CN215438625U - Chip feeding equipment - Google Patents

Abstract

The application provides a chip charging equipment includes: the device comprises a transfer device, a feeding device, a direction detection device, a direction adjusting device and a feeding device; the transfer device comprises a transfer disc and a plurality of carrier mechanisms, wherein a feeding station, a direction detection station, a direction adjustment station and a feeding station are preset in sequence along the transfer disc, the carrier mechanisms are arranged at intervals along the periphery of the transfer disc and are used for bearing chips, and the feeding device is arranged at the feeding station and is used for placing the chips on the carrier mechanisms; the direction detection device is arranged at the direction detection station and used for detecting the direction of the chip; the direction adjusting device is arranged at the direction adjusting station and used for adjusting the direction of the chip; the feeding device is arranged at the feeding station and used for transferring the chip to a preset area. The equipment can obviously improve the efficiency of chip loading, and the probability of chip reverse arrangement is lower.

Description

Chip feeding equipment

Technical Field

The application relates to the technical field of chip processing, in particular to a chip loading device.

Background

With the development of molecular biology theory and technology, the chip technology has the advantages of high throughput, diversity, miniaturization and automation in the aspect of detection. In the molecular detection of various pathogens, detection is often performed against genes of the pathogen. The chip technology can perform qualitative and quantitative analysis on RNA and DNA of various pathogens, thereby helping a diagnostician to determine the types of diseases and the infection degrees of the diseases. Chip technology therefore plays an increasingly important role in the diagnosis of infectious diseases and the screening of pathogens. Before the manufactured chip is assembled, the chip needs to be placed in a designated area, namely, the chip needs to be loaded.

However, the existing chip feeding process is completed manually, the chip needs to be taken out manually from the place where the chip is stored, and the next step of assembly process is only started when the chip is determined not to be broken and the direction is correct, so that the efficiency of the method is too low, and the chip is easily put backwards during manual feeding, and the requirement of fast-beat production cannot be met.

Disclosure of Invention

An object of this application is to provide a chip charging equipment, can satisfy the requirement of fast beat production, is showing the efficiency that promotes the chip material loading, and the probability that the chip was put to the contrary is lower.

The purpose of the application is realized by adopting the following technical scheme:

a chip loading apparatus, comprising: the device comprises a transfer device, a feeding device, a direction detection device, a direction adjusting device and a feeding device; the transfer device comprises a transfer disc and a plurality of carrier mechanisms, wherein a feeding station, a direction detection station, a direction adjustment station and a feeding station are preset in sequence along the transfer disc, the carrier mechanisms are arranged at intervals along the periphery of the transfer disc and are used for bearing chips, and the transfer disc operates to enable the carrier mechanisms to flow between the preset stations in a reciprocating mode; the feeding device is arranged at the feeding station and is used for placing the chips on the carrier mechanism which flows to the feeding station; after feeding is finished, the transferring device transfers the chip flow to the direction detection station; the direction detection device is arranged at the direction detection station and used for detecting whether the mounting direction of the chip which flows to the direction detection station on the carrier mechanism is the same as the preset direction or not; after the detection of the installation direction of the chip is finished, the transferring device transfers the chip to the direction adjusting station; the direction adjusting device is arranged at the direction adjusting station and is used for adjusting the mounting direction of the chip which is transferred to the direction adjusting station and has the mounting direction different from the preset direction; after the adjustment of the installation direction of the chip is completed, the transferring device transfers the chip to the feeding station; the feeding device is arranged at the feeding station and used for transferring the chips which are transferred to the feeding station to a preset area. The technical scheme has the beneficial effects that on one hand, the feeding device, the direction detection device, the direction adjusting device and the feeding device can be arranged at intervals along the periphery of the transfer disc, so that the space is fully utilized, the whole feeding equipment has a compact structure, and the chip feeding efficiency is improved; on the other hand, the operation such as feeding, direction detection, direction adjustment and the pay-off of chip can be accomplished in proper order to the transport dish at the moving in-process, closely links up between each process, can satisfy the requirement of fast beat production, is showing the efficiency that promotes the chip material loading, and the probability that the chip was put to the wrong is lower.

