CN215867698U - Computing system and sealed server chassis - Google Patents

Abstract

A computing system includes a heat sink including a base and a multi-dimensional heat sink disposed adjacent to the base. A heat conducting layer is arranged between the multidimensional heat radiating device and the base and is in direct contact with the multidimensional heat radiating device and the base. A gasket includes a thermally conductive layer between the multi-dimensional heat sink and the base.

Description

Computing system and sealed server chassis

[ technical field ] A method for producing a semiconductor device

The present invention relates to computing systems for outdoor communications, and more particularly to techniques for cooling electronic components within a sealed enclosure for a communication device.

[ background of the utility model ]

Computing systems, such as those used for outdoor electronic communications, require higher and higher computing capabilities. Computing systems used in outdoor environments need to be placed within a dust and water resistant enclosure to protect components from adverse environmental conditions. For outdoor electronic computing devices, the housing of the computing system typically serves as a heat sink (heat sink) that cools the internal heat generating electronic components. High performance electronic components in computing systems, such as heat generating components connected to high performance expansion cards, can cause increased heat within the computer chassis of such computing systems.

[ Utility model ] content

The terms embodiment and similar terms are intended to be broadly construed to refer to all subject matter of the utility model and claims that follow. It should be understood that statements containing such terms are not intended to limit the subject matter described herein or the meaning or scope of the claims which follow. Embodiments of the utility model covered herein are defined by the claims that follow, rather than by the novel teachings herein. This novel disclosure is a general overview of aspects of the utility model and introduces some concepts that will be further described in the following detailed description. This novel disclosure is not intended to identify key or essential features of the claimed subject matter. Nor is the novel content herein intended to be used solely to establish the scope of the claimed subject matter. The claimed subject matter should be understood with reference to this entire specification, any or all drawings, and appropriate portions of the claims, of this application.

According to some aspects of the present invention, a computing system includes a heat sink including a base. A multi-dimensional heat sink is disposed adjacent to the base. A heat conducting layer is arranged between the multidimensional heat radiating device and the base and is in direct contact with the multidimensional heat radiating device and the base. A gasket is configured to include a thermally conductive layer.

According to some aspects of the present invention, a sealed server chassis includes a heat sink comprising a base and a plurality of heat transfer fins. The heat transfer fins protrude from an outer surface of the base. A vapor chamber is disposed adjacent an inner surface of the base. A heat source is disposed proximate the vapor chamber. And the heat conduction layer is arranged between the temperature equalizing plate and the base and is in direct contact with the temperature equalizing plate and the base. A gasket is configured to include a thermally conductive layer.

The above novel disclosure is not intended to represent various embodiments or aspects of the present invention. Rather, the foregoing novel disclosure provides only examples of some of the novel aspects and features set forth herein. The above features and advantages and other features and advantages of the present invention are readily apparent from the following detailed description of the exemplary embodiments and modes for carrying out the utility model when taken in connection with the accompanying drawings and appended claims. Other aspects of the present invention will become apparent to those of ordinary skill in the art in view of the detailed description of the embodiments with reference to the drawings, a brief description of which is provided below.

[ description of the drawings ]

The utility model, together with its advantages and drawings, will be best understood from the following description of exemplary embodiments when read in connection with the accompanying drawings. The drawings depict only exemplary embodiments and are not therefore to be considered to be limiting of the various embodiments or the scope of the claims.

FIG. 1 is a perspective view of an exemplary sealed computer chassis for outdoor use that includes a heat sink in accordance with some embodiments of the utility model.

Fig. 2 is an exemplary partial cross-sectional view of an outdoor sealed computer chassis including a heat sink, a vapor chamber, and a heat source according to some embodiments of the utility model.

Fig. 3 is an exemplary partial cross-sectional view of an outdoor sealed computer chassis including a heat sink and a vapor chamber, according to some embodiments of the utility model.

FIG. 4 is an exemplary partial cross-sectional view of a vapor plate according to some embodiments of the utility model.

