CN203857313U - LED bulb lamp with high lighting effect - Google Patents
LED bulb lamp with high lighting effect Download PDFInfo
- Publication number
- CN203857313U CN203857313U CN201420224702.3U CN201420224702U CN203857313U CN 203857313 U CN203857313 U CN 203857313U CN 201420224702 U CN201420224702 U CN 201420224702U CN 203857313 U CN203857313 U CN 203857313U
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- Prior art keywords
- led
- stem
- filament
- bulb lamp
- transparency carrier
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- Expired - Lifetime
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- 239000000463 material Substances 0.000 claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 3
- 239000003292 glue Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims 1
- 239000011229 interlayer Substances 0.000 description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- -1 Hybrid Chemical compound 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000011222 crystalline ceramic Substances 0.000 description 2
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 239000012782 phase change material Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses an LED bulb lamp with the high lighting effect. The LED bulb lamp comprises multiple LED filaments, a stem, an LED driver, a standard interface and a lampshade. The LED filaments and the stem are sealed through the lampshade. The lampshade is filled with heat dissipating materials. The two ends of each LED filament are in point welding connection with two stem electrodes on the stem through two filament electrodes of the LED filament. The multiple LED filaments are distributed around the stem in the bulb lamp. An exhaust pipe is connected to the lower portion of the stem. An electrode at the lower end of the stem is connected with the LED driver through an electric connecting line. The LED driver is connected with the standard interface through a lead. The standard interface is communicated with an external AC or DC power source. According to the LED bulb lamp with the high lighting effect, the LED filaments can be made to work at the low temperature and achieve the high lighting effect.
Description
Technical field
The utility model relates to a kind of LED bulb lamp, relates in particular to a kind of high light efficiency LED bulb lamp by filament direct-assembling.
Background technology
Semiconductor light-emitting-diode (LED) illumination is considered to one of 21 century field most with prospects, appearance along with various countries' forbidding incandescent lamp decree, LED is more and more extensive in lighting field application, and the LED filament wherein encapsulating on transparency carrier is because light efficiency is high and outer appearnce enjoys terminal client to like like traditional tengsten lamp.This filament is mainly that the P-N knot due to LED chip is that 4 Л angles are luminous, adopts support or ceramic package to return to lose half through P-N knot due to downward blu-ray reflection, finally causes blue light loss 25%; Adopt transparency carrier this part of blue light can be used, improve the light efficiency of LED light source, but adopt at present the filament of this transparency carrier substantially not there is heat-sinking capability, the bulb lamp of assembling is because excess Temperature causes the feature that light efficiency is high not outstanding, especially adopt this filament to make the bulb lamp of high light flux, so the heat radiation of filament bulb lamp is urgent problem.
Summary of the invention
The purpose of this utility model is for the deficiencies in the prior art, and a kind of LED bulb lamp of high light efficiency is provided.
The purpose of this utility model is achieved through the following technical solutions: a kind of LED bulb lamp of high light efficiency, comprising: a plurality of LED filaments, stem stem, LED driver, standard interface, lampshade; Described a plurality of LED filament and stem stem are sealed by lampshade, and fill heat sink material in lampshade; The two ends of each LED filament are all by two filament electrodes of LED filament and two soldered connecing of stem stem electrode points on stem stem, and a plurality of LED filaments are arranged around stem stem in bulb lamp inside; Described stem stem bottom connects blast pipe; The stem stem electrode of stem stem is connected with LED driver by electric connection line, and LED driver is connected with standard interface by lead-in wire, and standard interface is connected with external AC or DC power supply.
Described a plurality of LED filament is arranged and is specially around stem stem in bulb lamp inside: LED filament around stem stem be that taper linearity is arranged, LED filament around stem stem be that linear crossing is arranged, LED filament is that regular polygon is arranged or LED filament is M type around stem stem and arranges around stem stem.
Described LED filament comprises: filament electrode, transparency carrier, a plurality of LED chip, bonding line and fluorescent glue, a plurality of LED chips are fixed on the transparency carrier that contains filament electrode in two ends, between LED chip, be connected by bonding line between LED chip and filament electrode, on LED chip, bonding line and transparency carrier, wrap up fluorescent glue.
Described LED filament comprises: filament electrode, transparency carrier, a plurality of LED chip, circuit and fluorescent glue, a plurality of LED chips are fixed on the transparency carrier with circuit, by LED chip, the filament electrode at the circuit on transparency carrier and transparency carrier two ends is coupled together, on LED chip and transparency carrier, wrap up fluorescent glue.
