CN215880390U - Double-light-path glass drilling device - Google Patents
Double-light-path glass drilling device Download PDFInfo
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- CN215880390U CN215880390U CN202122308488.2U CN202122308488U CN215880390U CN 215880390 U CN215880390 U CN 215880390U CN 202122308488 U CN202122308488 U CN 202122308488U CN 215880390 U CN215880390 U CN 215880390U
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Abstract
The utility model discloses a double-light path glass drilling device, which comprises a first light source, a second light source, a light path switching unit, a processing unit and a control unit, wherein the first light source and the second light source are respectively provided with an ultrafast laser and a nanosecond laser which are respectively used for generating ultrafast laser and nanosecond laser, the optical path switching unit is arranged at the output ends of the first light source and the second light source, the processing unit is arranged at the output end of the optical path switching unit, the control unit is used for controlling the first light source and the second light source to be switched, so that ultrafast laser and nanosecond laser respectively enter the processing unit through the light path switching unit and are emitted by the processing unit to process the glass, therefore, the processing efficiency is ensured by the nanosecond laser, meanwhile, the hot cracking effect of pure nanosecond laser is avoided, and the generation of cracks is avoided, so that the processing quality of the glass is improved while the processing efficiency is kept.
Description
Technical Field
The utility model relates to the technical field of laser glass drilling, in particular to a double-light-path glass drilling device.
Background
In the field of glass processing, there are two main ways of drilling glass: one is to adopt nanosecond laser to drill glass, the nanosecond laser has high-efficiency drilling speed, but the nanosecond laser adopts a mode of controlling the trend of cracks to cut the glass, so that large edge breakage sizes are caused on the surface of the glass at a glass opening in the machining process, particularly in the final ending stage, the edge breakage sizes are always over 100um, but part of industries require the edge breakage sizes to be within 30 um; in addition, the cracks can cause certain hidden troubles to the stability of subsequent glass, so that in the glass processing industry, after nanosecond laser processing is adopted, the glass notch needs to be polished, time and labor are wasted, and the processing efficiency is low. The other method is to adopt picosecond laser to drill glass, the quality of the edge of the picosecond laser cutting glass is high, but the high-speed drilling of the glass with the thickness of more than 1mm cannot be realized due to the picosecond characteristic.
Therefore, it is necessary to provide a dual optical path glass drilling apparatus that improves the processing quality while maintaining the processing efficiency, so as to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a double-light-path glass drilling device which can keep the processing efficiency and improve the processing quality.
In order to achieve the purpose, the technical scheme of the utility model is as follows: the utility model provides a dual optical path glass drilling equipment, it includes first light source, second light source, light path switching unit, processing unit and the control unit, wherein, first light source the second light source has ultrafast laser, nanosecond laser respectively, is used for producing ultrafast laser, nanosecond laser respectively, light path switching unit locates first light source the output of second light source, processing unit locates light path switching unit's output, the control unit is used for control first light source the second light source switches, so that ultrafast laser the nanosecond laser passes through respectively light path switching unit gets into processing unit, and the warp process glass is processed after the processing unit outgoing.
Preferably, the switching between the first light source and the second light source is performed to process the top and the bottom of the glass after the ultrafast laser is emitted through the light path switching unit and the processing unit, so that the nanosecond laser is emitted through the light path switching unit and the processing unit to process the middle of the glass.
Preferably, the ultrafast laser processes the top and bottom of the glass by a spiral pattern or/and a concentric pattern.
Preferably, the first light source includes the ultrafast laser and a first beam expander arranged at an output end of the ultrafast laser, and the first beam expander is used for expanding beam and processing divergence angle of ultrafast laser emitted by the ultrafast laser; the second light source comprises a nanosecond laser and a second beam expander arranged at the output end of the nanosecond laser, and the second beam expander is used for expanding the nanosecond laser emitted by the nanosecond laser and processing the divergence angle of the nanosecond laser; the optical path switching unit comprises a first reflector and a beam combiner arranged at the output end of the first reflector, and the first reflector and the beam combiner are respectively arranged at the output end of the first beam expander and the output end of the second beam expander; the processing unit comprises a galvanometer scanning system and a telecentric focusing field lens arranged at the output end of the galvanometer scanning system, and the galvanometer scanning system is arranged at the output end of the beam combiner.
Preferably, the optical path switching unit further includes a second reflecting mirror, the second reflecting mirror is disposed between the beam combiner and the galvanometer scanning system, and the laser emitted from the beam combiner enters the galvanometer scanning system after being reflected by the second reflecting mirror.
