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CN214256936U - 模块 - Google Patents

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Publication number
CN214256936U
CN214256936U CN201990000842.3U CN201990000842U CN214256936U CN 214256936 U CN214256936 U CN 214256936U CN 201990000842 U CN201990000842 U CN 201990000842U CN 214256936 U CN214256936 U CN 214256936U
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CN
China
Prior art keywords
main surface
module
height
sealing resin
component
Prior art date
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CN201990000842.3U
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English (en)
Inventor
大坪喜人
秦强
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
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    • H05K3/22—Secondary treatment of printed circuits
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    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本实用新型提供不易按每个部件产生散热性差异的模块。模块(101)具备：布线基板(1)，其具有第1主面(31)；第1部件(41)，其安装于第1主面(31)，并具有第1高度(H1)；第2部件(42)，其安装于第1主面(31)，并具有比第1高度(H1)低的第2高度(H2)；以及密封树脂(3)，其配置为覆盖第1主面(31)并且覆盖第1部件(41)和第2部件(42)。同第1部件(41)与第1主面(31)之间的连接处使用的第1连接端子(51)相比，第2部件(42)与第1主面(31)之间的连接处使用的第2连接端子(52a)高度相对高。第1部件(41)的距第1主面(31)较远侧的表面和第2部件(42)的距第1主面(31)较远侧的表面从密封树脂(3)暴露。

Description

模块
技术领域
本实用新型涉及模块。
背景技术
日本特开2011-159930号公报(专利文献1)记载一种电子装置，具备：供安装高度不同的多个电子部件安装的印刷基板、散热板以及模塑树脂。以压缩的状态配置的热传导性凸块使多个电子部件和散热板热耦合。
专利文献1:日本特开2011-159930号公报
在专利文献1记载的结构中，高度不同的电子部件距散热板的距离不等，因此，与各电子部件连接的热传导性凸块的高度不同。在热传导性凸块的高度较大的情况下，散热路径长，因此，从电子部件向散热板散热的散热性劣化。因此，因电子部件的高度而异，散热性上产生差异。
实用新型内容
因此，本实用新型目的在于提供不易按每个部件产生散热性差异的模块。
用于实现上述目的，基于本实用新型的模块具备：布线基板，其具有第1主面；第1部件，其安装于上述第1主面，并具有第1高度；第2部件，其安装于上述第1主面，并具有比上述第1高度低的第2高度；以及密封树脂，其配置为覆盖上述第1主面并且覆盖上述第1部件和上述第2部件。同在上述第1部件和上述第1主面之间的连接处使用的第1连接端子相比，在上述第2部件和上述第1主面之间的连接处使用的第2连接端子高度相对高。上述第1部件的距上述第1主面较远侧的表面和上述第2部件的距上述第1主面较远侧的表面从上述密封树脂暴露。
根据本实用新型，第1部件和第2部件尽管部件本身的高度不同，也能够同等且高效地进行散热，因此，能够成为不易按每个部件产生散热性差异的模块。另外，第1部件和第2部件均从密封树脂暴露，因此，与使用热传导性凸块散热的构造相比，能够提高散热性。
附图说明
图1是基于本实用新型的实施方式1的模块的剖视图。