Described LED filament comprises: filament electrode, electrically-conductive backing plate, a plurality of LED chip, bonding line, a plurality of LED chips are fixed on the electrically-conductive backing plate with micropore, one end of electrically-conductive backing plate is as a filament electrode, the other end of electrically-conductive backing plate is connected with another filament electrode by binding material, between LED chip, couple together by bonding line between LED chip and filament electrode, on LED chip, bonding line, micropore, binding material and electrically-conductive backing plate, wrap up fluorescent glue.
The beneficial effects of the utility model are high light efficiency LED filament to be worked at a lower temperature and bring into play the advantage of its high light efficiency.
Accompanying drawing explanation
Fig. 1 (a)～(d) is the structural representation of the different case study on implementation of the utility model bulb lamp;
Fig. 2 (a)～(e) is the structural representation of the different case study on implementation of the utility model bulb lamp stem stem;
Fig. 3 (a)～(e) is the sectional view of the different case study on implementation of the utility model bulb lamp LED filament;
In figure, LED filament 1, filament electrode 2, stem stem 3, stem stem electrode 4, blast pipe 5, electric connection line 6, LED driver 7, lead-in wire 8, standard interface 9, lampshade 10, heat sink material 11; Insulating barrier 3-1, the first interlayer 3-2, the second interlayer 3-3, the first coating 3-4, the 3rd interlayer 3-5, the second coating 3-6; Transparency carrier 12, electrically-conductive backing plate 17, LED chip 13, bonding line 14, fluorescent glue 15, circuit 16, micropore 18, binding material 19.
The specific embodiment
Referring to accompanying drawing, the utility model is described in further detail.
As shown in Figure 1, the LED bulb lamp of a kind of high light efficiency of the utility model, comprising: a plurality of LED filaments 1, stem stem 3, LED driver 7, standard interface 9, lampshade 10; Described a plurality of LED filament 1 and stem stem 3 are sealed by lampshade 10, and fill heat sink material 11 in lampshade 10; The two ends of each LED filament 1 are all connected with two stem stem electrode 4 spot welding on stem stem 3 by two filament electrodes 2 of LED filament 1, and a plurality of LED filaments 1 are difformity in bulb lamp inside around stem stem 3 and arrange; Described stem stem 3 bottoms connect blast pipe 5; The stem stem electrode 4 of stem stem 3 is connected with LED driver 7 by electric connection line 6, and LED driver 7 is connected with standard interface 9 by lead-in wire 8, and standard interface 9 is connected with external AC or DC power supply;
Fig. 1 (a) is the first case study on implementation of bulb lamp, and wherein LED filament 1 is taper linearity and arranges;
Fig. 1 (b) is the second case study on implementation of bulb lamp, and wherein LED filament 1 is linear crossing and arranges;
Fig. 1 (c) is the 3rd case study on implementation of bulb lamp, and wherein LED filament 1 is regular polygon and arranges;
Fig. 1 (d) is the 4th case study on implementation of bulb lamp, and wherein LED filament 1 is M type and arranges;
As shown in Figure 2:
Fig. 2 (a) is the first case study on implementation of stem stem 3: stem stem 3 is by insulating barrier 3-1, to wrap up the first interlayer 3-2 (having the metal of high reflectance as silver, aluminium or titanium) to form;
Fig. 2 (b) is the second case study on implementation of stem stem 3: stem stem 3 is by insulating barrier 3-1, to wrap up the first interlayer 3-2 (having the metal of high reflectance as silver, aluminium or titanium) to form, and the second interlayer 3-3 (hot phase-change material is as paraffin or slaine) is contained in the first interlayer 3-2 inside;
Fig. 2 (c) is the 3rd case study on implementation of stem stem 3: stem stem 3 is to consist of insulating barrier 3-1 parcel the 3rd interlayer 3-5 (copper or its alloy material), and the 3rd interlayer 3-5 surface is coated with the first coating 3-4 (reflecting material material is silver, aluminium, titanium or platinum);
Fig. 2 (d) is the 4th case study on implementation of stem stem 3: stem stem 3 is to consist of insulating barrier 3-1 parcel the 3rd interlayer 3-5 (copper or its alloy material), and the second interlayer 3-3 (hot phase-change material is as paraffin or slaine) is contained in the 3rd interlayer 3-5 inside, surface is coated with the first coating 3-4 (reflecting material material is silver, aluminium, titanium or platinum);
Fig. 2 (e) is the 5th case study on implementation of stem stem 3: stem stem 3 is to consist of the 3rd interlayer 3-5 (copper or its alloy material) and the second coating 3-6 (reflecting material material is aluminium oxide, silica, titanium dioxide) of being plated in the 3rd interlayer 3-5 surface.
