CN214693975U - Anti-electromagnetic wave interference adhesive tape - Google Patents
Anti-electromagnetic wave interference adhesive tape Download PDFInfo
- Publication number
- CN214693975U CN214693975U CN202023212292.5U CN202023212292U CN214693975U CN 214693975 U CN214693975 U CN 214693975U CN 202023212292 U CN202023212292 U CN 202023212292U CN 214693975 U CN214693975 U CN 214693975U
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- Prior art keywords
- layer
- adhesive tape
- wave
- absorbing layer
- electromagnetic wave
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 37
- 239000010410 layer Substances 0.000 claims abstract description 126
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 39
- 239000012790 adhesive layer Substances 0.000 claims abstract description 24
- 239000000696 magnetic material Substances 0.000 claims abstract description 10
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920002681 hypalon Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 19
- 229920000058 polyacrylate Polymers 0.000 description 19
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- -1 polyethylene terephthalate Polymers 0.000 description 7
- 239000000843 powder Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002546 FeCo Inorganic materials 0.000 description 1
- 229910002555 FeNi Inorganic materials 0.000 description 1
- 229910005347 FeSi Inorganic materials 0.000 description 1
- 229910000604 Ferrochrome Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses an anti electromagnetic wave interference's sticky tape. The electromagnetic wave interference resistant adhesive tape comprises a shielding reinforcing layer, a wave absorbing layer and an adhesive layer, wherein a release layer is attached to the surface of the adhesive layer, the shielding reinforcing layer is made of a conductive material, and the wave absorbing layer is made of a magnetic material. The anti-electromagnetic wave interference adhesive tape is provided with a shielding reinforcing layer and a wave absorbing layer, when electromagnetic waves reach the adhesive tape, the shielding reinforcing layer reflects incident electromagnetic waves, the incident electromagnetic waves which are not reflected enter the wave absorbing layer, and are absorbed by the wave absorbing layer in the process of forward propagation in the adhesive tape, and the incident electromagnetic waves gradually attenuate residual energy, so that the electromagnetic waves are completely shielded or absorbed.
Description
Technical Field
The utility model relates to an sticky tape technical field especially relates to an anti electromagnetic wave interference's sticky tape.
Background
With the development of miniaturization, thinness, and multi-functionalization of electronic devices such as smartphones and tablet computers, it is becoming more important to suppress electromagnetic wave noise radiated from ICs and cables because a circuit board is also packaged with a large number of electronic components and the density thereof is increasing. Such radiation noise is difficult to predict at the design stage, and therefore countermeasures are taken at the manufacturing stage in many cases. It is conventional to receive the interference of electromagnetic wave noise with a filter device or a wave absorbing plate.
The current shielding materials for electromagnetic waves are divided into two types: the wave-absorbing material mainly takes absorption as a main part and has a small amount of transmitted waves, and the shielding material mainly takes reflection as a main part and also can not completely reflect electromagnetic waves. Therefore, the performance of the conventional electromagnetic wave shielding material cannot satisfy the expected effect. In addition, the thickness of the shielding material is required to meet the requirements of the existing ultra-thin products.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defect among the prior art, the embodiment of the utility model provides an anti electromagnetic wave interference's sticky tape, including shielding strengthening layer, microwave absorbing layer and adhesive layer, the surface of adhesive layer is attached with from the type layer, the shielding strengthening layer adopts conducting material to make, microwave absorbing layer adopts magnetic material to make.
Further, the wave absorbing layer comprises magnetic material particles.
Furthermore, the magnetic material particles have a particle size of 0.5 to 100 μm.
Further, the wave absorbing layer also comprises resin, and the resin is one of chlorosulfonated polyethylene, polyurethane and epoxy resin.
Furthermore, the shielding reinforcing layer is an electric conductor, and the surface impedance of the wave absorbing layer is 1 x 104-1*1012。
Furthermore, the thickness of the shielding reinforcing layer is 1-500 mu m, the thickness of the wave absorbing layer is 1-1000 mu m, the thickness of the adhesive layer is 1-500 mu m, and the thickness of the release layer is 1-200 mu m.
Furthermore, the total thickness of the adhesive tape is 30-1500 mu m.
Further, the adhesive layer is arranged between the shielding reinforcing layer and the wave absorbing layer.
Furthermore, the adhesive layer is arranged on two sides of the wave absorbing layer, and the shielding reinforcing layer is attached to the adhesive layer which does not comprise the release layer.
Furthermore, the adhesive layer is arranged on two sides of the shielding reinforcing layer, and the wave absorbing layer is attached to the adhesive layer which does not comprise the release layer.
