CN203013727U - Wafer-Level Lens module array and array combination - Google Patents
Wafer-Level Lens module array and array combination Download PDFInfo
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- CN203013727U CN203013727U CN 201220743207 CN201220743207U CN203013727U CN 203013727 U CN203013727 U CN 203013727U CN 201220743207 CN201220743207 CN 201220743207 CN 201220743207 U CN201220743207 U CN 201220743207U CN 203013727 U CN203013727 U CN 203013727U
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Abstract
The utility model provides a wafer-Level Lens module array and an array combination. The wafer-Level Lens module array comprises a transparent substrate possessing a first surface and a second surface, and a through hole substrate located on the first surface of the transparent substrate and comprising a plurality of through holes, wherein the through holes are exposed out of a part of the first surface of the transparent substrate. The wafer-Level Lens module array also comprises at least one of a first lens array and a second lens array. The first lens array is located at the positions of the through holes of the through hole substrate, and the second lens array is located on the second surface of the transparent substrate. The wafer-Level Lens module array provided by the utility model is simple in structure, is suitable for mass production, and has s wide market prospect.
Description
Technical field
The utility model relates to a kind of camera lens module, particularly a kind of wafer-level lens module array and array combination.
Background technology
In recent years, on the portable terminal device of the electronic equipments such as mobile phone or PDA (Personal Digital Assistant) all usually design be equipped with image unit.This image unit generally possesses the solid-state imager such as CCD (ChargeCoupled Device) imageing sensor or CMOS (Complementary Metal-OxideSemiconductor) imageing sensor and be used for forming the camera lens of subject image on solid-state imager.
Along with miniaturization, the slimming of portable terminal device, require also miniaturization of camera lens, slimming.And in order to seek the cost of portable terminal device, the manufacturing process of expectation camera lens can raise the efficiency.As the method for making this small-sized and most camera lenses, normally form the wafer-level lens array with a plurality of camera lens part structures on substrate, thereby and cut off this substrate a plurality of camera lens parts are separated, with the batch production camera lens module, for example application publication number is manufacture method, wafer level lens array and lens module and the image unit of the disclosed wafer level lens array of Chinese patent application file of CN102023322A.Prior art is usually by carrying out the substrate of the integrally formed lens array of pressing mold and carrying lens array to resin.In this case, no matter whether the lens array material therefor is identical with the substrate material therefor, and in the time of all can causing supplying with moulding material to mould, air is sneaked in moulding material, cause the shape of the camera lens part after moulding to change, thereby unavoidable ground can affect the optical property of camera lens.In addition, stamping technique need to be brought up to temperature more than 200 ℃, and more than guaranteeing that mould temperature reaches the glass transition temperature of resin solid, thereby the energy consumption of required consumption is more, and cost is higher.
The utility model content
By the background technology introduction as can be known, the existing method that forms wafer-level lens by stamping technique, when supplying with moulding material to mould, air is easily sneaked in moulding material, the optical property of the final camera lens that forms of impact.And the existing method that forms wafer-level lens by stamping technique need to be carried out under the temperature conditions more than 200 ℃, and energy consumption is high, and cost is high.
These defectives that exist for solving prior art, the utility model provides a kind of wafer-level lens module array, comprising:
Transparency carrier has first surface and second surface;
The through hole substrate is positioned at the described first surface of described transparency carrier, and described through hole substrate comprises a plurality of through holes, and described through hole exposes the described first surface of part of described transparency carrier;
Described wafer-level lens module array also comprise in first mirror head array and the second lens array at least one of them, wherein, described first mirror head array is positioned at the described lead to the hole site of described through hole substrate, and described the second lens array is positioned at the second surface of described transparency carrier.
Optionally, described first mirror head array is positioned at the described first surface of the described transparency carrier of part that described through hole exposes.
Optionally, described first mirror head array is positioned at place, described through hole aperture.
Optionally, in the first surface or second surface of described transparency carrier, be coated with optical thin film at least one surface, as IR film and/or AR film.
Optionally, described first mirror head array and/or described the second lens array are made by photoresist.
Optionally, described transparency carrier comprises transparent glass substrate or transparent resin substrate.
Optionally, described through hole substrate is BT plate, glass plate, ceramic wafer or polyimide plate.
The utility model provides another wafer-level lens module array, comprising:
The through hole substrate, described through hole substrate comprises a plurality of through holes;
Lens array, described lens array are positioned at the described lead to the hole site of described through hole substrate.
