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CN215415589U - Expansion type high-voltage acquisition board for HIL (hardware in the loop) test equipment - Google Patents

Expansion type high-voltage acquisition board for HIL (hardware in the loop) test equipment Download PDF

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Publication number
CN215415589U
CN215415589U CN202121582360.9U CN202121582360U CN215415589U CN 215415589 U CN215415589 U CN 215415589U CN 202121582360 U CN202121582360 U CN 202121582360U CN 215415589 U CN215415589 U CN 215415589U
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interface
voltage
relay
state simulation
driving
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εˆ˜ζ™“δΉ‰
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Jiangsu Dupu New Energy Technology Co ltd
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Dupu Suzhou New Energy Technology Co ltd
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Abstract

The utility model discloses an expansion type high-voltage acquisition board for HIL (hardware in the loop) test equipment, which comprises a high-voltage acquisition board card (1), and a high-voltage interface (2), a state simulation interface (3) and a driving interface (4) which are arranged on the high-voltage acquisition board card (1); the high-voltage acquisition board card (1) is connected with a high-voltage interface of HIL test equipment (5) through a high-voltage interface (2), the high-voltage acquisition board card (1) is connected with a sampling interface (61) of a mobile charging pile controller (6) through a state simulation interface (3), and the high-voltage acquisition board card (1) is connected with a relay driving interface (62) of the mobile charging pile controller (6) through a driving interface (4). According to the utility model, the high-voltage acquisition board card is introduced between the HIL test equipment and the mobile charging pile controller, so that the requirement on high-voltage sampling resources of the HIL test equipment is reduced when the mobile charging pile controller is tested and verified, the hardware cost is saved, and various fault scenes can be simulated more conveniently.

