CN203932107U - A kind of LED encapsulation sealing heating arrangement - Google Patents
A kind of LED encapsulation sealing heating arrangement Download PDFInfo
- Publication number
- CN203932107U CN203932107U CN201420184636.1U CN201420184636U CN203932107U CN 203932107 U CN203932107 U CN 203932107U CN 201420184636 U CN201420184636 U CN 201420184636U CN 203932107 U CN203932107 U CN 203932107U
- Authority
- CN
- China
- Prior art keywords
- led
- glue
- heating
- clamping plate
- heated base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 30
- 238000005538 encapsulation Methods 0.000 title claims abstract description 22
- 238000007789 sealing Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000605 extraction Methods 0.000 abstract description 4
- 206010023126 Jaundice Diseases 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000009156 water cure Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 239000000084 colloidal system Substances 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED encapsulation sealing heating arrangement, comprising: the clamping plate tool of fixing described LED middle plateform type substrate; Carry the heated base of described LED middle plateform type substrate and described clamping plate tool.This structure is fixed on plate substrate on heated base with stationary fixture, by bottom-heated mode, moment in several seconds just can be by the moulding of packaging plastic water cure, the heating cycle of having saved traditional heating operation is long, also avoid causing the light decay phenomenon of chip and fluorescent material, thereby also avoided causing the variation of white light LED color temperature, colourity.By the plate substrate glue rapid curing of die bond, bonding wire, improve production efficiency by heating station.The rapid curing of encapsulation glue, has also avoided glue high temperature in high-temperature heating process to cause that encapsulation glue refractive index reduces, the phenomenon of jaundice, has improved light extraction efficiency.
Description
Technical field
The utility model relates to LED encapsulation technology field, relates in particular a kind of LED encapsulation sealing heating arrangement.
Background technology
Current ceramic substrate and aluminium base adopt the flat structure without bowl cup mostly, for the encapsulation sealing adhesive process structure of plate substrate and support, common band " box dam " the formula point glue mode of main employing, it is not high that this process structure substrate goes out light reflectivity, luminous efficiency is low, and complex procedures, production process efficiency is low; Another kind is to adopt high-viscosity glue water spot glue mode, high-viscosity glue viscosity is all more than 30,000 cps, be not easy very much extracting vacuum, so just easily produce the problem of bubble, operation is also difficult for, and high-viscosity glue is all one pack system molecular structure, optical index is not high, makes LED luminous efficiency low.
In sum, how providing the encapsulating structure that a kind of production efficiency is high, light extraction efficiency is high is the problem that those skilled in the art need solution badly.
Utility model content
In view of this, the utility model provides a kind of LED encapsulation sealing heating arrangement, comprising:
The clamping plate tool of fixing described LED middle plateform type substrate;
Carry the heated base of described LED middle plateform type substrate and described clamping plate tool.
Preferably, in above-mentioned LED encapsulation sealing heating arrangement, the Temperature Setting of described heated base is 150 °-180 °.
Preferably, in above-mentioned LED encapsulation sealing heating arrangement, described clamping plate tool on described heated base slidably.
Preferably, in above-mentioned LED encapsulation sealing heating arrangement, described heated base is automatic heating device.
Known via above-mentioned technical scheme, compared with prior art, the utility model openly provides a kind of LED encapsulation sealing heating arrangement, this structure is fixed on plate substrate on heated base with stationary fixture, by bottom-heated mode, the temperature of heated base is controlled between 150-180 degree, moment in several seconds just can be by the moulding of packaging plastic water cure, the heating cycle of having saved traditional heating operation is long, also avoid causing the light decay phenomenon of chip and fluorescent material, thereby also avoided causing the variation of white light LED color temperature, colourity.By the plate substrate glue rapid curing of die bond, bonding wire, improve production efficiency by heating station.The rapid curing of encapsulation glue, has also avoided glue high temperature in high-temperature heating process to cause that encapsulation glue refractive index reduces, the phenomenon of jaundice, has improved light extraction efficiency.
