CN214751682U

CN214751682U - Computer solid state disk with built-in heat dissipation module

Info

Publication number: CN214751682U
Application number: CN202120694031.7U
Authority: CN
Inventors: 刘奕
Original assignee: Suzhou Vocational University
Current assignee: Suzhou Vocational University
Priority date: 2021-04-06
Filing date: 2021-04-06
Publication date: 2021-11-16
Anticipated expiration: 2031-04-06

Abstract

The utility model provides a built-in radiating module's computer solid state hard drives, which comprises a housin, the radiating block, printed circuit board, the casing includes the casing, lower casing, go up casing and casing fixed connection down and both enclose and establish a holding cavity, printed circuit board sets up in the holding cavity, it has set the radiating block to go up to embed on the casing, the top of radiating block is higher than the top setting of last casing and the radiating block bottom is located the holding cavity, the concave radiating groove that is equipped with a plurality of cross-sections and is the type of falling T in the top array of radiating block, the part that the radiating block is located the holding cavity is equipped with a water-cooling portion that contains the rivers passageway, in order to take away the absorptive heat of radiating block. The utility model discloses a set up the mode of radiating groove and water-cooling portion on the radiating block, improved the radiating conversion efficiency of solid state hard drives, strengthened the radiating effect of solid state hard drives, simultaneously, still be provided with radiator fan on the radiating block, further shortened the time of circulation of air.

Description

Computer solid state disk with built-in heat dissipation module

Technical Field

The utility model belongs to the technical field of the hard disk, specifically speaking relates to a built-in heat dissipation module's computer solid state hard drives.

Background

A Solid State Drive (SSD) is a computer storage device that mainly uses flash memory for storage. The solid state drive has the advantages of small size, large capacity, no noise and vibration resistance, and is supported by many users for hardware equipment of desktop computers or notebook computers. In addition, the solid state disk is far better than the conventional hard disk in the read/write speed, and the use of the solid state disk is undoubtedly a very desirable option for the group pursuing the speed or performance of the computer.

The solid state disk has higher reading speed and is widely used by the existing computer, but most of the existing solid state disks are not provided with a heat dissipation module and need to dissipate heat by the aid of the outside, a water cooling system contained in a case with a water cooling unit cannot be effectively used, and meanwhile, most of the solid state disks are directly fixed in the computer host through screws, and the anti-seismic performance is determined by the computer host and the autonomous anti-seismic effect is poor.

In view of this, the present invention is provided.

Disclosure of Invention

In view of this, the present invention provides a solid state disk of a computer with a built-in heat dissipation module.

In order to achieve the above purpose, the utility model adopts the technical scheme that:

the utility model provides a built-in radiating module's computer solid state hard drives, includes casing, radiating block, printed circuit board, the casing includes casing, lower casing, go up the casing with casing fixed connection and both enclose to establish a holding cavity down, printed circuit board sets up in the holding cavity, it has set up on the last casing the radiating block, the top of radiating block is higher than the top of going up the casing sets up just the radiating block bottom is located in the holding cavity, the concave radiating groove that is the type of falling T of a plurality of cross-sections that is equipped with of radiating block's top array, the radiating block is located part in the holding cavity is equipped with a water-cooling portion that contains the rivers passageway, in order to take away the absorptive heat of radiating block.

Furthermore, the water cooling portion includes inlet channel, play water course and heat exchange microchannel, arbitrary one side of radiating piece is provided with an inlet tube and an outlet pipe respectively the syntropy, the inlet channel with it sets up to go out the water course symmetry the inside of radiating block and both respectively with the inlet tube with go out water piping connection, the inlet channel with it is a plurality of to go out between the water course heat exchange microchannel connect in order to constitute the rivers passageway.

Furthermore, one side of the water inlet channel and one side of the water outlet channel, which are close to the water inlet pipe and the water outlet pipe, are respectively provided with an upward bending section, so that the liquid level height of the water inlet channel and the water outlet channel is lower than that of the water inlet pipe and the water outlet pipe.

Furthermore, a heat dissipation fan is further arranged on the heat dissipation block, the heat dissipation fan is arranged at the top of the heat dissipation groove so as to form heat dissipation airflow relative to the heat dissipation groove, and the top of the heat dissipation fan is flush with the top of the heat dissipation groove.

