CN203299694U - High-temperature integrated servers and high-temperature integrated server cluster - Google Patents
High-temperature integrated servers and high-temperature integrated server cluster Download PDFInfo
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- CN203299694U CN203299694U CN2013202872142U CN201320287214U CN203299694U CN 203299694 U CN203299694 U CN 203299694U CN 2013202872142 U CN2013202872142 U CN 2013202872142U CN 201320287214 U CN201320287214 U CN 201320287214U CN 203299694 U CN203299694 U CN 203299694U
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- power supply
- temperature integrated
- cabinet
- fan group
- integrated server
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Abstract
The utility model provides high-temperature integrated servers and a high-temperature integrated server cluster. The high-temperature integrated servers comprise cabinets, mainboards, power supply adapter boards, hard disks, power supplies and a fan group. Each mainboard, each power supply adapter board and each hard disk are arranged in the interior of each cabinet. The power supplies and the fan group are arranged outside the cabinets. Each cabinet body of each cabinet is provided with a power supply interface, via which each power supply is connected with each power supply adapter board. Each power supply adapter board is electrically connected with each mainboard, each hard disk and the fan group. Furthermore, the air inlet of the fan group is communicated with the interior of each cabinet. The air outlet of the fan group faces towards the external environment where each cabinet is arranged. The fan group dissipates heat of the interior of each cabinet through a ventilation mode. By adopting the structural mode of the utility model, the server density is increased; servers are enabled to adapt to high-ambient temperature; and integral power consumption of the server cluster is reduced.
Description
Technical field
The utility model belongs to the server architecture technical field, is specifically related to a kind of high-temperature integrated server and high-temperature integrated server cluster.
Background technology
As shown in Figure 1, Structural Tectonics schematic diagram for traditional separate unit server, arrange mainboard, power supply, hard disk and fan in machine box for server inside, by power supply, powers to mainboard, hard disk and fan respectively, reduce the environment temperature of cabinet inside by fan, thereby reach the effect of heat radiation.
Along with developing rapidly of computer technology, need quantity of information to be processed increasing, therefore,, for improving server operation speed, usually multiple servers is put together, that is: provide a certain service by server cluster.
For server cluster, when the separate unit server adopts structure shown in Figure 1, the large problem that has that server density is low, server cluster takes up room; And each station server dispels the heat by the fan of self respectively, has the high deficiency of overall power consumption; In addition, the power limited of the fan that configures due to the separate unit server, thus cause the undesirable problem of server cluster integral heat sink effect, generally be merely able to adapt to the environment temperatures of 35 degree Celsius.
The utility model content
Defect for the prior art existence, the utility model provides a kind of high-temperature integrated server and high-temperature integrated server cluster, by using frame mode of the present utility model, can increase server density, make server adapt to more high ambient temperature, but also can reduce the overall power of server cluster.
The technical solution adopted in the utility model is as follows:
The utility model provides a kind of high-temperature integrated server, comprises cabinet, mainboard, Power conversion board, hard disk, power supply and blower group; Wherein, described mainboard, described Power conversion board and described hard disk are arranged on the inside of described cabinet; Described power supply and described fan group are arranged on the outside of described cabinet; On the casing of described cabinet, power supply interface is installed; Described power supply is connected with described Power conversion board by described power supply interface; Described Power conversion board is electrically connected to described mainboard, described hard disk and described fan group respectively; And the air inlet of described fan group is communicated with described cabinet inside, and the exhaust outlet of described fan group is towards the external environment condition at described cabinet place; Described fan group is distributed the heat of described cabinet inside by the exhausting mode.
Preferably, described power supply interface is arranged on the front panel of described cabinet; Perhaps, described power supply interface is arranged on the rear panel of described cabinet.
Preferably, described fan group comprises the fan that is set up in parallel more than.
The utility model also provides a kind of high-temperature integrated server cluster, comprises high-temperature integrated server above-mentioned more than two; Two the above high-temperature integrated servers share same described fan group, and, share same described power supply.
Preferably, described high-temperature integrated server cluster is contacted up and down to be arranged in parallel by each described high-temperature integrated server and forms.
The beneficial effects of the utility model are as follows:
The high-temperature integrated server that the utility model provides and high-temperature integrated server cluster, the power supply and blower group is arranged on the outside of cabinet, by using frame mode of the present utility model, can increase server density, make server adapt to more high ambient temperature, but also can reduce the overall power of server cluster.
Description of drawings
Fig. 1 is traditional server architecture schematic diagram;
Wherein, 1-1 power supply; The 1-2 mainboard; The 1-3 fan; The 1-4 hard disk;
The high-temperature integrated server architecture schematic diagram that Fig. 2 provides for the utility model;
Wherein, 2-1 Power conversion board; The 2-2 mainboard; Power supply interface before 2-3; The 2-4 hard disk; The 2-5 attachment;
The structural representation of the high-temperature integrated server cluster that Fig. 3 provides for the utility model;
Wherein, 3-1 high-temperature integrated server; 3-2 fan group.
