CN214482116U

CN214482116U - Positioning tool for IGBT module

Info

Publication number: CN214482116U
Application number: CN202120315387.5U
Authority: CN
Inventors: 张大千; 李�浩; 徐涛涛; 罗进恒; 王波
Original assignee: Shenzhen Faraday Electric Drive Co ltd
Current assignee: Shenzhen Faraday Electric Drive Co ltd
Priority date: 2021-02-03
Filing date: 2021-02-03
Publication date: 2021-10-22
Anticipated expiration: 2031-02-03

Abstract

The embodiment of the utility model discloses a location frock of IGBT module, location frock includes the frock bottom plate, and the frock bottom plate back is equipped with the direction reference column that a plurality of positions respectively with the module fixed orifices one-to-one of IGBT module one-to-one in a pair of angle department, sets up on the frock bottom plate a plurality of positions respectively with the pin one-to-one of IGBT module dodge logical groove; a plurality of hole avoiding grooves which are respectively in one-to-one correspondence with the module fixing holes at the other pair of corners of the IGBT module are formed in the edge of the tool bottom plate; the guide positioning column is perpendicular to the tool bottom plate. The utility model discloses an accurate assembly of IGBT module can protect the IGBT module assembly in-process pin not by the damage, can inject IGBT module set screw and screw up the order, guarantees that heat dissipation silicone grease evenly spreads out after the assembly, guarantees the product uniformity simultaneously.

Description

Positioning tool for IGBT module

Technical Field

The utility model relates to a machine controller produces technical field, especially relates to a location frock of IGBT module.

Background

The IGBT module is a key power device of the inverter and has direct influence on the performance and reliability of the inverter. Currently, most IGBT modules are packaged generally and do not have specific positioning characteristics. And one or more IGBT modules in the inverter are simultaneously assembled with the PCB and the product heat dissipation structure, so that the positioning of the IGBT modules in the assembling process is particularly important.

The currently common assembly scheme is as follows:

1) assembling an IGBT module and a drive PCB and welding pins; coating heat-conducting silicone grease on the IGBT module heat-radiating substrate; and assembling the coated IGBT module on a heat dissipation structure of a product. The disadvantages of this assembly solution are: 1. the integral flatness of the radiating substrate of each IGBT module is difficult to ensure; 2. in the IGBT coating and turnover processes, each IGBT module is connected with the drive PCB by virtue of a welding pin, and the pin can receive stress; 3. when the IGBT module is assembled on the heat dissipation structure, the IGBT module can deform in the screwing process, so that stress is generated on pins of the IGBT module; 4. when the first fixing screw is screwed down, the rotation friction force of the screw to the fixed position of the module drives the module to rotate, so that the assembly is influenced, and the coated heat dissipation silicone grease is damaged.

2) Firstly, coating silicone grease on an IGBT module radiating substrate; assembling each IGBT module on a product heat dissipation structure; and then assembling a driving PCB and welding the pins of the IGBT module. The difficulty of the scheme is that when the IGBT module is assembled on a product heat dissipation structure, the accurate position of the IGBT module is difficult to determine. The inaccuracy of the IGBT module position will have the following problems: 1. when the fixing screw of the IGBT module is screwed, the screw cannot accurately fall into the screw hole, and the heat dissipation surface is damaged in the screwing process; 2. when the first fixing screw is screwed down, the rotation friction force of the screw to the fixed position of the module drives the module to rotate, so that the assembly is influenced, and the coated heat dissipation silicone grease is damaged; 3. the risk of accidentally damaging the pins of the IGBT module exists in the screw screwing process; 4. when the driving PCB is assembled, due to inaccurate positions of the modules, the driving PCB and the pins of the IGBT module may have assembly interference; 5. if the packaging holes of the pins of the driver PCB and the IGBT module are enlarged to avoid the assembly interference of the driver PCB, the probability of welding defects such as solder leakage and solder missing of the pins is increased.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a technical problem who solves lies in, provides a location frock of IGBT module to realize the accurate assembly of IGBT module.