Furthermore, printed circuit board upper surface electric connection has connector, interface chip, flash memory controller, flash memory chip in proper order, the connector passes go up the casing with the junction and the part of casing are exposed down the casing is kept away from inlet tube one side.

Furthermore, an even number of fixing through holes for fixing the computer case inner side wall are uniformly distributed at the peripheral edge of the shell, and a damping component is further arranged in each fixing through hole.

Further, damper includes antidetonation sliding sleeve, spacing groove and damping spring, go up the casing with the casing junction is followed down the radial concave of fixing hole is equipped with the spacing groove, sliding connection has antidetonation sliding sleeve and both coaxial settings in the fixing hole, the circumference outside of antidetonation sliding sleeve is corresponding the position department in spacing groove is followed the antidetonation sliding sleeve radially extends and is provided with a slip boss, the embedding of slip boss spacing inslot and its top surface and bottom surface pass through respectively damping spring with the cell wall fixed connection of spacing groove.

Compared with the prior art, the beneficial effects of the utility model reside in that: the utility model discloses a mode that sets up radiating groove and water course on the radiating block realizes the effective heat dissipation to solid state hard drives to increased radiator fan and further improved heat-sinking capability, this radiating block adopts three kinds of radiating modes to dispel the heat to solid state hard drives simultaneously, and heat-sinking capability is showing the reinforcing. And simultaneously, the utility model discloses a setting has slip boss and damping spring's antidetonation sliding sleeve, can play absorbing purpose when external force disturbs or quick-witted case self work vibrations.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a main sectional view of the present invention;

fig. 3 is a cross-sectional view of the heat dissipation module of the present invention;

fig. 4 is the main sectional view of the middle anti-seismic sliding sleeve of the utility model.

Reference numerals and component parts description referred to in the drawings:

1-a shell; 11-an upper shell; 12-a lower housing; 2-a heat dissipation block; 21-a heat sink; 22-water cooling section; 221-a water inlet channel; 222-water outlet channel; 223-heat exchange microchannels; 3-a printed circuit board; 31-a connector; 32-interface chip; 33-a flash memory controller; 34-a flash memory chip; 4-fixing the through hole; 41-anti-seismic sliding sleeve; 411-sliding boss; 42-a shock-absorbing spring; 43-a limit groove; 5-a heat dissipation fan; 6-water inlet pipe; and 7-a water outlet pipe.

Detailed Description

The technical solution of the present invention will be described clearly and completely through the following detailed description. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 to 4, a computer solid state disk with a built-in heat dissipation module, including a housing 1, a heat dissipation block 2, a printed circuit board 3, the housing 1 includes an upper housing 11, a lower housing 12, the upper housing 11 and the lower housing 12 are fixedly connected and both enclose to form a holding chamber, the printed circuit board 3 is disposed in the holding chamber, the heat dissipation block 2 is embedded on the upper housing 11, the top of the heat dissipation block 2 is higher than the top of the upper housing 1 and the bottom of the heat dissipation block 2 is located in the holding chamber, a plurality of heat dissipation grooves 21 with inverted T-shaped cross sections are concavely arranged on the top array of the heat dissipation block 2, the heat dissipation groove 21 adopting the structure can increase the heat dissipation area when in use, and a water cooling portion 22 containing a water flow channel is arranged on the portion of the heat dissipation block 2 located in the holding chamber to take away the heat absorbed by the heat dissipation block 2. By adopting the design, the heat dissipation efficiency of the solid state disk during working can be improved, and the working reliability of the solid state disk is further improved.

Referring to fig. 1, 2 and 3, a through hole is formed in the top of the upper housing 11, the heat dissipation block 2 is clamped in the through hole of the upper housing 11 in an interference or transition fit manner, the heat dissipation block 2 has a dual heat dissipation structure, and the plurality of heat dissipation grooves 21 exposed outside the housing 1 perform heat dissipation by using a principle of profile heat dissipation, that is, by using good heat conductivity of the profile, the profile is usually made of copper or aluminum. The water cooling part 22 located in the accommodating chamber comprises a water inlet channel 221, a water outlet channel 222 and heat exchange micro-channels 223, a water inlet pipe 6 and a water outlet pipe 7 are respectively arranged on any one side of the upper shell 11 in the same direction, the water inlet channel 221 and the water outlet channel 222 are symmetrically arranged inside the heat dissipation block 2 and are respectively fixedly connected with the water inlet pipe 6 and the water outlet pipe 7, and the water inlet channel 221 and the water outlet channel 222 are connected through the plurality of heat exchange micro-channels 223 to form a water flow channel. Wherein, inlet tube 6 and outlet pipe 7 syntropy set up, and this arrangement mode practices thrift the space to other components and parts are conveniently arranged, and inlet tube 6 and outlet pipe 7 are connected with the inside cooling water circulation pipeline of mainframe, can realize the effective utilization to computer mainframe cooling resource.