Embodiment
Below in conjunction with accompanying drawing, the utility model is elaborated:
As shown in Figure 2, the utility model provides a kind of high-temperature integrated server, comprises cabinet, mainboard, Power conversion board, hard disk, power supply and blower group; Wherein, mainboard, Power conversion board and hard disk are arranged on the inside of cabinet; The power supply and blower group is arranged on the outside of cabinet; On the casing of cabinet, power supply interface is installed, wherein, power supply interface can be arranged on the front panel or rear panel of cabinet.Power supply is connected with Power conversion board by power supply interface; Power conversion board is electrically connected to mainboard, hard disk and fan group respectively; And the air inlet of fan group is communicated with cabinet inside, and the exhaust outlet of fan group is towards the external environment condition at cabinet place; The fan group is distributed the heat of cabinet inside by the exhausting mode.The fan group comprises the fan that is set up in parallel more than.As shown in Figure 3, the fan group is comprised of three parallel fans.
Apply above-mentioned high-temperature integrated server, the utility model also provides a kind of high-temperature integrated server cluster, and the high-temperature integrated server cluster is contacted up and down to be arranged in parallel by each high-temperature integrated server and forms.As shown in Figure 3, the high-temperature integrated server cluster for by 6 high-temperature integrated servers, being formed.In addition, the utility model does not limit the concrete angles of high-temperature integrated server cluster,, according to different demands, can horizontal, perpendicularly put or with level, place at an angle.
In the utility model, the power supply and blower group is independent outside at cabinet, and, concentrate and to provide electric energy and heat radiation for many high-temperature integrated servers, in Fig. 3, fan group is concentrated as three high-temperature integrated servers provide heat sinking function, and power supply is concentrated provides electric energy for 6 high-temperature integrated servers.Concentrate the frame mode of heat radiation by the fan group, higher than the independent radiating efficiency of traditional server, can run well in 45 degree environment Celsius.In addition, when the traditional server fan breaks down, after needing to close tester in power-down state, open machine box for server and change fan, and the high-temperature integrated server cluster that the utility model provides, the fan group is arranged on the cabinet outside, therefore, can change the fan group under the high-temperature integrated server contention states, avoid the process of high-temperature integrated server cycle power.
The high-temperature integrated server that the utility model provides and high-temperature integrated server cluster, the power supply and blower group is arranged on the outside of cabinet, make multiple servers share identical fan group, by using frame mode of the present utility model, can increase server density, make server adapt to more high ambient temperature, but also can reduce the overall power of server cluster, also have advantages of convenient for maintaining fan group.
The above is only preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be looked protection domain of the present utility model.
Claims (5)
1. a high-temperature integrated server, is characterized in that, comprises cabinet, mainboard, Power conversion board, hard disk, power supply and blower group; Wherein, described mainboard, described Power conversion board and described hard disk are arranged on the inside of described cabinet; Described power supply and described fan group are arranged on the outside of described cabinet; On the casing of described cabinet, power supply interface is installed; Described power supply is connected with described Power conversion board by described power supply interface; Described Power conversion board is electrically connected to described mainboard, described hard disk and described fan group respectively; And the air inlet of described fan group is communicated with described cabinet inside, and the exhaust outlet of described fan group is towards the external environment condition at described cabinet place; Described fan group is distributed the heat of described cabinet inside by the exhausting mode.
2. high-temperature integrated server according to claim 1, is characterized in that, described power supply interface is arranged on the front panel of described cabinet; Perhaps, described power supply interface is arranged on the rear panel of described cabinet.
3. high-temperature integrated server according to claim 1, is characterized in that, described fan group comprises the fan that is set up in parallel more than.
4. a high-temperature integrated server cluster, is characterized in that, comprises two described high-temperature integrated servers of above claim 1-3 any one; Two the above high-temperature integrated servers share same described fan group, and, share same described power supply.
5. high-temperature integrated server cluster according to claim 4, is characterized in that, described high-temperature integrated server cluster is contacted up and down to be arranged in parallel by each described high-temperature integrated server and forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202872142U CN203299694U (en) | 2013-05-23 | 2013-05-23 | High-temperature integrated servers and high-temperature integrated server cluster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202872142U CN203299694U (en) | 2013-05-23 | 2013-05-23 | High-temperature integrated servers and high-temperature integrated server cluster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203299694U true CN203299694U (en) | 2013-11-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202872142U Expired - Lifetime CN203299694U (en) | 2013-05-23 | 2013-05-23 | High-temperature integrated servers and high-temperature integrated server cluster |
Country Status (1)
| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104181980A (en) * | 2013-05-23 | 2014-12-03 | 北京天地超云科技有限公司 | High-temperature integrated server and high-temperature integrated server cluster |
-
2013
- 2013-05-23 CN CN2013202872142U patent/CN203299694U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104181980A (en) * | 2013-05-23 | 2014-12-03 | 北京天地超云科技有限公司 | High-temperature integrated server and high-temperature integrated server cluster |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131120 |
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| CX01 | Expiry of patent term |