Preferably, the second mirror is a 45 ° mirror.
Preferably, the processing unit further comprises a dust removal system arranged corresponding to the telecentric focusing field lens, and the dust removal system is used for sucking away processing dust.
Preferably, the galvanometer scanning system is a three-dimensional scanning galvanometer or a combination of a two-dimensional scanning galvanometer and a single-axis moving part.
Preferably, the ultra-fast laser and the nanosecond laser have the wavelengths of 501nm-550nm or 1064nm, the frequency of 100K and the power of 10W.
Preferably, the pulse width of the ultrafast laser is 15-50ps, and the pulse width of the nanosecond laser is 1-10 ns.
Compared with the prior art, the double-light-path glass drilling device has the advantages that the first light source and the second light source are provided with the ultrafast laser and the nanosecond laser which are respectively used for generating the ultrafast laser and the nanosecond laser, so that the bottom and the top of the glass are subjected to cold processing at the beginning and the end by the ultrafast laser beam generated by the first light source through switching of the first light source and the second light source, the thermal cracking effect of pure nanosecond laser is avoided, the generation of cracks is avoided, the processing quality of the glass is improved, and then the middle of the glass is processed by the nanosecond laser generated by the second light source, so that the processing efficiency is ensured. Therefore, the double-light-path glass drilling device can improve the processing quality while maintaining the processing efficiency, saves the mechanical polishing process for customers, saves the processing time and program and protects the environment.
Drawings
FIG. 1 is a schematic view of the optical path of the dual optical path glass drilling apparatus of the present invention.
FIG. 2 is a schematic structural view of the dual optical path glass drilling apparatus of the present invention.
Fig. 3 is a schematic diagram of a trajectory of the helical wire processing.
Fig. 4 is a schematic diagram of tracks of concentric circle processing.
Detailed Description
Embodiments of the present invention will now be described with reference to the drawings, wherein like element numerals represent like elements. The dual-optical-path glass drilling device 100 provided by the utility model is particularly suitable for the field of high-quality glass processing, such as drilling of high-requirement products in the fields of automobile glass, glass screens in the consumer electronics industry, glass sockets in the household appliance industry, glass USB interface shells and the like, but is not limited thereto, and can be used for drilling of other common glass or other similar products.
Referring to fig. 1, the dual light path glass drilling apparatus 100 of the present invention includes a first light source 110, a second light source 120, a light path switching unit 130, a processing unit 140, and a control unit. The first light source 110 and the second light source 120 respectively have an ultrafast laser and a nanosecond laser, and the ultrafast laser and the nanosecond laser are respectively used for generating ultrafast laser and nanosecond laser; the optical path switching unit 130 is disposed at the output ends of the first light source 110 and the second light source 120, and the processing unit 140 is disposed at the output end of the optical path switching unit 130. The control unit is used for controlling the first light source 110 and the second light source 120 to be switched, so that laser beams generated by the ultrafast laser or the nanosecond laser enter the processing unit 140 through the light path switching unit 130, and are output by the processing unit 140 to drill and process glass, wherein the top and the bottom of the glass are processed by the laser beams generated by the ultrafast laser, and the middle of the glass is processed by the laser beams generated by the nanosecond laser, so that the processing efficiency is ensured, meanwhile, the heat cracking effect of the pure nanosecond laser is avoided, further, the generation of cracks during processing is avoided, and the processing quality of the glass is improved.
Referring to fig. 2, in an embodiment of the dual optical path glass drilling apparatus 100 according to the present invention, the first light source 110 specifically includes an ultrafast laser 111 and a first beam expander 112 disposed at an output end thereof, and the first beam expander 112 is configured to expand a laser beam output by the ultrafast laser 111 and process a divergence angle of the laser beam. Correspondingly, the second light source 120 includes a nanosecond laser 121 and a second beam expander 122 disposed at an output end of the nanosecond laser, and the second beam expander 122 is configured to expand a laser beam output by the nanosecond laser 121 and perform divergence angle processing. Understandably, the arrangement positions of the ultrafast laser 111 and the nanosecond laser 121 are interchangeable.
In one embodiment of the present invention, the ultrafast laser 111 is preferably a picosecond laser, and the top and bottom of the glass are cold-processed at the beginning and end by using the cold etching effect of the picosecond laser, so as to avoid the thermal cracking effect of the pure nanosecond laser, thereby avoiding the generation of cracks, solving the problem of edge chipping during the nanosecond laser processing, and improving the processing quality of the glass.
