CN203179943U - Waterproof SMD LED package structure - Google Patents
Waterproof SMD LED package structure Download PDFInfo
- Publication number
- CN203179943U CN203179943U CN2013200624627U CN201320062462U CN203179943U CN 203179943 U CN203179943 U CN 203179943U CN 2013200624627 U CN2013200624627 U CN 2013200624627U CN 201320062462 U CN201320062462 U CN 201320062462U CN 203179943 U CN203179943 U CN 203179943U
- Authority
- CN
- China
- Prior art keywords
- pin
- flanging
- housing
- cavity
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/85951—Forming additional members, e.g. for reinforcing
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- Led Device Packages (AREA)
Abstract
The utility model discloses a waterproof SMD LED package structure comprising a housing, PIN feet, chips, and gold wires. A bowl-shaped hollow cavity is formed in the housing. The PIN feet are symmetrically arranged on two sides of the housing, and extend into the hollow cavity. The chips are fixed at a functional zone on the bottom of the hollow cavity, and are respectively connected with the symmetric PIN feet through the gold wires. The PIN feet are composed of at least four folds. According to the utility model, PIN feed folds are increased, such that water vapor climbing distance is increased, and service life is prolonged.
Description
Technical field
The utility model relates to a kind of water proof type SMD LED encapsulating structure.
Background technology
To shown in Figure 5, a kind of LED encapsulating structure that prior art discloses comprises housing 10, PIN pin 20, chip 30 and gold thread 40 as Fig. 1; Housing 10 forms the down bowl-shape cavity 101 of convergent of bore, and PIN pin 20 left and right symmetricallies are installed in housing 10 both sides, and stretch in the cavity 101; One side PIN pin 20 is connected with positive source, and opposite side PIN pin 20 is connected with power cathode; Chip 30 is fixed on bowl-shape cavity 101 bottoms, and chip 30 welds with both sides PIN pin 20 respectively by gold thread 40, but forms the circuit of conducting, and is behind the galvanization that chip 30 conductings are luminous.Chip portfolio by different glow colors is combined into the color that needs, in use, and sealing resin colloid 50 in bowl-shape cavity usually.
As shown in Figure 2, PIN pin 20 is " 7 " font, is made up of first flanging 201, second flanging 202 and the 3rd flanging 203, and under long-term use, steam is prolonging successively, second flanging 202 and the 3rd flanging 203 climb up.Owing to have only two flangings, steam climbs up easily and enters cavity bottom, and corrosion PIN pin 20 function area part, chip 30 and gold thread 40 reduce its useful life.
As shown in Figures 2 and 3, the cross section of cavity 101 is " trapezoidal ", and bore dwindles gradually and forms the slope from top to bottom, therefore, the steam slope of postponing is down climbed, the long-term use down, and steam finally enters cavity 101 bottoms, corrosion PIN pin 20 functional areas portions, chip 30 and gold thread 40 reduce its useful life.
The utility model content
The purpose of this utility model is to provide a kind of and prolongs the creeping distance of steam and promote the moisture resistant grade of LED, increases the LED water proof type SMDLED encapsulating structure in useful life.
For reaching above-mentioned purpose, solution of the present utility model is:
A kind of water proof type SMDLED encapsulating structure comprises housing, PIN pin, chip and gold thread; Form bowl-shape cavity in the housing, PIN pin symmetry is installed in the housing both sides, and stretches in the cavity; Chip is installed in the cavity bottom functional areas, is connected with symmetrically arranged PIN pin respectively by gold thread; The PIN pin is made up of four flangings at least.
Further, the PIN pin is made up of first flanging, second flanging, the 3rd flanging, Fourth Fold and the 5th flanging, and first flanging is connected with second flanging and is " 7 " font, and Fourth Fold is connected with the 5th flanging and is " 7 " font; Second flanging is connected by the 3rd flanging with Fourth Fold.
Further, the oral area of bowl-shape cavity forms the rim of a cup step.
Further, also comprise the resin colloid, the resin colloid is potted in the bowl-shape cavity.
Further, the PIN pin is symmetrical arranged three pairs.
After adopting such scheme, the utility model PIN pin is made up of four flangings at least, than the PIN pin increase flanging of prior art, and then the distance of creeping of increase steam, thereby prolong useful life of the present utility model.
And the utility model forms the rim of a cup step at the oral area of bowl-shape cavity, further increases steam along the distance of creeping on cavity slope, further prolongs useful life of the present utility model.
Description of drawings
Fig. 1 is the vertical view of prior art;
Fig. 2 is Figure 1A-A direction cutaway view;
Fig. 3 is the prior art right view;
Fig. 4 is the prior art three-dimensional combination figure;
Fig. 5 is the prior art three-dimensional exploded view;
Fig. 6 is vertical view of the present utility model;
Fig. 7 is Fig. 6 B-B direction cutaway view;
Fig. 8 is the utility model right view;
Fig. 9 is the utility model three-dimensional combination figure.