Fig. 5 is an exemplary side view of a thermal equalization plate coupled to a heat sink of an outdoor computer chassis according to some embodiments of the present invention.

Fig. 6 is an exemplary side perspective view of an outdoor computer chassis including a heat sink having heat transfer fins according to some embodiments of the utility model.

[ notation ] to show

100 computer cabinet

110 casing enclosure

112, base

115 outer surface

120 casing enclosure

150 heat transfer fin

155 clearance (c)

157 dust-proof and water-proof surface

200 heat sink

212 base

215 heat transfer fin

220 multidimensional heat dissipation device

222 plane of

230 heat source

240 main board

250 outer space

260 inner space

300 heat sink

312 base

314 channel

315 heat transfer fin

320 temperature equalizing plate

322 plane of

324 inner surface

330 heat source

350 outer space

360 inner space

370 heat conducting layer

380 gasket

410 heat input surface

415 thermal input side

420, temperature equalizing plate

430 vaporization compartment

440 heat output surface

445 heat output side

450 is a shell

460 capillary structure

512: base

520 multidimensional heat dissipation device

530 mechanical fastener

600 computer cabinet

610 casing enclosure

612 heat sink

615 Heat transfer fins

617 channel

620 casing surround

657 dustproof and waterproof surface

P is the periphery

[ detailed description ] embodiments

An outdoor computing system is described herein that includes a heat sink, a multi-dimensional heat sink (e.g., a vapor chamber), a thermally-conductive layer, and a gasket. A multi-dimensional thermal displacement device is disposed adjacent to the base of the heat sink. The heat conducting layer is arranged between the multidimensional heat radiating device and the base. The gasket includes a thermally conductive layer between the multi-dimensional heat sink and the base. The multi-dimensional heat dissipation device is configured to perform at least two-dimensional thermal conduction (two-dimensional thermal conduction) to rapidly transfer heat from a heat source (e.g., a cpu) to a cooling region.

The illustrated outdoor computing system is applied in a fifth generation (5G) wireless mobile communication technology. As the transmission speed of 5G exceeds the transmission technology of the previous generation, the power consumption of 5G computing systems also increases. The increased power consumption in turn leads to increased heat. If the computing system does not dissipate heat sufficiently, the operating efficiency of the computing system may be reduced and device problems such as damage to computing components, system crash, network disconnection, etc. may result, thereby reducing the user experience.

Various embodiments are described with reference to the drawings, wherein like reference numerals are used to refer to like or equivalent elements throughout. The drawings are not to scale and are merely illustrative of the utility model. Several aspects of the utility model are described below with reference to example applications for illustration. It should be understood that numerous specific details, relationships, and means are set forth to provide a full understanding of the utility model. One skilled in the relevant art will recognize, however, that the utility model can be practiced without one or more of the specific details, or with other methods. In other instances, well-known structures or operations are not shown in detail to avoid obscuring the utility model. The various embodiments are not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events. Moreover, not all illustrated acts or events are required to implement the present invention.

For the purposes of this invention, the singular includes the plural and vice versa unless specifically stated otherwise. The term "comprising" means "including but not limited to". Moreover, general terms such as "about," "almost," "substantially," "about," and the like may be used herein to refer to terms such as "in," "near," or "almost," or logical combinations of any of them, such as "within 3-5% or" within acceptable manufacturing tolerances. Similarly, "vertical" or "horizontal" refer to a vertical or horizontal orientation, respectively, further comprising "within 3-5%. Furthermore, directional terms, such as "top," "bottom," "left," "right," "up," and "down," relate to equivalent directions as drawn in the reference drawings. May be understood from the context of a self-referenced item or element (e.g., from a common location of the item or element); or otherwise described herein.

Reference is now made to fig. 1, which is a perspective view of an exemplary computer chassis 100, such as for a computing system or server system. The computer chassis 100 is sealed for outdoor use and includes an exterior surface 115 and an interior space (not shown). A plurality of heat transfer fins (fin) 150 are disposed on the outer surface 115 and act as heat sinks. The computer chassis 100 includes at least two housing enclosures 110, 120 secured to one another to form a dust and water resistant surface 157 generally along the x-z plane between the two housing enclosures 110, 120. The computer case 100 protects electronic components including heat generating components disposed in an inner space thereof.