Description

Expansion type high-voltage acquisition board for HIL (hardware in the loop) test equipment
Technical Field
The utility model relates to a battery pack testing device, In particular to an extensible high-voltage acquisition board for an HIL (Hardware In the Loop, which means a Hardware-In-Loop, hereinafter referred to as HIL) testing device.
Background
The mobile charging pile in the prior art generally comprises an ACDC module, a DCDC module, an energy storage battery pack and the like. The output of each module needs to be controlled by a relay, and each relay needs to be diagnosed and controlled by a high-voltage sampling point, such as the diagnosis of the normally open and adhered faults of the high-voltage relay, the judgment of whether a battery is reversely connected, the judgment of whether a fuse is in fault and the like, which all need to use the high-voltage sampling point to diagnose. And along with the continuous development of the mobile charging pile technology, the expansion of the functional module of the mobile charging pile technology, the required high-voltage sampling points are more and more. Therefore, when the HIL testing device (i.e., the complete vehicle hardware-in-the-loop testing device) in the prior art is used for testing and verifying the mobile charging pile controller, the HIL testing device needs to have enough high-voltage sampling resources for detecting the high-voltage sampling points, and occupies a large amount of high-voltage resources on the HIL testing device, so that the hardware cost is greatly increased.
Disclosure of Invention
The utility model aims to provide an expansion type high-voltage acquisition board for HIL testing equipment, which can reduce the requirement on high-voltage sampling resources of the HIL testing equipment when a mobile charging pile controller is tested and verified, so that the hardware cost is saved.
The utility model is realized by the following steps:
an expansion type high-voltage acquisition board for HIL test equipment comprises a high-voltage acquisition board card, and a high-voltage interface, a state simulation interface and a driving interface which are arranged on the high-voltage acquisition board card; the high-voltage acquisition board card is connected with a high-voltage interface of the HIL test equipment through a high-voltage interface, the high-voltage acquisition board card is connected with a sampling interface of the mobile charging pile controller through a state simulation interface, and the high-voltage acquisition board card is connected with a relay driving interface of the mobile charging pile controller through a driving interface.
The high-voltage interface comprises a first high-voltage interface and a second high-voltage interface, the high-voltage positive ports of the first high-voltage interface and the second high-voltage interface are respectively connected to the high-voltage positive port of the HIL testing equipment, and the high-voltage negative ports of the first high-voltage interface and the second high-voltage interface are respectively connected to the high-voltage negative port of the HIL testing equipment.
The state simulation interface comprises a main negative relay state simulation interface which is connected between a first high-voltage interface of the high-voltage interface and a high-voltage negative interface of the second high-voltage interface in series; the driving interface comprises a first optical MOS relay, the output end of the first optical MOS relay is connected to the main negative relay state simulation interface, and the input end of the first optical MOS relay is connected to the first relay driving interface and the second relay driving interface of the relay driving interface.
The state simulation interface comprises a main positive relay state simulation interface which is connected between a first high-voltage interface of the high-voltage interface and a high-voltage positive port of the second high-voltage interface in series; the driving interface comprises a third optical MOS relay, the output end of the third optical MOS relay is connected to the main positive relay state simulation interface, and the input end of the third optical MOS relay is connected to the third relay driving interface and the fourth relay driving interface of the relay driving interface.
The state simulation interface comprises a main negative relay contact state simulation interface, and the driving interface comprises a second optical MOS relay; the output end of the second light MOS relay is connected to the main negative relay contact state simulation interface, and the input end of the second light MOS relay is connected to the first relay driving interface and the second relay driving interface of the relay driving interface.
The state simulation interface comprises a main positive relay contact state simulation interface, and the driving interface comprises a fourth optical MOS relay; the output end of the fourth light MOS relay is connected to the main positive relay contact state simulation interface, and the input end of the fourth light MOS relay is connected to the third relay driving interface and the fourth relay driving interface of the relay driving interface.
The state simulation interface comprises a fuse state simulation interface, and the fuse state simulation interface and a main positive relay state simulation interface of the state simulation interface are connected in series between a first high-voltage interface of the high-voltage interface and a high-voltage positive port of a second high-voltage interface.
Compared with the prior art, the utility model has the following beneficial effects:
1. the HIL testing device can detect the normal and fusing states of the fuse, the normally open and adhesion states of the relay and the control function of the relay, meet the testing requirements of the mobile charging pile controller, and expand high-voltage sampling resources of the HIL testing device by introducing the board card, so that the hardware requirements on the HIL testing device are reduced.
