CN215619207U - Slicing device for semiconductor production - Google Patents
Slicing device for semiconductor production Download PDFInfo
- Publication number
- CN215619207U CN215619207U CN202122328778.3U CN202122328778U CN215619207U CN 215619207 U CN215619207 U CN 215619207U CN 202122328778 U CN202122328778 U CN 202122328778U CN 215619207 U CN215619207 U CN 215619207U
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- China
- Prior art keywords
- fixedly connected
- fixing table
- oil cylinder
- knife
- material fixing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 97
- 238000005520 cutting process Methods 0.000 claims abstract description 32
- 238000009434 installation Methods 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims description 35
- 238000000034 method Methods 0.000 abstract description 4
- 239000003921 oil Substances 0.000 description 25
- 238000010008 shearing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010730 cutting oil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to the technical field of semiconductor production, in particular to a slicing device for semiconductor production, which comprises a material fixing table, wherein an installation rack is arranged right above the material fixing table, a lifting oil cylinder is fixedly connected to the top of the installation rack, the movable end of the lifting oil cylinder faces downwards, a U-shaped connecting frame is arranged at the movable end of the lifting oil cylinder, two knife rollers are arranged at the bottom of the inner side of the U-shaped connecting frame, knife grooves are formed in the surfaces of the two knife rollers, a cutting line is arranged between the two knife grooves, and a cutting groove matched with the cutting line is formed in the top of the material fixing table. According to the device, the cutter roller and the cutting line are arranged, so that the complete slicing operation of the whole wafer rod can be realized at one time, compared with the prior art, the slicing efficiency is greatly improved, the sheet is not subjected to lateral stress in the slicing process, the slicing quality is good, and the requirement of high-efficiency mass production and use of semiconductor materials is met.
Description
Technical Field
The utility model relates to the technical field of semiconductor production, in particular to a slicing device for semiconductor production.
Background
Through retrieval, the slicing device for semiconductor production in the prior art mainly comprises two types, one type is the scheme disclosed in patent CN212352479U, the scheme that a material conveying table is adopted to convey materials and a shearing mechanism on the upper portion is matched to complete the slicing operation of the materials in a shearing mode, the obvious use disadvantage exists, the shearing and cutting can give lateral stress to the front end sliced materials, the sliced materials are bent and deformed, the slicing quality is poor, the yield is low, and the production requirement cannot be met, the scheme that the scheme is disclosed in patent CN212736100U and patent CN209851337U is adopted, the material conveying table or the material feeding table is matched with the cutting mechanism on the upper portion to carry out slicing, the slicing operation mode of the device is that the material conveying table conveys the materials for a certain distance and then positions and cuts the materials, the materials are fed again after the cutting is completed, the slicing operation is repeated, only one slice can be cut at a time, the overall slicing efficiency is low, and the high-efficiency production requirement cannot be met, therefore, a slicing apparatus for semiconductor production is proposed to solve the above-mentioned disadvantages.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a slicing device for semiconductor production.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the slicing device comprises a material fixing table, wherein an installation rack is arranged right above the material fixing table, a lifting oil cylinder is fixedly connected to the top of the installation rack, the movable end of the lifting oil cylinder faces downwards, a U-shaped connecting frame is arranged at the movable end of the lifting oil cylinder, a knife roller is arranged at the bottom of the inner side of the U-shaped connecting frame, two knife rollers are arranged, knife grooves are formed in the surfaces of the two knife rollers, a cutting line is arranged between the two knife grooves, a cutting groove matched with the cutting line is formed in the top of the material fixing table, a sliding support is arranged above the rear portion of the material fixing table, a sliding support is connected to the bottom of the sliding support in a sliding mode, a lifting support is fixedly connected to one side of the bottom of the sliding support close to the material fixing table, and a material pressing and taking mechanism is fixedly connected to the bottom of the lifting support.
Preferably, the knife grooves are arranged at equal intervals along the surface of the knife roller, and the distance between the two knife rollers is larger than the width of the material fixing table.
Preferably, the top of the material fixing table is provided with a material fixing groove, one side of the material fixing table is fixedly connected with a clamping oil cylinder, and the movable end of the clamping oil cylinder is fixedly connected with a clamping block.
Preferably, the back of the sliding support is fixedly connected with a pushing oil cylinder, and the movable end of the pushing oil cylinder is fixedly connected with the middle part of the sliding frame.
