CN215545620U - Tin cream knife coating device for lead frame - Google Patents
Tin cream knife coating device for lead frame Download PDFInfo
- Publication number
- CN215545620U CN215545620U CN202121403771.7U CN202121403771U CN215545620U CN 215545620 U CN215545620 U CN 215545620U CN 202121403771 U CN202121403771 U CN 202121403771U CN 215545620 U CN215545620 U CN 215545620U
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- China
- Prior art keywords
- scraping
- extending
- placing
- lead frame
- side plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010345 tape casting Methods 0.000 title claims abstract description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 11
- 239000006071 cream Substances 0.000 title claims abstract description 10
- 238000007790 scraping Methods 0.000 claims abstract description 36
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 230000007480 spreading Effects 0.000 claims description 2
- 238000003892 spreading Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 4
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 4
- 235000017491 Bambusa tulda Nutrition 0.000 description 4
- 241001330002 Bambuseae Species 0.000 description 4
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 4
- 239000011425 bamboo Substances 0.000 description 4
- 244000309464 bull Species 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A tin cream knife coating device for lead frame includes: a base plate; the placing component is arranged on the bottom plate and comprises a pair of fixed side plates arranged on the bottom plate, the placing side plates are arranged on the inner walls of the fixed side plates in an equally-spaced array along the length direction of the inner walls, and clamping strips are formed on the inner walls of the placing side plates; the scraping and coating mechanism is arranged on the bottom plate; the placing component is used for placing a plurality of lead frame placing plates, and the scraping mechanism is used for scraping solder paste. When the core bonding operation is carried out, the solder paste can be fully and fully coated at the corresponding point position of the lead frame, the semiconductor processing efficiency is improved, the yield of the semiconductor is ensured, and the method has strong practicability.
Description
Technical Field
The utility model relates to the technical field related to semiconductor production equipment, in particular to a solder paste scraping device for a lead frame.
Background
In order to improve the productivity of semiconductors and to save raw materials and facilitate processing, it is generally necessary to press-form copper or aluminum plates by pressing, and the intermediate product obtained by press-forming is a lead frame.
The existing chip is usually welded to the corresponding node position of the lead frame through solder paste, in the welding process, the end part of a rod is generally arranged in a solder paste groove, so that the solder paste is adhered to the end part of the rod, then the rod adhered with the solder paste is transferred to the corresponding point position of the lead frame, then the end part of the rod is contacted with the lead frame, so that the solder paste is transferred onto the lead frame, and then core adhering operation is carried out.
SUMMERY OF THE UTILITY MODEL
The utility model provides a solder paste scraping device for a lead frame, which is used for solving the defects of the prior art, and can fully and fully coat solder paste on corresponding point positions of the lead frame when core bonding operation is carried out, so that the semiconductor processing efficiency is improved, the yield of semiconductors is ensured, and the practicability is strong.
In order to achieve the purpose of the utility model, the following technology is adopted:
a tin cream knife coating device for lead frame includes:
a base plate;
the placing component is arranged on the bottom plate and comprises a pair of fixed side plates arranged on the bottom plate, the placing side plates are arranged on the inner walls of the fixed side plates in an equally-spaced array along the length direction of the inner walls, and clamping strips are formed on the inner walls of the placing side plates;
the scraping and coating mechanism is arranged on the bottom plate;
the placing component is used for placing a plurality of lead frame placing plates, and the scraping mechanism is used for scraping solder paste.
Further, knife coating mechanism is including installing in the first mounting panel of bottom plate, first mounting panel upwards is equipped with extending the riser with extending, the upper end outer wall that extends the riser outwards extends installs and scrapes the coating groove, the upper end that extends the riser is equipped with the drive bearing frame, drive motor is installed to the drive bearing frame, drive motor's output shaft has drive gear, drive gear meshes has from the driving wheel, be equipped with an internal thread section of thick bamboo from the driving wheel, an internal thread section of thick bamboo is worn and is stretched the riser on, the both ends of an internal thread section of thick bamboo all are equipped with the spacing ring, an internal thread section of thick bamboo all is equipped with the knife coating lead screw, the other end of knife coating lead screw is equipped with the end plate, the both ends of end plate outwards extend ground and be equipped with a pair of overhanging guide arm, overhanging guide arm all wears in last riser that extends, the knife coating component is installed to the end plate, the knife coating component is used for the knife coating of tin cream.
Further, the knife coating component is including installing in the overhanging seat of end plate, overhanging seat has worn a pair of post of wearing, the lower extreme of wearing the post all is equipped with the scraper blade, the one side of wearing the post all is equipped with the locating pin, overhanging seat upwards is installed a pair of upward extending bearing frame, upward extend the bearing frame and be located between the post of wearing, one of them is gone up to extend the bearing frame and is installed self-locking motor, self-locking motor's output shaft has the bull stick, the both ends of bull stick all are equipped with the rotor plate, the locating pin all wears in the rotor plate, the key shape hole has all been seted up to the rotor plate, the locating pin all wears in the key shape hole.
Further, the lower end of the scraper is of a wedge-shaped structure.
