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CN203036306U - LED lamp module - Google Patents

LED lamp module Download PDF

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Publication number
CN203036306U
CN203036306U CN2012207182026U CN201220718202U CN203036306U CN 203036306 U CN203036306 U CN 203036306U CN 2012207182026 U CN2012207182026 U CN 2012207182026U CN 201220718202 U CN201220718202 U CN 201220718202U CN 203036306 U CN203036306 U CN 203036306U
Authority
CN
China
Prior art keywords
led lamp
led
lamp module
heat dissipation
transparent cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012207182026U
Other languages
Chinese (zh)
Inventor
毕晓峰
石智伟
谭吉志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KINGSUN OPTOELECTRONIC CO Ltd
Original Assignee
Dongguan Kingsun Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Kingsun Optoelectronic Co Ltd filed Critical Dongguan Kingsun Optoelectronic Co Ltd
Priority to CN2012207182026U priority Critical patent/CN203036306U/en
Application granted granted Critical
Publication of CN203036306U publication Critical patent/CN203036306U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The utility model relates to a LED lighting technology field especially relates to a LED lamp module, including transparent face lid and LED lamp plate, be equipped with the LED chip on the LED lamp plate, transparent face housing locates on the LED lamp plate, and the LED chip is acceptd in transparent face lid, the LED lamp plate is connected with the heat dissipation post, the heat dissipation post passes the LED lamp plate and laminates mutually with the LED chip; the outer edge of the LED lamp module is provided with a plastic layer for preventing foreign objects from entering the LED lamp module; the LED lamp panel and the LED chip are sealed by the plastic layer, the heat dissipation column and the transparent surface cover, so that the whole LED lamp module is good in waterproof and dustproof performance, the protection grade of the LED lamp module reaches IP68, the LED lamp module can work underwater for a long time, and can be used as a water-bottom lamp; the heat dissipation column directly conducts the heat of the LED chip to the radiator to be dissipated, and the heat dissipation effect is good.

