CN214518237U - Full-automatic laser processing equipment - Google Patents
Full-automatic laser processing equipment Download PDFInfo
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- CN214518237U CN214518237U CN202022903420.4U CN202022903420U CN214518237U CN 214518237 U CN214518237 U CN 214518237U CN 202022903420 U CN202022903420 U CN 202022903420U CN 214518237 U CN214518237 U CN 214518237U
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Abstract
The utility model relates to a full-automatic laser beam machining equipment, including workstation, the portable laser cutting tool that sets up on the workstation and laser lobe of a leaf tool and set up laser cutting device, laser lobe of a leaf device and the last feeding mechanical arm on the base that is equipped with the base, go up feeding mechanical arm and be used for absorbing the semi-manufactured goods material after the cutting of laser cutting device on the laser cutting tool to laser lobe of a leaf tool on, laser lobe of a leaf device is used for laser lobe of a leaf tool semi-manufactured goods material carries out laser lobe of a leaf. The utility model discloses degree of automation is high, and carries out laser cutting again after the Mark point on the product through camera location, and laser cutting platform adopts linear electric motor control cutting orbit, has guaranteed the precision of processing position and processing orbit.
Description
Technical Field
The utility model belongs to the technical field of laser cutting, especially, relate to a full-automatic laser beam machining equipment.
Background
In the laser processing industry, particularly laser cutting equipment for processing fragile materials such as sapphire and the like, the automation degree is relatively high; on one hand, labor cost can be saved, more benefits are created for enterprises, on the other hand, the requirement of products on cleanliness is higher, manual participation is reduced, and the yield of the products can be improved. However, because sapphire has high hardness, the conventional CNC machining method is slow in efficiency and high in consumable material.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve not enough among the prior art to a certain extent at least, provide a full-automatic laser processing equipment.
In order to achieve the above object, an embodiment of the present invention provides a full-automatic laser processing apparatus, including:
the device comprises a workbench, wherein a base is arranged on the workbench;
the laser cutting jig is movably arranged on the workbench;
the laser cutting device is arranged on the base and is used for carrying out laser cutting on the material to be processed on the laser cutting jig;
the laser splinter jig is movably arranged on the workbench;
the feeding and discharging mechanical arm is movably arranged on the base and is used for sucking the semi-finished product materials cut by the laser cutting device on the laser cutting jig to the laser splinter jig;
and the laser splitting device is arranged on the base and is used for carrying out laser splitting on the semi-finished product material on the laser splitting jig.
Preferably, the material feeding device comprises a first longitudinal driving mechanism arranged on the workbench, a material rack arranged on the first longitudinal driving mechanism in a sliding manner, at least one material box detachably arranged on the material rack, and a handle used for locking or unlocking the material box; the material box is suitable for loading a plurality of plate-shaped materials to be processed, and the plurality of materials to be processed are arranged at intervals along the longitudinal direction; and the feeding and discharging mechanical arm is used for sucking the materials to be processed on the feeding device to the laser cutting jig.
Preferably, the laser cutting jig is mounted on the workbench through a laser cutting platform, the laser cutting platform comprises a second longitudinal driving mechanism fixed on the workbench and a first transverse driving mechanism arranged on the second longitudinal driving mechanism, the laser cutting jig is arranged on the first transverse driving mechanism, and the laser cutting platform can drive the laser cutting jig to move in the transverse direction and the longitudinal direction; the laser cutting jig further comprises a clamping and positioning mechanism for clamping and positioning the material to be processed and an adsorption mechanism for adsorbing and fixing the material to be processed.
Preferably, the workbench is further provided with a base, the base comprises two stand columns respectively fixed at the left end and the right end of the workbench and a cross beam connected with the two stand columns, the laser cutting device comprises a first lifting mechanism arranged on the cross beam and a laser cutting mechanism arranged on the first lifting mechanism, and the first lifting mechanism can drive the laser cutting mechanism to lift; the laser cutting mechanism comprises a laser generator, a light path system and a laser cutting head, and the laser cutting head is used for focusing light beams generated by the laser generator to cut and process the material to be processed.
Preferably, the laser cutting device further comprises a CCD positioning mechanism arranged on the first lifting mechanism, wherein the CCD positioning mechanism is used for photographing and positioning the material to be processed and identifying the cutting position, so that the laser cutting mechanism cuts and processes the material to be processed along a preset cutting track.
