CN203553214U - LED filament - Google Patents
LED filament Download PDFInfo
- Publication number
- CN203553214U CN203553214U CN201320681651.2U CN201320681651U CN203553214U CN 203553214 U CN203553214 U CN 203553214U CN 201320681651 U CN201320681651 U CN 201320681651U CN 203553214 U CN203553214 U CN 203553214U
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- CN
- China
- Prior art keywords
- led
- fluorescent material
- substrate
- adhesive tape
- casting glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Led Device Packages (AREA)
Abstract
The utility model discloses an LED filament, comprising a substrate (1) and a plurality of LED chips (2) which are arranged on the substrate (1) in a horizontal straight line, adjacent LED chips (2) are connected through a metal wire (3), the LED chips (2) at two ends are connected to electrode lead ends (4) respectively, and the surface of each of the LED chips (2) is covered by a fluorescent powder adhesive tape (5). The LED filament further comprises a potting adhesive (6) with diffusion powder, and the potting adhesive (6) wraps the substrate (1) and the fluorescent powder adhesive tape (5). The LED filament can enable the light to be more uniform and the color difference to be smaller by adopting the structure disclosed by the utility model.
Description
Technical field
The utility model relates to LED lamp field, specifically a kind of LED filament.
Background technology
LED, i.e. light-emitting diode, is the luminous semi-conductor electricity sub-element of a kind of energy.LED has lot of advantages compared with other light source such as incandescent lamp, and LED has longer life-span, preferably stability, switching characteristic and lower energy consumption faster conventionally.Along with LED gos deep into people's life day by day as light source of new generation, its application is also more and more extensive, such as display, television set daylighting decoration, illumination etc.
At present, traditional LED fluorescent powder packaging is after LED sapphire chip is fixed on substrate, after mixing with a certain proportion of LED fluorescent material and casting glue, be enclosed on sapphire chip, specifically comprise a glue or spraying method, to realize after sapphire chip energising through the exciting of fluorescent material, send different colours.
The patent No. is that the utility model patent that " 201220258798.6 ", name are called " LED lamp " discloses a kind of technical scheme; claimed a kind of LED lamp; its structure comprises LED encapsulating housing; LED encapsulating housing is directly enclosed within on the substrate of LED chip and encapsulates LED chip; from power, further mention; LED encapsulating housing comprises lens, saturating cover, lampshade, light guide plate or light-guiding pillar; LED encapsulating housing is mixed by LED fluorescent material, Chemical Engineering plastics and the agent of organic object light spread powder; also mention, LED chip is provided with the protection glue that one deck does not contain fluorescent material simultaneously.Although the light that such LED lamp sends can be evenly, because fluorescent material is blended in LED encapsulating housing, thereby this just requires fluorescent material to mix relatively reasonable, evenly to have increased technique difficulty, and the demand of fluorescent material also can increase in addition.
At present, owing to being subject to the restriction of packing forms, LED lamp is also not easy to realize the such omnibearing luminous and jewelly bright effect of incandescent lamp.Occurred at present a kind of LED packing forms of filament, its luminous form that can imitate tungsten filament realizes omnibearing luminous, but the spatial color deviation of LED filament is larger at present.
Utility model content
The utility model provides a kind of LED filament, has solved the large problem of spatial color deviation of current single LED filament.
The purpose of this utility model is achieved through the following technical solutions: a kind of LED filament, comprise substrate and be arranged on substrate and be multiple LED chips that " one " word arranges, between adjacent LED chip, by metal wire, connect, the LED chip connecting electrode at two ends draws end, the surface coverage fluorescent material adhesive tape of each LED chip, also comprise the casting glue with spread powder, described casting glue wraps substrate and fluorescent material adhesive tape.
In this programme, substrate, LED chip, metal wire, casting glue is all the structure that existing LED must have, the difference of this programme and existing structure is, in the casting glue of using in this programme, do not contain fluorescent material, and LED chip surface coverage has fluorescent material adhesive tape, thereby the region of fluorescent material parcel has been reduced, luminous must just can being shot out through fluorescent material adhesive tape that LED chip sends, therefore, compared with existing structure, the light that LED chip sends contacts more abundant with fluorescent material, thereby improved luminous efficiency, make light more even, reduce aberration, also can reduce to a certain extent the use amount of fluorescent material simultaneously.
Further, described substrate adopts glass or transparent ceramic to make.Substrate adopts the thing of transparent material to make conventionally, and finds by a large amount of experimental study, and glass or transparent ceramic during as substrate, can obtain preferably illumination effect.
Further, described casting glue is shaped as cylindrical or cuboid.Casting glue normally adopts die forming, therefore in order to make mould structure simple, is convenient to be shaped, and selects comparatively conventional cylindrical or cuboid, and meanwhile, the light that the casting glue of these two kinds of shapes sends is more even, nature also.