The utility model has the advantages as follows:
the anti-electromagnetic wave interference adhesive tape is provided with a shielding reinforcing layer and a wave absorbing layer, when electromagnetic waves reach the adhesive tape, the shielding reinforcing layer reflects incident electromagnetic waves, the incident electromagnetic waves which are not reflected enter the wave absorbing layer, and are absorbed by the wave absorbing layer in the process of forward propagation in the adhesive tape, and the incident electromagnetic waves gradually attenuate residual energy, so that the electromagnetic waves are completely shielded or absorbed.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of an electromagnetic interference resistant adhesive tape according to an embodiment of the present invention;
fig. 2 is a schematic view of an electromagnetic interference resistant adhesive tape according to a second embodiment of the present invention;
fig. 3 is a schematic view of an electromagnetic interference resistant adhesive tape according to a third embodiment of the present invention;
fig. 4 is a schematic view of an electromagnetic interference resistant adhesive tape according to a fourth embodiment of the present invention;
fig. 5 is a schematic view of an electromagnetic interference resistant adhesive tape according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature.
The present invention will be further described with reference to the accompanying drawings and examples.
The application includes an electromagnetic wave interference resistant adhesive tape. The anti-electromagnetic wave interference adhesive tape comprises a shielding reinforcing layer 2, a wave absorbing layer 1 and an adhesive layer 3, wherein a release layer 4 is attached to the surface of the adhesive layer 3, the shielding reinforcing layer 2 is made of a conductive material, and the wave absorbing layer 1 is made of a magnetic material.
The anti-electromagnetic wave interference adhesive tape is provided with a shielding reinforcing layer 2 and a wave absorbing layer 1, when electromagnetic waves reach the adhesive tape, the shielding reinforcing layer 2 reflects incident electromagnetic waves, the incident electromagnetic waves which are not reflected enter the wave absorbing layer 1, and in the process of forward propagation in the adhesive tape, the incident electromagnetic waves are absorbed by the wave absorbing layer 1, and the incident electromagnetic waves gradually attenuate residual energy, so that the electromagnetic waves are completely shielded or absorbed.
The shielding reinforcing layer 2 is made of one of silver foil, gold foil, copper foil and aluminum foil.
The wave-absorbing layer 1 includes magnetic material particles and resin. Wherein the magnetic material particles are single-substance metal or metal alloy particles with the particle size of 0.5-100 μm, and are double-complex dielectric materials, such as carbonyl iron, FeSiAl powder, FeSi powder, FeSiCr powder, FeCo powder, FeNi powder and FeCr powder. The resin is made by adding a high absorptivity electromagnetic wave absorber such as chlorosulfonated polyethylene, polyurethane, and epoxy resin, or other elastomer resin to a resin matrix.
The shielding reinforcing layer 2 is an electric conductor, and the surface impedance of the wave absorbing layer 1 is 1 x 104-1*1012。
The adhesive layer 3 is a modified polyacrylate pressure-sensitive adhesive layer. The modified polyacrylate pressure-sensitive adhesive comprises a polyacrylic acid adhesive layer and a film reinforcing layer. Wherein the film reinforcing layer comprises one or more of free polyethylene terephthalate (PET), Polyimide (PI) and polyphenylene sulfide (PPS).
The wave-absorbing layer 1 can be coated on the shielding reinforcing layer 2 between the shielding reinforcing layer 2 and the wave-absorbing layer 1 in a hot pressing mode, and can also be formed by bonding a modified polyacrylate pressure-sensitive adhesive layer, and the modified polyacrylate pressure-sensitive adhesive layer can be randomly combined on the shielding reinforcing layer 2 and the wave-absorbing material layer in one layer or multiple layers.
The thickness of the shielding reinforcing layer 2 is 1-500 mu m, the thickness of the wave absorbing layer 1 is 1-1000 mu m, the thickness of the adhesive layer 3 is 1-500 mu m, and the thickness of the release layer 4 is 1-200 mu m. The total thickness of the adhesive tape is 30 to 1500 μm.
Example one
As shown in figure 1, the anti-electromagnetic wave interference adhesive tape comprises a modified polyacrylate pressure-sensitive adhesive layer with the thickness of 15 microns, a wave absorbing layer 1 with the thickness of 30 microns, a shielding reinforcing layer 2 with the thickness of 30 microns and a release layer 4. Wherein the modified polyacrylate pressure-sensitive adhesive layer comprises a polyethylene terephthalate film with the thickness of 5 mu m, and the polyethylene terephthalate film is subjected to double-sided corona treatment. The treated polyethylene terephthalate film was provided with acrylic adhesives on both sides. The modified polyacrylate pressure-sensitive adhesive layers are respectively attached to two surfaces of the wave absorbing layer 1, and the release layer 4 is attached to the modified polyacrylate pressure-sensitive adhesive layer. The shielding reinforcing layer 2 is attached to another modified polyacrylate pressure-sensitive adhesive layer which does not contain the release layer 4.
Example two
As shown in FIG. 2, the anti-electromagnetic wave interference adhesive tape comprises a modified polyacrylate pressure-sensitive adhesive layer with a thickness of 15 μm, a wave-absorbing layer 1 with a thickness of 30 μm, a shielding reinforcing layer 2 with a thickness of 30 μm, and a release layer 4. Wherein the modified polyacrylate pressure-sensitive adhesive layer comprises a polyethylene terephthalate film with the thickness of 5 mu m, and the polyethylene terephthalate film is subjected to double-sided corona treatment. The treated polyethylene terephthalate film was provided with acrylic adhesives on both sides. The modified polyacrylate pressure-sensitive adhesive layers are respectively attached to two surfaces of the shielding reinforcing layer 2, and the release layer 4 is attached to the modified polyacrylate pressure-sensitive adhesive layer. The wave absorbing layer 1 is attached to another modified polyacrylate pressure-sensitive adhesive layer which does not contain the release layer 4.