Preferably, the laser splinter device comprises a second lifting mechanism arranged on the beam and a laser splinter mechanism arranged on the second lifting mechanism, and the second lifting mechanism can drive the laser splinter mechanism to lift; the laser splitting mechanism is used for generating high-temperature laser energy to heat a laser cutting track so as to split a semi-finished product of a material to be processed into a finished product and a waste material after laser cutting.
Preferably, the feeding and discharging manipulator comprises a rack fixed on the base, a second transverse driving mechanism arranged on the rack, a third lifting mechanism arranged on the second transverse driving mechanism, and a first suction assembly and a second suction assembly arranged on the third lifting mechanism, and the first suction assembly and the second suction assembly are respectively positioned on two sides of the third lifting mechanism.
Preferably, the laser splinter jig is arranged on the workbench through a third longitudinal driving mechanism.
Preferably, the dust extraction device further comprises a suction nozzle and a connector communicated with the suction nozzle, the connector is communicated with the negative pressure device through a pipe body, and the suction nozzle is located above the third longitudinal driving mechanism and is provided with a dust extraction port facing the third longitudinal driving mechanism.
Preferably, the blanking device is arranged on the workbench and comprises a fourth longitudinal driving mechanism arranged on the workbench, a blanking frame arranged on the fourth longitudinal driving mechanism and a blanking plate placed on the blanking frame; and the feeding and discharging mechanical arm is used for sucking a finished product split by the laser splitting device on the laser splitting jig to the discharging device.
From the foregoing the embodiment of the utility model provides a can know, the utility model has the advantages of as follows:
the automation degree is high, the Mark points on the product are positioned through the camera, then laser cutting is carried out, and the laser cutting platform adopts a linear motor to control the cutting track, so that the precision of the processing position and the processing track is ensured; in addition, the whole cutting process of the full-automatic laser processing equipment is in a closed environment, so that the environment pollution can be avoided, and the processing environment is ensured.
Drawings
In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural view of a full-automatic laser processing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of the loading and unloading robot of FIG. 1 without the loading and unloading robot;
FIG. 3 is a schematic view of the structure of the feeding device in FIG. 1;
FIG. 4 is a schematic structural view of the laser cutting jig shown in FIG. 1;
FIG. 5 is a schematic structural view of the feeding and discharging manipulator in FIG. 1;
FIG. 6 is a schematic structural view of the laser splinter jig and the dust extraction device shown in FIG. 1;
FIG. 7 is a schematic structural view of the blanking device in FIG. 1;
fig. 8 is a schematic structural diagram of another embodiment of a fully automatic laser processing apparatus.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention, and all other embodiments obtained by those skilled in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", and the like, indicate the orientation or positional relationship indicated based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1-2, the utility model discloses a full-automatic laser processing device, which comprises a worktable 100, a feeding device 10, a laser cutting jig 20, a laser cutting device 30, a laser splinter jig 60, a loading and unloading manipulator 50, a laser splinter device 40 and a blanking device 70; wherein, a base is arranged on the workbench 100, the feeding device 10 and the blanking device 70 are respectively and fixedly arranged at two ends of the workbench 100, the feeding device 10 is used for supplying materials to be processed, the laser cutting jig 20 and the laser splinter jig 60 are respectively and movably arranged on the workbench 100, the loading and unloading manipulator 50 is movably arranged on the base and is used for absorbing the materials to be processed on the feeding device 10 to the laser cutting jig 20, the laser cutting device 30 is arranged on the base and is used for carrying out laser cutting on the materials to be processed on the laser cutting jig 20, the loading and unloading manipulator 50 is also used for absorbing semi-finished materials on the laser cutting jig 20 after being cut by the laser cutting device 30 to the laser splinter jig 60, the laser splinter device 40 is arranged on the base and is used for carrying out laser splinter on the semi-finished materials on the laser splinter jig 60, and the loading and unloading manipulator 50 is also used for absorbing the finished materials on the laser splinter jig 60 after being splinter by the laser splinter device 40 Sucking to a blanking device 70.
The material to be processed is a plate or a sheet made of brittle materials such as sapphire, the laser cutting device 30 adopts a picosecond laser and is used for cutting the material to be processed on the laser cutting jig 20 according to a preset cutting track, and after picosecond laser cutting, a finished product and waste materials cannot be completely separated, so that a semi-finished product is formed; and the laser splinter device 40 is used for generating CO2The laser heats the cutting track of the semi-finished product on the laser cutting jig 20 to separate the waste material from the finished product.