Furthermore, the water inlet channel 221 and the water outlet channel 222 are respectively provided with an upward bending section at one side close to the water inlet pipe 6 and the water outlet pipe 7, so that the liquid level height of the water inlet channel 221 and the water outlet channel 222 is lower than the liquid level height of the water inlet pipe 6 and the water outlet pipe 7, when in use, circulating water flows into the water inlet channel 221, submerges the heat exchange micro-channel 223, and then climbs through the water outlet channel 222 to flow out in the bending section, and because the liquid level height of the water inlet channel 221 and the water outlet channel 222 is lower than the liquid level height of the water inlet pipe 6 and the water outlet pipe 7, the heat exchange micro-channel 223 can be completely soaked by the circulating water, the heat dissipation uniformity of the water cooling part 22 is improved, so that the whole solid state hard disk can work under the condition of uniform temperature or similar uniform temperature, and the service life of the solid state hard disk is prolonged.

It bears, still be provided with radiator fan 5 on the radiating groove 21, the mounting groove that the degree of depth and radiator fan 5 height are the same that is provided with of radiating groove 21 top surface several to make radiator fan 5's top and radiating groove 21's top parallel and level, reduced radiator fan 5 and outside area of contact, thereby reduced radiator fan 5 and received the risk that external disturbance and damage, improved the stability of using. When the solid state disk works, the heat dissipation fan 5 can gather the airflow carrying the heat of the heat dissipation block 2 to the fan blades under the guidance of the heat dissipation groove 21, and the airflow is discharged in the air along the air outlet, so that the air circulation rate of the heat dissipation groove 21 is improved, and the heat dissipation capacity of the heat dissipation block 2 is improved.

Referring to fig. 1 and 2, the lower surface of the printed circuit board 3 is fixedly connected to the inner wall of the lower housing 12, the upper surface of the printed circuit board 3 is electrically connected to the connector 31, the interface chip 32, the flash memory controller 33, and the flash memory chip 34 in sequence, wherein the connector 31 penetrates through the joint of the upper housing 11 and the lower housing 12, and is partially exposed to the side away from the water inlet pipe 6, the arrangement is adopted to avoid the connector 31 interfering with the water cooling portion 22 in the using process, so as to affect the normal use of the heat dissipation block 2, the connector 31 is arranged opposite to the water inlet pipe 6, so that the external space between the connector 31 and the water inlet pipe is increased, and the installation of external devices and firmware is facilitated.

Specifically, the connector 31 is plugged with an external host signal line and a power line at the same time, and is used for receiving or transmitting an external signal and supplying power to the hard disk body; the interface chip 32 is used for setting data register and buffer logic to adapt to the speed difference between the CPU and the peripheral equipment and coordinate the difference between the information type and the level of the CPU and the peripheral equipment, and meanwhile, the interface chip 32 can convert the information format; a flash memory chip 33, a memory chip that is erased or written many times in operation, the flash memory chip 33 is used to store general data and exchange transmission data between the computer and other digital products; the flash controller 34 is used to control each flash chip 33 to store information.