EXAMPLE III
As shown in fig. 3, the difference from the electromagnetic wave interference resistant adhesive tape in the third embodiment is that a modified polyacrylate pressure-sensitive adhesive layer is further attached to the other surface of the wave-absorbing layer 1, so as to form a double-sided electromagnetic shielding adhesive tape.
Example four
As shown in FIG. 4, an anti-electromagnetic wave interference adhesive tape includes a modified polyacrylate pressure-sensitive adhesive layer with a thickness of 15 μm, a wave-absorbing layer 1 with a thickness of 200 μm, a shielding reinforcing layer 2 with a thickness of 100 μm, and a release layer 4. The wave-absorbing layer 1 and the shielding reinforcing layer 2 are bonded in a hot-pressing mode. The modified polyacrylate pressure-sensitive adhesive layer is attached to the wave absorbing layer 1, and the release layer 4 is attached to the other surface of the modified polyacrylate pressure-sensitive adhesive layer.
EXAMPLE five
As shown in fig. 5, the tape for resisting electromagnetic wave interference in the fourth embodiment is different from the tape for resisting electromagnetic wave interference in that the modified polyacrylate pressure-sensitive adhesive layer is attached to the shielding reinforcing layer 2.
In addition, in other specific embodiments, the thicknesses of the wave-absorbing layer 1, the shielding reinforcing layer 2 and the adhesive layer 3 may be adjusted according to the needs of actual situations. Preferably, the wave-absorbing layer 1 can also be 100 μm, 200 μm and 500 μm; the thickness of the shield reinforcing layer 2 was 100 μm and 200 μm.
The present invention has been explained by using specific embodiments, and the explanation of the above embodiments is only used to help understand the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
Claims (10)
1. The adhesive tape is characterized by comprising a shielding reinforcing layer, a wave-absorbing layer and an adhesive layer, wherein a release layer is attached to the surface of the adhesive layer, the shielding reinforcing layer is made of a conductive material, and the wave-absorbing layer is made of a magnetic material.
2. The adhesive tape for resisting electromagnetic wave interference according to claim 1, wherein the wave-absorbing layer comprises particles of magnetic material.
3. The adhesive tape for resisting electromagnetic wave interference according to claim 2, wherein the magnetic material particles have a particle size of 0.5 to 100 μm.
4. The electromagnetic wave interference resistant adhesive tape according to claim 2, wherein the wave absorbing layer further comprises a resin, and the resin is one of chlorosulfonated polyethylene, polyurethane and epoxy resin.
5. The electromagnetic wave interference resistant adhesive tape according to claim 1, wherein the shielding reinforcing layer is an electric conductor, and the surface impedance of the wave absorbing layer is 1 x 104-1*1012。
6. The electromagnetic wave interference resistant adhesive tape according to claim 1, wherein the shielding reinforcing layer is 1-500 μm thick, the wave absorbing layer is 1-1000 μm thick, the adhesive layer is 1-500 μm thick, and the release layer is 1-200 μm thick.
7. The adhesive tape for resisting electromagnetic wave interference according to claim 1, wherein the total thickness of the adhesive tape is 30 to 1500 μm.
8. The electromagnetic wave interference resistant adhesive tape according to claim 1, wherein the adhesive layer is disposed between the shielding reinforcing layer and the wave-absorbing layer.
9. The electromagnetic wave interference resistant adhesive tape according to claim 8, wherein the adhesive layer is disposed on both sides of the wave absorbing layer, and the shielding reinforcing layer is attached to the adhesive layer without the release layer.
10. The electromagnetic wave interference resistant adhesive tape according to claim 8, wherein the adhesive layer is disposed on both sides of the shielding reinforcing layer, and the wave absorbing layer is attached to the adhesive layer without the release layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023212292.5U CN214693975U (en) | 2020-12-28 | 2020-12-28 | Anti-electromagnetic wave interference adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023212292.5U CN214693975U (en) | 2020-12-28 | 2020-12-28 | Anti-electromagnetic wave interference adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214693975U true CN214693975U (en) | 2021-11-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023212292.5U Active CN214693975U (en) | 2020-12-28 | 2020-12-28 | Anti-electromagnetic wave interference adhesive tape |
Country Status (1)
| Country | Link |
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| CN (1) | CN214693975U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115895487A (en) * | 2022-12-27 | 2023-04-04 | 成都佳驰电子科技有限公司 | Super-hydrophobic wave-absorbing adhesive tape and preparation method thereof |
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2020
- 2020-12-28 CN CN202023212292.5U patent/CN214693975U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115895487A (en) * | 2022-12-27 | 2023-04-04 | 成都佳驰电子科技有限公司 | Super-hydrophobic wave-absorbing adhesive tape and preparation method thereof |
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