As shown in fig. 3, the feeding device 10 includes a first longitudinal driving mechanism 11 disposed on the working table 100, a material rack 12 slidably disposed on the first longitudinal driving mechanism 11, at least one material box 12 detachably mounted on the material rack 12, and a handle 13 for locking or unlocking the material box 12; the material box 12 is adapted to load a plurality of plate-shaped materials to be processed, which are vertically arranged and longitudinally spaced. The first longitudinal driving mechanism 11 can drive the material rack 12 to move the material box 12 back and forth in the longitudinal direction, so as to cooperate with the loading and unloading robot 50 to suck the material to be processed in the material box 12.
Specifically, the surface of the material rack 12 is provided with an accommodating groove, the handle 13 is arranged adjacent to the accommodating groove and is linked with a pressing rod, when the material box 12 is placed in the accommodating groove, the pressing rod is driven by the handle 13 to press against the material box 12, so that the material box 12 and the material rack 12 are mutually fixed and locked; and after the material to be processed in the material box 12 is completely taken out, the pressing rod is driven by the handle 13 to be far away from the material box 12, and at the moment, the material box 12 can be taken out from the accommodating groove of the material rack 12, so that the material box 12 filled with the material to be processed can be rapidly replaced.
It should be noted that in the material rack 12 in this embodiment, two material boxes 12 are arranged side by side along the transverse direction, that is, the feeding and discharging manipulator 50 sucks two materials to be processed at a time. Correspondingly, the laser cutting jig 20 and the laser splinter jig 60 respectively have two processing stations.
Referring to fig. 4, the laser cutting jig 20 is mounted on the worktable 100 through a laser cutting platform 80, the laser cutting platform 80 includes a second longitudinal driving mechanism 81 fixed on the worktable 100 and a first transverse driving mechanism 82 disposed on the second longitudinal driving mechanism 81, the laser cutting jig 20 is disposed on the first transverse driving mechanism 82, and the laser cutting platform 80 can drive the laser cutting jig 20 to move in the transverse direction and the longitudinal direction; when the feeding and discharging mechanical arm 50 absorbs the material to be processed and moves and fixes the material to the laser cutting jig 20, the material to be processed on the laser cutting jig 20 is driven by the laser cutting platform 80 to move on the plane, and the laser generated by the laser cutting device 30 is matched to cut the material to be processed according to the preset cutting track.
The laser cutting jig 20 further includes a clamping and positioning mechanism 21 for clamping and positioning the material to be processed and an adsorption mechanism for adsorbing and fixing the material to be processed. Specifically, the laser cutting jig 20 has two cutting stations arranged side by side in the transverse direction, each cutting station is correspondingly provided with a clamping and positioning mechanism 21, the clamping and positioning mechanism 21 comprises a positioning portion 211 arranged at a right angle, a movable transverse clamping portion 212 and a longitudinal clamping portion 213, and a driving component for driving the transverse clamping portion 212 to move in the transverse direction and the longitudinal clamping portion 213 to move in the longitudinal direction, when a material to be processed is required to be arranged on the cutting station of the laser cutting jig 20, the driving component drives the transverse clamping portion 212 and the longitudinal clamping portion 213 to be away from the positioning portion 211 along the transverse direction and the longitudinal direction respectively, when the material to be processed is arranged on the cutting station defined by the positioning portion 211, the transverse clamping portion 212 and the longitudinal clamping portion 213, the driving component drives the transverse clamping portion 212 and the longitudinal clamping portion 213 to be close to the positioning portion 211 respectively, the clamping and fixing of the materials to be processed are achieved, and the postures of the materials to be processed are corrected.
And adsorption device constructs including setting up the vacuum chuck on the cutting station and with the negative pressure generator 22 of vacuum chuck intercommunication, after centre gripping positioning mechanism 21 location centre gripping has been treated the processing material, will treat that the processing material adsorbs firmly to fix on the cutting station through adsorption device, prevents to take place to become flexible in the laser beam machining process.
In one embodiment, the base may be made of marble, and includes two columns 101 fixed to the left and right ends of the worktable 100, respectively, and a beam 102 connecting the two columns 101, wherein the base is located at the rear end of the worktable 100, and the feeding device 10, the laser cutting jig 20, the laser splinting jig 60, and the blanking device 70 are arranged on the front end surface of the worktable 100 in a transverse direction in sequence.
The laser cutting device 30 comprises a first lifting mechanism 31 arranged on the front side of the beam 102 and a laser cutting mechanism 32 arranged on the first lifting mechanism 31; the laser cutting mechanism 32 includes a laser generator, an optical path system, and a laser cutting head for focusing a light beam generated by the laser generator to cut and process the material to be processed. The first lifting mechanism 31 can drive the laser cutting mechanism 32 to lift so as to adjust the distance between the laser cutting mechanism 32 and the material to be processed, so that the material to be processed is at the focus of laser, then the laser cutting platform 80 is driven to drive the material to be processed to move in the transverse direction and the longitudinal direction according to the preset cutting track, the generated laser moves on the material to be processed along the preset cutting track,
further, the laser cutting device 30 further comprises a CCD positioning mechanism 33 disposed on the first lifting mechanism 31, the CCD positioning mechanism 33 is used for photographing, positioning and cutting the material to be processed on the station and identifying Mark points, so that when the laser cutting platform 80 drives the material to be processed to move, the cutting laser of the laser cutting mechanism 32 can cut and process the material to be processed along a preset cutting track. In this embodiment, the laser cutting device 30 includes two CCD positioning mechanisms 33, which correspond to the two cutting stations on the laser cutting jig 20, respectively, so that the laser cutting mechanism 32 can accurately identify the respective cutting positions when respectively processing the materials on the two cutting stations, thereby ensuring the cutting accuracy on the two cutting stations.
In one embodiment, the laser splinter device 40 includes a second lifting mechanism 41 disposed on the beam 102 and a laser splinter mechanism 42 disposed on the second lifting mechanism 41, wherein the second lifting mechanism 41 can drive the laser splinter mechanism 42 to lift and lower so as to adjust the distance between the laser splinter mechanism 42 and the semi-finished product on the laser splinter jig 60; laser spalling mechanism 42 is used to generate high temperature CO2The laser energy heats the laser cutting track to split the semi-finished product of the material to be processed into a finished product and waste material after laser cutting. Preferably, the laser splinter device 40 may further include a CCD positioning mechanism 43, and when it is detected that the laser splinter jig 60 drives the semi-finished product to move into the effective range of the laser splinter mechanism 42, the laser splinter mechanism 42 is controlled to be turned on to generate high-temperature CO2The laser energy heats the laser cutting track of the semi-finished product to achieve the splitting effect.
As shown in fig. 5, in one embodiment, the loading and unloading robot 50 includes a frame 51 fixed on the base, a second transverse driving mechanism 52 disposed on the frame 51, a third lifting mechanism 53 disposed on the second transverse driving mechanism 52, and a first suction assembly 54 and a second suction assembly 55 disposed on the third lifting mechanism 53, and the first suction assembly 54 and the second suction assembly 55 are respectively disposed at two sides of the third lifting mechanism 53.
Specifically, the frame 51 comprises two supporting pieces 511 which are respectively arranged on the two upright posts 101 and extend upwards in an inclined manner towards the front of the workbench 100, and a mounting plate 512 which is connected between the two supporting pieces 511, the second transverse driving mechanism 52 is fixed on the front side of the mounting plate 512, so that the laser cutting device 30 and the laser splitting device 40 are positioned between the cross beam 102 and the mounting plate 512, the structure is more compact, the second transverse driving mechanism 52 can drive the third lifting mechanism 53 to move back and forth in the transverse direction integrally, and the third lifting mechanism 53 can drive the first suction assembly 54 and the second suction assembly 55 to ascend or descend integrally; wherein the angle of the first suction assembly 54 is controllably rotatedThe device is used for sucking the sheet-shaped material to be processed vertically placed on the feeding device 10, horizontally placing the sucked vertical material to be processed through rotation, and movably placing the material to be processed on a cutting station on the laser cutting jig 20; the second suction assembly 55 is used for sucking and moving the semi-finished product on the laser cutting jig 20 to the laser splinting jig 60, and the semi-finished product passes through the high-temperature CO of the laser splinting mechanism 422After the laser energy is heated and split into the finished product and the waste material, the finished product on the laser splitting jig 60 is sucked to the blanking device 70 by the second sucking component 55. It should be noted that the steps of sucking the material to be processed on the feeding device 10 to the laser cutting jig 20 by the first sucking component 54 and sucking the semi-finished product on the laser cutting jig 20 to the laser splinting jig 60 by the second sucking component 55 can be performed synchronously.
Referring to fig. 6, the laser splinting jig 60 is disposed on the worktable 100 through a third longitudinal driving mechanism 61, and the third longitudinal driving mechanism 61 can drive the laser splinting jig 60 to move back and forth in the longitudinal direction of the worktable 100; in the embodiment, the laser splinter jig 60 correspondingly has two splinter stations, and after the second suction assembly 55 sucks the semi-finished product on the laser cutting jig 20 to the splinter station of the laser splinter jig 60, the laser splinter jig 60 is driven by the third longitudinal driving mechanism 61 to move to the lower side of the laser splinter mechanism 42, and the high-temperature CO generated by the laser splinter mechanism 42 passes through2The laser energy cuts the cutting track on the semi-finished product to achieve the effect of splitting.
In addition, based on the actual processing efficiency analysis, two COs were configured for one picosecond laser cutting system2The laser lobe of a leaf system can reach the maximization of processing efficiency; that is, in the present embodiment, the number of the laser splitting mechanisms 42 and the CCD positioning mechanisms of the laser splitting device 40 corresponds to the number of the splitting stations on the laser splitting jig 60, and both are two.
Further, the full-automatic laser processing apparatus of this embodiment further includes a dust extraction device 90, and further includes the dust extraction device 90, the dust extraction device 90 includes a suction nozzle 91 and an interface 92 communicated with the suction nozzle 91, the interface 92 is communicated with the negative pressure device through a pipe body, the suction nozzle 91 is located above the third longitudinal driving mechanism 61, and has a dust extraction port facing the third longitudinal driving mechanism 61. Specifically, the suction nozzle 91 is fixed below the cross beam 102 through the mounting bracket 93, and since the waste material generated after the laser splinter jig 60 is splinted is small fragments, the splinter jig can be moved to a position right below the dust extraction port of the suction nozzle 91 through the third longitudinal driving mechanism 61 after splinter, and the waste material is removed by the suction nozzle 91.
As described with reference to fig. 7, the blanking device 70 includes a fourth longitudinal driving mechanism 71 disposed on the work table 100, a blanking frame 72 disposed on the fourth longitudinal driving mechanism 71, and a blanking plate 73 disposed on the blanking frame 72. The fourth longitudinal driving mechanism 71 can drive the blanking frame 72 and the blanking plate 73 to move longitudinally on the workbench 100, so that the finished products after processing can be arranged on the surface of the whole blanking plate 73 by matching with the feeding and blanking manipulator 50; preferably, the blanking frame 72 is provided with a positioning groove, the blanking plate 73 can be positioned in the positioning groove, and when the blanking plate 73 is fully placed, the blanking plate 73 filled with the finished product can be directly taken out, so that another empty blanking plate 73 can be quickly replaced on the blanking frame 72.
It should be noted that, in this embodiment, each of the transverse and longitudinal driving mechanisms employs a linear motor, thereby ensuring the precision in each machining process.
As shown in fig. 8, in some embodiments, the full-automatic laser processing apparatus further includes a cabinet 200, a protective cover 300 and a controller, the controller is disposed in the cabinet 200, the work table 100 is fixed on the cabinet 200, the protective cover 300 is covered on the cabinet 200, and the work table 100, the feeding device 10, the loading and unloading manipulator 50, the laser cutting jig 20, the laser cutting device 30, the laser splinter jig 60, the laser splinter device 40 and the unloading device 70 are accommodated in the protective cover 300, so that the service life of the entire apparatus can be prolonged; the controller is used for controlling the operation of the whole full-automatic laser processing equipment, and the protective cover 300 is also provided with a display 301, an operation panel 302 and a three-color alarm lamp 303.
The working process of the full-automatic laser processing equipment is as follows:
placing a material box 12 loaded with materials to be processed in an accommodating groove of a material frame 12, fixing the material box 12 on the material frame 12 through a handle 13, starting the full-automatic laser processing equipment, driving the material box 12 to a proper position through a first longitudinal driving mechanism 11, sucking two pieces of materials to be processed from the material box 12 by a first sucking component 54 of a feeding and discharging mechanical arm 50, placing the two pieces of materials to be processed on two cutting stations of a laser cutting jig 20, and fixing the two pieces of materials through a clamping and positioning mechanism 21 and an adsorbing mechanism;
shoot through CCD positioning mechanism and fix a position and treat the processing material and discern the Mark point, first elevating system 31 drive laser cutting mechanism 32 goes up and down to the distance between adjustment laser cutting mechanism 32 and the material of treating processing makes the material of treating processing be in the focus of cutting laser, then drives the removal of treating the processing material through laser cutting platform 80, so that cutting laser cuts processing according to predetermined cutting orbit on treating the processing material, forms semi-manufactured goods.