Optionally, described lens array comprises first mirror head array and the second lens array, comprises smooth packed layer between described first mirror head array and described the second lens array, and described smooth packed layer is filled described through hole.
Optionally, described lens array comprises first mirror head array and the second lens array, and described first mirror head array and/or described the second lens array are made by photoresist.
Optionally, described through hole substrate is BT plate, glass plate, ceramic wafer or polyimide plate.
The utility model also provides the third wafer-level lens module array combination, comprising:
Mutual stacked the first wafer-level lens module array as above and the second wafer-level lens module array as above.
The utility model also provides a kind of manufacture method of wafer-level lens module array, comprising:
Transparency carrier is provided, and described transparency carrier has first surface and second surface;
Bonding has the through hole substrate of a plurality of through holes on described first surface, and described through hole exposes the described first surface of described transparency carrier, and forms the first mirror head array in described through hole, forms the second lens array on described second surface.
Optionally, forming the first mirror head array in described through hole comprises: make first mirror head material layer in described through hole, described first mirror head material layer is carried out exposure imaging, form the first mirror surface layer, described first mirror surface layer is carried out the first camera lens moulding process, form the first mirror head array;
Forming the second lens array on the described second surface of described transparency carrier comprises: form the second camera lens material layer on the second surface at described transparency carrier, described the second camera lens material layer is carried out exposure imaging, form the second specular layer, described the second specular layer is carried out the second camera lens moulding process, form the second lens array.
Optionally, described the first camera lens moulding process and/or described the second camera lens moulding process comprise reflow soldering process or gray mask technique.
Optionally, described first mirror head material layer and/or described the second camera lens material layer are the photoresist layer.
Optionally, in the first surface or second surface of described transparency carrier, be coated with optical thin film at least one surface, as IR film and/or AR film.
Optionally, described transparency carrier comprises transparent glass substrate or transparent resin substrate.
Optionally, described through hole substrate is BT plate, glass plate, ceramic wafer or polyimide plate.
The utility model also provides the manufacture method of the second wafer-level lens module array, comprising:
Through hole with a plurality of through holes substrate is provided, forms the first mirror head array in described through hole;
Transparency carrier is provided, and described transparency carrier has first surface and second surface;
At the described through hole substrate of described first surface bonding of described transparency carrier, at described second surface formation second lens array of described transparency carrier.
Optionally, forming the first mirror head array in described through hole comprises: make first mirror head material layer in described through hole, described first mirror head material layer is carried out exposure imaging, form the first mirror surface layer, described first mirror surface layer is carried out the first camera lens moulding process, form the first mirror head array;
Forming the second lens array on the described second surface of described transparency carrier comprises: form the second camera lens material layer on the second surface at described transparency carrier, described the second camera lens material layer is carried out exposure imaging, form the second specular layer, described the second specular layer is carried out the second camera lens moulding process, form the second lens array.
Optionally, described the first camera lens moulding process and/or described the second camera lens moulding process comprise reflow soldering process or gray mask technique.
Optionally, described first mirror head material layer and/or described the second camera lens material layer are the photoresist layer.
Optionally, in the first surface or second surface of described transparency carrier, be coated with optical thin film at least one surface, as IR film and/or AR film.
Optionally, described transparency carrier comprises transparent glass substrate or transparent resin substrate.
Optionally, described through hole substrate is BT plate, glass plate, ceramic wafer or polyimide plate.
The utility model also provides the manufacture method of the third wafer-level lens module array, comprising:
Through hole with a plurality of through holes substrate is provided;
Described lead to the hole site at described through hole substrate forms lens array.
Optionally, described lens array comprises first mirror head array and the second lens array; Before forming described first mirror head array and described the second lens array, first form smooth packed layer in described through hole, described first mirror head array and described the second lens array are formed at respectively the upper and lower surface of smooth packed layer described in described through hole.
Optionally, described lens array comprises first mirror head array and the second lens array that is positioned at different layers;
Forming the first mirror head array at described lead to the hole site comprises: make first mirror head material layer at described lead to the hole site, described first mirror head material layer is carried out exposure imaging, form the first mirror surface layer, described first mirror surface layer is carried out the first camera lens moulding process, form the first mirror head array;
Forming the second lens array at described lead to the hole site comprises: make the second camera lens material layer at described lead to the hole site, described the second camera lens material layer is carried out exposure imaging, form the second specular layer, described the second specular layer is carried out the second camera lens moulding process, form the second lens array.
Optionally, described the first camera lens moulding process and/or described the second camera lens moulding process comprise reflow soldering process or gray mask technique.