In the present invention, the wavelength of the ultrafast laser 111 is preferably 501nm to 550nm or 1064nm, the pulse width of the ultrafast laser 111 is preferably 15 to 50ps, the frequency is preferably 100K, the power is preferably 10W, and it is a high single pulse energy ultrafast laser 111. In one embodiment, a picosecond laser with a wavelength of 532nm, a pulse width of 15ps, a frequency of 100K, and a power of 10W is selected.
Accordingly, the nanosecond laser 121 preferably has a wavelength of 501nm to 550nm or 1064nm, and the nanosecond laser 121 preferably has a pulse width of 1 to 10ns, a frequency of 100K and a power of 10W. In this embodiment, a nanosecond laser 121 with a wavelength of 532nm, a frequency of 100K, a pulse width of 6ns and a power of 10W is selected.
It is to be understood that the parameters of the picosecond laser and the nanosecond laser 121 in the present invention are not limited to those in the above embodiments, and the parameters of the two are flexibly set according to specific processing requirements.
With reference to fig. 2, the optical path switching unit 130 includes a first reflector 131 and a beam combiner 132 disposed at an output end thereof, one of the first reflector 131 and the beam combiner 132 is correspondingly disposed at the output end of the first beam expander 112, and the other of the first reflector 131 and the beam combiner 132 is correspondingly disposed at the output end of the second beam expander 122, and two laser beams are integrated and share a set of processing unit 140 by cooperation of the first reflector 131 and the beam combiner 132, specifically, a laser beam emitted by one of the ultrafast laser 111 and the nanosecond laser 121 may directly enter the processing unit 140 after exiting through the beam combiner 132, and a laser beam emitted by the other of the ultrafast laser 111 and the nanosecond laser 121 enters the beam combiner 132 after being reflected by the first reflector 131, and then enters the processing unit 140 after exiting through the beam combiner 132.
In one embodiment of the present invention, the beam combiner 132 is disposed at the output end of the first beam expander 112, and the first reflector 131 is correspondingly disposed at the output end of the second beam expander 122. During operation, a picosecond laser beam emitted by the picosecond laser directly enters the beam combiner 132 after being subjected to beam expansion and divergence angle processing by the first beam expander 112, and then enters the processing unit 140 after being emitted by the beam combiner 132; the nanosecond laser beam of the nanosecond laser 121 is expanded by the second expander 122 and then enters the first reflector 131, is reflected by the first reflector 131, enters the beam combiner 132, and is emitted to the processing unit 140 through the beam combiner 132.
Furthermore, the optical path switching unit 130 further includes a second reflecting mirror 133, the second reflecting mirror 133 is disposed between the output end of the beam combining mirror 132 and the output end of the processing unit 140, the laser beam emitted from the beam combining mirror 132 enters the processing unit 140 after being reflected by the second reflecting mirror 133, and the transmission path of the laser beam is changed by the second reflecting mirror 133.
In the present invention, the second reflecting mirror 133 is preferably a 45 ° reflecting mirror, but is not limited thereto, and may be flexibly selected according to the need.
Referring to fig. 2 again, in the present invention, the processing unit 140 includes a galvanometer scanning system 141 and a telecentric focusing field lens 142 disposed at an output end thereof, wherein the galvanometer scanning system 141 is disposed at the output end of the second reflecting mirror 133, the galvanometer scanning system 141 performs pattern scanning and processing by swinging of the mirror, and the telecentric focusing field lens 142 is used for forming a uniform-sized focused spot of the laser beam in the whole processing plane.
In the present invention, the galvanometer scanning system 141 may be a three-dimensional scanning galvanometer, or a combination of a two-dimensional scanning galvanometer and a single-axis moving part, both of which are conventional structures in the art, and therefore, detailed description thereof is omitted. The focal length F of the telecentric focusing field lens 142 is preferably 60 to 160mm, but not limited thereto.
Referring again to fig. 2, in the present invention, the processing unit 140 further includes a dust removing system 143 disposed at the output end of the telecentric focusing field lens 142 and corresponding to the processing position, the dust removing system 143 is used for absorbing dust generated during the processing process, and the structure and principle of the dust removing system 143 are conventional in the art and therefore will not be described in detail.