Description

A kind of LED lamp module
Technical field
The utility model relates to the LED lighting technical field, relates in particular to a kind of LED lamp module.
Background technology
Existing LED lamp module comprises transparent cover, aluminium base, pcb board, led chip, silica gel sealing ring, connector and radiator, and led chip is located on the pcb board, is provided with the insulate heat resistance layer between lamp plate and the radiator.Its sealing means is to adopt silica gel sealing ring to seal, and the caloric requirement of led chip could arrive radiator by aluminium base and insulate heat resistance layer, the heat dispersion of entire module is relatively poor, and the waterproof and dustproof performance of LED lamp module is unsatisfactory, its degree of protection is IP65, and the reliability of entire module has much room for improvement.
The utility model content
The purpose of this utility model is to provide at the deficiencies in the prior art the LED lamp module of a kind of sealing, perfect heat-dissipating.
For achieving the above object, LED lamp module of the present utility model comprises transparent cover and LED lamp plate, described LED lamp plate is provided with led chip, described transparent area housing is located on the LED lamp plate, led chip is contained in the transparent cover, described LED lamp plate is connected with thermal column, and described thermal column passes described LED lamp plate and fits with led chip; LED lamp module outer rim is provided be used to preventing that foreign object from entering the plastic layer of LED lamp module internal.
As preferably, described plastic layer is TPU flexible glue layer, and the injection moulding of TPU flexible glue layer is sealed in the outer rim of LED lamp module.
As preferably, the injection moulding of described TPU flexible glue layer is sealed in the junction of junction, thermal column and the LED lamp plate of transparent cover and LED lamp plate.
As preferably, described thermal column is provided with shaft shoulder portion, and described shaft shoulder portion is provided with the ladder mouth.
As preferably, the edge side of described transparent cover is provided with groove, and described TPU flexible glue layer is embedded in described groove.
As preferably, described thermal column is the copper post.
As preferably, described LED lamp plate is pcb board.
As preferably, described transparent area covers and is provided with some lens, and the quantity of lens is corresponding with the quantity of led chip.
The beneficial effects of the utility model: a kind of LED lamp module, LED lamp plate and led chip are nested in the bottom of transparent cover, and thermal column passes described LED lamp plate and fits with led chip, and plastic layer is sealed in the bottom of LED lamp module; Plastic layer, thermal column and transparent cover seal LED lamp plate and led chip, make the waterproof and dustproof performance of LED lamp module integral body good, and its degree of protection reaches IP68, can work long hours under water, can be used as underwater lamp and use; Thermal column is directly conducted to heat sink radiates with the heat of led chip and goes out good heat dissipation effect.
Description of drawings
Fig. 1 is front view of the present utility model.
Fig. 2 is the Section View along A-A line among Fig. 1.
Fig. 3 is the left view of Fig. 1.
Reference numeral comprises:
1-transparent cover 11-groove
2-LED lamp plate, 3-led chip
4-copper post, 41-shaft shoulder portion
42-ladder mouth, 5-plastic layer.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described in detail.
As shown in Figure 1 to Figure 3, a kind of LED lamp module of the present utility model, comprise transparent cover 1 and LED lamp plate 2, described LED lamp plate 2 is provided with led chip 3, described transparent cover 1 covers on the LED lamp plate 2, led chip 3 is contained in the transparent cover 1, and described LED lamp plate 2 is connected with thermal column 4, and described thermal column 4 passes described LED lamp plate 2 and fits with led chip 3; LED lamp module outer rim is provided be used to preventing that foreign object from entering the plastic layer 5 of LED lamp module internal.
The LED lamp module of present embodiment is by single injection-molded in the mould, described plastic layer 5 is TPU flexible glue layer, the injection moulding of TPU flexible glue layer is sealed in the outer rim of LED lamp module, specifically is sealed in the junction of junction, thermal column 4 and the LED lamp plate 2 of transparent cover 1 and LED lamp plate 2.LED lamp plate 2 and led chip 3 are nested in the bottom of transparent cover 1, thermal column 4 passes LED lamp plate 2 and fits with led chip 3, then that combinations thereof is good LED lamp module is put in the mould, by injector with the injection moulding of TPU flexible glue in the junction of transparent cover 1 and LED lamp plate 2, the junction of thermal column 4 and LED lamp plate 2, whole LED lamp module is sealed, integral waterproofing, the anti-dust performance of LED lamp module are good, its degree of protection reaches IP68, can work long hours under water, can be used as underwater lamp and use.
Described thermal column 4 is provided with shaft shoulder portion 41, and described shaft shoulder portion 41 is provided with ladder mouth 42.The shaft shoulder portion 41 that arranges on the thermal column 4 can prevent that outside liquid or dust from infiltering LED lamp module internal by the wall of thermal column 4.In like manner, the ladder mouth 42 that shaft shoulder portion 41 places arrange can function as described above equally.
The edge side of described transparent cover 1 is provided with groove 11, and described TPU flexible glue layer is embedded in described groove 11, and TPU flexible glue layer is more firm with being connected of transparent cover 1, makes the integral body of LED lamp module more fastening.
As preferably, the thermal column 4 of present embodiment is the copper post, and the heat dispersion of copper post is more superior.The LED lamp plate 2 of present embodiment is pcb board, need not to use aluminium base in the LED lamp module, has not only simplified the combining structure of LED lamp module, and copper post 4 can be directly conducted to the heat of led chip 3 heat sink radiates and go out, and obtains better heat radiating effect.
Described transparent cover 1 is provided with some lens, and the quantity of lens is corresponding with the quantity of led chip 3.
LED lamp module need carry out high pressure resistant test as a kind of lighting.And the voltage of Hi-pot test can arrange insulating barrier to protect usually up to more than the 2000V in the design of routine, prevents that the electrode of led chip 3 is broken down by high-voltage.And insulating barrier is not set among the design, it is very crucial to the influence of led chip 3 electrodes to eliminate high pressure in Hi-pot test, lampshade (not shown) by LED lamp module among the design makes LED lamp module place fully in the airtight lamp casing, thereby when Hi-pot test, voltage only forms the loop by lamp casing, can not cause the high-voltage breakdown influence to led chip 3.
Above content only is preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, the part that all can change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.