Optionally, described first mirror head material layer and/or described the second camera lens material layer are the photoresist layer.
Optionally, described through hole substrate is BT plate, glass plate, ceramic wafer or polyimide plate.
Optionally, the surface coverage of lens array has optical thin film, as IR film and/or AR film.
The utility model also provides a kind of manufacture method of wafer-level lens module array combination, comprising:
Utilize above-mentioned the first or the second manufacture method to make the first wafer-level lens module array;
Utilize above-mentioned the third manufacture method to make the second wafer-level lens module array;
Described the first wafer-level lens module array and described the second wafer-level lens module array combination are produced on together, form the wafer-level lens module array combination.
Compared with prior art, the utlity model has following advantage:
Wafer-level lens module array provided by the utility model is simple in structure, can form even several thousand camera lenses of hundreds of on a substrate, is suitable for a large amount of productions, has wide market prospects.
Wafer-level lens module array provided by the utility model utilizes photoresist to make camera lens, replaced and originally formed the technique of camera lens with resin by pressing mold, photoresist can form the camera lens module by existing maturation process means such as exposure imagings, make easily, do not need to adopt stamping technique, both avoid the stamping technique Air easily to sneak into problem in the making material of camera lens, do not needed again higher temperature, reduced cost.
The manufacture method of wafer-level lens module array provided by the utility model adopts Reflow Soldering (reflow) technique and gray tone masking process, the wafer-level lens mirror smooth of formation, good forming effect.
Description of drawings
The wafer-level lens module array schematic diagram that Fig. 1 provides for the utility model embodiment one;
The wafer-level lens module array schematic diagram that Fig. 2 provides for the utility model embodiment two;
The wafer-level lens module array schematic diagram that Fig. 3 provides for the utility model embodiment three;
The wafer-level lens module array schematic diagram that Fig. 4 provides for the utility model embodiment four;
The wafer-level lens module array schematic diagram that Fig. 5 provides for the utility model embodiment five;
Each step structural representation of manufacture method of the wafer-level lens module array that Fig. 6 to Figure 10 provides for the utility model embodiment six;
Each step structural representation of manufacture method of the wafer-level lens module array that Figure 11 to Figure 14 provides for the utility model embodiment eight.
Embodiment
Embodiment one
Please refer to Fig. 1, the wafer-level lens module array schematic diagram that Fig. 1 provides for the utility model embodiment one.This wafer-level lens module array includes transparency carrier 110.The material of this transparency carrier 110 can include but not limited to it is transparent glass substrate or transparent resin substrate, and other the material that has corresponding mechanical strength and optical property and be applicable to the utility model manufacture craft also can be used for making this transparency carrier 110.This transparency carrier 110 has first surface and second surface, though this first surface and second surface are not marked in Fig. 1, can corresponding regard upper surface and the lower surface of transparency carrier 110 in Fig. 1 as.
What be positioned at these transparency carrier 110 first surfaces (being upper surface) is through hole substrate 120.The making material of this through hole substrate 120 can include but not limited to it is BT(Bismaleimide Triazine, full name BT resin substrate material, make by bismaleimides and cyanate ester resin are synthetic, a kind of special high-performance baseplate material) plate, glass plate, ceramic wafer or polyimide plate, other substrate that is applicable to manufacture craft of the present utility model and corresponding requirements also can apply in the utility model embodiment.This through hole substrate 120 comprises a plurality of through holes 121, and this through hole 121 exposes this first surface of part of this transparency carrier 110 of part.
This wafer-level lens module array also comprises first mirror head array and the second lens array, and wherein the first mirror head array is comprised of a plurality of the first camera lenses 130 that are arranged in through hole 121 positions, and namely a plurality of the first camera lenses 130 have consisted of the first mirror head array.This first mirror head array is positioned at the first surface of this transparency carrier 110 of part that through hole 121 exposes, and namely the first mirror head array just is filled in the bottom of through hole 121, and covers transparency carrier 110 first surfaces that through hole 121 exposes.The second lens array is positioned at the second surface of this transparency carrier 110, is comprised of a plurality of the second camera lenses 140.
This wafer-level lens module array that the present embodiment provides can include only one of them of first mirror head array and the second lens array, can make separately one of them in first mirror head array and the second lens array according to the requirement of the final image unit that will form, can certainly make simultaneously first mirror head array and the second lens array according to the requirement of the final image unit that will form.