As shown below in conjunction with fig. 2-4, there are two common methods for drilling glass: one is spiral track processing, as shown in fig. 3, the spiral track has the advantages of fewer positions of switching light, improved processing speed of the galvanometer and reduced influence of green heat; the other method is concentric track processing, as shown in fig. 4, the method is complementary to a spiral track, the spiral track has a more obvious characteristic at an outer port, namely, a gap is formed due to light opening, and the concentric track can well compensate the gap problem.
Based on the above processing principle, the processing unit 140 of the present invention combines the spiral track and the concentric track when processing, and the specific method is as follows: when cutting the round hole, the inside processing of circle adopts the helix to fill, and during the external diameter of circle, then docks helix and circle to eliminate the breach problem of helix ending position, thereby process out perfect pass structure.
The operation principle and process of the dual light path glass drilling apparatus 100 according to the present invention for drilling glass will be described with reference to fig. 1-4.
First, primitive processing is performed. Specifically, data processing is performed on a graph provided by a client, because the graph provided by the client mostly mainly consists of CAD single lines and the processing effect by using a galvanometer is not good, the graph generally needs to be processed to form a single layer or a plurality of layers densely distributed at a certain interval, and the line interval is specifically processed according to a focusing spot and the processing effect. In a specific embodiment of the present invention, the line space is 0.01mm, and no matter the round hole or the irregular hole, a similar method is adopted for processing, a plurality of layers are formed, and each layer corresponds to different processing parameters.
The glass bottom was then treated with a picosecond laser. Specifically, the first light source 110 is started to enable the picosecond laser to emit picosecond laser, the laser beam emitted by the picosecond laser is subjected to beam expansion and divergence angle treatment by the first beam expander 112, then sequentially enters the galvanometer scanning system 141 and the telecentric focusing field lens 142 through the beam combiner 132 and the second reflector 133, is emitted by the telecentric focusing field lens 142 and then acts on the bottom of the glass, etching and ablation treatment is carried out on the bottom of the glass by utilizing the characteristics of the picosecond laser, the bottom can be etched by a spiral line mode or a concentric circle mode or a combination mode of the spiral line and the concentric circle, and the edge of the treated bottom of the glass is clean and tidy, and has no burrs and no cracks; and after etching to a certain depth, controlling the picosecond laser to stop.
Next, the glass middle was treated with a nanosecond laser. Specifically, the second light source 120 is started to enable the nanosecond laser 121 to emit nanosecond laser, a laser beam of the nanosecond laser is expanded by the second beam expander 122 and processed by a divergence angle, the laser beam enters the beam combiner 132 after being reflected by the first reflector 131, then enters the galvanometer scanning system 141 and the telecentric focusing field lens 142 after sequentially passing through the beam combiner 132 and the second reflector 133, and is emitted by the telecentric focusing field lens 142 to act on glass, the nanosecond laser processed glass has different characteristics from picosecond laser processed glass, the nanosecond laser processing is mainly used for controlling the crack trend of the glass, the power is properly adjusted, the nanosecond laser is used for crushing the glass, so that the glass in a groove in the middle of the glass forms micron-level particles, high-speed drilling is realized, glass dust is timely removed by the dust removal system 143 in the process, and the depth of the nanosecond laser processing is designed in the processing process, the nanosecond laser 121 terminates processing when the designed processing depth is reached.
Finally, the glass top was again treated with a picosecond laser. Specifically, at the position department about several hundred microns apart from the glass top, restart first light source 110 makes its picosecond laser instrument send picosecond laser, utilize picosecond laser to carry out the ending to the glass top and handle, etch the top through helix mode or concentric circles mode or helix and concentric circles compound mode, in this embodiment, preferentially adopt concentric circles to come the butt joint helix to eliminate the breach problem of helix ending position, reach the effect that collapses the limit below 30um from this.
In summary, in the dual-optical-path glass drilling device 100 of the present invention, the first light source 110 and the second light source 120 respectively have the ultrafast laser 111 and the nanosecond laser 121 for generating ultrafast laser and nanosecond laser, respectively, so that the ultrafast laser beam generated by the first light source 110 is switched between the first light source 110 and the second light source 120 to perform cold processing on the bottom and the top of the glass at the beginning and the end, thereby avoiding the thermal cracking effect of the pure nanosecond laser and avoiding the occurrence of cracks, so as to improve the processing quality of the glass, and then the nanosecond laser generated by the second light source 120 is used to process the middle of the glass, thereby ensuring the processing efficiency. Therefore, the dual optical path glass drilling device 100 of the present invention can improve the processing quality while maintaining the processing efficiency, and save the mechanical polishing process for the customer, save the processing time and procedure, and protect the environment.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
1. The utility model provides a double-light-path glass drilling device, its characterized in that, includes first light source, second light source, light path switching unit, processing unit and the control unit, first light source the second light source has ultrafast laser, nanosecond laser respectively, is used for producing ultrafast laser, nanosecond laser respectively, light path switching unit locates first light source the output of second light source, processing unit locates light path switching unit's output, the control unit is used for control first light source the second light source switches, so that ultrafast laser the nanosecond laser passes through respectively light path switching unit gets into processing unit, and the warp process glass is processed after the processing unit emergence.
