CN214014476U - Earphone charging box - Google Patents

Abstract

The utility model relates to an earphone technical field that charges provides an earphone box that charges. This earphone box of charging includes casing and radiator unit, and radiator unit is located the inside holding chamber of casing, when placing the earphone and bearing the shell in, radiator unit can dispel the heat to each part in earphone and the earphone box of charging, and the casing of earphone box of charging includes the heat conduction shell, radiator unit supports the inboard that leans on in the heat conduction shell, then, on being connected to the electronic product with the earphone box of charging through the heat conduction shell, the heat conduction shell with the electronic product butt, just can dispel the heat to the electronic product through radiator unit, make the earphone box of charging except the single function that charges for the earphone, still have the radiating function for the electronic product concurrently, thereby promote user's use and experience.

Description

Earphone charging box

Technical Field

The utility model relates to an earphone technical field that charges, in particular to earphone box that charges.

Background

An earphone is a transducer unit that receives electrical signals from a media player or receiver and converts them into audible sound waves using a speaker proximate to the ear. The existing earphones can be divided into wired earphones and wireless earphones, wherein the wired earphones need a left earphone and a right earphone to form a left sound channel and a right sound channel in a wired connection mode, a stereo effect is generated, and the wearing is inconvenient. The wireless headset communicates with the terminal through a wireless communication protocol (such as bluetooth), and compared with a wired headset, the wireless headset has the characteristics of no need of data line collection and convenience in use. Wherein, wireless earphone need charge wireless earphone through dedicated earphone box that charges.

In prior art, the earphone box that charges only possesses the function of charging for wireless earphone, and the function is single, leads to the user when using wireless earphone, need carry the earphone box that charges, but the earphone box that charges can not exert the effect outside charging, and user experience is relatively poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an earphone box that charges aims at solving the current earphone and charges the poor problem of user experience that box function singleness leads to.

In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides an earphone charging box, is including the casing that has the holding chamber and locate the radiator unit in the holding intracavity of casing, the casing including heat conduction shell and connect in bear the shell on the heat conduction shell, the lateral surface of heat conduction shell is attached on the electronic product, radiator unit support lean on in the medial surface of heat conduction shell, earphone install in bear on the shell.

In one embodiment, the heat dissipation assembly comprises a semiconductor refrigeration piece and a heat dissipation piece which are arranged in a stacked mode, the refrigeration surface of the semiconductor refrigeration piece is abutted against the heat conduction shell, the heat dissipation surface of the semiconductor refrigeration piece is abutted against the heat dissipation piece, and one side, back to the semiconductor refrigeration piece, of the heat dissipation piece is abutted against the bearing shell.

In one embodiment, the heat dissipation assembly further comprises an airflow guide disposed at one end of the heat sink for guiding heat away from the heat sink.

In one embodiment, the heat sink includes a base plate and a plurality of heat dissipation fins connected to the base plate and formed by protruding from a side of the base plate facing away from the semiconductor chilling plate, and the airflow guide member causes airflow to flow between the heat dissipation fins.

In one embodiment, the housing further includes a middle housing disposed between the bearing housing and the heat conducting housing, the airflow guiding member is installed in the middle housing, the middle housing is provided with a first heat dissipation hole, one end of the heat dissipation plate, which is away from the airflow guiding member, abuts against a side surface of the bearing housing, and the side surface of the bearing housing is provided with a second heat dissipation hole.

In one embodiment, the heat dissipation fins are parallel to each other and have the same height.

In one embodiment, the substrate abuts against the heat dissipation surface of the semiconductor chilling plate, and one end of the heat dissipation fin, which is far away from the substrate, abuts against the bearing shell.

In one embodiment, the inner side of the heat conducting shell is provided with a magnet, and the outer side surface of the heat conducting shell is a plane.

In one embodiment, the earphone charging box further comprises a power supply assembly, and the bearing shell and the heat dissipation assembly are electrically connected to the power supply assembly.

In one embodiment, the power module includes a power connection terminal, a battery electrically connected to the power connection terminal, and a main board electrically connected to the battery, the carrier case and the heat dissipation module are electrically connected to the main board, and the battery is a rechargeable battery.

The utility model has the advantages that: the earphone charging box comprises a shell and a heat dissipation assembly, the heat dissipation assembly is located in an accommodating cavity inside the shell, when the earphone is placed in the bearing shell, the heat dissipation assembly can dissipate heat of all parts in the earphone and the earphone charging box, the shell of the earphone charging box comprises a heat conduction shell, the heat dissipation assembly is abutted to the inner side of the heat conduction shell, and therefore the earphone charging box is connected to an electronic product through the heat conduction shell.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic view of a first three-dimensional structure of an earphone charging box provided in an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an earphone charging box according to an embodiment of the present invention in a disassembled state;

fig. 3 is a schematic diagram of a second three-dimensional structure of an earphone charging box according to an embodiment of the present invention;

fig. 4 is a schematic cross-sectional structure view of an earphone charging box provided in an embodiment of the present invention;

fig. 5 is a schematic structural view of a heat dissipation assembly in an earphone charging box according to an embodiment of the present invention.