Show in Fig. 1 that first mirror head array and the second lens array are all for being similar to convex lens half, but the utility model embodiment does not limit the lens type of camera lens in first mirror head array and the second lens array, can be designed to according to the needs of corresponding product the camera lens (for example concavees lens camera lens) of other respective type.Simultaneously, the position of first mirror head array in through hole substrate 120 is not defined as position shown in Fig. 1 yet, and can regulate the upper-lower position of first mirror head array in through hole substrate 120 according to optical design.
In the present embodiment, one of them is to be made by photoresist at least for above-mentioned first mirror head array and the second lens array.The prior art lens array is formed by stamping technique by resin usually, and pressing mold process entrained air causes formed lens optical hydraulic performance decline, and stamping technique need to carry out under higher temperature conditions, and energy consumption is high, and cost is high.But the utility model embodiment adopts photoresist to make lens array, does not need to adopt stamping technique, has both avoided the stamping technique Air easily to sneak into problem in the making material of camera lens, does not need again higher temperature, has reduced cost.Utility model people finds that available light hinders material and (claim again photo-induced corrosion resistant material, PR) make this first mirror head array and the second lens array, and it is all more satisfactory to make by photoresist the lens optical effect and the mechanical strength that obtain.
In the present embodiment, in the first surface or second surface of this transparency carrier 110, be coated with optical thin film at least one surface, this optical thin film can be the IR(infrared ray) film and/or AR film (antireflective coating also claims anti-reflective film or anti-reflection film).Concrete, the present embodiment is provided with an optical thin film 150 at the upper surface of the transparency carrier 110 of wafer-level lens module array shown in Figure 1, and this optical thin film 150 can be both the IR film, can be also the AR film, can also both laminated construction.Increasing the IR membrane interaction is allow visible light to see through camera lens and end or reflects infrared light, thereby makes when using this lens shooting, can not be subject to unnecessary infrared ray impact.Increasing the AR membrane interaction is the reverberation that can reduce the camera lens surface, thereby increases light transmission capacity.When described transparency carrier 110 surfaces had this IR film and this AR film simultaneously, it can regard the two filters (in IR-CUT, IR refers to above-mentioned IR film, and CUT refers to above-mentioned AR film) of a kind of IR-CUT as.The concrete material of IR film and AR film and concrete manufacture method are prior art, and this specification does not repeat them here.In other embodiments, can be that corresponding optical thin film 160 is set on the lower surface of transparency carrier 110, perhaps design simultaneously optical thin film 150 and optical thin film 160(with reference to figure 2 in the upper and lower surface of transparency carrier 110).
Embodiment two
Please refer to Fig. 2, the wafer-level lens module array schematic diagram that Fig. 2 provides for the utility model embodiment two.The wafer-level lens module array that the present embodiment provides is identical with the most of structure of wafer-level lens module array described in embodiment one, and for this reason, this specification only is illustrated both difference.
As shown in Figure 2, in the present embodiment, this first mirror head array is positioned at this through hole 121 places, apertures, and the first mirror head array that namely is comprised of the first camera lens 130 this moment is not to be positioned at through hole substrate 120 and transparency carrier 110 to paste formed through hole 121 bottoms, locates but be positioned at the aperture that through hole 121 opens wide.As can be seen from Figure 2, each first camera lens 130 has part to be positioned at through hole 121 inside, guarantees that like this first camera lens 130 can be fixed on through hole 121 places, apertures.The second lens array that is formed by the second camera lens 140 with embodiment one in identical, be the lower surface that is positioned at transparency carrier 110.Simultaneously, the upper and lower surface of transparency carrier 110 designs optical thin film 150 and optical thin film 160 simultaneously in the present embodiment, and optical thin film 150 and optical thin film 160 can be IR film and/or AR film.
In the present embodiment, be similar to embodiment one, in the present embodiment, the position of first mirror head array in through hole substrate 120 is not defined as position shown in Fig. 2 yet, can regulate the upper-lower position of first mirror head array in through hole substrate 120 according to optical design.Need to prove especially, in this specification, lead to the hole site has comprised the position, above and below of through hole inside and through hole.
Embodiment three
Please refer to Fig. 3, the wafer-level lens module array schematic diagram that Fig. 3 provides for the utility model embodiment three.The present embodiment wafer-level lens module array comprises through hole substrate 220, and this through hole substrate 220 comprises that in a plurality of through hole 221(Fig. 3, through hole 221 is filled up by smooth packed layer 270, and its structure can be with reference to shown in Figure 4).The through hole substrate 220 of the present embodiment is similar to the through hole substrate 120 in embodiment one, thereby its make material also can be identical with the through hole substrate 120 in embodiment one, namely through hole substrate 220 includes but not limited to BT plate, glass plate, ceramic wafer or polyimide plate.