Claims (8)

1. 一种LED灯模组,包括透明面盖和LED灯板,所述LED灯板上设有LED芯片,所述透明面盖罩设于LED灯板上,LED芯片收容于透明面盖内,其特征在于:所述LED灯板连接有散热柱,所述散热柱穿过所述LED灯板并与LED芯片相贴合;LED灯模组外缘设有用于防止外物进入LED灯模组内部的塑胶层。 1. An LED lamp module, comprising a transparent cover and an LED lamp board, the LED lamp board is provided with LED chips, the transparent cover is arranged on the LED lamp board, and the LED chips are housed in the transparent cover , characterized in that: the LED lamp board is connected with a heat dissipation column, and the heat dissipation column passes through the LED lamp board and is attached to the LED chip; the outer edge of the LED lamp module is provided with a The plastic layer inside the group. 2. 根据权利要求1所述的LED灯模组,其特征在于:所述塑胶层为TPU软胶层,TPU软胶层注塑密封于LED灯模组的外缘。 2. The LED lamp module according to claim 1, wherein the plastic layer is a TPU soft rubber layer, and the TPU soft rubber layer is injected and sealed on the outer edge of the LED lamp module. 3. 根据权利要求2所述的LED灯模组,其特征在于:所述TPU软胶层注塑密封于透明面盖与LED灯板的连接处、散热柱与LED灯板的连接处。 3. The LED lamp module according to claim 2, characterized in that: the TPU soft rubber layer is injection-molded and sealed at the connection between the transparent cover and the LED light board, and at the connection between the heat dissipation column and the LED light board. 4. 根据权利要求1所述的LED灯模组,其特征在于:所述散热柱设置有轴肩部,所述轴肩部设置有阶梯口。 4. The LED lamp module according to claim 1, characterized in that: the heat dissipation column is provided with a shaft shoulder, and the shaft shoulder is provided with a stepped opening. 5. 根据权利要求2所述的LED灯模组,其特征在于:所述透明面盖的边缘侧设置有凹槽,所述TPU软胶层嵌接于所述凹槽。 5. The LED lamp module according to claim 2, wherein a groove is provided on the edge side of the transparent cover, and the soft TPU layer is embedded in the groove. 6. 根据权利要求1~5任意一项所述的LED灯模组,其特征在于:所述散热柱为铜柱。 6. The LED lamp module according to any one of claims 1-5, characterized in that: the heat dissipation column is a copper column. 7. 根据权利要求6所述的LED灯模组,其特征在于:所述LED灯板为PCB板。 7. The LED lamp module according to claim 6, wherein the LED lamp board is a PCB board. 8. 根据权利要求6所述的LED灯模组,其特征在于:所述透明面盖上设有若干透镜,透镜的数量与LED芯片的数量相对应。 8. The LED lamp module according to claim 6, wherein a plurality of lenses are arranged on the transparent cover, and the number of lenses corresponds to the number of LED chips.
CN2012207182026U 2012-12-24 2012-12-24 LED lamp module Expired - Fee Related CN203036306U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012207182026U CN203036306U (en) 2012-12-24 2012-12-24 LED lamp module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012207182026U CN203036306U (en) 2012-12-24 2012-12-24 LED lamp module

Publications (1)

Publication Number Publication Date
CN203036306U true CN203036306U (en) 2013-07-03

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ID=48688432

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012207182026U Expired - Fee Related CN203036306U (en) 2012-12-24 2012-12-24 LED lamp module

Country Status (1)

Country Link
CN (1) CN203036306U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015062144A1 (en) * 2013-11-01 2015-05-07 梁卫昕 High-power led underwater lamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015062144A1 (en) * 2013-11-01 2015-05-07 梁卫昕 High-power led underwater lamp

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20171101

Address after: 523565 Guangdong city of Dongguan province Changping Zhen Heng Jiang Jiang Xia Heng Industrial Road, set up a file

Patentee after: KINGSUN OPTOELECTRONIC CO., LTD.

Address before: 523565 Guangdong province Dongguan city Changping town Hengjiang Dongguan KingSun Au Optronics Co set up a file

Patentee before: Dongguan Qinshang Photoelectric Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130703

Termination date: 20181224