In some optional embodiments, the feeding device comprises a feeding mechanism and a taking mechanism, the feeding mechanism is used for placing the chips, and the taking mechanism is used for transferring the chips placed on the feeding mechanism to a carrier mechanism at the feeding station; the feeding mechanism comprises a bearing component, a mounting frame and a first base, wherein the bearing component is arranged on the upper surface of the mounting frame, and the mounting frame is slidably arranged on the upper surface of the first base. The beneficial effects of this technical scheme lie in, the mounting bracket can be at the last surface slip of first base for feeding mechanism can be close to feeding mechanism, and when a plurality of chips were placed on feeding mechanism, feeding mechanism's position can be adjusted at any time, shortens the distance of the last chip of feeding mechanism and feeding mechanism, further improves the efficiency of chip material loading.

In some alternative embodiments, the carrier assembly includes a shelf and a tray; the article placing plate is arranged on the upper surface of the supporting plate, a positioning pin is arranged on one side, close to the material taking mechanism, of the upper surface of the supporting plate and used for fixing the article placing plate, close to one side of the material taking mechanism, and a positioning screw is further arranged on one side, far away from the material taking mechanism, of the upper surface of the supporting plate and used for fixing one side, far away from the material taking mechanism, of the article placing plate. The technical scheme has the beneficial effects that on one hand, the object placing plate can be fixed on the upper surface of the supporting plate by arranging the positioning pin and the positioning screw; on the other hand, the set screw can set up in the upper surface of layer board and keep away from one side of extracting mechanism, can leave sufficient space and screw up the set screw.

In some optional embodiments, the upper surface of the object placing plate is provided with a first hole for placing a chip; the upper surface of mounting bracket is the inclined plane and towards the feeding agencies. The beneficial effects of this technical scheme lie in, the upper surface of mounting bracket can set up to the inclined plane and towards extracting mechanism for put the chip on the thing board towards extracting mechanism one side slope, avoid the chip to rock in the first hole of putting the thing board.

In some optional embodiments, the carrier mechanism is provided with a second hole for accommodating the chip, and the radius of the second hole is gradually reduced from top to bottom. The technical scheme has the beneficial effects that on one hand, the contact area between the surface of the chip and the carrier mechanism can be reduced under the condition of ensuring the chip to be stably placed, and the chip is prevented from being scraped; on the other hand, the radius of the upper part of the second hole is larger, so that the chip is convenient to take and place.

In some optional embodiments, an upper end of the chip mounted on the carrier mechanism is provided with a chamfer for identifying a direction; the direction detection device comprises a ccd camera. The technical scheme has the beneficial effects that the ccd camera can judge whether the installation direction of the chip on the carrier mechanism is the same as the preset direction or not by detecting the position of the chamfer of the chip on the carrier mechanism.

In some optional embodiments, the direction adjusting device includes a first clamping jaw for clamping the chip from the carrier mechanism, a first air cylinder for driving the first clamping jaw to rotate, a first guide rail for mounting the first clamping jaw and the first air cylinder, and a second air cylinder for driving the first clamping jaw and the first air cylinder to move up and down on the first guide rail. This technical scheme's beneficial effect lies in, when the installation orientation of the chip on the carrier mechanism needs the adjustment, the chip is got to first clamping jaw clamp, and the second cylinder drives the chip and follows first guide rail rebound, and first cylinder drives the chip rotatory, makes the orientation adjustment of chip to predetermineeing the orientation, and after the adjustment was accomplished, the second cylinder drives the chip and follows first guide rail rebound, puts back the chip in original place, from this, accomplishes the adjustment to the installation orientation of chip.

In some optional embodiments, the direction adjusting device further comprises a second guide rail and a third air cylinder, the first guide rail and the second air cylinder are mounted on the second guide rail, and the third air cylinder is used for driving the first guide rail and the second air cylinder to horizontally move on the second guide rail. This technical scheme's beneficial effect lies in, when placing a plurality of chips on the carrier mechanism, can utilize third cylinder drive first guide rail and second cylinder along second guide rail horizontal migration, and then drive first clamping jaw and first cylinder along second guide rail horizontal migration for direction adjusting device can adjust one by one the installation direction of a plurality of chips that lie in same carrier mechanism, improves work efficiency.

In some optional embodiments, the feeding device comprises a second base and a chip grabbing component, and the chip grabbing component is arranged on the side surface of the second base in a lifting and horizontal sliding manner. This technical scheme's beneficial effect lies in, after the chip stream turned to pay-off station department, the chip snatchs the subassembly and drives the chip rebound, drives the side horizontal migration of chip edge second base again to shift the chip to preset the region.

In some optional embodiments, the chip grabbing assembly includes a second clamping jaw for clamping the chip from the carrier mechanism, a third guide rail for mounting the second clamping jaw, a fourth cylinder for driving the second clamping jaw to ascend and descend on the third guide rail, and a fifth cylinder for driving the chip grabbing assembly to horizontally slide on the second base. This technical scheme's beneficial effect lies in, after the chip stream turned to pay-off station department, the second clamping jaw got the chip clamp, and the second clamping jaw drives the chip along third guide rail rebound under the effect of fourth cylinder, drives the chip along second base horizontal slip afterwards under the effect of fifth cylinder to shift the chip to preset the region.

Drawings

The present application is further described below with reference to the drawings and examples.

Fig. 1 is a schematic structural diagram of a chip feeding apparatus provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a chip provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a transfer device provided in an embodiment of the present application;

fig. 4 is a schematic structural diagram of a carrier mechanism according to an embodiment of the present disclosure;

fig. 5 is a schematic cross-sectional view of a carrier mechanism according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of an orientation detection apparatus according to an embodiment of the present application;

FIG. 7 is an exploded view of a feeding device according to an embodiment of the present disclosure;

FIG. 8 is a schematic structural diagram of a load bearing assembly provided in an embodiment of the present application;

fig. 9 is a schematic structural diagram of a mounting bracket according to an embodiment of the present application;

FIG. 10 is a schematic structural diagram of a direction adjustment apparatus according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a feeding device according to an embodiment of the present application.

In the figure: 1. a chip feeding device; 2. a chip; 2c, chamfering; 10. a feeding device; 11. a feeding mechanism; 111. a load bearing assembly; 1111. a support plate; 1111a, a positioning screw; 1111b, a positioning pin; 1112. a storage plate; 112. a mounting frame; 1121. a positioning column; 1122. a rapid clamp; 113. a first base; 12. a material taking mechanism; 20. a direction detecting device; 21. a light source; 22. a ccd camera; 23. a photographing route; 30. a direction adjusting device; 31. a first jaw; 32. a first cylinder; 33. a first guide rail; 34. a second cylinder; 35. a second guide rail; 36. a third cylinder; 40. a feeding device; 41. a second base; 42. a chip grabbing component; 421. a second jaw; 422. a third guide rail; 423. a fourth cylinder; 424. a fifth cylinder; 50. a transfer device; 51. a carrier mechanism; 511. a second hole; 52. and (7) transferring the disc.

Detailed Description

The present application is further described with reference to the accompanying drawings and the detailed description, and it should be noted that, in the present application, the embodiments or technical features described below may be arbitrarily combined to form a new embodiment without conflict.

Referring to fig. 1 to 11, an embodiment of the present application provides a chip loading apparatus 1, including: the device comprises a transfer device 50, a feeding device 10, a direction detection device 20, a direction adjusting device 30 and a feeding device 40;

the transfer device 50 comprises a transfer disc 52 and a plurality of carrier mechanisms 51, wherein a feeding station, a direction detection station, a direction adjusting station and a feeding station are preset in sequence along the transfer disc 52, the carrier mechanisms 51 are arranged at intervals along the periphery of the transfer disc 52, the carrier mechanisms 51 are used for bearing the chips 2, and the transfer disc 52 operates to enable the carrier mechanisms 51 to flow back and forth between the preset stations;

the feeding device 10 is arranged at the feeding station, and the feeding device 10 is used for placing the chips 2 on the carrier mechanism 51 which is circulated to the feeding station;

after the feeding is finished, the transferring device 50 transfers the chip 2 to the direction detection station; the direction detection device 20 is disposed at the direction detection station, and is configured to detect whether an installation direction of the chip 2, which is flowed to the direction detection station, on the carrier mechanism 51 is the same as a preset direction;

after the detection of the mounting direction of the chip 2 is completed, the transferring device 50 transfers the chip 2 to the direction adjusting station; the direction adjusting device 30 is arranged at the direction adjusting station and is used for adjusting the mounting direction of the chip 2, which is transferred to the direction adjusting station and has a mounting direction different from a preset direction;

after the adjustment of the mounting direction of the chip 2 is completed, the transferring device 50 transfers the chip 2 to the feeding station; the feeding device 40 is disposed at the feeding station, and is configured to transfer the chips 2 that have flowed to the feeding station to a preset area. The preset area may be a preset area, and after the chip 2 is transferred to the preset area, the chip 2 may be assembled.

In a specific application, the upper end of the chip 2 mounted on the carrier mechanism 51 is provided with a chamfer 2c for identifying the direction. Generally speaking, the upper end of the chip 2 can be clamped, and the lower end of the chip 2 should be prevented from contacting other objects, so as to avoid affecting the detection accuracy of the chip 2.

Referring to fig. 1 to 4, the chip 2 has opposite front and back surfaces, opposite left and right side surfaces, and a surface perpendicular to the upper surface of the transfer tray 52, perpendicular to the radial direction of the transfer tray 52, and adjacent to the center of the transfer tray 52 is used as the front surface of the chip 2, and with the front surface of the chip 2 as a reference, the left side surface of the chip 2 is the left side surface of the chip 2, and the right side surface of the chip 2 is the right side surface of the chip 2.

After the chip 2 is placed on the carrier mechanism 51, if the chamfer 2c of the chip 2 is located on the left side surface of the upper end of the chip 2, the mounting direction of the chip 2 is different from the preset direction; if the chamfer 2c of the chip 2 is located on the right side of the upper end of the chip 2, the mounting direction of the chip 2 is the same as the preset direction.

If the installation direction of the chip 2 is the same as the preset direction, after the transferring device 50 transfers the chip 2 to the direction adjusting station, the direction adjusting device 30 does not need to adjust the installation direction of the chip 2, the transferring device 50 transfers the chip 2 to the material conveying station, and the feeding device 40 transfers the chip 2 to the preset area.

Therefore, on one hand, the feeding device 10, the direction detection device 20, the direction adjusting device 30 and the feeding device 40 can be arranged at intervals along the periphery of the transfer disc 52, so that the space is fully utilized, the whole feeding equipment has a compact structure, and the chip feeding efficiency is improved; on the other hand, the transfer disc 52 can finish the processes of feeding, direction detection, direction adjustment, feeding and the like of the chip 2 in sequence in the operation process, and the processes are closely linked, so that the requirement of fast-beat production can be met, the chip feeding efficiency is obviously improved, and the probability of turning back the chip 2 is lower.

In a specific embodiment, the feeding apparatus may further include a control device, and the transfer device 50, the feeding device 10, the direction detecting device 20, the direction adjusting device 30, and the feeding device 40 may be respectively in communication connection with the control device, and the control device controls the orderly operation of the devices of the chip feeding apparatus 1 to realize the feeding of the chip 2.

The control device may be any suitable computing device, such as a personal computer, a server, a Programmable Logic Controller (PLC), a single chip, or an integrated computer device, and has functions of receiving information and sending control commands, and the control device may control each device to perform corresponding actions through wired communication or wireless communication, so as to complete loading of the chip 2.

Referring to fig. 6, in a specific embodiment, the direction detection device 20 may include a ccd camera 22. Specifically, a light source 21 is disposed between the ccd camera 22 and the chip 2 at the direction detection station, light reflected by the chip 2 enters a lens of the ccd camera 22 along a photographing route 23, and it is possible to detect whether the mounting direction of the chip 2 on the carrier mechanism 51 is the same as the preset direction according to imaging of the chip 2. Wherein, the photographing route 23 is directed to the lens of the ccd camera 22 from each point on the surface of the chip 2.

Thus, the ccd camera 22 can determine whether the mounting direction of the chip 2 on the carrier mechanism 51 is the same as the preset direction by detecting the position of the chamfer 2c of the chip 2 on the carrier mechanism 51.

Referring to fig. 1, 7 to 9, in an embodiment, the feeding device 10 may include a feeding mechanism 11 and a material taking mechanism 12, the feeding mechanism 11 may be used for placing the chip 2, and the material taking mechanism 12 may be used for transferring the chip 2 placed on the feeding mechanism 11 to a carrier mechanism 51 at the feeding station; the feeding mechanism 11 may include a bearing assembly 111, a mounting bracket 112 and a first base 113, wherein the bearing assembly 111 may be disposed on an upper surface of the mounting bracket 112, and the mounting bracket 112 may be slidably disposed on an upper surface of the first base 113.

From this, mounting bracket 112 can slide at the upper surface of first base 113 for feeding mechanism 11 can be close to extracting mechanism 12, and when placing a plurality of chips 2 on feeding mechanism 11, can adjust feeding mechanism 11's position at any time, shortens extracting mechanism 12 and the last chip 2's of feeding mechanism 11 distance, further improves the efficiency of chip material loading.

Referring to FIG. 8, in one embodiment, the carrier assembly 111 may include a shelf 1112 and a tray 1111; the object placing plate 1112 can be arranged on the upper surface of the supporting plate 1111, a positioning pin 1111b can be arranged on one side of the upper surface of the supporting plate 1111, which is adjacent to the material taking mechanism 12, for fixing one side of the object placing plate 1112, which is adjacent to the material taking mechanism 12, and a positioning screw 1111a can be arranged on one side of the upper surface of the supporting plate 1111, which is far away from the material taking mechanism 12, for fixing one side of the object placing plate 1112, which is far away from the material taking mechanism 12.

Thus, on the one hand, by providing positioning pin 1111b and positioning screw 1111a, object placing plate 1112 can be fixed to the upper surface of supporting plate 1111; on the other hand, the set screw 1111a may be disposed on a side of the upper surface of the supporting plate 1111 away from the material taking mechanism 12, and a sufficient space may be left for screwing the set screw 1111 a.

In a specific application, a plurality of object placing plates 1112 can be placed on each supporting plate 1111, the number of the object placing plates 1112 can be determined according to the length of the supporting plate 1111, the number of the object placing plates 1112 is, for example, 5, each object placing plate 1112 can contain a plurality of chips 2, the object placing plates 1112 full of the chips 2 can be manually fixed on the upper surface of the supporting plate 1111, one side of the object placing plates 1112 is fixed by a positioning pin 1111b, and the other side of the object placing plates 1112 is fixed on one side of the upper surface of the supporting plate 1111 away from the material taking mechanism 12 by manually tightening a positioning screw 1111 a.

Referring to fig. 8 and 9, in a specific application, a positioning pillar 1121 is disposed on a side of the upper surface of the mounting frame 112 adjacent to the material taking mechanism 12, a U-shaped groove matched with the positioning pillar 1121 is disposed on a side of the supporting plate 1111 adjacent to the material taking mechanism 12, and a side of the supporting plate 1111 adjacent to the material taking mechanism 12 can be fixed to the upper surface of the mounting frame 112 through the positioning pillar 1121;

a quick clamp 1122 is arranged on one side of the upper surface of the mounting frame 112 away from the material taking mechanism 12, and one side of the supporting plate 1111 away from the material taking mechanism 12 can be fixed on the upper surface of the mounting frame 112 through the quick clamp 1122.

In one embodiment, the top surface of the object placing plate 1112 may be provided with a first hole for placing the chip 2; the upper surface of the mounting bracket 112 may be sloped and face the take-off mechanism 12.

The number of the first holes on each object placing plate 1112 may be multiple, the first holes on the object placing plate 1112 may be distributed in a rectangular array, the number of the first holes may be determined according to the size of the object placing plate 1112, and the arrangement of the first holes is, for example, 8 rows and 12 columns.

In a specific application, the cross-sectional shape of the first hole may be circular or elliptical, and when the chip 2 is placed in the first hole, the contact area between the surface of the chip 2 and the carrier plate is small, so that the chip 2 can be prevented from being scratched.

From this, the upper surface of mounting bracket 112 can set up to the inclined plane and towards extracting mechanism 12 for put chip 2 on thing board 1112 and incline towards extracting mechanism 12 one side, avoid chip 2 to rock in putting the first downthehole of thing board 1112.

With continued reference to fig. 5, in one embodiment, the carrier mechanism 51 is provided with a second hole 511 for accommodating the chip 2, and the radius of the second hole 511 is gradually reduced from top to bottom.

The chip 2 has the characteristics of small size and fragile structure, most part of the lower end of the chip 2 cannot be touched to avoid influencing the detection accuracy, and the structural design of the carrier mechanism 51 can reduce the contact area between the surface of the chip 2 and the carrier mechanism 51 under the condition of ensuring the chip 2 to be stably placed on one hand, and avoid the chip 2 from being scratched and influencing the detection accuracy; on the other hand, the radius of the upper part of the second hole 511 is larger, so that the chip 2 is convenient to pick and place, and the chip 2 is not easy to break.

In one embodiment, the material taking mechanism 12 may include a 4-axis robot, and the 4-axis robot may be used to transfer the chip 2 placed on the feeding mechanism 11 to the carrier mechanism 51 at the feeding station.

Referring to fig. 10, in an embodiment, the direction adjusting device 30 may include a first clamping jaw 31 for clamping the chip 2 from the carrier mechanism 51, a first cylinder 32 for driving the first clamping jaw 31 to rotate, a first guide rail 33 for mounting the first clamping jaw 31 and the first cylinder 32, and a second cylinder 34 for driving the first clamping jaw 31 and the first cylinder 32 to move up and down on the first guide rail 33.

In a specific application, when the chamfer 2c of the chip 2 transferred to the direction adjusting station is located on the left side of the upper end of the chip 2, the mounting direction of the chip 2 is different from the preset direction, and the mounting direction of the chip 2 on the carrier mechanism 51 needs to be adjusted. The first cylinder 32 may rotate the chip 2 by 180 ° so that the chamfer 2c of the rotated chip 2 is located on the right side of the upper end of the chip 2.

From this, when the installation direction of chip 2 on carrier mechanism 51 needs to be adjusted, chip 2 is got to first clamping jaw 31 clamp, and second cylinder 34 drives chip 2 along first guide rail 33 rebound, and first cylinder 32 drives chip 2 rotatory, makes the direction adjustment of chip 2 to predetermineeing the direction, and after the adjustment was accomplished, second cylinder 34 drives chip 2 along first guide rail 33 rebound, puts back chip 2 in the original place, from this, accomplishes the adjustment to the installation direction of chip 2.

In a specific embodiment, the direction adjustment device 30 may further include a second guide rail 35 and a third cylinder 36, the first guide rail 33 and the second cylinder 34 may be mounted on the second guide rail 35, and the third cylinder 36 may be used to drive the first guide rail 33 and the second cylinder 34 to move horizontally on the second guide rail 35.

Therefore, when a plurality of chips 2 are placed on the carrier mechanism 51, the third cylinder 36 can be used to drive the first guide rail 33 and the second cylinder 34 to horizontally move along the second guide rail 35, so as to drive the first clamping jaw 31 and the first cylinder 32 to horizontally move along the second guide rail 35, so that the direction adjusting device 30 can adjust the installation directions of the plurality of chips 2 on the same carrier mechanism 51 one by one, and the work efficiency is improved.

Referring to fig. 11, in an embodiment, the feeding device 40 may include a second base 41 and a chip grabbing assembly 42, and the chip grabbing assembly 42 is disposed on a side surface of the second base 41 in a manner of being lifted and horizontally slid.

From this, after chip 2 circulates to material conveying station department, chip snatchs subassembly 42 and drives chip 2 rebound, drives chip 2 along the side horizontal migration of second base 41 again to shift chip 2 to preset the region.

In an embodiment, the chip grabbing assembly 42 may include a second clamping jaw 421 for clamping the chip 2 from the carrier mechanism 51, a third guide rail 422 for mounting the second clamping jaw 421, a fourth air cylinder 423 for driving the second clamping jaw 421 to ascend and descend on the third guide rail 422, and a fifth air cylinder 424 for driving the chip grabbing assembly 42 to horizontally slide on the second base 41.

From this, after chip 2 circulated to the material station department of sending, second clamping jaw 421 presss from both sides chip 2 and gets, and second clamping jaw 421 drives chip 2 along third guide rail 422 upward movement under the effect of fourth cylinder 423, drives chip 2 along second base 41 horizontal slip under the effect of fifth cylinder 424 afterwards to shift chip 2 to preset the region.