The technical scheme has the advantages that:
when the core bonding operation is carried out, the solder paste can be fully and fully coated at the corresponding point position of the lead frame, the semiconductor processing efficiency is improved, the yield of the semiconductor is ensured, and the method has strong practicability.
Drawings
Fig. 1 shows a perspective view of one embodiment.
Fig. 2 shows an enlarged view at a.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship which the products of the present invention usually put in use, only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined. For example, "parallel" merely means that the directions are more parallel relative to "perpendicular," and does not mean that the structures are necessarily perfectly parallel, but may be slightly tilted.
Furthermore, the terms "substantially", and the like are intended to indicate that the relative terms are not necessarily strictly required, but may have some deviation. For example: "substantially equal" does not mean absolute equality, but because absolute equality is difficult to achieve in actual production and operation, certain deviations generally exist. Thus, in addition to absolute equality, "substantially equal" also includes the above-described case where there is some deviation. In this case, unless otherwise specified, terms such as "substantially", and the like are used in a similar manner to those described above.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-2, a solder paste spreading apparatus for lead frame includes: the device comprises a bottom plate 1, a placing component 2 and a scraping and coating mechanism 3, wherein the placing component 2 is arranged on the bottom plate 1, and the scraping and coating mechanism 3 is arranged on the bottom plate 1; the placing member 2 is used for placing a plurality of lead frame placing plates, and the scraping mechanism 3 is used for scraping solder paste.
The placing component 2 comprises a pair of fixed side plates 20 arranged on the bottom plate 1, placing side plates 21 are arranged on the inner walls of the fixed side plates 20 along the length direction in an equally spaced array, and clamping strips 22 are formed on the inner walls of the placing side plates 21;
the scraping mechanism 3 comprises a first mounting plate 300 installed on the bottom plate 1, the first mounting plate 300 is provided with an upward extending vertical plate 30 in an upward extending mode, a scraping groove 31 is installed in an outward extending mode on the outer wall of the upper end of the upward extending vertical plate 30, a driving bearing seat 32 is arranged at the upper end of the upward extending vertical plate 30, a driving motor 33 is installed on the driving bearing seat 32, an output shaft of the driving motor 33 is connected with a driving gear 34, the driving gear 34 is meshed with a driven wheel 35, the driven wheel 35 is provided with an internal thread cylinder 36, the internal thread cylinder 36 penetrates through the upward extending vertical plate 30, both ends of the internal thread cylinder 36 are provided with limiting rings, the internal thread cylinder 36 is provided with a scraping lead screw 37, the other end of the scraping lead screw 37 is provided with an end plate 39, both ends of the end plate 39 are provided with a pair of outward extending guide rods 390, the outward guide rods 390 all penetrate through the upward extending vertical plate 30, scraping components are installed on the end plate 39, and are used for scraping tin paste.
Wherein, the knife coating component is including installing in the overhanging seat 391 of end plate 39, overhanging seat 391 has worn a pair of post 397, the lower extreme of wearing post 397 all is equipped with scraper blade 398, the one side of wearing post 397 all is equipped with locating pin 396, overhanging seat 391 is installed a pair of upward extending bearing frame 392 upwards extendedly, upward extending bearing frame 392 is located between wearing the post 397, one of them upward extending bearing frame 392 installs self-locking motor 393, the output shaft of self-locking motor 394 has the bull stick, the both ends of bull stick 394 all are equipped with rotor plate 395, locating pin 396 all wears in rotor plate 395, rotor plate 395 has all seted up key shape hole, locating pin 396 all wears in key shape hole. The lower end of the squeegee 398 is wedge shaped.
The device is according to the problem that exists among the prior art, through bottom plate 1, place component 2 and blade coating mechanism 3 and conveniently carry out the placing of lead frame placement tray to and fully with the tin cream coating in the position department that the lead frame corresponds. Wherein, place component 2 and conveniently carry out placing of lead frame placement tray, wherein the lead frame placement tray is provided with the reference column in it for the placement tray of lead frame accurate positioning, and its both sides are provided with the standing groove, and place component 2 and can carry out placing like above a plurality of trays, and blade coating mechanism 3 conveniently carries out the blade coating operation of tin cream to ensure the sufficiency and the satisfiess of tin cream blade coating, ensure the off-the-shelf quality of semiconductor.