图2是基于本实用新型的实施方式2的模块的剖视图。
图3是基于本实用新型的实施方式3的模块的剖视图。
图4是基于本实用新型的实施方式4的模块的剖视图。
图5是基于本实用新型的实施方式5的模块的剖视图。、
图6是将基于本实用新型的实施方式5的模块安装于其他构件的结构的剖视图。
图7是基于本实用新型的实施方式6的模块的剖视图。
图8是基于本实用新型的实施方式7的模块的剖视图。
具体实施方式
附图中所示的尺寸比率并不总是如实地代表实际情况，存在为了方便说明而将尺寸比率夸张示出的情况。以下的说明中，提及上或者下的概念时不局限于是指绝对的上或者下，存在是指图示的姿势中的相对的上或者下的情况。
(实施方式1)
参照图1，对基于本实用新型的实施方式1的模块进行说明。此处所说的模块也可以被称为部件内置模块。
如图1所示，模块101具备：具有第1主面31的布线基板1、第1部件41、第2部件42、密封树脂3。第1部件41安装于第1主面31，并具有第1高度H1。第2部件42安装于第1主面31，并具有比第1高度低的第2高度H2。密封树脂3配置为覆盖第1主面31并且覆盖第1部件41和第2部件42。此处虽叙述为“覆盖”，但密封树脂3不是完全覆盖第1部件41和第2部件42，而是如后述那样，在第1部件41和第2部件42任一者中，一部分的面从密封树脂3暴露。而且，同在第1部件41与第1主面31之间的连接处使用的第1连接端子51相比，在第2部件42与第1主面31之间的连接处使用的第2连接端子52a高度相对高。第1部件41的距第1主面31较远侧的表面和第2部件42的距第1主面31较远侧的表面从密封树脂3暴露。
布线基板1也可以是树脂基板，也可以是陶瓷基板。布线基板1也可以是被称为芯体基板的结构。也可以如图1所例示那样，布线基板1是多个绝缘层2的层叠体。绝缘层2也可以是树脂层，也可以是陶瓷层。
此处所示的例子中，作为第1主面31的相反侧的面，布线基板1具有第2主面32。在第2主面32配置有外部连接电极11。外部连接电极11与贯通绝缘层2的导体导通孔14电连接。
在布线基板1的第1主面31配置有连接电极13。并且，配置有用于连接电子部件41和连接电极13的第1连接端子51。此处所示的例子中，第1连接端子51是焊料。第1连接端子51也可以是除焊料以外的任一种导电体。第1连接端子51也可以以例如在厚度方向上延伸的单一的导电体的形式形成。第1连接端子51也可以是例如焊料凸块。
在第1部件41的下方，与连接电极13电连接地配置有导体导通孔12。导体导通孔12配置为贯通绝缘层2。如第2部件42的下方所示，导体导通孔12也可以直接暴露于第1主面31。第2部件42具有电极42a。第2连接端子52a将电极42a和导体导通孔12电连接。此处所示的例子中，第2连接端子52a由在厚度方向上堆叠2个导体导通孔而成，但第2连接端子也可以以在厚度方向上延伸的单一的导电体的形式形成。第2连接端子52a也可以是由在厚度方向上堆叠三个以上的导体导通孔形成的。
此处，与第1连接端子51相比，第2连接端子52a相对高，由此，第1部件41的上表面与第2部件42的上表面成为相同的高度。即，第1部件41的上表面和第2部件42的上表面位于同一面内。第1部件41的上表面和第2部件42的上表面是必须成为相同的高度，两者也可以成为不同高度，但在该情况下，第1部件41的上表面和第2部件42的上表面双方从密封树脂3暴露。此处，使用在布线基板1的上侧存在第1部件41和第2部件42的例子进行了说明，因此，着眼于两部件的上表面的位置进行了说明，但存在第1部件41和第2部件42所处位置不局限于布线基板1的上侧，也可以是下侧。在该情况下，针对两部件的下表面的位置可以说相同。
也可以在第1主面31安装有除第1部件41和第2部件42以外的部件。图1所示的例子中，部件48也安装于第1主面31。贴片部件49a、49b也安装于第1主面31。优选部件48的上表面从密封树脂3暴露。优选部件48的上表面相对于第1部件41的上表面和第2部件42的上表面位于同一面内。
此处所示的例子中，第1部件41和第2部件42为IC。部件48也为IC。贴片部件49a、49b例如也可以为电容器。此处，贴片部件49a、49b为电容器，但贴片部件的种类不局限于此。贴片部件也可以是例如电感器也可以是电阻器。也可以是，除贴片部件49a、49b之外还安装有其他种类的部件，或者替代贴片部件49a、49b而安装有其他种类的部件。
在本实施方式中，第1部件41的距第1主面31较远侧的表面和第2部件42的距第1主面31较远侧的表面从密封树脂3暴露，因此，第1部件41中产生的热和第2部件42中产生的热不会受到密封树脂3妨碍，能够向外部释放。因此，第1部件41和第2部件42尽管部件本身的高度不同，也能够同等且高效地进行散热。因此，能够成为不易按每个部件产生散热性差异的模块。