Label declaration
Second flanging 202 the 3rd flanging 203
Resin colloid 50
Rim of a cup step 12 PIN pin 2
First flanging, 21 second flangings 22
The 3rd flanging 23 Fourth Folds 24
The 5th flanging 25 chips 3
Embodiment
Below in conjunction with drawings and the specific embodiments the utility model is done comparatively detailed explanation.
Consult Fig. 6 to shown in Figure 9, a kind of water proof type SMDLED encapsulating structure that the utility model discloses comprises housing 1, PIN pin 2, chip 3 and gold thread 4.
Form bowl-shape cavity 11 in the housing 1, the bore of cavity 11 dwindles from top to bottom gradually, PIN pin 2 symmetries are installed in the housing both sides, wherein the PIN pin 2 of a side is connected with the power supply (not shown) is anodal, and the PIN pin 2 of opposite side is connected with power cathode, the PIN pin 2 of both sides does not separately contact, and the PIN pin 2 of both sides all stretches in the cavity 11, as Figure 6 and Figure 7.In the present embodiment, PIN pin 2 is symmetrical arranged three pairs, and each side arranges three.
The chip 3 of different emission wavelengths is separately fixed at functional areas, bowl-shape cavity 11 bottom, be welded to connect with symmetrically arranged PIN pin 2 functional areas respectively by gold thread 4, but form the circuit of conducting, behind the galvanization, and then make that the LED lamp pearl (not shown) that is fixed in the chip 3 is luminous.
Wherein, PIN pin 2 is made up of four flangings at least.In the present embodiment, as shown in Figure 7, PIN pin 2 is made up of first flanging 21, second flanging 22, the 3rd flanging 23, Fourth Fold 24 and the 5th flanging 25, and first flanging 21 is connected with second flanging 22 and is " 7 " font, and Fourth Fold 24 is connected with the 5th flanging 25 and is " 7 " font; Second flanging 22 is connected by the 3rd flanging 23 with Fourth Fold 24.
For further increasing steam along the distance of creeping on cavity slope, at the oral area formation rim of a cup step 12 of bowl-shape cavity 11, rim of a cup step 12 can be the one-level step, also can be multistage step.
The utility model in use, sealing resin colloid 5 in cavity 11 for the protection of chip 3 and gold thread 4, increases the service life usually.
The above is preferred embodiment of the present utility model only, is not the restriction to this case design, and all equivalent variations of doing according to the design key of this case all fall into the protection range of this case.
Claims (5)
1. a water proof type SMD LED encapsulating structure comprises housing, PIN pin, chip and gold thread; Form bowl-shape cavity in the housing, PIN pin symmetry is installed in the housing both sides, and stretches in the cavity; Chip is fixed on the cavity bottom functional areas, is connected with symmetrically arranged PIN pin respectively by gold thread; It is characterized in that: the PIN pin is made up of four flangings at least.
2. a kind of water proof type SMDLED encapsulating structure as claimed in claim 1, it is characterized in that: the PIN pin is made up of first flanging, second flanging, the 3rd flanging, Fourth Fold and the 5th flanging, first flanging is connected with second flanging and is " 7 " font, and Fourth Fold is connected with the 5th flanging and is " 7 " font; Second flanging is connected by the 3rd flanging with Fourth Fold.
3. a kind of water proof type SMDLED encapsulating structure as claimed in claim 1 or 2 is characterized in that: the oral area formation rim of a cup step of bowl-shape cavity.
4. a kind of water proof type SMDLED encapsulating structure as claimed in claim 1 or 2, it is characterized in that: the PIN pin is symmetrical arranged three pairs.
5. a kind of water proof type SMDLED encapsulating structure as claimed in claim 1, it is characterized in that: also comprise the resin colloid, the resin colloid is potted in the bowl-shape cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200624627U CN203179943U (en) | 2013-02-04 | 2013-02-04 | Waterproof SMD LED package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200624627U CN203179943U (en) | 2013-02-04 | 2013-02-04 | Waterproof SMD LED package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203179943U true CN203179943U (en) | 2013-09-04 |
Family
ID=49076603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013200624627U Expired - Fee Related CN203179943U (en) | 2013-02-04 | 2013-02-04 | Waterproof SMD LED package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203179943U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160145303A (en) * | 2015-06-10 | 2016-12-20 | 엘지이노텍 주식회사 | A light emitting device package |
-
2013
- 2013-02-04 CN CN2013200624627U patent/CN203179943U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160145303A (en) * | 2015-06-10 | 2016-12-20 | 엘지이노텍 주식회사 | A light emitting device package |
| KR102402259B1 (en) | 2015-06-10 | 2022-05-27 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | A light emitting device package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20210204 |