Preferably, the top of the sliding frame is fixedly connected with a pressing oil cylinder, and the movable end of the pressing oil cylinder is fixedly connected with the top of the material pressing and taking mechanism.
Preferably, the material pressing and taking mechanism comprises an arc-shaped material pressing plate, a sheet passing groove is formed in the middle of the arc-shaped material pressing plate, and a material sucking head is arranged at the top of the arc-shaped material pressing plate.
The utility model has at least the following beneficial effects:
this device passes through the setting of rotor and line of cut, can once only realize the complete section operation to whole wafer stick, compares prior art, has promoted section efficiency by a wide margin, and the sheet does not receive lateral stress among the slicing process, and it is of high quality to cut into slices, satisfies semiconductor material high efficiency mass production and uses.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a top view of the knife roll, the material table and the sliding support structure of the present invention;
fig. 3 is a schematic structural view of the cutting line cutting into the wafer and the material pressing and fetching mechanism performing the material pressing state according to the present invention.
In the figure: 1. a material fixing table; 2. installing a frame; 3. a lift cylinder; 4. a U-shaped connecting frame; 5. a knife roll; 6. cutting a line; 7. cutting the groove; 8. a sliding support; 9. a carriage; 10. a lifting support; 11. a material pressing and taking mechanism; 12. a material fixing groove; 13. clamping the oil cylinder; 14. a clamping block; 15. pushing the oil cylinder; 16. and pressing the oil cylinder.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Referring to fig. 1-3, a slicing device for semiconductor production comprises a material fixing table 1, a mounting frame 2 is arranged right above the material fixing table 1, a lifting cylinder 3 is fixedly connected to the top of the mounting frame 2, the movable end of the lifting cylinder 3 is arranged downwards, a U-shaped connecting frame 4 is arranged at the movable end of the lifting cylinder 3, two knife rolls 5 are arranged at the bottom of the inner side of the U-shaped connecting frame 4, knife grooves are arranged on the surfaces of the two knife rolls 5, a cutting line 6 is arranged between the two knife grooves, a cutting groove 7 matched with the cutting line 6 is arranged at the top of the material fixing table 1, a sliding support 8 is arranged above the rear of the material fixing table 1, a sliding frame 9 is slidably connected to the bottom of the sliding support 8, a lifting support 10 is fixedly connected to one side of the bottom of the sliding frame 9 close to the material fixing table 1, and a material pressing and taking mechanism 11 is fixedly connected to the bottom of the lifting support 10, and a driving motor is arranged at the shaft end of the knife roller 5 and used for driving the knife roller 5 to rotate and driving the cutting lines 6 between the knife rollers 5 to run.
The scheme has the following working processes:
when the automatic slicing machine works, a wafer rod material is placed in a material fixing groove 12, a clamping block 14 is driven by a clamping oil cylinder 13 to clamp the material, a cutting wire 6 is driven by the operation of a cutting roller 5 to run at a high speed, a U-shaped connecting frame 4 and the cutting roller 5 structure arranged in the frame are driven by a lifting oil cylinder 3 to descend at a constant speed, the cutting wire 6 finishes slicing operation on the material in the descending process, after the cutting wire 6 is completely cut into the material, a sliding frame 9 is pushed by a pushing oil cylinder 15 to extend forwards, a material pressing and taking mechanism 11 is positioned right above a material fixing table 1, the material pressing and taking mechanism 11 is driven by a pressing oil cylinder 16 to descend to press the sheet material with the upper part cut, the material is completely sliced when the cutting wire 6 runs to the bottom of a cutting groove 7, the material is completely sliced, the material pressing and taking mechanism 11 is reset after the sheet material is adsorbed by a material suction head, the sliced sheet material is taken out from the material fixing table 1 to be unloaded, the cutting oil cylinder 3 drives the cutting roller 5 to reset, the next round of slicing operation can be performed.
Further, the cutter grooves are arranged at equal intervals along the surface of the cutter roller 5, the distance between the two cutter rollers 5 is larger than the width of the material fixing table 1, and the cutter grooves can be arranged in different cutter groove interval specifications according to the thickness of the cut sheet.
Further, the top of the material fixing table 1 is provided with a material fixing groove 12, one side of the material fixing table 1 is fixedly connected with a clamping oil cylinder 13, a movable end of the clamping oil cylinder 13 is fixedly connected with a clamping block 14, one side of the material fixing groove 12 realizes one end limitation on the wafer rod material, the clamping oil cylinder 13 drives the clamping block 14 to realize the clamping fixation on the other end of the material, and the material fixing groove 12 realizes the limitation on the front and back direction of the material.