While the present application is described in terms of various aspects, including exemplary embodiments, the principles of the invention should not be limited to the disclosed embodiments, but are also intended to cover various modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A chip loading apparatus, comprising: the device comprises a transfer device, a feeding device, a direction detection device, a direction adjusting device and a feeding device;

the transfer device comprises a transfer disc and a plurality of carrier mechanisms, wherein a feeding station, a direction detection station, a direction adjustment station and a feeding station are preset in sequence along the transfer disc, the carrier mechanisms are arranged at intervals along the periphery of the transfer disc and are used for bearing chips, and the transfer disc operates to enable the carrier mechanisms to flow between the preset stations in a reciprocating mode;

the feeding device is arranged at the feeding station and is used for placing the chips on the carrier mechanism which flows to the feeding station;

after feeding is finished, the transferring device transfers the chip flow to the direction detection station; the direction detection device is arranged at the direction detection station and used for detecting whether the mounting direction of the chip which flows to the direction detection station on the carrier mechanism is the same as the preset direction or not;

after the detection of the installation direction of the chip is finished, the transferring device transfers the chip to the direction adjusting station; the direction adjusting device is arranged at the direction adjusting station and is used for adjusting the mounting direction of the chip which is transferred to the direction adjusting station and has the mounting direction different from the preset direction;

after the adjustment of the installation direction of the chip is completed, the transferring device transfers the chip to the feeding station; the feeding device is arranged at the feeding station and used for transferring the chips which are transferred to the feeding station to a preset area.

2. The chip loading apparatus according to claim 1, wherein the feeding device includes a feeding mechanism for placing a chip and a picking mechanism for transferring the chip placed on the feeding mechanism onto a carrier mechanism at the feeding station;

the feeding mechanism comprises a bearing component, a mounting frame and a first base, wherein the bearing component is arranged on the upper surface of the mounting frame, and the mounting frame is slidably arranged on the upper surface of the first base.

3. The chip loading apparatus according to claim 2, wherein the carrier assembly includes a placement plate and a pallet;

the article placing plate is arranged on the upper surface of the supporting plate, a positioning pin is arranged on one side, close to the material taking mechanism, of the upper surface of the supporting plate and used for fixing the article placing plate, close to one side of the material taking mechanism, and a positioning screw is further arranged on one side, far away from the material taking mechanism, of the upper surface of the supporting plate and used for fixing one side, far away from the material taking mechanism, of the article placing plate.

4. The chip feeding apparatus according to claim 3, wherein the upper surface of the placement plate is provided with a first hole for placing a chip;

the upper surface of mounting bracket is the inclined plane and towards the feeding agencies.

5. The chip loading apparatus according to claim 1, wherein the carrier mechanism is provided with a second hole for receiving the chip, and the radius of the second hole is gradually reduced from top to bottom.

6. The chip loading apparatus according to claim 1, wherein an upper end of the chip mounted on the carrier mechanism is provided with a chamfer for identifying a direction;

the direction detection device comprises a ccd camera.

7. The chip feeding apparatus according to claim 1, wherein the direction adjusting device comprises a first clamping jaw for clamping the chip from the carrier mechanism, a first cylinder for driving the first clamping jaw to rotate, a first guide rail for mounting the first clamping jaw and the first cylinder, and a second cylinder for driving the first clamping jaw and the first cylinder to move up and down on the first guide rail.

8. The chip feeding apparatus according to claim 7, wherein the direction adjusting device further comprises a second guide rail and a third cylinder, the first guide rail and the second cylinder are mounted on the second guide rail, and the third cylinder is configured to drive the first guide rail and the second cylinder to move horizontally on the second guide rail.

9. The chip feeding device according to claim 1, wherein the feeding device comprises a second base and a chip grabbing component, and the chip grabbing component is arranged on the side surface of the second base in a lifting and horizontal sliding manner.

10. The chip loading apparatus according to claim 9, wherein the chip grabbing assembly comprises a second clamping jaw for grabbing the chip from the carrier mechanism, a third guide rail for mounting the second clamping jaw, a fourth cylinder for driving the second clamping jaw to ascend and descend on the third guide rail, and a fifth cylinder for driving the chip grabbing assembly to horizontally slide on the second base.

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