As shown in Figure 3:
Fig. 3 (a) is the first case study on implementation of LED filament 1, LED filament 1 comprises filament electrode 2, transparency carrier 12, a plurality of LED chips 13, bonding line 14 and fluorescent glue 15, LED chip 13 (being mainly for positive cartridge chip) passes through die bond material (as silica gel, epoxy resin, Hybrid, PMMA, PU) be fixed on contain filament electrode 2 in two ends transparency carrier 12 (as clear glass, crystalline ceramics, yttrium-aluminium-garnet, sapphire, transparency and heat-proof PC/PS/PMMA) on, follow by bonding line LED chip 13, and chip 13 couples together with electrode 2, pass through again fluorescent glue 15 by LED chip 13, bonding line 14 and substrate 12 wrap up the LED filament 1 that forms 360 degree bright dippings.
Fig. 3 (b) is the second case study on implementation of LED filament 1, LED filament 1 comprises filament electrode 2, transparency carrier 12, a plurality of LED chip 13, circuit 16, fluorescent glue 15, LED chip 13 (being mainly over against flip-chip) is fixed on by die bond material (as gold, gold-tin alloy, tin cream) on the transparency carrier 12 (as clear glass, crystalline ceramics, yttrium-aluminium-garnet, sapphire, transparency and heat-proof PC/PS/PMMA) with circuit 16, by LED chip 13, the circuit on substrate 12 16 and the filament electrode 2 at substrate two ends is coupled together; By fluorescent glue 15, LED chip 13 and substrate 12 are wrapped up to the LED filament 1 that forms 360 degree bright dippings again.
Fig. 3 (c)～(e) is the 3rd case study on implementation of LED filament 1, and Fig. 3 (c) is the perspective view of LED filament 1, and Fig. 3 (d) is the semi-finished product figure of LED filament 1, and Fig. 3 (e) is the finished product appearing diagram of LED filament 1.
LED filament 1 comprises filament electrode 2, electrically-conductive backing plate 17, a plurality of LED chips 13, bonding line 14, a plurality of LED chips 13 pass through die bond material (as silica gel, epoxy resin, Hybrid, PMMA, PU) be fixed on and there is micropore 18 (the small cavity that air forms, size 10nm～100um) electrically-conductive backing plate 17 is (as copper, silver, iron or its alloy material) on, one end of electrically-conductive backing plate 17 is as a filament electrode 2, (macromolecular material is as PPA by binding material 19 for the other end of electrically-conductive backing plate 17, PCT, EMC, SMC, LCP) be connected with another filament electrode 2, between LED chip 13, between LED chip 13 and filament electrode 2, by bonding line 14, couple together, then the mode by Molding by fluorescent glue 15 by LED chip 13, bonding line 14, micropore 18, binding material 19, electrically-conductive backing plate 17 wraps up, only reserve filament electrode 2, as shown in Fig. 3 (e).
The utility model is not limited to above embodiment, and in the protection domain of spirit of the present utility model and claim, any modification and change that the utility model is made, all should think protection domain of the present utility model.
Claims (5)
1. a LED bulb lamp for high light efficiency, is characterized in that, comprising: a plurality of LED filaments (1), stem stem (3), LED driver (7), standard interface (9), lampshade (10); Described a plurality of LED filaments (1) and stem stem (3) are by lampshade (10) sealing, and filling heat sink material (11) in lampshade (10); The two ends of each LED filament (1) are all connected with two stem stem electrodes (4) spot welding on stem stem (3) by two filament electrodes (2) of LED filament (1), and a plurality of LED filaments (1) are arranged around stem stem (3) in bulb lamp inside; Described stem stem (3) bottom connects blast pipe (5); The stem stem electrode (4) of stem stem (3) is connected with LED driver (7) by electric connection line (6), LED driver (7) is connected with standard interface (9) by lead-in wire (8), and standard interface (9) is connected with external AC or DC power supply.