A plurality of heat transfer fins 150 are spaced along the outer surface 115 of the base 112 of the housing enclosure 110. The outer surface 115 is substantially parallel to the x-z plane. The plurality of heat transfer fins 150 protrude (perpendicularly) from the outer surface 115 such that the plurality of heat transfer fins 150 are substantially parallel to the y-z plane. The plurality of heat transfer fins 150 and the base 112 form a heat sink. The heat transfer fin 150 may be secured to the base 112 via an interference fit (or other mechanical fastening system).

In some embodiments, a plurality of second heat transfer fins (not shown) may similarly be disposed on an opposing outer surface (not shown) associated with the housing enclosure 120. During operation of the electronic components within the computer chassis 100, ambient air (ambient air) will be heated at one or both external surfaces (e.g., external surface 115) of the computer chassis 100 and flow through the air gaps (air gaps) (e.g., gap 155) between adjacent heat transfer fins. Natural convection due to the pressure differential between the heated ambient air in the gap 155 and the ambient air will drive the heated air upward away from the outer surface 115. In some embodiments, the height of the plurality of heat transfer fins 150 perpendicular to the outer surface 115 is greater than about five times the air gap between adjacent spaced heat transfer fins 150. In some embodiments, the plurality of heat transfer fins 150 have the same height. In some embodiments, a majority of the plurality of heat transfer fins 150 have the same height. In some embodiments, the computer chassis 100 has a width along the x-axis of about 6-7 inches or more, which allows a sufficient number of heat transfer fins 150 to be disposed on the outer surface 115 of the enclosure 110 to meet the heat dissipation requirements of heat generating electronic components (not shown) disposed within the computer chassis 100.

Referring to fig. 2, a schematic partial cross-sectional view of an outdoor sealed computer chassis is shown. As shown in FIG. 2, the exemplary x-y plane of the computer chassis 100 is generally aligned with the exemplary x-y plane of FIG. 1, and the heat sink 200 is further shown to transfer heat from the interior space 260 of the computer chassis. In some embodiments, heat sink 200 includes a base 212 and heat transfer fins 215 disposed in an exterior space 250 surrounding a sealed computer chassis. A multi-dimensional thermal displacement device 220, such as a vapor chamber, is disposed adjacent to the base 212 of the heat sink 200. In some aspects, the multi-dimensional heat sink 220 can be embedded in the base 212. In addition, the heat source 230 may include one or more target heat-generating components (e.g., one or more microprocessors and/or storage devices) disposed on the motherboard 240, wherein all of the heat-generating components are disposed in the interior space 260 of the sealed computer case. The heat transfer fins 215 of the heat sink 200 protrude perpendicularly from the planar surface 222 of the multi-dimensional heat sink 220.

Referring to fig. 3, a schematic partial cross-sectional view of an outdoor sealed computer chassis is shown. As shown, the exemplary y-z plane of FIG. 3 is substantially aligned with the exemplary y-z plane of computer chassis 100 of FIG. 1. Similar to fig. 2, a portion of a sealed computer chassis includes a heat sink 300 for transferring heat from an interior space 360 of the computer chassis. In some embodiments, heat sink 300 includes a base 312 and heat transfer fins 315 disposed in an exterior space 350 surrounding a sealed computer chassis. Although only a single heat transfer fin is illustrated in fig. 3, a plurality of heat transfer fins 315 may be disposed adjacent to one another, similar to the plurality of heat transfer fins 150, 215 of fig. 1 and 2. As shown in fig. 3, a vapor chamber (vapor chamber)320 is disposed adjacent to the base 312 of the heat sink 300. Similar to the illustration in fig. 2, the vapor chamber 320 may be embedded in the base 312. In addition, the heat source 330 may include one or more target heat generating components, such as one or more microprocessors and/or storage devices disposed on a motherboard (not shown), wherein all of the heat generating components are disposed within the interior space 360 of the sealed computer case. The heat transfer fins 315 of the heat sink 300 protrude perpendicularly from the plane 322 of the temperature equalization plate 320.