The second sucking component 55 of the loading and unloading manipulator 50 sucks and moves the semi-finished product on the laser cutting jig 20 to the splitting station of the laser splitting jig 60, and CO generated by the laser splitting mechanism 422The laser heats the cutting track to separate the waste material from the finished product (i.e. the splinter), the second suction assembly 55 sucks and moves the separated finished product to the blanking plate 73 of the blanking device 70, the waste material remains on the laser splinter jig 60 at this time, the third driving mechanism drives the laser splinter jig 60 to move to the lower part of the dust extraction opening, and the waste material on the laser splinter jig 60 is sucked and removed completely through the dust extraction device 90.
Above-mentioned full-automatic laser machining equipment, to treat that the processing material loads in material box 12, and place material fixed loading attachment with material box 12 and add, can start full-automatic laser machining equipment and treat the processing material and carry out full automatic cutout, go up unloading manipulator 50 and absorb the processing material of treating in material box 12 and place in laser cutting tool 20, fix a position and carry out picosecond laser cutting according to predetermined cutting orbit through CCD positioning mechanism and become after the semi-manufactured goods, half-manufactured goods are absorbed to move to laser lobe of a leaf tool 60 on rethread unloading manipulator 50, via CO2The laser heats the cutting track to separate the waste from the finished product, the finished product is sucked by the feeding and discharging mechanical arm 50 and moved to the discharging device 70, and the waste is sucked and cleaned by the dust-pumping device 90. The automation degree is high, the Mark points on the product are positioned through the camera, then laser cutting is carried out, the laser cutting platform 80 adopts a linear motor to control the cutting track, and the precision of the processing position and the processing track is ensured; in addition, the whole cutting process of the full-automatic laser processing equipment is in a closed environment, so that the environment pollution can be avoided, and the processing environment is ensured.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
Above is the description to the technical scheme that the utility model provides, to technical personnel in the field, according to the utility model discloses the thought of embodiment all has the change part on concrete implementation and range of application, to sum up, this description content should not be understood as the restriction of the utility model.
Claims (10)
1. A full-automatic laser processing apparatus, comprising:
the device comprises a workbench, wherein a base is arranged on the workbench;
the laser cutting jig is movably arranged on the workbench;
the laser cutting device is arranged on the base and is used for carrying out laser cutting on the material to be processed on the laser cutting jig;
the laser splinter jig is movably arranged on the workbench;
the feeding and discharging mechanical arm is movably arranged on the base and is used for sucking the semi-finished product materials cut by the laser cutting device on the laser cutting jig to the laser splinter jig;
and the laser splitting device is arranged on the base and is used for carrying out laser splitting on the semi-finished product material on the laser splitting jig.
2. The full-automatic laser processing equipment according to claim 1, further comprising a feeding device arranged on the workbench, wherein the feeding device comprises a first longitudinal driving mechanism arranged on the workbench, a material rack arranged on the first longitudinal driving mechanism in a sliding manner, at least one material box detachably arranged on the material rack, and a handle for locking or unlocking the material box; the material box is suitable for loading a plurality of plate-shaped materials to be processed, and the plurality of materials to be processed are arranged at intervals along the longitudinal direction; and the feeding and discharging mechanical arm is used for sucking the materials to be processed on the feeding device to the laser cutting jig.
3. The full-automatic laser processing equipment according to claim 1, wherein the laser cutting jig is mounted on the worktable through a laser cutting platform, the laser cutting platform comprises a second longitudinal driving mechanism fixed on the worktable and a first transverse driving mechanism arranged on the second longitudinal driving mechanism, the laser cutting jig is arranged on the first transverse driving mechanism, and the laser cutting platform can drive the laser cutting jig to move in the transverse direction and the longitudinal direction; the laser cutting jig further comprises a clamping and positioning mechanism for clamping and positioning the material to be processed and an adsorption mechanism for adsorbing and fixing the material to be processed.