2. The utility model has expandability, can be quickly connected between HIL test equipment and the mobile charging pile controller, has more flexible combination of each port of the board card, and can simulate various relay fault conditions, thereby better adapting to different project requirements.
According to the utility model, the high-voltage acquisition board card is introduced between the HIL test equipment and the mobile charging pile controller, so that the requirement on high-voltage sampling resources of the HIL test equipment is reduced when the mobile charging pile controller is tested and verified, the hardware cost is saved, and various fault scenes can be simulated more conveniently.
Drawings
FIG. 1 is a system diagram of an extended high voltage acquisition board for HIL test equipment according to the present invention;
fig. 2 is a schematic circuit diagram of an extended high voltage acquisition board for HIL testing equipment according to the present invention.
In the figure, 1 a high-voltage acquisition board card, 2 a high-voltage interface, 3 a state simulation interface, 4 a driving interface, 5 an HIL test device, 6 a mobile charging pile controller, 61 a sampling interface, 62 a relay driving interface, J1 a first high-voltage interface, J2 a second high-voltage interface, J3 a main negative relay state simulation interface, J4 a main positive relay state simulation interface, J5 a main negative relay contact state simulation interface, J6 a main positive relay contact state simulation interface, J7 a fuse state simulation interface, HV + high-voltage positive port, HV-high-voltage negative port, MOS1 a first optical MOS relay, M0S2 a second optical MOS relay, MOS3 a third optical MOS relay, MOS4 a fourth optical MOS relay, drive interface of a drive1 a first relay, drive interface of a drive2 a second relay drive interface, drive3 a third relay drive interface, drive4 a fourth relay drive interface, HV1 a fuse front-end high-voltage sampling point, the sampling points of the high voltage at the rear end of the HV2 fuse, the high voltage at the rear end of the HV3 relay, the sampling points of the positive high voltage for HVN reverse connection test and the sampling points of the negative high voltage for HVP reverse connection test.
Detailed Description
The utility model is further described with reference to the following figures and specific examples.
Referring to fig. 1, an extended high voltage acquisition board for HIL test equipment includes a high voltage acquisition board 1, and a high voltage interface 2, a state simulation interface 3 and a driving interface 4 which are arranged on the high voltage acquisition board 1; the high voltage acquisition board card 1 is connected with a high voltage interface of the HIL test equipment 5 through the high voltage interface 2, the high voltage acquisition board card 1 is connected with a sampling interface 61 of the mobile charging pile controller 6 through a state simulation interface 3, and the high voltage acquisition board card 1 is connected with a relay driving interface 62 of the mobile charging pile controller 6 through a driving interface 4.
Referring to fig. 2, the high-voltage interface 2 includes a first high-voltage interface J1 and a second high-voltage interface J2, positive high-voltage ports HV + of the first high-voltage interface J1 and the second high-voltage interface J2 are respectively connected to a positive high-voltage port HV + of the HIL testing apparatus 5, and negative high-voltage ports HV-of the first high-voltage interface J1 and the second high-voltage interface J2 are respectively connected to a negative high-voltage port HV-of the HIL testing apparatus 5.
The state simulation interface 3 comprises a main negative relay state simulation interface J3, and the main negative relay state simulation interface J3 is connected in series between a first high-voltage interface J1 of the high-voltage interface 2 and a high-voltage negative port HV-of a second high-voltage interface J2; the driving interface 4 comprises a first photo MOS relay MOS1, an output end of the first photo MOS relay MOS1 is connected to the main and negative relay state simulation interface J3, and an input end of the first photo MOS relay MOS1 is connected to the first relay driving interface drive1 and the second relay driving interface drive2 of the relay driving interface 62.
The state simulation interface 3 comprises a main positive relay state simulation interface J4, and the main positive relay state simulation interface J4 is connected in series between a first high-voltage interface J1 of the high-voltage interface 2 and a high-voltage positive port HV + of a second high-voltage interface J2; the driving interface 4 comprises a third photo MOS relay MOS3, an output end of the third photo MOS relay MOS3 is connected to the main positive relay state simulation interface J4, and an input end of the third photo MOS relay MOS3 is connected to the third relay driving interface drive3 and the fourth relay driving interface drive4 of the relay driving interface 62.
The state simulation interface 3 comprises a main negative relay contact state simulation interface J5, and the driving interface 4 comprises a second photo MOS relay MOS 2; the output end of the second photo MOS relay MOS2 is connected to the main negative relay contact state simulation interface J5, and the input end of the second photo MOS relay MOS2 is connected to the first relay drive interface drive1 and the second relay drive interface drive2 of the relay drive interface 62.
The state simulation interface 3 comprises a main positive relay contact state simulation interface J6, and the driving interface 4 comprises a fourth photo MOS relay MOS 4; the output end of the fourth photo MOS relay MOS4 is connected to the main positive relay contact state simulation interface J6, and the input end of the fourth photo MOS relay MOS4 is connected to the third relay drive interface drive3 and the fourth relay drive interface drive4 of the relay drive interface 62.