A thermally-conductive layer 370 is disposed between the vapor chamber 320 and the base 312 and is in direct contact with the vapor chamber 320 and the base 312. The gasket (gasket)380 includes a thermally conductive layer 370 positioned between the vapor plate 320 and the base 312 of the heat sink 300. The planar surface 322 of the vapor chamber 320 facing the susceptor may be a roughened metal surface that has an air gap when in direct contact with the inner surface 324 of the susceptor 312. In some embodiments, the roughened metal surface of the vapor plate 320 has an average roughness (Ra) of between about 1.6 and about 6.3. The presence of the air gap allows for an imperfect thermal connection between the vapor plate 320 and the heat sink 300 when the two elements are in direct contact with each other. The thermally conductive layer 370 minimizes the air gap between the roughened metal surface of the vapor plate 320 and the base 312, thereby achieving efficient heat transfer from the vapor plate 320 to the heat sink 300. The thickness of the thermally conductive layer 370 may vary. In some embodiments, the thickness of the thermally conductive layer 370 is large enough to smooth out (smoothen) imperfections in the roughened metal surface and minimize any air gap between the vapor plate 320 and the heat sink 300.

In some embodiments, the gasket 380 may be embedded in the channel 314 within the base 312. In some aspects, the gasket 380 and/or the channel 314 extend along a perimeter P (shown in fig. 5) of the vapor plate 320. The gasket 380 may be a resilient polymeric material or other compressible material that forms a seal when compressed to contain the thermally conductive layer 370. For example, when the vapor plate 320 is pressed against the base 312, the gasket 380 may be compressed to allow the thermally conductive layer 370 to be contained such that the thermally conductive paste (grease) remains in place flowing out from between the vapor plate 320 and the base 312. In some embodiments, an outdoor sealed computer chassis includes a multi-dimensional heat sink, a heat sink, and a thermally conductive layer. The sealed computer case has a length of about 12-18 inches, a width of about 14-20 inches, a depth of about 4-10 inches, and is capable of dissipating about 250-325 watts of heat.

Referring to fig. 4, an exemplary partial cross-sectional view of a vapor chamber is shown. The temperature equalization plate 420 is a flat heat pipe (planar heat pipe) for two-dimensional heat transfer. The vapor plate 420 includes a working fluid (e.g., water) that vaporizes in the vaporization compartment 430 and travels to a cooler region of the vapor plate 420 adjacent the heat output surface 440 where it condenses back into a liquid phase. The thermal plate 420 is in thermal contact with a heat generating source (not shown), such as a microprocessor or a memory device, that provides heat input to the thermal plate 420 at the heat input surface 410.

The vapor plate 420 includes a housing 450 having a heat output surface 440 and a heat input surface 410. The housing 450 is made of a thermally conductive material (e.g., a metal such as copper) that readily receives heat from the heat input surface 410. A capillary structure (wick)460 transports the condensed working fluid (e.g., water) from the heat output side 445 of the vapor chamber 420 back to the heat input side 415 (the heat input received at the heat input side 415 causes the liquid to evaporate). The vaporized liquid then moves back toward the heat output side 445 of the vapor plate 420 and condenses, and the working fluid is reabsorbed by the capillary structure 460 and again brought back at the heat input side 415.

The heat output surface 440 of the vapor plate 420 is in direct contact with a thermally conductive layer (e.g., the thermally conductive layer 370 of fig. 3), which transfers the output heat to a heat sink (e.g., the heat sinks 200, 300 of fig. 1 and 2). The evaporation and condensation steps form a repeating cycle of heat transfer from the heat-generating electronic components thermally coupled to the heat input surface 410 to the heat sink thermally coupled to the heat output surface 440.