(实施方式2)
参照图2，对基于本实用新型的实施方式2的模块进行说明。对于基本结构，本实施方式的模块102与实施方式1中说明的模块101相同。另一方面，关于以下方面，与模块101不同。
模块102具备屏蔽膜6，上述屏蔽膜6配置为覆盖第1部件41、第2部件42和密封树脂3。在模块102中，第1部件41和第2部件42与屏蔽膜6接触。屏蔽膜6也可以是例如金属膜。优选屏蔽膜6还覆盖布线基板1的侧面。
此处所示的例子中，第1部件41和第2部件42与屏蔽膜6面接触。图2所示的例子中，部件48也与屏蔽膜6接触。部件48也与屏蔽膜6面接触。
在本实施方式中，设置有屏蔽膜6，因此能够遮挡由第1部件41或者第2部件42产生的电磁波，能够防止对外部带来电磁影响。或者，能够防止外部的电磁波对第1部件41或者第2部件42带来影响。另外，屏蔽膜6能够由金属等那样热传导性优异的材料形成，在本实施方式中，第1部件41和第2部件42与屏蔽膜6接触，因此，第1部件41和第2部件42中产生的热能够经由屏蔽膜6高效地释放。因此，能够实现散热性优异的模块。
若第1部件41和第2部件42与屏蔽膜6面接触，则能够更高效地散热，从而优选。
(实施方式3)
参照图3，对基于本实用新型的实施方式3的模块进行说明。对于基本结构，本实施方式的模块103与实施方式2中说明的模块102相同。另一方面，关于以下方面，与模块102不同。
模块103在第2部件42与第1主面31之间具备安装于第1主面31的其他部件9。部件9也可以是例如贴片部件。部件9的高度小于第2连接端子52a的高度。也可以在部件9的上表面与第2部件42的下表面之间存在间隙。
在本实施方式中，在第2部件42与第1主面31之间具备安装于第1主面31的其他部件9，因此，第2部件42和其他部件9配置为在厚度方向上重叠。通过像这样配置于重叠位置，从而有助于在有限的面积安装更多的部件。在本实施方式中，能够实现省空间化。
此外，此处，将在实施方式2中说明的模块102追加了部件9的结构作为模块103进行了说明，但也可考虑在实施方式1中说明的模块101追加部件9而成的结构。
(实施方式4)
参照图4，对基于本实用新型的实施方式4的模块进行说明。对于基本结构，本实施方式的模块104与实施方式1中说明的模块101相同。另一方面，关于以下方面，与模块101不同。
模块104具备散热板7。第1部件41和第2部件42与散热板7接触。散热板7也可以是例如金属板。散热板7由比密封树脂3热传导性优异的材料形成即可。图4所示的例子中，部件48也与散热板7接触。
此处所示的例子中，第1部件41和第2部件42与散热板7面接触。
在本实施方式中，第1部件41和第2部件42与散热板7接触，因此，能够使第1部件41和第2部件42中产生的热经由散热板7高效地释放。此处，示出散热板7为平板的例子，但散热板7不局限于此平板状的构件，也可以具有不同的形状。例如，散热板7也可以具备散热片。
(实施方式5)
参照图5，对基于本实用新型的实施方式5的模块进行说明。对于基本结构，本实施方式的模块105与实施方式1中说明的模块101相同，但与模块101相比，上下颠倒。如图5所示，在模块105中，布线基板1的下表面成为第1主面31，上表面成为第2主面32。模块105具备连接导体15。连接导体15与形成于第1主面31的电极电连接，并贯通密封树脂3。连接导体15为棒状的导电体。连接导体15也可以是金属销。连接导体15也可以是层叠多个导体导通孔而形成的。第2部件42安装于第1主面31，并通过第2连接端子52b与设置于第1主面31的连接电极电连接。第2连接端子52b可以是镀敷、焊料凸块、条纹凸块、柱凸块等中任一种。
图6示出将模块105安装于构件501的表面501u的情况。第1主面31是将模块105安装于其他构件501时朝向其他构件501侧的表面。构件501也可以是例如母基板。
在本实施方式中，第1部件41的距第1主面31较远侧的表面和第2部件42的距第1主面31较远侧的表面从密封树脂3暴露，而且，第1主面31是在将模块105安装于其他构件501时朝向其他构件501侧的面，因此，第1部件41和第2部件42的从密封树脂3暴露的面能够与构件501的表面501u抵接，或者即便不抵接也至少接近。因此，第1部件41和第2部件42中分别产生的热能够通过构件501来散热。因此，第1部件41和第2部件42尽管部件本身的高度不同，也能够同等且高效地散热。因此，能够成为不易按每个部件产生散热性差异的模块。