The present embodiment wafer-level lens module array include equally first mirror head array and the second lens array at least one of them, wherein, the first mirror head array is comprised of a plurality of the first camera lenses 230, the second lens array is comprised of a plurality of the second camera lenses 240.
Identical with embodiment one, in the present embodiment, this first mirror head array and/or this second lens array are made by photoresist.This first mirror head array and this second lens array are positioned at this through hole 221 positions of this through hole substrate 220.In the present embodiment, comprise smooth packed layer 270 between this first mirror head array and this second lens array, this smooth packed layer 270 is filled this through hole 221, utilizes this smooth packed layer 270 with the smooth filling of through hole 221, is conducive to the making of follow-up first mirror head array and the second lens array.Wherein the material of this smooth packed layer 270 can be also photoresist.It is identical that the structure of the present embodiment other parts and structure in embodiment one and embodiment two have more, for structure and the character thereof of other parts in the present embodiment, can reference example one and embodiment two in each structure and character.
Embodiment four
Please refer to Fig. 4, the wafer-level lens module array schematic diagram that Fig. 4 provides for the utility model embodiment four.The present embodiment wafer-level lens module array is identical with the most of structure of embodiment three wafer-level lens module arrays, difference only is, there is no the smooth packed layer 270 in embodiment three in the present embodiment, the first mirror head array that be comprised of a plurality of the first camera lenses 230 this moment and the second lens array that is comprised of a plurality of the second camera lenses are arranged in through hole 221 simultaneously, and both directly interconnect.It is identical that the structure of the present embodiment other parts and structure in embodiment one, embodiment two and embodiment three have more, for structure and the character thereof of other parts in the present embodiment, and can reference example one, each structure and character in embodiment two and embodiment three.
The utility model embodiment does not limit the first mirror head array and the second lens array links together with structure shown in Figure 4, the first mirror head array be connected lens array also can have one of them with on the contrary towards connection, perhaps both with on the contrary towards linking together.And the lens type of first mirror head array and the second lens array is not defined as the semi-convex lens shaped shown in Fig. 4 yet, can be half concavees lens shape or other lens shape yet.
Embodiment five
Please refer to Fig. 5, the wafer-level lens module array schematic diagram that Fig. 5 provides for the utility model embodiment five.The wafer-level lens module array of the present embodiment can be regarded the combination of embodiment one wafer-level lens module array and embodiment four wafer-level lens module arrays as.This wafer-level lens module array has comprised transparency carrier 110, through hole substrate 120 and through hole substrate 220 as seen from Figure 5.Be coated with the first mirror head array that is formed by a plurality of the first camera lenses 130 on the first surface (upper surface) of the transparency carrier 110 that through hole substrate 120 exposes, be coated with on the second surface of transparency carrier 110 by a plurality of the second camera lens 140 second lens arrays.Upper surface at transparency carrier also includes optical thin film 150, and it can be IR film and/or AR film.And in the through hole 221 of through hole substrate 220, include the first mirror head array that is formed by a plurality of the first camera lenses 230 and the second lens array that is formed by a plurality of the second camera lenses 240.In the present embodiment, each structure and character thereof can be in conjunction with structure and the contents of each wafer-level lens module array in reference example one to embodiment four.
Embodiment six
Please refer to Fig. 1 and Fig. 6 to Figure 10, the utility model embodiment six provides a kind of manufacture method of wafer-level lens module array, utilizes Fig. 6 to the final formation of each step shown in Figure 10 structure shown in Figure 1.
Please refer to Fig. 6, at first the present embodiment provides transparency carrier 110, and this transparency carrier 110 can include but not limited to it is transparent glass substrate or transparent resin substrate.This transparency carrier 110 has first surface and second surface, though do not mark in Fig. 6, in the present embodiment, the first surface that can be understood as transparency carrier 110 corresponds to its upper surface, and the second surface of transparency carrier 110 corresponds to its lower surface.As can see from Figure 6, the first surface of this transparency carrier 110 is coated with one deck optical thin film 150, and this optical thin film 150 can be IR film or AR film, or the lamination of IR film and AR film.
Please refer to Fig. 7, bonding has the through hole substrate 120 of a plurality of through holes 121 on these transparency carrier 110 first surfaces.Can bond with suitable binding agent, for example optical cement.This through hole substrate 120 includes but not limited to it is BT plate, glass plate, ceramic wafer or polyimide plate.What see in Fig. 7 is that through hole substrate 120 cuts along several through holes 121 cut-away view that forms, thereby seem to present each several part isolated shape mutually, but should be appreciated that, actual through hole substrate 120 is to offer the substrate of a plurality of separate through holes 121 on a whole substrate.As can be seen from Figure 7, this through hole 121 exposes the first surface of this transparency carrier 110, and after pasting, the part first surface that is exposed by through hole 121 of this transparency carrier 110 has formed the bottom of through hole 121.
Please refer to Fig. 8 and Fig. 9, Fig. 8 and Fig. 9 demonstrate the process at the interior formation first mirror of through hole 121 head array of through hole substrate 120 jointly.
As shown in Figure 8, this first mirror head array molding process comprises: at the interior making first mirror of through hole 121 head material layer 130 '.In the present embodiment, preferred, this first mirror head material layer 130 ' is the photoresist layer.Utility model people finds, can utilize the photoresist layer and make camera lens by existing semi-conductive technology, and this method both can be used for the scale of mass production of camera lens, saved again the energy and cost.Can form this first mirror head material layer 130 ' by including but not limited to physical vapour deposition (PVD) (PVD) method, chemical vapor deposition (CVD) method, mould coating (Die Coat) method, spin coated (Spin Coat) method, injection (Spray) method or silk screen print method.Form first mirror head material layer 130 ' afterwards, this first mirror head material layer 130 ' is exposed and develops, forming first mirror surface layer (not shown).When the interior making first mirror of through hole 121 head material layer 130 ', first mirror head material layer 130 ' may be to fill up whole through hole 121, even overflows through hole 121 parts.Then by exposure and developing process, the moderate and suitable first mirror surface layer that is used for making the first mirror head array of the height of formation.Certainly, also can be by controlling corresponding technological parameter, directly at the suitable first mirror surface layer of the interior formation of through hole 121.
As shown in Figure 9, after forming above-mentioned first mirror surface layer, then this first mirror surface layer is carried out the first camera lens moulding process, form a plurality of the first camera lenses 130, these a plurality of first camera lenses 130 namely form the first mirror head array.This first camera lens moulding process can include but not limited to it is Reflow Soldering (reflow) technique or gray mask technique, and this first camera lens moulding process can also be the combination of described two kinds of techniques.Gray mask technique includes multiple concrete technology, the present embodiment adopts intermediate tone mask (halftonemask) technique wherein, this intermediate tone mask technique comprises according to the structural parameters of target camera lens and face shape and designs and make the halftoning mask, recycle this mask the first mirror facing surface is contacted, approaches, then projection exposure.First mirror surface layer after exposure is developed, obtain shaggy micro relief profile, then to the micro relief profile surface carrying out high temperature hot melt Reflow Soldering (reflow) technique, thereby make the micro relief profile surface become level and smooth.Utilize above-mentioned technique disposablely to make even several thousand camera lenses of hundreds of on wafer, thereby the cost of each camera lens, and the good forming effect of camera lens.
As shown in figure 10, after the first mirror head array that completes, the present embodiment subsequent step continues to complete the making of the second lens array.It is included in and forms the second camera lens material layer 140 ' on the second surface of transparency carrier 110, as shown in figure 10.This second camera lens material layer 140 ' can be the photoresist layer equally.Can take to be similar to the identical step of above-mentioned technical process, this the second camera lens material layer 140 ' is carried out exposure imaging, form the second specular layer, this second specular layer is carried out the second camera lens moulding process, form a plurality of the second camera lenses 140, these a plurality of second camera lenses 140 namely form the second lens array.
Final the present embodiment forms as shown in Figure 1 wafer-level lens module array by above each step.Need to prove, the present embodiment is to take first to make the first mirror head array, then makes the mode of the second lens array, but in other embodiments, order can be turned around, namely first makes the second lens array, then makes the first mirror head array.
Embodiment seven
Please refer to Fig. 2 and Fig. 6 to Figure 10, the utility model embodiment seven provides a kind of manufacture method of wafer-level lens module array, utilizes to be similar to Fig. 6 to each step shown in Figure 10, finally forms structure shown in Figure 2.
The described method of the present embodiment is identical on many steps with the described method of above-described embodiment, and same section can be with reference to above-described embodiment,, the present embodiment repeats no more, and the present embodiment only is illustrated special part wherein.The present embodiment due to the structure that forms as shown in Figure 2, it is with structure difference in Fig. 1, the first mirror head array is formed in the aperture of through hole 121 and locates.Thereby to form this structure, must first form the first mirror head array that is formed by a plurality of the first camera lenses 130 the through hole 121 of through hole substrate 120 is interior, and then this through hole substrate sticking is gone to transparency carrier 110.