Fig. 5 is an exemplary cross-sectional view of a multi-dimensional heat sink 520 (e.g., a vapor chamber) coupled to a base 512 of a heat sink of an outdoor computer chassis. As shown in the figure. The perspective of fig. 5 is generally aligned with the exemplary x-z plane of computer chassis 100 in fig. 1. In some embodiments, the multi-dimensional heat sink 520 is mechanically secured to the base 512, for example, using one or more mechanical fasteners 530 (e.g., screws). Mechanical fastening of the multidimensional heat sink 520 is desirable, such fastening including thermal-induced strain due to temperature variations that may otherwise cause the multidimensional heat sink 520 to separate from or loosen the base 512 of the heat sink, thereby reducing heat dissipation efficiency.

Fig. 6 is an exemplary side perspective view of an outdoor computer chassis 600 that includes a heat sink 612 having heat transfer fins 615. The perspective in fig. 6 is generally aligned with the exemplary y-z plane of the computer chassis 100, 300 of fig. 1, 3. Heat transfer fins 615 include coolant-filled channels 617. Although only a single heat transfer fin is illustrated in fig. 6, a plurality of heat transfer fins 315 may be disposed adjacent to one another, similar to the plurality of heat transfer fins 150, 215 of fig. 1 and 2.

The computer case 600 is sealed for outdoor use and includes an inner space (not shown). Similar to the computer chassis 100 of FIG. 1, the computer chassis 600 may include two housing enclosures 610, 620 secured to one another to form a dust and water resistant surface 657 generally along the x-z plane between the housing enclosures 610, 620. The computer case 600 protects electronic components including heat generating components disposed in the inner space thereof.

In some embodiments, the heat transfer fins 615 are formed from two sheets of aluminum material having channels stamped (stamp) therein and then roll-bonded together. An exemplary coolant filling the passage 617 may include R1233zd coolant or similar material.

Although the utility model has been illustrated and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In addition, while a particular feature of the utility model may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application.

While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. Numerous changes to the disclosed embodiments can be made in accordance with the disclosure herein without departing from the spirit or scope of the utility model. Thus, the breadth and scope of the present invention should not be limited by any of the above-described embodiments. Rather, the scope of the utility model is to be defined in accordance with the following claims and their equivalents.

Claims (10)

1. A computing system, comprising:

a heat sink comprising a base;

a multidimensional heat dissipation device which is arranged adjacent to the base;

the heat conduction layer is arranged between the multidimensional heat dissipation device and the base and is directly contacted with the multidimensional heat dissipation device and the base;

a gasket for containing the heat conductive layer.

2. The computing system of claim 1, wherein the multi-dimensional heat sink comprises a vapor chamber.

3. The computing system of claim 1, wherein a plane of the multi-dimensional heat sink facing the base is a roughened metal surface having an average roughness between about 1.6 and about 3.6.

4. The computing system of claim 1, wherein the gasket is embedded in a channel in the base.

5. The computing system of claim 2, wherein the gasket extends along a perimeter of the thermal block.

6. The computing system of claim 1, wherein the gasket is compressed to form a seal between the multi-dimensional heat sink and the base.

7. The computing system of claim 1, wherein the heat sink comprises a plurality of heat transfer fins protruding perpendicularly from a plane of the multi-dimensional heat dissipation device.

8. The computing system of claim 7, wherein a height of the plurality of heat transfer fins is greater than about five times a gap width between adjacently spaced ones of the plurality of heat transfer fins.

9. A sealed server chassis, comprising:

a heat sink comprising a base and a plurality of heat transfer fins protruding from an outer surface of the base;

a temperature equalization plate disposed adjacent an inner surface of the base;

a heat source arranged adjacent to the vapor chamber;

the heat conduction layer is arranged between the temperature-equalizing plate and the base and is directly contacted with the temperature-equalizing plate and the base; and

a gasket for containing the heat conductive layer.

10. The sealed server chassis of claim 9, wherein the plurality of heat transfer fins protrude perpendicularly from the outer surface of the base.

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