Referring to fig. 1, fig. 2 and fig. 4 again, the upper casing 11 and the lower casing 12 are fixed by bolts, an even number of fixing through holes 4 for fixing with the inner side wall of the computer case are uniformly distributed at the peripheral edge of the casing 1, a damping component is further arranged in each fixing through hole 4, the damping component comprises an anti-seismic sliding sleeve 41, a limiting groove 43 and a damping spring 42, specifically, a limiting groove 43 is radially recessed at the joint of the upper casing 11 and the lower casing 12 along the fixing through hole 4, the anti-seismic sliding sleeve 41 is slidably connected in the fixing through hole 4 and coaxially arranged with the fixing through hole 4, a sliding boss 411 is radially extended at the position corresponding to the limiting groove 43 outside the circumference of the anti-seismic sliding sleeve 41, the sliding boss 411 is embedded in the limiting groove 43, and the top surface and the bottom surface of the sliding boss are fixedly connected with the groove walls of the limiting groove 43 through the damping spring 42. When the solid state disk is stressed, the spring 42 will slightly rise or fall along with the mechanical vibration or external force of the solid state disk, so that the anti-vibration sliding sleeve 41 can play a role in damping and absorbing vibration for the housing 1.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The computer solid state disk with the built-in heat dissipation module is characterized by comprising a shell (1), a heat dissipation block (2) and a printed circuit board (3), wherein the shell (1) comprises an upper shell (11) and a lower shell (12), the upper shell (11) is fixedly connected with the lower shell (12) and the upper shell and the lower shell enclose to form an accommodating cavity, the printed circuit board (3) is arranged in the accommodating cavity, the heat dissipation block (2) is embedded in the upper shell (11), the top of the heat dissipation block (2) is higher than the top of the upper shell (1) and the bottom of the heat dissipation block (2) is located in the accommodating cavity, a plurality of heat dissipation grooves (21) with inverted T-shaped cross sections are concavely arranged in the top array of the heat dissipation block (2), and a water cooling part (22) with a water flow channel is arranged in the part of the heat dissipation block (2) located in the accommodating cavity, so as to carry away the heat absorbed by the heat-dissipating block (2).

2. The computer solid state disk with the built-in heat dissipation module of claim 1, wherein the water cooling portion (22) comprises a water inlet channel (221), a water outlet channel (222) and heat exchange micro-channels (223), a water inlet pipe (6) and a water outlet pipe (7) are respectively arranged on any side of the heat dissipation block (2) in the same direction, the water inlet channel (221) and the water outlet channel (222) are symmetrically arranged inside the heat dissipation block (2) and are respectively connected with the water inlet pipe (6) and the water outlet pipe (7), and the water inlet channel (221) and the water outlet channel (222) are connected through a plurality of heat exchange micro-channels (223) to form the water flow channel.

3. The computer solid state disk with the built-in heat dissipation module as recited in claim 2, wherein the water inlet channel (221) and the water outlet channel (222) are respectively provided with an upward bent section at a side close to the water inlet pipe (6) and the water outlet pipe (7), so that the liquid level of the water inlet channel (221) and the water outlet channel (222) is lower than the liquid level of the water inlet pipe (6) and the water outlet pipe (7).

4. The computer solid state disk with the built-in heat dissipation module as recited in claim 1, wherein the heat dissipation block (2) is further provided with a heat dissipation fan (5), the heat dissipation fan (5) is disposed on the top of the heat dissipation groove (21) to form a heat dissipation airflow relative to the heat dissipation groove (21), and the top of the heat dissipation fan (5) is flush with the top of the heat dissipation groove (21).

5. The computer solid state disk with the built-in heat dissipation module as recited in claim 2, wherein the printed circuit board (3) has a connector (31), an interface chip (32), a flash memory controller (33), and a flash memory chip (34) electrically connected to an upper surface thereof in sequence, and the connector (31) passes through a connection between the upper housing (11) and the lower housing (12) and is partially exposed on a side of the housing (1) away from the water inlet pipe (6).

6. The computer solid state disk with the built-in heat dissipation module as recited in claim 1, wherein an even number of fixing through holes (4) for fixing with the inner side wall of the computer case are evenly distributed at the peripheral edge of the casing (1), and a shock absorption component is further arranged in the fixing through holes (4).

7. The computer solid state disk with the built-in heat dissipation module according to claim 6, wherein the shock absorption assembly comprises an anti-vibration sliding sleeve (41), a limiting groove (43) and a shock absorption spring (42), the limiting groove (43) is radially recessed in the joint of the upper shell (11) and the lower shell (12) along the fixing through hole (4), the anti-vibration sliding sleeve (41) is slidably connected in the fixing through hole (4) and coaxially arranged with the fixing through hole, a sliding boss (411) is radially extended along the anti-vibration sliding sleeve (41) at a position corresponding to the limiting groove (43) outside the circumference of the anti-vibration sliding sleeve (41), the sliding boss (411) is embedded in the limiting groove (43), and the top surface and the bottom surface of the sliding boss are respectively fixedly connected with the groove wall of the limiting groove (43) through the shock absorption spring (42).