Further, the Breadth Maximum of the cross section of described casting glue is 1.2mm ~ 3mm.The cross sectional dimensions of casting glue is unsuitable excessive or too small, crosses conference and causes the overall dimensions of LED bigger than normal, and the too small illumination effect that may cause is not too desirable, through a large amount of test, research, inventor finds, when the cross sectional dimensions of casting glue is during at 1.2mm ~ 3mm, effect is better.
Further, the distance between described two adjacent LEDs chip is 0.1mm ~ 1mm.Distance between LED chip is very important, because distance is excessive, may cause overall light inhomogeneous, and the too small utilance of light that causes is not high, test discovery, and when the distance of LED chip is 0.1 ~ 1mm, the uniformity of light and utilance are all higher.
Further, the thickness of described fluorescent material adhesive tape is 0.5mm ~ 1.5mm.The thickness of fluorescent material adhesive tape has direct connection with illumination effect, in fluorescent material adhesive tape, the distribution of fluorescent material is relatively even, fluorescent material is more or very fewly all can exert an influence to illumination effect, inventor finds through lot of experiments, when the thickness of fluorescent material adhesive tape is 0.5mm ~ 1.5mm, illumination effect is better.
The utlity model has following beneficial effect:
(1) the utility model directly overlays LED chip surface by fluorescent material adhesive tape, light that LED chip sends is contacted more abundant with fluorescent material, and after the effect of diffusion pulvis, luminous efficiency is higher, and aberration is less.
(2) LED filamentray structure of the present utility model, owing to having used light diffusion particle in external sealant, can effectively carry out the light of filament light-emitting mixed light and obtain the uniform white light of spatial color.
Accompanying drawing explanation
Fig. 1 is filament internal structure;
Fig. 2 is filamentray structure cross-sectional view.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but execution mode of the present utility model is not limited only to this.
Embodiment 1:
As Fig. 1, shown in Fig. 2, the present embodiment comprises the substrate 1 of being made by glass and is arranged on and on substrate 1, is multiple LED chips 2 that " one " word arranges, distance between two adjacent LEDs chip 2 is 0.1mm, between LED chip 2, by metal wire 3, connect, LED chip 2 connecting electrodes at two ends draw end 4, the surface coverage fluorescent material adhesive tape 5 of each LED chip 2, the thickness of fluorescent material adhesive tape 5 is 0.5mm, also comprise the casting glue 6 with spread powder, being shaped as of casting glue 6 is cylindrical, the diameter of casting glue 6 is 1.2mm, casting glue 6 wraps substrate 1 and fluorescent material adhesive tape 5.
Embodiment 2:
The present embodiment comprises the substrate 1 of being made by transparent ceramic and is arranged on and on substrate 1, is multiple LED chips 2 that " one " word arranges, distance between two adjacent LEDs chip 2 is 0.5mm, between LED chip 2, by metal wire 3, connect, LED chip 2 connecting electrodes at two ends draw end 4, the surface coverage fluorescent material adhesive tape 5 of each LED chip 2, the thickness of fluorescent material adhesive tape 5 is 1mm, also comprise the casting glue 6 with spread powder, being shaped as of casting glue 6 is cylindrical, the diameter of casting glue 6 is 2.1mm, and casting glue 6 wraps substrate 1 and fluorescent material adhesive tape 5.
Embodiment 3:
The present embodiment comprises the substrate 1 of being made by transparent ceramic and is arranged on and on substrate 1, is multiple LED chips 2 that " one " word arranges, distance between two adjacent LEDs chip 2 is 1mm, between LED chip 2, by metal wire 3, connect, LED chip 2 connecting electrodes at two ends draw end 4, the surface coverage fluorescent material adhesive tape 5 of each LED chip 2, the thickness of fluorescent material adhesive tape 5 is 1.5mm, also comprise the casting glue 6 with spread powder, being shaped as of casting glue 6 is cylindrical, the diameter of casting glue 6 is 3mm, and casting glue 6 wraps substrate 1 and fluorescent material adhesive tape 5.
Embodiment 4:
The present embodiment comprises the substrate 1 of being made by transparent ceramic and is arranged on and on substrate 1, is multiple LED chips 2 that " one " word arranges, distance between two adjacent LEDs chip 2 is 1mm, between LED chip 2, by metal wire 3, connect, LED chip 2 connecting electrodes at two ends draw end 4, the surface coverage fluorescent material adhesive tape 5 of each LED chip 2, the thickness of fluorescent material adhesive tape 5 is 1.5mm, also comprise the casting glue 6 with spread powder, casting glue 6 be shaped as cuboid, the diameter of casting glue 6 is 3mm, and casting glue 6 wraps substrate 1 and fluorescent material adhesive tape 5.