Brief description of the drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, other accompanying drawing can also be provided according to the accompanying drawing providing.
Fig. 1 accompanying drawing is generalized section of the present utility model.
In Fig. 1: 1 is that LED middle plateform type substrate, 2 is that heated base, 3 is that packing colloid, 4 is clamping plate tool.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
The utility model embodiment discloses a kind of LED encapsulation sealing heating arrangement, comprising:
The clamping plate tool 4 of fixed L ED middle plateform type substrate 1:
The heated base 2 of carrying LED middle plateform type substrate 1 and clamping plate tool 4.
First with clamping plate tool 4, the plate substrate 1 of die bond, bonding wire is fixed on heated base on 2, then by the mode of bottom-heated, packing colloid 3 is solidified fast, and then chip and wire are effectively protected.The heating cycle of having saved traditional heating operation is long, has also avoided causing the light decay phenomenon of chip and fluorescent material, thereby has also avoided causing the variation of white light LED color temperature, colourity.
In order further to optimize technique scheme, the Temperature Setting of heated base 2 is 150 °-180 °.Show through a large amount of experiments, in the time that heating and temperature control is between 150 °-180 °, can make packing colloid 3 solidify within the time in several seconds, and can not impact other structures, the rapid curing of encapsulation glue, just avoid glue high temperature in high-temperature heating process to cause that encapsulation glue refractive index reduces, the phenomenon of jaundice, improved light extraction efficiency.
In order further to optimize technique scheme, described clamping plate tool on described heated base 2 slidably.The regulation and control of clamping plate position can step up the plate substrate in the LED of different model, have expanded the scope of application of the present utility model.
In order further to optimize technique scheme, described heated base 2 is automatic heating device.Can automatic heating constant-temperature control, the efficiency in very effective raising production process.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is and the difference of other embodiment, between each embodiment identical similar part mutually referring to.For the disclosed device of embodiment, because it corresponds to the method disclosed in Example, so description is fairly simple, relevant part illustrates referring to method part.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (4)
1. a LED encapsulation sealing heating arrangement, is characterized in that, comprising:
The clamping plate tool (4) of fixing described LED middle plateform type substrate (1);
Carry the heated base (2) of described LED middle plateform type substrate (1) and described clamping plate tool (4).
2. LED encapsulation sealing heating arrangement according to claim 1, is characterized in that, the Temperature Setting of described heated base (2) is 150 °-180 °.
3. LED according to claim 1 encapsulation sealing heating arrangement, is characterized in that, described clamping plate tool on described heated base (2) slidably.
4. LED encapsulation sealing heating arrangement according to claim 1, is characterized in that, described heated base (2) is automatic heating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420184636.1U CN203932107U (en) | 2014-04-15 | 2014-04-15 | A kind of LED encapsulation sealing heating arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420184636.1U CN203932107U (en) | 2014-04-15 | 2014-04-15 | A kind of LED encapsulation sealing heating arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203932107U true CN203932107U (en) | 2014-11-05 |
Family
ID=51827872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420184636.1U Expired - Lifetime CN203932107U (en) | 2014-04-15 | 2014-04-15 | A kind of LED encapsulation sealing heating arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203932107U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108514996A (en) * | 2018-03-16 | 2018-09-11 | 武汉华星光电半导体显示技术有限公司 | Colloid coating method and colloid apparatus for coating |
| CN108598249A (en) * | 2018-07-24 | 2018-09-28 | 厦门多彩光电子科技有限公司 | A kind of packaging method of LED light source |
-
2014
- 2014-04-15 CN CN201420184636.1U patent/CN203932107U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108514996A (en) * | 2018-03-16 | 2018-09-11 | 武汉华星光电半导体显示技术有限公司 | Colloid coating method and colloid apparatus for coating |
| CN108598249A (en) * | 2018-07-24 | 2018-09-28 | 厦门多彩光电子科技有限公司 | A kind of packaging method of LED light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141105 |
|
| CX01 | Expiry of patent term |