为了高效地散热，优选第1部件41和第2部件42与构件501接触。进一步优选第1部件41和第2部件42与构件501面接触。
(实施方式6)
参照图7，对基于本实用新型的实施方式6的模块进行说明。对于基本结构，本实施方式的模块106与实施方式5中说明的模块105相同，但与模块105相比，以下方面不同。
在模块106中，布线基板1在第1主面31的相反侧具有第2主面32，在第2主面32安装有第3部件43。第3部件43也可以是例如IC。另外，第3部件43的距第2主面32较远侧的表面也可以从密封树脂3暴露。在该情况下，第3部件43与屏蔽膜6面接触，能够使第3部件43中产生的热高效地释放。在模块106中，不仅第1主面31侧，第2主面32侧也由密封树脂3覆盖。在第2主面32，除了第3部件43之外还安装有多个贴片部件49。此处所示的只不过是一个例子，实际上，安装于第2主面32的部件也可以是IC，也可以是贴片部件，也可以是其他种类的部件，个数可以是任何数字。
屏蔽膜6形成为覆盖除模块106的下表面以外部分。安装于第2主面32的所有部件被密封树脂3覆盖，而且该密封树脂3由屏蔽膜6覆盖。屏蔽膜6不仅覆盖密封树脂3，还覆盖布线基板1的侧面，并且覆盖配置于第1主面31的密封树脂3的侧面。
在本实施方式中，也能够得到与实施方式5所述相同的效果。而且，在本实施方式中，不仅在布线基板1的第1主面31，在第2主面32也安装有部件，因此，能够成为在有限的面积安装了更多部件的结构。
此处，示出具备屏蔽膜6的例子，但也可以是没有屏蔽膜6的结构。形成有屏蔽膜6的范围不局限于图7所示的结构。
(实施方式7)
参照图8，对基于本实用新型的实施方式7的模块进行说明。对于基本结构，本实施方式的模块107与实施方式6中说明的模块106相同，但与模块106相比，以下方面不同。
模块107在第2部件42与第1主面31之间具备安装于第1主面31的其他部件9。部件9也可以是例如贴片部件。部件9的高度小于第2连接端子52a的高度。也可以在部件9的下表面与第2部件42的上表面之间存在间隙。
在本实施方式中，也能够得到与实施方式6所述相同的效果。而且，在本实施方式中，在第2部件42与第1主面31之间，具备安装于第1主面31的其他部件9，因此，第2部件42和其他部件9配置为在厚度方向上重叠。通过像这样配置于重叠的位置，能够得到实施方式3所述那样的效果。
此外，也可以将上述实施方式中的多个适当地组合而采用。
此外，这次公开的上述实施方式所有方面均为例示，且不是限制性的。本实用新型的范围由权利要求书示出，包括与权利要求书等同的意思和范围内的所有变更。
附图标记说明
1...布线基板；2...绝缘层；3...密封树脂；6...屏蔽膜；7...散热板；8...构件；9...部件；11...外部连接电极；12、14...导体导通孔；13...连接电极；15...连接导体；18...连接端子；31...第1主面；32...第2主面；41...第1部件；42...第2部件；42a...电极；48...部件；49、49a、49b...贴片部件；51...第1连接端子；52a、52b...第2连接端子；101、102、103、104、105、106、107...模块；501...构件；501u...表面。

Claims (6)

1.一种模块，其特征在于，具备：
布线基板，其具有第1主面；
第1部件，其安装于所述第1主面，并具有第1高度；
第2部件，其安装于所述第1主面，并具有比所述第1高度低的第2高度；以及
密封树脂，其配置为覆盖所述第1主面并且覆盖所述第1部件和所述第2部件，
同所述第1部件与所述第1主面之间的连接处使用的第1连接端子相比，所述第2部件与所述第1主面之间的连接处使用的第2连接端子高度相对高，
所述第1部件的距所述第1主面较远侧的表面和所述第2部件的距所述第1主面较远侧的表面从所述密封树脂暴露。
2.根据权利要求1所述的模块，其特征在于，
具备屏蔽膜，所述屏蔽膜配置为覆盖所述第1部件、所述第2部件和所述密封树脂，所述第1部件和所述第2部件与所述屏蔽膜接触。
3.根据权利要求1所述的模块，其特征在于，
具备散热板，所述第1部件和所述第2部件与所述散热板接触。
4.根据权利要求1所述的模块，其特征在于，
所述第1主面是在将所述模块安装于其他构件时朝向所述其他构件侧的面。
5.根据权利要求4所述的模块，其特征在于，
所述布线基板在所述第1主面的相反侧具有第2主面，
在所述第2主面安装有第3部件。
6.根据权利要求1～5中任一项所述的模块，其特征在于，
在所述第2部件与所述第1主面之间具备安装于所述第1主面的其他部件。
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