2. The dual optical path glass drilling apparatus according to claim 1, wherein the switching between the first light source and the second light source is performed so that the ultrafast laser beam exits through the optical path switching unit and the processing unit to process the top and the bottom of the glass, and the nanosecond laser beam exits through the optical path switching unit and the processing unit to process the middle of the glass.
3. The dual optical path glass drilling apparatus of claim 2, wherein the ultrafast laser processes the top and bottom of the glass by a spiral pattern or/and a concentric circle pattern.
4. The dual optical path glass drilling apparatus as claimed in any one of claims 1 to 3,
the first light source comprises the ultrafast laser and a first beam expander arranged at the output end of the ultrafast laser, and the first beam expander is used for expanding beam and processing divergence angle of ultrafast laser emitted by the ultrafast laser;
the second light source comprises a nanosecond laser and a second beam expander arranged at the output end of the nanosecond laser, and the second beam expander is used for expanding the nanosecond laser emitted by the nanosecond laser and processing the divergence angle of the nanosecond laser;
the optical path switching unit comprises a first reflector and a beam combiner arranged at the output end of the first reflector, and the first reflector and the beam combiner are respectively arranged at the output end of the first beam expander and the output end of the second beam expander;
the processing unit comprises a galvanometer scanning system and a telecentric focusing field lens arranged at the output end of the galvanometer scanning system, and the galvanometer scanning system is arranged at the output end of the beam combiner.
5. The dual optical path glass drilling apparatus as claimed in claim 4, wherein the optical path switching unit further comprises a second reflecting mirror disposed between the beam combiner and the galvanometer scanning system, and the laser light emitted from the beam combiner enters the galvanometer scanning system after being reflected by the second reflecting mirror.
6. The dual optical path glass drilling apparatus of claim 5, wherein the second mirror is a 45 ° mirror.
7. The dual optical path glass drilling apparatus of claim 4, wherein the processing unit further comprises a dust removal system disposed in correspondence with the telecentric focusing field lens, the dust removal system being configured to suck away processing dust.
8. A dual optical path glass drilling apparatus as in claim 4, wherein the galvanometer scanning system is a three-dimensional scanning galvanometer or a combination of a two-dimensional scanning galvanometer and a single axis moving part.
9. The dual optical path glass drilling apparatus of claim 1, wherein the ultrafast laser and the nanosecond laser each have a wavelength of 501nm to 550nm or 1064nm, a frequency of 100K, and a power of 10W.
10. The dual optical path glass drilling apparatus as claimed in claim 1, wherein the pulse width of the ultrafast laser is 15-50ps, and the pulse width of the nanosecond laser is 1-10 ns.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122308488.2U CN215880390U (en) | 2021-09-23 | 2021-09-23 | Double-light-path glass drilling device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122308488.2U CN215880390U (en) | 2021-09-23 | 2021-09-23 | Double-light-path glass drilling device |
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| CN215880390U true CN215880390U (en) | 2022-02-22 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114682934A (en) * | 2022-06-01 | 2022-07-01 | 杭州凌像科技有限公司 | Multi-pulse width composite printed circuit board laser processing device |
| CN117226254A (en) * | 2023-11-02 | 2023-12-15 | 武汉华日精密激光股份有限公司 | Laser drilling device and method based on ultrafast laser-long pulse laser combination |
-
2021
- 2021-09-23 CN CN202122308488.2U patent/CN215880390U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114682934A (en) * | 2022-06-01 | 2022-07-01 | 杭州凌像科技有限公司 | Multi-pulse width composite printed circuit board laser processing device |
| CN117226254A (en) * | 2023-11-02 | 2023-12-15 | 武汉华日精密激光股份有限公司 | Laser drilling device and method based on ultrafast laser-long pulse laser combination |
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