In order to solve the technical problem, an embodiment of the utility model provides a positioning tool for an IGBT module, which comprises a tool bottom plate matched with the size of the IGBT module to be installed, wherein the back surface of the tool bottom plate is provided with a plurality of guiding positioning columns, the positions of the guiding positioning columns are in one-to-one correspondence with module fixing holes at one diagonal position of the IGBT module respectively, and the tool bottom plate is provided with a plurality of avoidance through grooves, the positions of which are in one-to-one correspondence with pins of the IGBT module respectively; a plurality of hole avoiding grooves which are respectively in one-to-one correspondence with the module fixing holes at the other pair of corners of the IGBT module are formed in the edge of the tool bottom plate; the guide positioning column is perpendicular to the tool bottom plate, the diameter of the front end of the guide positioning column is smaller than that of the middle of the guide positioning column, the size of the middle of the guide positioning column is matched with the module fixing hole of the IGBT module, and the sum of the total length of the middle and the rear end of the guide positioning column and the thickness of the tool bottom plate is larger than the total thickness of the IGBT module.

Further, the front face of the tool bottom plate is provided with a handle.

The utility model has the advantages that:

1) the utility model solves the problem of positioning the IGBT module in the assembly process;

2) the utility model can protect the pins from being damaged in the process of assembling the IGBT module;

3) the utility model can limit the tightening sequence of the fixing screws of the IGBT module, ensure that the heat dissipation silicone grease is evenly spread after assembly, and simultaneously ensure the consistency of products;

4) the utility model is used for the set screw of fixed IGBT module does not need the pretension, has improved production efficiency.

Drawings

Fig. 1 is the utility model discloses three-dimensional structure chart of location frock of IGBT module.

Fig. 2 is a rear view of the positioning tool of the IGBT module according to the embodiment of the present invention.

Fig. 3 is a cross-sectional view at a-a in fig. 2.

Fig. 4 is the structure diagram of the IGBT module of the embodiment of the present invention when it is assembled on the heat dissipation structure.

Fig. 5 is the structure diagram of the positioning tool of the IGBT module of the embodiment of the present invention for positioning the IGBT module.

Fig. 6 is a cross-sectional view at B-B in fig. 5.

Fig. 7 is a structural diagram of the IGBT module according to the embodiment of the present invention when fixing screws are installed at opposite corners.

Fig. 8 is a structural diagram of the IGBT module according to the embodiment of the present invention when the positioning tool is removed.

Fig. 9 is a structural diagram of the IGBT module according to the embodiment of the present invention when fixing screws are installed at another diagonal position.

Fig. 10 is a structural view of the drive PCB board according to the embodiment of the present invention.

Fig. 11 is a structural diagram of the embodiment of the present invention when the assembly is completed.

Detailed Description

It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict, and the present invention is further described in detail with reference to the accompanying drawings and specific embodiments.

In the embodiment of the present invention, if there is directional indication (such as upper, lower, left, right, front, and rear … …) only for explaining the relative position relationship between the components and the motion situation under a certain posture (as shown in the drawing), if the certain posture is changed, the directional indication is changed accordingly.

In addition, the descriptions of the first, second, etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

Referring to fig. 1 to 3, a positioning tool of an IGBT module according to an embodiment of the present invention includes a tool bottom plate 1 and a guiding and positioning column 2.

The tool bottom plate 1 is matched with a plurality of IGBT modules 20 to be installed in size. The guiding positioning columns 2 are arranged on the back surface of the tool bottom plate 1, and the positions of the guiding positioning columns respectively correspond to the module fixing holes 21 at one pair of corners of the plurality of to-be-installed IGBT modules 20 one by one. The number of the guiding positioning columns 2 is twice that of the IGBT modules 20 to be assembled, preferably, the IGBT modules 20 to be assembled are 3 IGBT modules 20 to be assembled side by side, the number of the guiding positioning columns 2 is 6, and the positions of the guiding positioning columns correspond to the module fixing holes 21 at one pair of corners of the 3 IGBT modules 20 to be assembled side by side one by one.

A plurality of avoidance through grooves 3 are formed in the tool bottom plate 1, and the positions of the avoidance through grooves correspond to the pins 22 of the IGBT modules 20 one by one. Part of the avoiding through groove 3 is positioned in the middle of the tool bottom plate 1, and part of the avoiding through groove is positioned at the edge of the tool bottom plate 1. The edge of the tool baseplate 1 is provided with a plurality of hole avoiding grooves 4 which are respectively in one-to-one correspondence with the module fixing holes 21 at the other pair of corners of the IGBT module 20. The number of the hole avoiding grooves 4 is the same as that of the guiding positioning columns 2, and the positions of the hole avoiding grooves correspond to the module fixing holes 21 at the other diagonal positions of the plurality of to-be-installed IGBT modules 20 one by one.

The guiding and positioning column 2 is perpendicular to the tool bottom plate 1. The diameter of the front end of the guide positioning column 2 is smaller than that of the middle part. The size of the front end of the guiding positioning column 2 is matched with the size of a fixing threaded hole 31 on the heat dissipation structure 30. The size of the middle part is matched with a module fixing hole 21 of the IGBT module 20, the sum of the total length of the middle part and the rear end of the guide positioning column 2 and the thickness of the tool bottom plate 1 is larger than the total thickness of the IGBT module 20, so that a pin 22 of the IGBT module 20 is lower than the surface of the tool bottom plate 1, namely the pin 22 of the IGBT module 20 is in the tool bottom plate 1, the pin 22 is protected, and the pin 22 is prevented from being damaged in the assembling process.

As an implementation mode, the front surface of the tool bottom plate 1 is provided with a handle 5.

The embodiment of the utility model provides an assembly method of IGBT module who adopts, include:

step 1: referring to fig. 4, the IGBT module 20 coated with silicone grease is placed on the corresponding heat dissipation structure 30;

step 2: referring to fig. 5 to 6, the guiding positioning column 2 of the positioning tool of the IGBT module is inserted into the module fixing hole 21 of the IGBT module 20, and the IGBT module 20 is precisely positioned by the positioning tool of the IGBT module;

and step 3: referring to fig. 7, a fixing screw 24 is inserted into a module fixing hole 21 of the IGBT module 20 at the hole avoiding groove 4 and is tightened to fix the position of the IGBT module 20;

and 4, step 4: referring to fig. 8, the positioning tool of the IGBT module is taken down, referring to fig. 9, fixing screws 24 are installed in other module fixing holes 21 of the IGBT module 20 and tightened, and the assembly of the IGBT module 20 is completed;

and 5: referring to fig. 10, the driving PCB 40 is placed, and the pins 22 of the IGBT module 20 penetrate through the driving PCB 40;

step 6: referring to fig. 11, the driving PCB 40 is fixed to the IGBT module 20 by screws 41 (the screws 41 are inserted into the driving board fixing holes 23 of the IGBT module 20 through the driving PCB 40), and the pins 22 of the IGBT module 20 and the driving PCB 40 are soldered to complete the assembly.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A positioning tool for an IGBT module is characterized by comprising a tool bottom plate matched with the size of the IGBT module to be installed, wherein a plurality of guide positioning columns are arranged on the back surface of the tool bottom plate, the positions of the guide positioning columns are in one-to-one correspondence with module fixing holes at one diagonal position of the IGBT module respectively, and a plurality of avoidance through grooves are formed in the tool bottom plate, the positions of the avoidance through grooves are in one-to-one correspondence with pins of the IGBT module respectively; a plurality of hole avoiding grooves which are respectively in one-to-one correspondence with the module fixing holes at the other pair of corners of the IGBT module are formed in the edge of the tool bottom plate; the guide positioning column is perpendicular to the tool bottom plate, the diameter of the front end of the guide positioning column is smaller than that of the middle of the guide positioning column, the size of the middle of the guide positioning column is matched with the module fixing hole of the IGBT module, and the sum of the total length of the middle and the rear end of the guide positioning column and the thickness of the tool bottom plate is larger than the total thickness of the IGBT module.

2. The positioning tool for the IGBT module as claimed in claim 1, wherein a handle is arranged on the front surface of the tool bottom plate.