The state simulation interface 3 comprises a fuse state simulation interface J7, and the fuse state simulation interface J7 and a main positive relay state simulation interface J4 of the state simulation interface 3 are connected in series between a first high-voltage interface J1 of the high-voltage interface 2 and a high-voltage positive port HV + of a second high-voltage interface J2.
The working principle of the utility model is as follows:
the CAN port of the HIL testing equipment 5 is connected with the CAN port of the mobile charging pile controller 6 through a CAN wire harness, the 12V power end of the HIL testing equipment 5 is connected with the 12V power end of the mobile charging pile controller 6 through a power line, the analog output interface of the mobile charging pile controller 6 is correspondingly connected with the analog input interface of the HIL testing equipment 5, and the digital output interface of the mobile charging pile controller 6 is correspondingly connected with the digital input interface of the HIL testing equipment 5.
The first high-voltage interface J1 and the second high-voltage interface J2 of the high-voltage interface 2 serve as high-voltage input and output terminals, and the high-voltage positive port HV + and the high-voltage negative port HV-of the first high-voltage interface J1 and the second high-voltage interface J2 are respectively connected with the high-voltage positive port HV + and the high-voltage negative port HV-of the HIL test equipment 5 through high-voltage wiring harnesses.
A fuse front-end high-voltage sampling point HV1 is arranged at the front end of the fuse state simulation interface J7, namely between the fuse state simulation interface J7 and a high-voltage positive port HV + of a first high-voltage interface J1, a fuse rear-end high-voltage sampling point HV2 is arranged at the rear end of the fuse state simulation interface J7, namely between the fuse state simulation interface J7 and a main positive relay state simulation interface J4, a relay rear-end high-voltage sampling point HV3 and a reverse connection test positive high-voltage sampling point HVP are sequentially arranged between the main positive relay state simulation interface J4 and a high-voltage positive port HV + of a second high-voltage interface J2, and a reverse connection test negative high-voltage sampling point HVN is arranged between the main negative relay state simulation interface J3 and a high-voltage negative port HV-of the second high-voltage interface J2.
1. The voltage at two ends of the fuse state analog interface J7 is detected through the fuse front end high voltage sampling point HV1 and the fuse rear end high voltage sampling point HV2, and whether the fuse breaks down or not is detected.
When the fuse state simulation interface J7 is inserted into the jumper cap, the simulation fuse is normal, at the moment, the main negative relay state simulation interface J3, the main positive relay state simulation interface J4 are in a closed state, the voltage values of the fuse front end high-voltage sampling point HV1 and the fuse rear end high-voltage sampling point HV2 are both 1000V, the fuse fusing fault can be simulated after the jumper cap is removed, at the moment, the main negative relay state simulation interface J3 and the main positive relay state simulation interface J4 are in a closed state, the voltage value of the fuse front end high-voltage sampling point HV1 is 1000V, and the voltage value of the fuse rear end high-voltage sampling point HV2 is 0V.
2. The main positive relay state simulation interface J4 is used for detecting whether the main positive relay of the mobile charging pile is in a normally open state or an adhesion state.
When the main positive relay state simulation interface J4 receives the closing instruction of the mobile charging pile controller 6 and the main positive relay state simulation interface J4 is short-circuited without a jumper cap, the main positive relay state simulation interface J4 simulates that the main positive relay is in a normally open state, and at the moment, the fuse state simulation interface J7 and the main negative relay state simulation interface J3 are in a short-circuited state.
When the main positive relay state simulation interface J4 receives the disconnection instruction of the mobile charging pile controller 6, and the main positive relay state simulation interface J4 has no jumper cap short circuit, the main positive relay state simulation interface J4 simulates that the main positive relay is in the adhesion state, and at the moment, the fuse state simulation interface J7 and the main negative relay state simulation interface J3 are in the short circuit state.
3. The main negative relay state simulation interface J3 is used for detecting whether the main negative relay of the mobile charging pile is in a normally open state or an adhesion state.
When the main negative relay state simulation interface J3 receives a closing instruction of the mobile charging pile controller 6 and the main negative relay state simulation interface J3 is short-circuited without a jumper cap, the main negative relay state simulation interface J3 simulates that the main negative relay is in a normally open state, and at the moment, the fuse state simulation interface J7 and the main positive relay state simulation interface J4 are in a short-circuited state.
When the main negative relay state simulation interface J3 receives a disconnection instruction of the mobile charging pile controller 6 and the main negative relay state simulation interface J3 is short-circuited without a jumper cap, the main negative relay state simulation interface J3 simulates that the main negative relay is in an adhesion state, and at the moment, the fuse state simulation interface J7 and the main positive relay state simulation interface J4 are in a short-circuited state.