Description of the main element symbols: earphone charging box-100; a shell-10; a thermally conductive shell-11; a carrier shell-12; mesochite-13; a heat dissipation assembly-20; an earphone-30; mounting surface-121; a semiconductor refrigerating sheet-21; -a heat sink-22; a substrate-221; a heat sink-222; an airflow guide-23; a first heat dissipation hole-131; a second louver-122; a magnet-14; a power supply component-40; power connection terminal-41; a main board-42.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1 to 5, an earphone charging box 100 according to an embodiment of the present invention is shown, including a casing 10 having a receiving cavity and a heat dissipation assembly 20 disposed in the receiving cavity of the casing 10, wherein the casing 10 includes a heat conductive shell 11 and a carrying shell 12 connected to the heat conductive shell 11, the heat conductive shell 11 is attached to an electronic product, the heat dissipation assembly 20 is abutted against an inner side surface of the heat conductive shell 11, and an earphone is mounted on the carrying shell 12.

In this embodiment, the earphone charging box 100 includes a housing 10 and a heat dissipation assembly 20, and the heat dissipation assembly 20 is located in an accommodating cavity inside the housing 10, when the earphone 30 is placed in the bearing shell 12, the heat dissipation assembly 20 can dissipate heat of the earphone 30 and each component inside the earphone charging box 100, and the housing 10 of the earphone charging box 100 includes a heat conducting shell 11, the heat dissipation assembly 20 abuts against the inner side of the heat conducting shell 11, then, the earphone charging box 100 is connected to an electronic product through the heat conducting shell 11, when the heat conducting shell 11 abuts against the electronic product, the electronic product can be dissipated through the heat dissipation assembly 20, so that the earphone charging box 100 has a heat dissipation function for the electronic product besides a single function of charging the earphone 30, and therefore the use experience of a user is improved.

In an alternative embodiment, the heat dissipation assembly 20 is located between two earphones, and two sets of mounting surfaces 121 for mounting the earphones are specifically provided on the carrying shell 12, and after the earphones are respectively mounted on the two sets of mounting surfaces 121, the earphone charging box 100 charges the earphones. The heat sink assembly 20 also provides for better heat dissipation of the headset 30 after the headset 30 is placed on the mounting surface 121 of the carrier housing 12.

Referring to fig. 2-5, in one embodiment, the heat dissipation assembly 20 includes a semiconductor chilling plate 21 and a heat dissipation plate 22, which are stacked, wherein the chilling surface of the semiconductor chilling plate 21 abuts against the heat conduction shell 11, the heat dissipation surface of the semiconductor chilling plate 21 abuts against the heat dissipation plate 22, and the side of the heat dissipation plate 22 opposite to the semiconductor chilling plate 21 abuts against the bearing shell 12.

The semiconductor cooling plate 21 is also called a thermoelectric cooling plate, and is a heat transfer tool. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The semiconductor chilling plate 21 has advantages of no sliding parts, less space requirement in application, high reliability and no refrigerant pollution. Therefore, the semiconductor cooling fins 21 applied to the heat dissipation assembly 20 in the present embodiment can make the heat dissipation assembly 20 require less space for the housing 10, and thus make the volume of the earphone charging box 100 smaller.

In this embodiment, the heat dissipation assembly 20 includes the semiconductor refrigeration piece 21 and the heat dissipation fin 22, the refrigeration surface through with the semiconductor refrigeration piece 21 leans on with the heat conduction shell 11 of casing 10, when making the heat conduction shell 11 contact with the electronic product, can cool down the heat dissipation with the electronic product through the refrigeration surface of semiconductor refrigeration piece 21, and the cooling surface of semiconductor refrigeration piece 21 leans on with the heat dissipation fin 22, so, the heat dissipation fin 22 just can absorb the heat of the cooling surface of semiconductor refrigeration piece 21, thereby make the semiconductor refrigeration piece 21 can last stable work.

Referring to fig. 2, 3 and 5, in one embodiment, the heat dissipation assembly 20 further includes an airflow guide 23 disposed at one end of the heat sink 22 for guiding heat away from the heat sink 22. It will be appreciated that when the airflow guide 23 is operated, the airflow near the heat dissipation fins 22 circulates, so that the heat absorbed by the heat dissipation fins 22 is dissipated, and the heat dissipation fins 22 can continuously and stably absorb the heat around, so that the entire heat dissipation assembly 20 continuously and stably operates.