Further, the back of the sliding support 8 is fixedly connected with a pushing oil cylinder 15, the movable end of the pushing oil cylinder 15 is fixedly connected with the middle of the sliding frame 9, the pushing oil cylinder 15 is used for driving the sliding frame 9 to slide along the sliding support 8, and station changing of the material pressing and taking mechanism 11 is achieved.
Further, the top of the carriage 9 is fixedly connected with a pressing oil cylinder 16, the movable end of the pressing oil cylinder 16 is fixedly connected with the top of the material pressing and taking mechanism 11, and the pressing oil cylinder 16 is used for driving the material pressing and taking mechanism 11 to move up and down.
Further, the material pressing and taking mechanism 11 comprises an arc-shaped material pressing plate, a sheet passing groove is formed in the middle of the arc-shaped material pressing plate, a material sucking head is arranged at the top of the arc-shaped material pressing plate, the material pressing plate is fed into the upper portion of the material after the cutting line 6 is cut into the position below the height of the wafer to compress the sheet subjected to upper portion cutting, the upper portion of the sheet penetrates through the passing groove to be positioned, the sheet exposed out of the top of the passing groove is adsorbed through the material sucking head, and one-time material taking is achieved after the cutting is finished.
The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the utility model, but that various changes and modifications may be made without departing from the spirit and scope of the utility model, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. A slicing device for semiconductor production comprises a material fixing table (1) and is characterized in that an installation rack (2) is arranged right above the material fixing table (1), a lifting oil cylinder (3) is fixedly connected to the top of the installation rack (2), the movable end of the lifting oil cylinder (3) is arranged downwards, a U-shaped connecting frame (4) is arranged at the movable end of the lifting oil cylinder (3), knife rollers (5) are arranged at the bottom of the inner side of the U-shaped connecting frame (4), two knife rollers (5) are arranged, knife grooves are formed in the surfaces of the two knife rollers (5), a cutting line (6) is arranged between the two knife grooves, a cutting groove (7) matched with the cutting line (6) is formed in the top of the material fixing table (1), a sliding support (8) is arranged above the rear portion of the material fixing table (1), and a sliding frame (9) is connected to the bottom of the sliding support (8) in a sliding mode, one side fixedly connected with lifting support (10) that balladeur train (9) bottom is close to material platform (1) surely to the bottom fixedly connected with of lifting support (10) presses material feeding agencies (11).
2. The slicing device for semiconductor production as claimed in claim 1, wherein the knife grooves are arranged at equal intervals along the surface of the knife roller (5), and the distance between the two knife rollers (5) is greater than the width of the material fixing table (1).
3. The slicing device for semiconductor production according to claim 1, wherein a material fixing groove (12) is formed in the top of the material fixing table (1), a clamping oil cylinder (13) is fixedly connected to one side of the material fixing table (1), and a clamping block (14) is fixedly connected to the movable end of the clamping oil cylinder (13).
4. The slicing device for semiconductor manufacturing according to claim 1, wherein a pushing cylinder (15) is fixedly connected to the back surface of the sliding support (8), and the movable end of the pushing cylinder (15) is fixedly connected to the middle portion of the carriage (9).
5. The slicing device for semiconductor production according to claim 1, wherein a pressing cylinder (16) is fixedly connected to the top of the carriage (9), and the movable end of the pressing cylinder (16) is fixedly connected to the top of the material pressing and taking mechanism (11).
6. The slicing device for semiconductor production as claimed in claim 1, wherein the material pressing and taking mechanism (11) comprises an arc-shaped material pressing plate, a sheet passing groove is formed in the middle of the arc-shaped material pressing plate, and a material sucking head is arranged at the top of the arc-shaped material pressing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122328778.3U CN215619207U (en) | 2021-09-26 | 2021-09-26 | Slicing device for semiconductor production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122328778.3U CN215619207U (en) | 2021-09-26 | 2021-09-26 | Slicing device for semiconductor production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215619207U true CN215619207U (en) | 2022-01-25 |
Family
ID=79919435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122328778.3U Expired - Fee Related CN215619207U (en) | 2021-09-26 | 2021-09-26 | Slicing device for semiconductor production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215619207U (en) |
-
2021
- 2021-09-26 CN CN202122328778.3U patent/CN215619207U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220125 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |