CN215450114U - Computing system and cooling device and cooling assembly used for same - Google Patents

Abstract

The utility model discloses a computing system, a cooling device and a cooling assembly for the computing system. The cooling device comprises a radiator, a base and a cover body. The heat sink includes a plurality of fins extending from a first portion of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves are configured to mate with at least a portion of the plurality of fins of the heat spreader. The cover is configured to couple with the base and encapsulate the heat spreader. The cover also includes two apertures, each aperture configured to couple to a pipe. The width of the plurality of fins of the heat sink is smaller than the width of the plurality of grooves of the base. The height of the heat sink is less than the height of the inner portion of the cover.

Description

Computing system and cooling device and cooling assembly used for same

Technical Field

The present disclosure relates to a method for cooling computing system components, and more particularly, to a liquid cooling method for cooling server system components using a heat sink.

Background

Computer housings and other types of electronic equipment typically contain many heat-generating electronic components. Typically, the heat in the system is confined within the housing. Therefore, additional methods are implemented to reduce the temperature of a particular component or the system as a whole. The amount of heat generated by each element also increases according to the increase in processing capacity. Thus, overheating is a common issue that may negatively impact the performance of the components in the system. Overheating can reduce efficiency and can cause long term damage to the components.

A common method of reducing the temperature of a computing system is to include one or more fans within the system to increase the flow of air. Increasing the flow of air within the system generally reduces the overall temperature of the system. However, it may be difficult to target a particular electronic component, which may generate more heat than other components, and therefore require more cooling. Therefore, liquid cooling systems are often used for direct, localized cooling because such systems have a higher heat transfer rate than fans. Liquid cooling systems may be used as an alternative, or in conjunction with fans.

Liquid cooling systems typically include a cooling assembly having a heat sink, a cooling plate made of metal, and connections for conduits for conducting cooling liquid into and out of the cooling assembly. The cooling assembly is typically placed above components, such as the processing unit, which generate relatively high amounts of heat compared to other components of the system. It is therefore very important not to let liquid leak from the cooling package, since leaking coolant may cause damage to other parts of the system, in particular to the electrical components.

Furthermore, the heat sink in the cooling assembly is typically placed in an orientation in which the protruding fins (fin) of the heat sink extend from the bottom of the heat sink. The fins of the heat sink function to provide additional surface area to increase contact with air or liquid coolant. Therefore, the fins of the heat sink increase the rate of heat dissipation. However, such fin orientation may not provide the most surface area closest to the heat source. In addition, many heat sinks are made of copper or aluminum and may not have optimal thermal conductivity. Better thermal conductivity can increase the rate of heat dissipation, thereby reducing the time to cool system components.

Therefore, there is a need for a cooling system having a high heat dissipation rate. More specifically, there is a need to design a heat sink with more surface area closer to the heat source. In addition, it is desirable to design a heat sink with high thermal conductivity. There is also a need to reduce the time to cool components in a computing system using a cooling assembly.

SUMMERY OF THE UTILITY MODEL

The terms "embodiment" and the like are intended to broadly refer to all subject matter of the disclosure and claims. Statements containing these terms should be understood not to limit the meaning or scope of the subject matter described herein or the claims. The embodiments of the present disclosure referred to herein are defined by the claims, rather than by the teachings of the utility model. The following detailed description is provided to enable any person skilled in the art to make or use the utility model, and is not intended to limit the utility model to the particular forms disclosed. The summary is not intended to identify key or essential features of the claimed subject matter. Nor is the disclosure intended to be used in isolation to determine the scope of the claimed subject matter. The subject matter should be understood with reference to appropriate portions of the entire specification of the disclosure, any or all of the drawings, and each claim.

According to an aspect of the present disclosure, a cooling device for a computing system is disclosed. The device comprises a radiator, a base and a cover body. The heat sink includes a plurality of fins extending from a first portion of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves are configured to mate with at least a portion of the plurality of fins of the heat spreader. The cover is configured to couple with the base and encapsulate the heat spreader.

Another aspect of the present disclosure includes a cooling assembly for a computing system. The cooling assembly includes an inlet tube, an outlet tube, and a device. The inlet piping is configured to deliver liquid into the cooling assembly. The outlet piping is configured to output the liquid out of the cooling assembly. The device comprises a radiator, a base and a cover body. The heat sink includes a plurality of fins extending from a first portion of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves are configured to mate with at least a portion of the plurality of fins of the heat spreader. The cover is configured to couple with the base and encapsulate the heat spreader. The cover includes a connector connected to the inlet pipe to receive the inflow of the liquid coolant, and a connector connected to the outlet pipe to take away the liquid coolant.

The above summary is not intended to represent each embodiment or every aspect of the present disclosure. Rather, the foregoing merely provides examples of some of the novel aspects and features described herein. The above features and advantages, and other features and advantages of the present disclosure, will be readily apparent from the following detailed description of the representative embodiments and modes for carrying out the present disclosure when taken in connection with the accompanying drawings and appended claims. Other aspects of the present disclosure will become apparent to those ordinarily skilled in the art upon review of the following detailed description of various embodiments and with reference to the accompanying figures, which are briefly described below.

Drawings

The present disclosure, together with advantages and drawings thereof, will be best understood from the following description of exemplary embodiments with reference to the accompanying drawings. The drawings depict only exemplary embodiments and are not therefore to be considered to limit the scope of the various embodiments or the claims.

FIG. 1 is a perspective view of a computing system having an exemplary cooling system within a chassis of the computing system.

FIG. 2 is a cross-sectional view of an exemplary heat sink that allows a cooling fluid to flow through.

Fig. 3 is a cross-sectional view of an exemplary base that mates with the heat sink of fig. 2.

Fig. 4 is a cross-sectional view of an exemplary top cover that mates with the base of fig. 3.

FIG. 5 is a perspective view of an exemplary cooling device shown in exploded form.

Fig. 6 is a sectional view of the cooling device of fig. 5.

Fig. 7 is a cross-sectional view of an exemplary heat transfer path between a heat spreader and a base.

FIG. 8 is a perspective view of an exemplary cooling assembly having a transparent top cover.

While the present disclosure is susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in further detail herein. However, it should be understood that the disclosure is not intended to be limited to the particular forms disclosed. On the contrary, the disclosure is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the disclosure as defined by the appended claims.

Description of the reference numerals

100 server system

102 cooling assembly

104 case

106 mainboard

108 power supply

110 connecting port

112 inlet pipe

114 outlet pipe

116 electronic component

117 cooled electronic component

118 top plate

120: bottom plate

122 first side wall

124 second side wall

126 front wall

128 rear wall

200 heat sink

202 fin

206 top part

208 bottom part

210 gap

212 left end of the tube

214 the right end

300 base

302 groove

306 top edge

308 bottom edge

310 left side

312 right side

400, cover body

402 outer part

404 inner part

406 top wall

408 first side wall

410 second side wall

412 third side wall

414 fourth side wall

416 fifth side wall

418 sixth side wall

420 seventh side wall

422 eighth side wall

424 bottom opening

426 first circular hole

428 second round hole

500 cooling device

602 first space

604 second space

606 third space

702 heat source

704 arrow head

800 cooling assembly

802 first group of pipes

804 second group of pipes

806 inlet pipe

808: an outlet pipe

810 first cavity

812 second cavity

Detailed Description

Various embodiments are described with reference to the drawings, wherein like reference numerals are used to refer to like or equivalent elements throughout. The figures are not drawn to scale but are merely illustrative of the present disclosure. Several aspects of the disclosure are described below with reference to application examples, which are set forth below. It should be understood that numerous specific details, relationships, and methods are set forth to provide a full understanding of the disclosure. One skilled in the relevant art will recognize, however, that the disclosure may be practiced without one or more of the specific details, or with other methods. In other instances, well-known structures or operations are not shown in detail to avoid obscuring the disclosure. The various embodiments are not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events. Moreover, not all illustrated acts or events are required to implement a methodology in accordance with the present disclosure.

For example, elements and limitations disclosed in the abstract, the utility model, and the embodiments, but not explicitly recited in the claims, should not be incorporated into the claims by implication, inference, or otherwise, either individually or collectively. In this embodiment, the singular includes the plural and vice versa, unless specifically stated otherwise. The term "including" refers to "including but not limited to". Moreover, approximating words such as "about", "almost", "substantially", "about", and the like may be used herein to connote: the "in," close to, "or" nearly in, "or" within 3 to 5%, or "within acceptable manufacturing tolerances," or any logical combination thereof.

The present disclosure relates to a method for cooling computing system components, and more particularly, to a liquid cooling method that utilizes a heat sink to cool components of a server system.

FIG. 1 is a perspective view of a computing system, such as but not limited to a server system 100. The server system 100 includes a plurality of cooling assemblies 102 in a chassis 104. The illustrated server system 100 includes a chassis 104, a motherboard 106, a power supply 108, a series of connection ports 110, a series of coolant inlet pipes 112, a series of coolant outlet pipes 114, and electronics 116. In other embodiments, the server system 100 may include more or less than the listed elements. The chassis 104 includes a top panel 118, a bottom panel 120, a first side wall 122, a second side wall 124, a front wall 126, and a rear wall 128 to enclose the electronic components of the server system 100. The top and bottom plates 118, 120 are substantially perpendicular to the first and second sidewalls 122, 124.

In some embodiments, the electronic component 116 is a chip, such as a processing unit and a memory unit, including a high density power chip. The electronic components 116 include a group of cooled electronic components 117, wherein the cooled electronic components 117 have been cooled by the cooling assembly 102. A group of electronic components 116 are positioned generally about the enclosure 104 and on the floor 120 between a first sidewall 122 and a second sidewall 124. Another set of electronic components 116 is located generally between the front wall 126 and the rear wall 128. In this example, there are a plurality of cooling assemblies 102 positioned above the electronic components 116. More specifically, the set of cooled electronic components 117 is located below the cooling assembly 102. The cooling assembly 102 may be located in the chassis 104, between the electronic components 116, or above the electronic components 116 to transfer heat away from the electronic components 116. The set of inlet tubes 112 may be connected to a portion of the cooling assembly 102. The set of outlet tubes 114 may also be connected to a portion of the cooling module 102. The power supply 108 may be located near the front wall 126. A series of ports 110 may also be located on the front wall 126. The host board 106 may be located in a portion of the chassis 104 closest to the bottom panel 120 and the rear wall 128.

Various elements of the server system 100, such as processing units, may dissipate, generate, produce, or radiate heat. Thus, heat in the server system 100 may build up if a cooling mechanism is not implemented. The inlet and outlet pipes 112, 114 and the cooling module 102 may function as a cooling system to circulate liquid coolant to reduce the overall temperature in the chassis 104. More specifically, each cooling assembly 102 of the server system 100 may cool an element to a lower temperature by transferring heat to the liquid coolant provided by the inlet pipe 112. Thus, the ambient heat of components near the cooling assembly 102, such as the cooled electronic components 117 located directly below the cooling assembly 102, is absorbed based on the relatively low temperature of the cooling assembly 102, thereby reducing the heat. The outlet pipe 114 then removes the absorbed heat from the heated liquid coolant out of the cooling assembly 102. The heated liquid coolant is circulated to an external heat exchanger (not shown) which removes heat and recirculates the cooled liquid coolant through inlet line 112. This process continues while the inlet and outlet pipes 112, 114 are in operation, circulating liquid coolant to cool the system.

Fig. 2 is a cross-sectional view of a heat sink 200 that allows liquid coolant to flow through. The heat sink 200 may be an element of the cooling package 102 shown in fig. 1. The heat sink 200 includes a top portion 206 and a bottom portion 208. As shown, the heat spreader 200 has a substantially rectangular cross-section and resembles a rectangular prism (prism). A plurality of fins 202 extend from a top portion 206 of the heat sink 200. The plurality of fins 202 may extend the entire length of the top portion 206 of the heat sink 200. The heat sink 200 also has a left end 212 and a right end 214. Each of the plurality of fins 202 may be substantially rectangular in shape and may extend from the top portion 206 to the bottom portion 208 at approximately the same distance. Thus, each of the plurality of fins 202 may generally have the same length. The plurality of fins 202 may have a shape other than a rectangle, such as a triangle. A gap 210 is formed between each of the plurality of fins 202. Each gap 210 may be about the same size and shape or may be a different size and shape and extend to the bottom portion 208. In the present embodiment, the heat sink 200 is made of graphite. In other embodiments, the heat sink 200 may be made of other metals that absorb heat, such as copper or aluminum.

Fig. 3 is a cross-sectional view of a base 300 mated with the heat sink 200 shown in fig. 2. Base 300 includes a top edge 306, a bottom edge 308, a left edge 310, and a right edge 312. In the illustrated embodiment, the base 300 has a generally rectangular cross-section and resembles an octagonal prism. In other embodiments, the shape may resemble a hollow rectangle, pentagon, hexagon, heptagon, nonagon, decagon prism, or a prism having more sides. The plurality of grooves 302 extend from a top edge 306 to a bottom edge 308. The channel 302 does not extend the entire height of the base 300. Furthermore, the plurality of grooves 302 may not extend the entire length of the top surface 306. Thus, left 310 and right 312 give the ends of trench 302. In the illustrated embodiment, the base 300 is made of copper. In other embodiments, the base 300 may be made of another thermally conductive metal, such as aluminum or graphite. In some embodiments, the base 300 may also be a cooling plate. Each of the plurality of grooves 302 may be substantially rectangular in shape. In other embodiments, the plurality of grooves 302 may exhibit a shape other than rectangular, such as triangular. Generally, the shape of the plurality of trenches 302 matches the shape of the plurality of fins 202.

Fig. 4 is a cross-sectional view of the cover 400 mated with the base 300 shown in fig. 3. As shown, the cover 400 has a generally rectangular cross-section with a generally circular cutout, such as a central first circular aperture 426. The three-dimensional shape of the cover 400 resembles a hollow octagonal prism. In other embodiments, the shape of the cover 400 may resemble a hollow rectangular, pentagonal, hexagonal, heptagonal, nonagonal, decagonal prism, or a prism having more than ten sides. The cover 400 includes an outer portion 402 and an inner portion 404. The cover 400 also includes a top wall 406, a first sidewall 408, a second sidewall 410, a third sidewall 412 (shown in fig. 5), a fourth sidewall 414, a fifth sidewall 416 (shown in fig. 5), a sixth sidewall 418 (shown in fig. 5), a seventh sidewall 420, an eighth sidewall 422, and a bottom opening 424. Each of the side walls 408-422 is substantially flat. In some embodiments, the cover 400 may include less than eight sidewalls, such as four-sided sidewalls. The first sidewall 408 and the second sidewall 410 may be parallel to each other. The third sidewall 412 (shown in fig. 5) and the fourth sidewall 414 may be parallel to each other. The fifth sidewall 416 (shown in fig. 5) and the eighth sidewall 422 may be parallel to each other. The sixth sidewall 418 (shown in fig. 5) and the seventh sidewall 420 may be parallel to each other. The cover 400 also includes a first circular aperture 426 and a second circular aperture 428 (shown in fig. 5). In this embodiment, the cover 400 is made of copper. In other embodiments, the cover 400 may be made of other metals, such as aluminum or graphite.

Fig. 5 is a perspective view showing the cooling device 500 as an exploded component. The components of the cooling device 500 may include the heat sink 200, the base 300, and the cover 400. The cooling device 500 may also include two tubes, such as the inlet tube 112 and the outlet tube 114 coupled to the first circular aperture 426 and the second circular aperture 428 in FIG. 1. When the components of the cooling device 500 are assembled together, the bottom portions 208 of the plurality of fins 202 of the heat sink 200 are inserted into the plurality of channels 302 on the top edge 306 of the base 300. Thus, at least a portion of the plurality of fins 202 of the heat sink 200 are received within and mate with the plurality of grooves 302 of the base 300. Accordingly, the width of the plurality of fins 202 of the heat sink 200 is less than the width of the plurality of grooves 302 of the base 300, because each fin 202 is received within each groove 302. Generally, at least a majority of the fins 202 are mated with the plurality of trenches 302. In some embodiments, when the number of fins 202 is less than the number of trenches 302, less than a majority of the fins 202 fit into the plurality of trenches 302.

After the heat sink 200 is coupled to the base 300, the cover 400 is inserted over the base 300. When the cover 400 is coupled to the base 300, the cover 400 encloses the heat sink 200. Therefore, the height of the plurality of fins 202 of the heat sink 200 is less than the height of the cover 400, because the cover 400 fits exactly on the heat sink 200 when the plurality of fins 202 are mated with the plurality of grooves 302 of the base 300. The cover 400 may be coupled to the base 300 by welding the interfacing edges of the cover 400 and the base 300 together so that no liquid leaks from the cover 400. In other embodiments, the cover 400 may be welded (bonded) or permanently adhered to the base 300. Thus, the cover 400 and the base 300 may have the same overall shape. In other embodiments, the base 300 may be larger than the cover 400 to ensure that there is sufficient surface area to secure the cover 400 to the base 300.

Fig. 6 is a sectional view of the cooling device 500. As shown and described above, the plurality of fins 202 of the heat sink 200 are engaged with the plurality of grooves 302 of the base 300, and the cover 400 is coupled to the base 300. Therefore, the length of the heat sink 200 is smaller than that of the base 300. The inner portion 404 of the cover 400 covers the entirety of the heat sink 200. When the cover 400 and the base 300 are coupled, a seal is formed at the internal connection between the cover 400 and the base 300, and thus no liquid can flow out from the interior of the cooling device 500. The seal may fuse, join, secure or otherwise join the components together via welding, soldering or adhesives capable of withstanding higher temperatures. The first bore 426 and the second bore (shown in FIG. 5) are configured to couple with a pipe connection to allow fluid to flow into and out of the cooling device 500.

The cross-sectional view of the cooling device 500 also shows a first space 602, a second space 604 and a third space 606. A first space 602 is defined between the top portion 206 of the heat sink 200 and the top wall 406 of the inner portion 404 of the cover 400. A second space 604 is defined between the left end 212 of the heat sink 200 and the first sidewall 408 of the inner portion 404 of the cover 400. A third space 606 is defined between the right end 214 of the heat sink 200 and the second sidewall 410 of the inner portion 404 of the cover 400. Additional space, not shown in fig. 6, may also be provided between the other walls of the inner portion 404 of the cover 400 and the ends of the heat sink 200. Accordingly, the height of the heat sink 200 is less than the height of the inner portion 404 of the cover 400. Likewise, the length of the heat sink 200 is also smaller than the length of the cover 400.

Each space, including the first space 602, the second space 604, and the third space 606, provides additional flow path opportunities for the liquid coolant to flow from the first circular bore 426 to the second circular bore 428 (shown in fig. 5). In addition, the gaps 210 between the plurality of fins 202 may also provide flow path opportunities for the liquid coolant to flow. The purpose of the liquid coolant is to reduce the temperature of the components surrounding the cooling device 500 by absorbing heat from the electronic components from the base 300 and the fins 202 of the heat sink 200. The liquid coolant may cool the component to a lower temperature by transferring heat to the liquid coolant. Examples of liquid coolants or coolants may include any mixture of water, deionized water, inhibited glycols, or dielectric fluids, including ethylene glycol, propylene glycol, HFE-7100, HFE-7300, R-134 a.

Fig. 7 is a cross-sectional view showing a potential thermal path between heat sink 200 and base 300 at arrow 704. For illustrative purposes, FIG. 7 shows a high density power processing wafer as the heat source 702. In other embodiments, other components of the computing system, such as dual in-line memory modules (DIMMs), processor chips, etc., may be used as heat sources. As the plurality of fins 202 are inserted into the plurality of grooves 302, more surface area is provided from the sides of the fins 202 and the sides of the grooves 302, which may be used to lower the temperature of the heat source 702, than if the heat sink 200 were in an inverted position. Further, each gap 210 provides a space for liquid coolant to pass through. Thus, there is more potential heat absorbing surface near the heat source 702 for cooling the heat source 702. Arrows 704 show exemplary paths through which heat may be transferred and thereby cooled when using a liquid coolant. Therefore, the heat generated by the heat source 702 can be absorbed by the base 300 to reduce the heat. The heat absorbed from the base 300 is transferred to the liquid coolant, and the heat sink 200 assists in absorbing additional heat, thereby maintaining a lower temperature.

Fig. 8 is a perspective view of a cooling assembly 800 with a cover 400, outlining the base 300 and heat sink 200. The cooling module 800 includes the heat sink 200, the base 300, the cover 400, an inlet pipe 806, and an outlet pipe 808. As shown, a first set of tubes 802 and a second set of tubes 804 are used on a first circular aperture 426 and a second circular aperture 428, respectively, of the cover 400. The first and second apertures 426, 428 function to secure the fluid coolant-carrying conduit to the cooling assembly 800. The first and second sets of tubes 802, 804 may be used to connect one end of inlet and outlet tubes 806, 808, respectively, to the cap 400. The first set of tubing 802 and the second set of tubing 804 may be replaced with pipe joints. The first set of tubes 802 and the second set of tubes 804 provide a liquid-tight seal that minimizes the chance of leakage from the first round aperture 426 and the second round aperture 428.

Liquid coolant enters the cooling assembly 800 via inlet tube 806. The liquid coolant enters the first circular bore 426 from the inlet tube 806 and then flows into a first cavity 810 formed by the opening between the cover 400, the left side 310 of the base 300, and the left end 212 of the heat sink 200. The liquid coolant then flows through the heat sink 200 through the plurality of fins 202 and/or any of the first space 602, the second space 604, and the third space 606 previously described and shown in fig. 6. The liquid coolant then flows into a second cavity 812 formed by the opening between the cover 400, the right side 312 of the base 300, and the right end 214 of the heat sink 200. Thereafter, the liquid coolant may continue to flow into the second circular aperture 428 of the cover 400 and into the outlet tube 808 to exit the cooling assembly 800. Although the flow through the cooling assembly 800 is generally linear, some liquid coolant may accumulate in certain areas.

The liquid coolant reduces the temperature of the cooling assembly 800. Because the heat absorbed by the cooling assembly 800 may then be transferred to the liquid coolant, the temperature of the components surrounding the cooling assembly 800 in the server system 100 is reduced as a result. Thus, as the liquid coolant passes from the first cavity 810 to the second cavity 812 of the cooling assembly 800 through the heat sink 200, the temperature of the liquid coolant may increase. Likewise, as the liquid coolant flows from the first circular aperture 426 to the second circular aperture 428 of the cap 400, its temperature also increases. The higher temperature liquid coolant, when flowing through the second cavity 812 of the cooling assembly 800, flows out of the second circular aperture 428 of the cover 400 after absorbing heat from various components of the server system 100 (shown in FIG. 1).