In one embodiment, as shown in fig. 5, the heat sink 22 includes a base 221 and a plurality of heat dissipation fins 222 connected to the base 221 and formed by protruding a side of the base 221 facing away from the semiconductor chilling plate 21, and the airflow guide 23 allows airflow to flow between the heat dissipation fins 222.

In this embodiment, the heat sink 22 is composed of a substrate 221 and a plurality of heat dissipation fins 222 connected to the substrate 221, the substrate 221 and the heat dissipation fins 222 have good heat conductivity, and the substrate 221 and the heat dissipation fins 222 in this embodiment are made of an aluminum alloy material. It can be understood that the heat dissipation of the heat sink 22 is mainly achieved by conduction, after the heat sink 22 absorbs the heat, the heat is dissipated by convection, and the heat dissipation area in the process of convection heat dissipation is mainly determined by the surface area of the heat sink 22, therefore, by disposing the heat dissipation fins 222 on the substrate 221, the surface area of the heat sink 22 can be effectively and greatly increased, and the heat dissipation effect in the process of convection heat dissipation is better. By increasing the number of the heat dissipation fins 222 and the length of the heat dissipation fins 222, the surface area of the heat dissipation plate 22 can be effectively increased, so that the heat dissipation performance of the heat dissipation plate 22 is better. When the airflow guide 23 operates, the airflow flows between the heat dissipating fins 222, and the heat dissipating fins 222 are spaced apart from each other, so that a channel for the airflow to pass through is formed between the heat dissipating fins 222, and the airflow dissipates the heat of the heat sink 22.

As shown in fig. 2 and 3, the housing 10 further includes a middle case 13 disposed between the bearing case 12 and the heat conducting case 11, the airflow guiding member 23 is disposed in the middle case 13, a first heat dissipating hole 131 is formed in the middle case 13, one end of the heat dissipating fin 22 away from the airflow guiding member 23 abuts against a side surface of the bearing case 12, a second heat dissipating hole 122 is formed in the side surface of the bearing case 12, and under the action of the airflow guiding member 23, the airflow circulates among the heat dissipating fin 222, the first heat dissipating hole 131 and the second heat dissipating hole 122, so as to dissipate heat of the whole heat dissipating fin 22 to the outside of the housing 10. Specifically, the direction of the airflow is determined by the airflow guiding member 23, and in this embodiment, the airflow flows into the housing 10 from the first heat dissipation hole 131, flows through the heat dissipation fin 22, and flows out from the second heat dissipation hole 122.

In an alternative embodiment, the cooling fins 222 are parallel to each other and have a uniform height. Thus, the heat dissipation effect of each part of the heat dissipation plate 22 is more uniform, and the structure of the heat dissipation plate 22 after installation is more stable. In this embodiment, in order to make the heat dissipation effect of the heat sink 22 more uniform and the production process more convenient, the heat dissipation fins 222 are perpendicular to the substrate 221, and the distances between the heat dissipation fins 222 are consistent.

Referring to fig. 4, in one embodiment, the substrate 221 abuts against the heat dissipation surface of the semiconductor chilling plate 21, and one end of the heat dissipation fin 222 away from the substrate 221 abuts against the carrying case 12. The substrate 221 has a good heat conducting effect, the substrate 221 contacts with the heat dissipating surface of the semiconductor cooling plate 21, so that the heat at each position of the heat dissipating surface of the semiconductor cooling plate 21 can be completely absorbed, one end of the heat dissipating fin 222 away from the substrate 221 abuts against the bearing shell 12, in this way, two opposite surfaces of the heat dissipating assembly 20 are both abutted against the shell 10, the position of the whole heat dissipating assembly 20 in the shell 10 is limited, a fixing device for fixing the heat dissipating assembly 20 is arranged in the shell 10, the heat dissipating assembly 20 can be stably installed in the shell 10 through the limitation of the shell 10 to the two opposite surfaces of the heat dissipating assembly 20 and the fixation of the fixing device to the heat dissipating assembly 20. In this embodiment, the fixing device for fixing the heat sink assembly 20 is a detachable structure.

In one particular embodiment, airflow guide 23 is a hydraulic blower. The hydraulic blower has a small volume and requires less energy to operate, and can be applied to the earphone charging box 100 in the present embodiment.

In a specific embodiment, the magnet 14 is disposed on the inner side of the heat conducting shell 11, and the outer side of the heat conducting shell 11 is a plane. Electronic product on the market is most built-in to have magnet, consequently, sets up magnet 14 after the inboard of heat conduction shell 11, when pressing close to heat conduction shell 11 and electronic product, can be with attached electronic product of heat conduction shell 11 on, and then make whole earphone box 100 that charges adsorb electronic product on to dispel the heat to electronic product.