Embodiment 5:
The present embodiment comprises the substrate 1 of being made by transparent ceramic and is arranged on and on substrate 1, is multiple LED chips 2 that " one " word arranges, distance between two adjacent LEDs chip 2 is 0.5mm, between LED chip 2, by metal wire 3, connect, LED chip 2 connecting electrodes at two ends draw end 4, the surface coverage fluorescent material adhesive tape 5 of each LED chip 2, the thickness of fluorescent material adhesive tape 5 is 0.5mm, also comprise the casting glue 6 with spread powder, casting glue 6 be shaped as cuboid, the diameter of casting glue 6 is 3mm, and casting glue 6 wraps substrate 1 and fluorescent material adhesive tape 5.
Embodiment 6:
The present embodiment comprises the substrate 1 of being made by glass and is arranged on and on substrate 1, is multiple LED chips 2 that " one " word arranges, distance between two adjacent LEDs chip 2 is 0.1mm, between LED chip 2, by metal wire 3, connect, LED chip 2 connecting electrodes at two ends draw end 4, the surface coverage fluorescent material adhesive tape 5 of each LED chip 2, the thickness of fluorescent material adhesive tape 5 is 1.5mm, also comprise the casting glue 6 with spread powder, casting glue 6 be shaped as cuboid, the diameter of casting glue 6 is 2mm, and casting glue 6 wraps substrate 1 and fluorescent material adhesive tape 5.
Embodiment 7:
The present embodiment comprises the substrate 1 of being made by glass and is arranged on and on substrate 1, is multiple LED chips 2 that " one " word arranges, distance between two adjacent LEDs chip 2 is 0.5mm, between LED chip 2, by metal wire 3, connect, LED chip 2 connecting electrodes at two ends draw end 4, the surface coverage fluorescent material adhesive tape 5 of each LED chip 2, the thickness of fluorescent material adhesive tape 5 is 1mm, also comprise the casting glue 6 with spread powder, casting glue 6 be shaped as cuboid, the diameter of casting glue 6 is 1.5mm, and casting glue 6 wraps substrate 1 and fluorescent material adhesive tape 5.
Above embodiment is preferred embodiment of the present utility model, the LED filament that above-described embodiment obtains obviously improves in luminous efficiency, because when light sends and does not have enough time to spread from LED chip, contact with fluorescent material, thereby in less region, realized contacting of light and fluorescent material, make contact more abundant, the efficiency of the light obtaining is thus higher, and aberration is less.In addition, because fluorescent material region is relatively less, therefore reduced to a certain extent the consumption of fluorescent material.
Claims (6)
1. a LED filament, it is characterized in that: comprise substrate (1) and be arranged on substrate (1), being multiple LED chips (2) that " one " word arranges, between adjacent LED chip (2), by metal wire (3), connect, LED chip (2) connecting electrode at two ends draws end (4), the surface coverage fluorescent material adhesive tape (5) of each LED chip (2), also comprise the casting glue (6) with spread powder, described casting glue (6) wraps substrate (1) and fluorescent material adhesive tape (5).
2. a kind of LED filament according to claim 1, is characterized in that: described substrate (1) adopts glass or transparent ceramic to make.
3. a kind of LED filament according to claim 1, is characterized in that: described casting glue (6) be shaped as cylindrical or cuboid.
4. a kind of LED filament according to claim 3, is characterized in that: the Breadth Maximum of the cross section of described casting glue (6) is 1.2mm ~ 3mm.
5. a kind of LED filament according to claim 1, is characterized in that: the distance between described two adjacent LEDs chip (2) is 0.1mm ~ 1mm.
6. a kind of LED filament according to claim 1, is characterized in that: the thickness of described fluorescent material adhesive tape (5) is 0.5mm ~ 1.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320681651.2U CN203553214U (en) | 2013-11-01 | 2013-11-01 | LED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320681651.2U CN203553214U (en) | 2013-11-01 | 2013-11-01 | LED filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553214U true CN203553214U (en) | 2014-04-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320681651.2U Expired - Fee Related CN203553214U (en) | 2013-11-01 | 2013-11-01 | LED filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203553214U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015168825A1 (en) * | 2014-05-04 | 2015-11-12 | 杭州杭科光电股份有限公司 | Led bulb light with high luminous efficacy |
-
2013
- 2013-11-01 CN CN201320681651.2U patent/CN203553214U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015168825A1 (en) * | 2014-05-04 | 2015-11-12 | 杭州杭科光电股份有限公司 | Led bulb light with high luminous efficacy |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160426 Address after: 629000 South Road, airport, Suining economic and Technological Development Zone, Sichuan, Sichuan, Suining Patentee after: Innoquick Electronics Technology Co., Ltd. Address before: Tak Road 629000 in Sichuan province Suining City Economic Development Zone Patentee before: Sichuan Bonshine Optical Electron Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20171101 |
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| CF01 | Termination of patent right due to non-payment of annual fee |