4. The first photo MOS relay MOS1 and the third photo MOS relay MOS3 are used for simulating a main positive relay and a main negative relay, and the first relay driving interface drive1, the second relay driving interface drive2, the third relay driving interface drive3 and the fourth relay driving interface drive4 are driving interfaces of the movable charging pile relay and are used for detecting a control signal of the charging pile relay. The connection between the first photo-MOS relay MOS1, the second photo-MOS relay MOS2, the third photo-MOS relay MOS3, and the fourth photo-MOS relay MOS4 and the first relay drive interface drive1, the second relay drive interface drive2, the third relay drive interface drive3, and the fourth relay drive interface drive4 is realized by PCBA wiring.
The third photo MOS relay MOS3 cooperates with the third relay drive interface drive3 and the fourth relay drive interface drive4 to detect the main relay control function, for example: whether a main positive relay can correctly execute a closing and opening instruction according to a control signal or not is detected, a main negative relay state simulation interface J3 is closed, a movable charging pile controller 6 controls the main positive relay to be closed through a third relay driving interface drive3 and a fourth relay driving interface drive4, when the movable charging pile controller 6 controls the main positive relay to be closed, the voltages of a fuse rear end high-voltage sampling point HV2 and a relay rear end high-voltage sampling point HV3 are measured, if the voltages of the fuse rear end high-voltage sampling point HV2 and the relay rear end high-voltage sampling point HV3 are consistent, the closing control function is considered to be effective, and when the movable charging pile controller 6 controls the main positive relay to be opened, the voltages of the fuse rear end high-voltage sampling point HV2 and the relay rear end high-voltage sampling point HV3 are measured, if the voltages of the fuse rear end high-voltage sampling point HV2 and the relay rear end high-voltage sampling point HV3 are greatly different, the control disconnection function is considered to be valid, otherwise the control function is considered to be abnormal.
The first photo MOS relay MOS1 cooperates with the first relay driving interface drive1 and the second relay driving interface drive2 to detect the control function of the main and negative relays, for example: detecting whether a control signal of a main negative relay is effective or not, wherein a main positive relay state simulation interface J4 is in a closed state, a movable charging pile controller 6 controls the main negative relay through a first relay driving interface drive1 and a second relay driving interface drive2, when a closing instruction is sent, when the movable charging pile controller 6 controls the main negative relay to be closed, measuring the voltages of a fuse rear end high-voltage sampling point HV2 and a relay rear end high-voltage sampling point HV3, if the voltages of the fuse rear end high-voltage sampling point HV2 and the relay rear end high-voltage sampling point HV3 are consistent, determining that the closing control function is effective, and when the movable charging pile controller 6 controls the main negative relay to be opened, measuring the voltages of the fuse rear end high-voltage sampling point HV2 and the relay rear end high-voltage sampling point HV3, if the voltages of the fuse rear end high-voltage sampling point HV2 and the relay rear end high-voltage sampling point HV3 are greatly different, the control disconnection function is considered to be valid, otherwise the control function is considered to be abnormal.
5. Second light MOS relay MOS2 and fourth light MOS relay MOS4 are used for simulating the auxiliary contact of main positive relay and main negative relay, and are used for detecting whether the function that its auxiliary contact is normally opened to the relay or adhesion fault detection is normal: will remove the butt joint of electric pile controller 6's contact feedback interface and the main positive relay contact state simulation interface J6, the removal fills electric pile controller 6 and controls main positive relay through third relay drive interface drive3 and fourth relay drive interface drive4, when sending closed instruction, main positive relay contact state simulation interface J6 is in the off-state, the removal fills electric pile controller 6 feedback contact and samples for the high level, then think that main positive relay is in normally open state, when taking place the off-instruction, main positive relay contact state simulation interface J6 is in the short circuit state, the removal fills electric pile controller 6 feedback contact and samples the low level, then think that main positive relay is in the adhesion state, the auxiliary contact detection function of removal controller 6 is normal, otherwise think that the contact detection function is unusual.
6. The reverse connection test positive high voltage sampling point HV _ P, the reverse connection test negative high voltage sampling point HV _ N and the relay rear end high voltage sampling point HV3 are used for detecting whether the reverse connection test function is normal: the main negative relay state simulation interface J3 and the main positive relay state simulation interface J4 are in a disconnected state, the second high-voltage interface J2 is connected with a high-voltage positive port HV + and a high-voltage negative port HV-, the pressure difference between the negative high-voltage sampling point HVP of the reverse connection test and the positive high-voltage sampling point HVN of the reverse connection test is tested, when the pressure difference is positive, the reverse connection is not found, the high-voltage positive port HV + of the second high-voltage interface J2 is connected with the high-voltage negative port HV-, the pressure difference between the negative high-voltage sampling point HVP of the reverse connection test and the positive high-voltage sampling point HVN of the reverse connection test is tested, and when the pressure difference is negative, the reverse connection is found.