The scraping mechanism 3 can scrape solder paste on a corresponding point of a lead frame, when scraping, the driving motor 33 is started, the driving gear 34 rotates under the driving of the driving motor 33, the rotation of the driving gear 34 drives the driven wheel 35 to rotate, the rotation of the driven wheel 35 drives the internal thread cylinder 36 to rotate, the rotation of the internal thread cylinder 36 enables the scraping screw 37 to do linear motion along the axial direction, the overhanging guide rod 390 plays a guiding and limiting role in the motion of the end plate 39, meanwhile, the scraping stability is ensured, the end plate 39 drives the overhanging seat 391 to move when moving, in the scraping process, the self-locking motor 393 is started, the rotating rod 394 rotates under the driving of the self-locking motor 393, the rotation of the rotating rod 394 drives the penetrating columns 397 to move through the rotating plate 395, one of the penetrating columns 397 moves upwards under the action of the rotating plate 395 when moving, the other post 397 will move downward under the action of the rotating plate 395, and when the post 397 moves downward, the squeegee 398 will move downward, and the squeegee 398 will scrape the solder paste under the driving of the end plate 39 at this time, when the driving motor 33 rotates reversely after the solder paste scraping is completed, the self-locking motor 393 will move the squeegee 398 at the upper end downward, and the squeegee 398 at the lower end will move upward, and then the squeegee 398 will gather the solder paste scraped to one end of the scraping slot 31 to the other end under the driving of the end plate 39, and at this time, the other time of the lead frame scraping operation will be completed.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is apparent that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (4)
1. The utility model provides a lead frame is with tin cream knife coating device which characterized in that includes:
a base plate (1);
the placing component (2) is arranged on the bottom plate (1) and comprises a pair of fixed side plates (20) arranged on the bottom plate (1), the placing side plates (21) are arranged on the inner walls of the fixed side plates (20) in an array at equal intervals along the length direction of the inner walls, and clamping strips (22) are formed on the inner walls of the placing side plates (21);
the blade coating mechanism (3) is arranged on the bottom plate (1);
the placing component (2) is used for placing a plurality of lead frame placing plates, and the scraping mechanism (3) is used for scraping solder paste.
2. The solder paste scraping device for the lead frame according to claim 1, wherein the scraping mechanism (3) comprises a first mounting plate (300) mounted on the bottom plate (1), the first mounting plate (300) is provided with an upward extending riser (30) in an upward extending manner, the outer wall of the upper end of the upward extending riser (30) is provided with a scraping groove (31) in an outward extending manner, the upper end of the upward extending riser (30) is provided with a driving bearing seat (32), the driving bearing seat (32) is provided with a driving motor (33), an output shaft of the driving motor (33) is connected with a driving gear (34), the driving gear (34) is meshed with a driven wheel (35), the driven wheel (35) is provided with an internal thread cylinder (36), the internal thread cylinder (36) penetrates through the upward extending riser (30), both ends of the internal thread cylinder (36) are provided with limiting rings, the scraping cylinder (36) is provided with a scraping screw rod (37), the other end plate (39) is arranged at the other end of the scraping screw rod (37), the both ends of end plate (39) are equipped with a pair of overhanging guide arm (390) outwards extending, and overhanging guide arm (390) all wears in last riser (30), and the blade coating component is installed in end plate (39), and the blade coating component is used for the blade coating of tin cream.
3. The solder paste scraping device for the lead frame according to claim 2, wherein the scraping component comprises an extending seat (391) installed on the end plate (39), a pair of extending columns (397) penetrate through the extending seat (391), scrapers (398) are arranged at the lower ends of the extending columns (397), positioning pins (396) are arranged on one sides of the extending columns (397), a pair of extending bearing seats (392) are installed on the extending seat (391) in an upward extending mode, the extending bearing seats (392) are located between the extending columns (397), a self-locking motor (393) is installed on one of the extending bearing seats (392), an output shaft of the self-locking motor (393) is connected with a rotating rod (394), rotating plates (395) are arranged at two ends of the rotating rod (394), the positioning pins (396) penetrate through the rotating plates (395), key-shaped holes are formed in the rotating plates (395), and the positioning pins (396) penetrate through the key-shaped holes.
4. The solder paste spreading apparatus for lead frames according to claim 3, wherein the lower end of the squeegee (398) has a wedge-shaped structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121403771.7U CN215545620U (en) | 2021-06-23 | 2021-06-23 | Tin cream knife coating device for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121403771.7U CN215545620U (en) | 2021-06-23 | 2021-06-23 | Tin cream knife coating device for lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215545620U true CN215545620U (en) | 2022-01-18 |
Family
ID=79819933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121403771.7U Active CN215545620U (en) | 2021-06-23 | 2021-06-23 | Tin cream knife coating device for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215545620U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115083980A (en) * | 2022-07-21 | 2022-09-20 | 四川明泰微电子有限公司 | Lead frame conveying device for bonding of multi-base-island lead frame and chip |
-
2021
- 2021-06-23 CN CN202121403771.7U patent/CN215545620U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115083980A (en) * | 2022-07-21 | 2022-09-20 | 四川明泰微电子有限公司 | Lead frame conveying device for bonding of multi-base-island lead frame and chip |
| CN115083980B (en) * | 2022-07-21 | 2022-11-11 | 四川明泰微电子有限公司 | Lead frame conveying device for bonding of multi-base-island lead frame and chip |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 629200 No. 1, floor 1, building 1, Gushan Avenue, Shehong Economic Development Zone, Suining City, Sichuan Province Patentee after: Sichuan Tongmiao Automation Equipment Co.,Ltd. Country or region after: China Address before: 629200 No. 1, floor 1, building 1, Gushan Avenue, Shehong Economic Development Zone, Suining City, Sichuan Province Patentee before: Sichuan tongmiao Technology Co.,Ltd. Country or region before: China |