While various embodiments of the present disclosure have been described above, it should be understood that they have been presented by way of example only, and not limitation. Numerous changes to the disclosed embodiments can be made in accordance with the disclosure herein without departing from the spirit or scope of the disclosure. Thus, the breadth and scope of the present disclosure should not be limited by any of the above-described embodiments. Rather, the scope of the disclosure should be defined in accordance with the claims and their equivalents.

Although the disclosed embodiments have been illustrated and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In addition, while a particular feature of the disclosure may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application.

The foregoing description of the embodiments, including what is depicted, has been presented for purposes of illustration and description only and is not intended to be exhaustive or to limit the precise forms disclosed. Numerous modifications, adaptations, and uses thereof will be apparent to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, where the terms "include," "have," "and" variants thereof are used in the detailed description and/or in the claims, these terms are intended to be inclusive in a manner similar to the term "comprise.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. Furthermore, terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Claims (10)

1. A cooling apparatus for a computing system, the cooling apparatus comprising:

a heat sink having a plurality of fins extending from a first portion of the heat sink;

a base comprising a plurality of grooves on a first side, the plurality of grooves configured to mate with at least a portion of the plurality of fins of the heat sink; and

a cover configured to couple with the base and encapsulate the heat spreader.

2. The cooling apparatus of claim 1, wherein the cover further comprises two apertures, each aperture configured to couple to a conduit.

3. The cooling apparatus as claimed in claim 1, wherein the width of the plurality of fins of the heat sink is smaller than the width of the plurality of grooves of the base; the height of the radiator is less than that of an inner part of the cover body; the length of the radiator is smaller than that of the base.

4. The cooling apparatus as claimed in claim 1, wherein the heat sink is formed of graphite, and wherein the cover and the base are formed of metal.

5. A cooling assembly for a computing system, the cooling assembly comprising:

an inlet tube configured to deliver liquid into the cooling module;

an outlet tube configured to output liquid out of the cooling module; and

an apparatus, comprising:

a heat sink having a plurality of fins extending from a first portion of the heat sink;

a base comprising a plurality of grooves on a first side, the plurality of grooves configured to mate with at least a portion of the plurality of fins of the heat sink; and

a cover configured to couple to the base and enclose the heat sink, wherein the cover includes a connector coupled to the inlet tube to receive the inflow of liquid coolant and a connector coupled to the outlet tube to carry away the liquid coolant.

6. The cooling assembly of claim 5, wherein the cover further comprises two apertures, each aperture configured to be connected to either the outlet tube or the inlet tube.

7. The cooling assembly of claim 5 wherein the fins of the heat sink have a width less than the width of the grooves of the base; the height of the radiator is less than that of an inner part of the cover body; the length of the radiator is smaller than that of the base.

8. A computing system, comprising:

an inlet tube capable of being coupled to a liquid coolant circulation system for conveying liquid coolant therefrom;

an outlet pipe capable of being coupled to the liquid coolant circulation system for delivering liquid coolant to the liquid coolant circulation system;

an electronic component generating heat; and

an apparatus thermally coupled to the electronic component, the apparatus comprising:

a heat sink having a plurality of fins extending from a first portion of the heat sink;

a base comprising a plurality of grooves on a first side, the plurality of grooves configured to mate with at least a portion of the plurality of fins of the heat sink; and

a cover configured to couple to the base and enclose the heat sink, wherein the cover is configured to couple to the inlet pipe and the outlet pipe.

9. The computing system of claim 8, wherein the cover further comprises two apertures, each aperture configured to couple to the outlet tube or the inlet tube.

10. The computing system of claim 8, wherein a width of the fins of the heat spreader is less than a width of the trenches of the base; the height of the radiator is less than that of an inner part of the cover body; the length of the radiator is smaller than that of the base.

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