So the present embodiment adopts and forms separately respectively the first mirror head array that is positioned on through hole substrate 120 and form the second lens array that is positioned on transparency carrier 110.Namely on the one hand, at the interior formation first mirror of through hole substrate 120 head material layer 130 ', again this first mirror head material layer 130 ' is exposed and develops, form first mirror surface layer (not shown), then this first mirror surface layer is carried out first mirror head array moulding process and form a plurality of the first camera lenses 130, these a plurality of first camera lenses 130 form the first mirror head array; On the other hand, form the second camera lens material layer 140 ' on the second surface of transparency carrier 110, this the second camera lens material layer 140 ' is carried out exposure imaging, form the second specular layer (not shown), this second specular layer is carried out the second camera lens moulding process, form a plurality of the second camera lenses 140, these a plurality of second camera lenses 140 form the second lens array.The through hole substrate 120 that will be formed with at last the first mirror head array is bonded together with the transparency carrier 110 that is formed with the first mirror head array, forms structure as shown in Figure 2.
Embodiment eight
Please refer to Fig. 3 and Figure 11 to Figure 14, the utility model embodiment eight provides a kind of manufacture method of wafer-level lens module array, utilizes Figure 11 to the final formation of each step shown in Figure 14 structure shown in Figure 3.
At first the present embodiment provides that to have a plurality of through hole 221(through holes 221 only shown in Figure 4, in Fig. 3, through hole 221 is filled up by smooth packed layer 270, thereby through hole 221 can be with reference to figure 4) through hole substrate 220, embodiment before being similar to, this through hole substrate 220 can include but not limited to it is BT plate, glass plate, ceramic wafer or polyimide plate.Then can form respectively first mirror head array and the second lens array in this through hole 221 positions of this through hole substrate 220.Need to prove especially, in this specification, lead to the hole site has comprised the position, above and below of through hole inside and through hole.
Please refer to Figure 11, the present embodiment is before forming this first mirror head array and this second lens array, first form smooth packed layer 270 this through hole 221 is interior, form this smooth packed layer 270 and can be used for the smooth filling of through hole 221 with through hole substrate 220, be conducive to the making of follow-up first mirror head array and the second lens array.This smooth packed layer 270 can be to be made by photoresist equally, and can adopt multiple deposition process that this smooth packed layer 270 is formed in the through hole 221 of through hole substrate 220.
The present embodiment forms the first mirror head array that is comprised of a plurality of the first camera lenses 230 in these through hole 221 positions (the present embodiment refers to the upper surface at smooth packed layer 270).At first at these through hole 221 positions making first mirror head material layers 230 '.This first mirror head material layer 230 ' can be the photoresist layer.Then this first mirror head material layer 230 ' is carried out exposure imaging, form first mirror surface layer (not shown).At last this first mirror surface layer is carried out the first camera lens moulding process, form a plurality of the first camera lenses 230, these a plurality of first camera lenses 230 form the first mirror head array.This first camera lens moulding process comprises reflow soldering process or gray mask technique, but this step reference example six and embodiment seven corresponding contents.Simultaneously, the surface of this first mirror head array can cover IR film and/or AR film (not shown).
Similarly, form in these through hole 221 positions (the present embodiment refers to the lower surface at smooth packed layer 270) the second lens array that is formed by a plurality of the second camera lenses 240.At first at these through hole 221 positions making the second camera lens material layers 240 '.This second camera lens material layer 240 ' can be the photoresist layer equally.Then this second camera lens material layer 240 ' is carried out exposure imaging, form the second specular layer (not shown).At last this second specular layer is carried out the second camera lens moulding process, form a plurality of the second camera lenses 240, these a plurality of second camera lenses 240 form the second lens array.Same, this second camera lens moulding process comprises reflow soldering process or gray mask technique, but so the same reference example six of this step and embodiment seven corresponding contents.Similarly, the surface coverage IR film of this second lens array and/or AR film (not shown).
Embodiment nine
Please refer to Fig. 4 and Figure 11 to Figure 14, the utility model embodiment nine provides a kind of manufacture method of wafer-level lens module array, utilizes to be similar to Figure 11 to each step (incomplete same) shown in Figure 14, finally forms structure shown in Figure 4.