In this embodiment, the number of the magnets 14 inside the heat conducting shell 11 is several, and the magnets are uniformly distributed on the periphery of the heat dissipating component 20, so that the earphone charging box 100 can be stably attached to the electronic product, the heat conducting shell 11 has good heat conducting performance, and when in specific use, the earphone charging box 100 is attached to a heating portion of the electronic product.

In one embodiment, as shown in fig. 2, the earphone charging box 100 further comprises a power supply assembly 40, and the carrier shell 12 and the heat sink assembly 20 are electrically connected to the power supply assembly 40. The power supply assembly 40 is electrically connected to the carrying case 12, so that when the earphone 30 is placed in the mounting surface 121 of the carrying case 12, the power supply assembly 40 can supply electric power to the earphone 30, so that the earphone 30 can be smoothly charged. The power module 40 is electrically connected to the heat sink 20, so that the heat sink 20 can operate stably.

In this embodiment, the power module 40 includes a power connection terminal 41, a battery electrically connected to the power connection terminal 41, and a main board 42 electrically connected to the battery, and the carrying case 12 and the heat dissipating module 11 are electrically connected to the main board 42, wherein the battery is a rechargeable battery. Through the power connection terminal 41, the rechargeable battery can be charged, storing energy for the rechargeable battery, which in turn provides energy for the earphone 30 and the heat sink assembly 20. The earphone charging box 100 further includes an indicator lamp 60 for indicating a charging state of the earphone 30, which is protruded toward a side of the housing 10 away from the heat conductive case 11.

The earphone charging box 100 in the embodiment can charge the earphone 30, can be connected to an electronic product to dissipate heat of the electronic product, can solve the problems of downtime, reduced operation speed and the like caused by overhigh temperature when the electronic products such as a collection notebook and a flat lamp run at high load, and prolongs the service life of the electronic product; the earphone charging box 100 can be used for placing the earphone 30 and can be fixed on an electronic product, and the earphone charging box 100 has small volume, small occupied space and convenient carrying and use.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. An earphone charging box, its characterized in that: including the casing that has the holding chamber and locate the radiator unit in the holding intracavity of casing, the casing include the heat conduction shell and connect in bear the shell on the heat conduction shell, the lateral surface of heat conduction shell is attached on the electronic product, radiator unit support lean on in the medial surface of heat conduction shell, the earphone install in bear on the shell.

2. The earphone charging box of claim 1, wherein: the heat dissipation assembly comprises semiconductor refrigeration pieces and heat dissipation fins which are stacked, the refrigeration surfaces of the semiconductor refrigeration pieces are abutted to the heat conduction shell, the heat dissipation surfaces of the semiconductor refrigeration pieces are abutted to the heat dissipation fins, and the heat dissipation fins are back to one side of the semiconductor refrigeration pieces and are abutted to the bearing shell.

3. The earphone charging box of claim 2, wherein: the heat dissipation assembly further comprises an airflow guide piece arranged at one end of the heat dissipation piece and used for guiding heat of the heat dissipation piece out.

4. The earphone charging box of claim 3, wherein: the radiating fin comprises a substrate and a plurality of radiating fins which are connected with the substrate and are formed by protruding one side of the substrate, which is far away from the semiconductor refrigerating piece, and the airflow guide piece enables airflow to flow among the radiating fins.

5. The earphone charging box of claim 3, wherein: the casing is still including locating bear the shell with the mesochite between the heat conduction shell, the air current guide install in the mesochite, first louvre has been seted up on the mesochite, the fin deviates from the one end of air current guide support lean on in bear the side of shell, bear the side of shell and seted up the second louvre.

6. The earphone charging box of claim 4, wherein: the radiating fins are parallel to each other and have the same height.

7. The earphone charging box of claim 4, wherein: the base plate is abutted against the heat dissipation surface of the semiconductor refrigeration piece, and one end, far away from the base plate, of the heat dissipation fin is abutted against the bearing shell.

8. The earphone charging box of claim 1, wherein: the inboard of heat conduction shell is equipped with magnet, the lateral surface of heat conduction shell is the plane.

9. An earphone charging box as claimed in any one of claims 1-8, wherein: the earphone charging box further comprises a power supply assembly, and the bearing shell and the heat dissipation assembly are electrically connected to the power supply assembly.

10. The earphone charging box of claim 9, wherein: the power supply module comprises a power connection terminal, a battery and an electric connection, wherein the battery is electrically connected with the power connection terminal, the electric connection is electrically connected with the mainboard of the battery, the bearing shell is electrically connected with the radiating module, the radiating module is electrically connected with the mainboard, and the battery is a rechargeable battery.

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