The present invention is not limited to the above embodiments, and any modifications, equivalent replacements, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. The utility model provides a board is gathered to extension formula high pressure for HIL test equipment which characterized by: the device comprises a high-voltage acquisition board card (1), and a high-voltage interface (2), a state simulation interface (3) and a driving interface (4) which are arranged on the high-voltage acquisition board card (1); the high-voltage acquisition board card (1) is connected with a high-voltage interface of HIL test equipment (5) through a high-voltage interface (2), the high-voltage acquisition board card (1) is connected with a sampling interface (61) of a mobile charging pile controller (6) through a state simulation interface (3), and the high-voltage acquisition board card (1) is connected with a relay driving interface (62) of the mobile charging pile controller (6) through a driving interface (4).
2. The extended high voltage collection board for HIL testing apparatus of claim 1, wherein: the high-voltage interface (2) comprises a first high-voltage interface and a second high-voltage interface, the high-voltage positive ports of the first high-voltage interface and the second high-voltage interface are respectively connected to the high-voltage positive port of the HIL testing equipment (5), and the high-voltage negative ports of the first high-voltage interface and the second high-voltage interface are respectively connected to the high-voltage negative port of the HIL testing equipment (5).
3. The extended high voltage collection board for HIL testing apparatus of claim 1, wherein: the state simulation interface (3) comprises a main negative relay state simulation interface which is connected between a first high-voltage interface of the high-voltage interface (2) and a high-voltage negative interface of the second high-voltage interface in series; the driving interface (4) comprises a first light MOS relay, the output end of the first light MOS relay is connected to the main and negative relay state simulation interface, and the input end of the first light MOS relay is connected to the first relay driving interface and the second relay driving interface of the relay driving interface (62).
4. The extended high voltage collection board for HIL testing apparatus of claim 1, wherein: the state simulation interface (3) comprises a main positive relay state simulation interface which is connected between a first high-voltage interface of the high-voltage interface (2) and a high-voltage positive port of a second high-voltage interface in series; the driving interface (4) comprises a third light MOS relay, the output end of the third light MOS relay is connected to the main positive relay state simulation interface, and the input end of the third light MOS relay is connected to the third relay driving interface and the fourth relay driving interface of the relay driving interface (62).
5. The extended high voltage collection board for HIL testing apparatus of claim 1, wherein: the state simulation interface (3) comprises a main negative relay contact state simulation interface, and the driving interface (4) comprises a second optical MOS relay; the output end of the second light MOS relay is connected to the main negative relay contact state simulation interface, and the input end of the second light MOS relay is connected to the first relay driving interface and the second relay driving interface of the relay driving interface (62).
6. The extended high voltage collection board for HIL testing apparatus of claim 1, wherein: the state simulation interface (3) comprises a main positive relay contact state simulation interface, and the driving interface (4) comprises a fourth optical MOS relay; the output end of the fourth light MOS relay is connected to the main positive relay contact state simulation interface, and the input end of the fourth light MOS relay is connected to the third relay driving interface and the fourth relay driving interface of the relay driving interface (62).
7. An extended high voltage collection board for HIL testing apparatus according to any one of claims 1 and 3 to 6, wherein: the state simulation interface (3) comprises a fuse state simulation interface, and the fuse state simulation interface and a main positive relay state simulation interface of the state simulation interface (3) are connected in series between a first high-voltage interface of the high-voltage interface (2) and a high-voltage positive port of a second high-voltage interface.
CN202121582360.9U 2021-07-13 2021-07-13 Expansion type high-voltage acquisition board for HIL (hardware in the loop) test equipment Active CN215415589U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121582360.9U CN215415589U (en) 2021-07-13 2021-07-13 Expansion type high-voltage acquisition board for HIL (hardware in the loop) test equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121582360.9U CN215415589U (en) 2021-07-13 2021-07-13 Expansion type high-voltage acquisition board for HIL (hardware in the loop) test equipment

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CN215415589U true CN215415589U (en) 2022-01-04

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Effective date of registration: 20231218

Address after: Room 304, 3rd Floor, Building 1, No. 111 Wusongjiang Avenue, Guoxiang Street, Wuzhong District, Suzhou City, Jiangsu Province, 215124

Patentee after: JIANGSU DUPU NEW ENERGY TECHNOLOGY Co.,Ltd.

Address before: Room 1001, 10 / F, office building, Shihu Jinling Plaza, 88 Nanxijiang Road, Yuexi, Wuzhong District, Suzhou City, Jiangsu Province, 215128

Patentee before: DuPu (Suzhou) New Energy Technology Co.,Ltd.