2. the LED bulb lamp of high light efficiency according to claim 1, it is characterized in that, described a plurality of LED filaments (1) are arranged and are specially around stem stem (3) in bulb lamp inside: LED filament (1) around stem stem (3) be that taper linearity is arranged, LED filament (1) around stem stem (3) be that linear crossing is arranged, LED filament (1) is that regular polygon is arranged or LED filament (1) is M type around stem stem (3) and arranges around stem stem (3).
3. the LED bulb lamp of high light efficiency according to claim 1, it is characterized in that, described LED filament (1) comprising: filament electrode (2), transparency carrier (12), a plurality of LED chips (13), bonding line (14) and fluorescent glue (15), a plurality of LED chips (13) are fixed on the transparency carrier (12) that contains filament electrode (2) in two ends, between LED chip (13), between LED chip (13) and filament electrode (2), by bonding line (14), be connected, LED chip (13), the upper parcel of bonding line (14) and transparency carrier (12) fluorescent glue (15).
4. the LED bulb lamp of high light efficiency according to claim 1, it is characterized in that, described LED filament (1) comprising: filament electrode (2), transparency carrier (12), a plurality of LED chip (13), circuit (16) and fluorescent glue (15), a plurality of LED chips (13) are fixed on the have circuit transparency carrier (12) of (16), by LED chip (13), the circuit (16) on transparency carrier (12) and the filament electrode (2) at transparency carrier (12) two ends are coupled together, the upper parcel of LED chip (13) and transparency carrier (12) fluorescent glue (15).
5. the LED bulb lamp of high light efficiency according to claim 1, it is characterized in that, described LED filament (1) comprising: filament electrode (2), electrically-conductive backing plate (17), a plurality of LED chips (13), bonding line (14), a plurality of LED chips (13) are fixed on the have micropore electrically-conductive backing plate (17) of (18), one end of electrically-conductive backing plate (17) is as a filament electrode (2), the other end of electrically-conductive backing plate (17) is connected with another filament electrode (2) by binding material (19), between LED chip (13), between LED chip (13) and filament electrode (2), by bonding line (14), couple together, LED chip (13), bonding line (14), micropore (18), the upper parcel of binding material (19) and electrically-conductive backing plate (17) fluorescent glue (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420224702.3U CN203857313U (en) | 2014-05-04 | 2014-05-04 | LED bulb lamp with high lighting effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420224702.3U CN203857313U (en) | 2014-05-04 | 2014-05-04 | LED bulb lamp with high lighting effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203857313U true CN203857313U (en) | 2014-10-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201420224702.3U Expired - Lifetime CN203857313U (en) | 2014-05-04 | 2014-05-04 | LED bulb lamp with high lighting effect |
Country Status (1)
| Country | Link |
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| CN (1) | CN203857313U (en) |
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| CN103994349A (en) * | 2014-05-04 | 2014-08-20 | 杭州杭科光电股份有限公司 | LED bulb lamp with high lighting efficiency |
| CN104776327A (en) * | 2014-11-12 | 2015-07-15 | 吴喜荣 | LED (Light Emitting Diode) lighting source with radiating function, filament lamp and lighting device |
| CN105485541A (en) * | 2016-01-06 | 2016-04-13 | 山东晶泰星光电科技有限公司 | Whole-light-distribution type LED lamp |
| WO2016191903A1 (en) * | 2015-05-29 | 2016-12-08 | 杭州杭科光电股份有限公司 | Led bulb lamp with drive power supply integrated within bulb shell |
| CN107314258A (en) * | 2016-04-27 | 2017-11-03 | 嘉兴山蒲照明电器有限公司 | The LEDbulb lamp of LED filament and its manufacture method and the application filament |
| US10544905B2 (en) | 2014-09-28 | 2020-01-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US10619800B2 (en) | 2015-08-17 | 2020-04-14 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED light bulb |
| US10627098B2 (en) | 2015-06-10 | 2020-04-21 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb having the same |
| US10655792B2 (en) | 2014-09-28 | 2020-05-19 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US10677396B2 (en) | 2006-07-22 | 2020-06-09 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb with symmetrical filament |
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Effective date of registration: 20180122 Address after: 246000 optoelectronic garden of Tongcheng Economic Development Zone in Anqing, Anhui Patentee after: ANHUI HANGKE PHOTOELECTRIC CO.,LTD. Address before: Hangzhou City, Zhejiang province 311122 Yuhang District Xianlin Street Xian Xing Road No. 31-33 Patentee before: HANGZHOU HANGKE OPTOELECTRONICS STOCK Ltd.,Corp. |
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