occur on the hole folding position, which results in the HDI board being scrapped. Especially for multilayer HDI boards of any order, if multilayer circuit boards all adopt the design of blind hole pile hole, the production degree of difficulty is very big, and the yields is extremely low, and prior art can only realize the board of any order of 12 layers at most at present.
In the embodiment of the present disclosure, as shown in fig. 2, the first blind hole 221, the second blind hole 222, and the buried hole 230 are designed by overlapping holes, that is, the projection of the first blind hole 221 on the circuit board plane, the projection of the second blind hole 222 on the circuit board plane, and the projection of the buried hole 230 on the circuit board plane are all overlapped.
In combination with the foregoing, the buried via 230 can connect the middle layer board 120 and each layer of the core board 110, the second blind via 222 can connect the second layer board 102 and the third layer board 103, and the first blind via 221 can connect the first layer board 101 and the second layer board 102. After the three are designed to be overlapped, the blind holes and the buried holes can be connected with each layer of circuit board, namely, the blind holes and the buried holes are designed to be overlapped to realize the connection of the outer layer circuit board and the inner layer circuit board.
For example, if the 16-layer HDI board illustrated in fig. 2 adopts an arbitrary step-and-stack hole design, when the HDI board is generated, blind holes of each layer need to be subjected to laser drilling, electroplating, pressing, positioning, and laser drilling … …, which easily causes electroplating fracture in the holes, and board explosion occurs, so that the 16-layer high-density HDI processing cannot be completed.
In the example shown in fig. 2, when the HDI board is processed, the intermediate layer board 120 and the core board 110 only need to be firstly laminated once, then the buried via 230 is opened once by using a mechanical drilling process, and then the HDI board with the 16-layer 2-step stacked via structure can be obtained by adopting a process of laminating laser drilling twice. The processing technology is greatly simplified, the processing complexity is reduced, and the yield is improved. And the mechanical drilling cost is lower than that of laser hole forming, so that the processing cost is greatly reduced. Meanwhile, the overlapped hole design of the buried hole and the blind hole also reduces the space occupation of the circuit board, improves the design flexibility, and realizes the miniaturization design of the PCB for example.
It is understood that the embodiment of fig. 2 is only an example of the printed circuit board of the present disclosure, and in other embodiments, the printed circuit board of the present disclosure may also have a circuit board structure with other numbers of layers or orders, for example, the printed circuit board of the embodiment of the present disclosure may implement a circuit board structure with at least 12 layers and multiple levels, which is not limited by the present disclosure.
The printed circuit board structure and the principle of the embodiments of the present disclosure are described above, and for the parts which are not described in detail, such as the processing flow of the PCB, etc., those skilled in the art can understand and fully implement the method by referring to the related technologies, and the detailed description of the present disclosure is not needed.
In a second aspect, the disclosed embodiments provide an electronic product, which includes the printed circuit board described above.
In particular, the electronic product of the embodiments of the present disclosure may be any device type suitable for implementation, such as a handheld terminal device like a smart phone or a tablet computer; wearable devices such as smartwatches, headsets, etc.; desktop terminal equipment such as a computing power box and a notebook computer; and so on. The present disclosure is not so limited.
According to the electronic product, the outer-layer blind hole and the middle-layer buried hole are overlapped and arranged on the printed circuit board of the electronic product, the design space of the blind hole and the buried hole in the horizontal direction is reduced, and the flexibility of circuit board design is improved. In addition, the blind holes and the buried holes are arranged in an overlapped mode, arrangement of connecting signal lines is reduced, occupied space of wiring on a circuit board is further reduced, and signal transmission quality is improved.
It should be understood that the above embodiments are only examples for clearly illustrating the present invention, and are not intended to limit the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the present disclosure may be made without departing from the scope of the present disclosure.
Claims (10)
1. A printed circuit board, comprising:
the multilayer circuit board is sequentially stacked;
at least one buried hole opened in the multilayer circuit board;
the blind hole is arranged on the multilayer circuit board, and the projection of the blind hole on the circuit board plane and the projection of the buried hole on the circuit board plane are at least partially overlapped.
2. The printed circuit board of claim 1,
the buried hole is a mechanical drilling hole, and the blind hole is a laser hole.
3. The printed circuit board of claim 1,
the multilayer circuit board comprises a core board positioned in the middle layer, middle layer boards sequentially stacked on two sides of the core board, and outer layer boards positioned on the outer layers of the middle layer boards;
the buried hole is formed in the middle layer plate, and the blind hole is formed in the outer layer plate.
4. The printed circuit board of claim 1,
an insulating layer is arranged between two adjacent circuit boards in the multilayer circuit board.
5. The printed circuit board of claim 1, further comprising:
at least one through hole, the through hole penetrates through the multilayer circuit board.
6. A printed circuit board according to any one of claims 1 to 5,
the at least one blind hole comprises a first blind hole and a second blind hole;
the first blind hole penetrates through the outermost layer circuit board of the multilayer circuit board and is used for connecting the outermost layer circuit board and the secondary outer layer circuit board;
and the second blind hole penetrates through the secondary outer layer circuit board and is used for connecting the secondary outer layer circuit board and the third layer circuit board.
7. The printed circuit board of claim 6,
the projection of the first blind hole on the circuit board plane is at least partially overlapped with the projection of the second blind hole on the circuit board plane.
8. The printed circuit board of claim 7,
the projection of the first blind hole on the circuit board plane, the projection of the second blind hole on the circuit board plane and the projection of the buried hole on the circuit board plane are at least partially overlapped.
9. The printed circuit board of claim 8,
the multilayer wiring board includes at least 12 layers of wiring boards.
10. An electronic product, characterized by comprising a printed circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121459025.XU CN215991354U (en) | 2021-06-29 | 2021-06-29 | Printed circuit board and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121459025.XU CN215991354U (en) | 2021-06-29 | 2021-06-29 | Printed circuit board and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215991354U true CN215991354U (en) | 2022-03-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121459025.XU Active CN215991354U (en) | 2021-06-29 | 2021-06-29 | Printed circuit board and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215991354U (en) |
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2021
- 2021-06-29 CN CN202121459025.XU patent/CN215991354U/en active Active
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