4. The full-automatic laser processing equipment according to claim 1, wherein the base comprises two upright columns respectively fixed at the left end and the right end of the workbench and a cross beam connecting the two upright columns, the laser cutting device comprises a first lifting mechanism arranged on the cross beam and a laser cutting mechanism arranged on the first lifting mechanism, and the first lifting mechanism can drive the laser cutting mechanism to lift; the laser cutting mechanism comprises a laser generator, a light path system and a laser cutting head, and the laser cutting head is used for focusing light beams generated by the laser generator to cut and process the material to be processed.
5. The full-automatic laser processing equipment according to claim 4, wherein the laser cutting device further comprises a CCD positioning mechanism arranged on the first lifting mechanism, and the CCD positioning mechanism is used for photographing and positioning the material to be processed and identifying a cutting position, so that the laser cutting mechanism cuts and processes the material to be processed along a preset cutting track.
6. The full-automatic laser processing equipment according to claim 4, wherein the laser splinter device comprises a second lifting mechanism arranged on the cross beam and a laser splinter mechanism arranged on the second lifting mechanism, and the second lifting mechanism can drive the laser splinter mechanism to lift; the laser splitting mechanism is used for generating high-temperature laser energy to heat a laser cutting track so as to split a semi-finished product of a material to be processed into a finished product and a waste material after laser cutting.
7. The full-automatic laser processing equipment as claimed in claim 4, wherein the loading and unloading robot comprises a frame fixed on the base, a second transverse driving mechanism arranged on the frame, a third lifting mechanism arranged on the second transverse driving mechanism, and a first suction assembly and a second suction assembly arranged on the third lifting mechanism, and the first suction assembly and the second suction assembly are respectively positioned at two sides of the third lifting mechanism.
8. The full-automatic laser processing equipment of claim 1, wherein the laser splinter jig is arranged on the workbench through a third longitudinal driving mechanism.
9. The full-automatic laser processing equipment according to claim 8, further comprising a dust extraction device, wherein the dust extraction device comprises a suction nozzle and a port communicated with the suction nozzle, the port is communicated with the negative pressure device through a pipe body, and the suction nozzle is located above the third longitudinal driving mechanism and has a dust extraction port facing the third longitudinal driving mechanism.
10. The full-automatic laser processing equipment according to claim 1, further comprising a blanking device disposed on the worktable, wherein the blanking device comprises a fourth longitudinal driving mechanism disposed on the worktable, a blanking frame disposed on the fourth longitudinal driving mechanism, and a blanking plate disposed on the blanking frame; and the feeding and discharging mechanical arm is used for sucking a finished product split by the laser splitting device on the laser splitting jig to the discharging device.
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| CN202022903420.4U CN214518237U (en) | 2020-12-04 | 2020-12-04 | Full-automatic laser processing equipment |
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| CN202022903420.4U CN214518237U (en) | 2020-12-04 | 2020-12-04 | Full-automatic laser processing equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114057384A (en) * | 2021-12-10 | 2022-02-18 | 青岛天仁微纳科技有限责任公司 | Scanning electron microscope auxiliary positioning splitting device and using method |
| CN116872059A (en) * | 2023-09-04 | 2023-10-13 | 沈阳和研科技股份有限公司 | Cutting machine for automatically cutting KIT rubber groove |
| CN117055147A (en) * | 2023-10-11 | 2023-11-14 | 上海鲲游科技有限公司 | Splitting method of diffraction optical waveguide |
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2020
- 2020-12-04 CN CN202022903420.4U patent/CN214518237U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114057384A (en) * | 2021-12-10 | 2022-02-18 | 青岛天仁微纳科技有限责任公司 | Scanning electron microscope auxiliary positioning splitting device and using method |
| CN114057384B (en) * | 2021-12-10 | 2024-06-11 | 青岛天仁微纳科技有限责任公司 | Auxiliary positioning lobe device of scanning electron microscope and use method |
| CN116872059A (en) * | 2023-09-04 | 2023-10-13 | 沈阳和研科技股份有限公司 | Cutting machine for automatically cutting KIT rubber groove |
| CN117055147A (en) * | 2023-10-11 | 2023-11-14 | 上海鲲游科技有限公司 | Splitting method of diffraction optical waveguide |
| CN117055147B (en) * | 2023-10-11 | 2023-12-19 | 上海鲲游科技有限公司 | Splitting method of diffraction optical waveguide |
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