In the present embodiment, do not form smooth packed layer 270, but directly form the first mirror head array that is formed by a plurality of the first camera lenses 230 and the second lens array that is formed by a plurality of the second camera lenses 240 in the through hole 221 of through hole substrate 220.Each step of the present embodiment has eight something in common with embodiment more, but thereby related content reference example eight, this specification does not repeat them here.
Embodiment ten
The utility model embodiment ten provides the manufacture method of a kind of wafer-level lens module array combination, please in conjunction with reference to figure 5 to Figure 14.The present embodiment comprises provides the first wafer-level lens module array of being made by embodiment six or embodiment seven manufacture methods and the second wafer-level lens module array of being made by embodiment eight or embodiment nine manufacture methods, and this first wafer-level lens module array and the combination of this second wafer-level lens module array are produced on together.Wherein, the second wafer-level lens module array as shown in Figure 4 (that is the wafer-level lens module array in the embodiment four) combination that forms as the first wafer-level lens module array as shown in Figure 1 (that is the wafer-level lens module array in embodiment one) and embodiment nine with embodiment six formation is produced on together, namely forms combination wafer-level lens module array combination (that is the wafer-level lens module array in embodiment five) as shown in Figure 5.
In the utility model embodiment, other compound mode can obtain other combination wafer-level lens module array combination (not shown), concrete combining structure can be carried out independent assortment with reference to each wafer-level lens module array in each embodiment more than this specification, gives unnecessary details no longer one by one at this.
In this specification, various piece adopts the mode of going forward one by one to describe, and what each part stressed is and the difference of other parts that between various piece, identical similar part is mutually referring to getting final product.The above is only specific embodiment of the utility model; purpose is in order to make those skilled in the art better understand spirit of the present utility model; yet protection range of the present utility model is not take the specific descriptions of this specific embodiment as limited range; any those skilled in the art is in the scope that does not break away from the utility model spirit; can make an amendment specific embodiment of the utility model, and not break away from protection range of the present utility model.
Claims (13)
1. a wafer-level lens module array, is characterized in that, comprising:
Transparency carrier has first surface and second surface;
The through hole substrate is positioned at the described first surface of described transparency carrier, and described through hole substrate comprises a plurality of through holes, and described through hole exposes the described first surface of part of described transparency carrier;
Described wafer-level lens module array also comprise in first mirror head array and the second lens array at least one of them, wherein, described first mirror head array is positioned at the described lead to the hole site of described through hole substrate, and described the second lens array is positioned at the second surface of described transparency carrier.
2. wafer-level lens module array as claimed in claim 1, is characterized in that, described first mirror head array is positioned at the described first surface of the described transparency carrier of part that described through hole exposes.
3. wafer-level lens module array as claimed in claim 1, is characterized in that, described first mirror head array is positioned at the place, aperture of described through hole.
4. wafer-level lens module array as claimed in claim 1, is characterized in that, in the first surface or second surface of described transparency carrier, is coated with optical thin film at least one surface.
5. wafer-level lens module array as claimed in claim 4, is characterized in that, described optical thin film comprises IR film and/or AR film.
6. wafer-level lens module array as claimed in claim 1, is characterized in that, described first mirror head array and/or described the second lens array are made by photoresist.
7. wafer-level lens module array as claimed in claim 1, is characterized in that, described transparency carrier comprises transparent glass substrate or transparent resin substrate.
8. wafer-level lens module array as claimed in claim 1, is characterized in that, described through hole substrate is BT plate, glass plate, ceramic wafer or polyimide plate.
9. a wafer-level lens module array, is characterized in that, comprising:
The through hole substrate, described through hole substrate comprises a plurality of through holes;
Lens array, described lens array are positioned at the described lead to the hole site of described through hole substrate.
10. wafer-level lens module array as claimed in claim 9, it is characterized in that, described lens array comprises first mirror head array and the second lens array, comprises smooth packed layer between described first mirror head array and described the second lens array, and described smooth packed layer is filled described through hole.
11. wafer-level lens module array as claimed in claim 9 is characterized in that, described lens array comprises first mirror head array and the second lens array, and described first mirror head array and/or described the second lens array are made by photoresist.
12. wafer-level lens module array as claimed in claim 11 is characterized in that, described through hole substrate is BT plate, glass plate, ceramic wafer or polyimide plate.
13. a wafer-level lens module array combination is characterized in that, comprising:
Mutual stacked wafer-level lens module array as described in claim 1 to 8 any one and wafer-level lens module array as described in claim 9 to 12 any one.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220743207 CN203013727U (en) | 2012-12-28 | 2012-12-28 | Wafer-Level Lens module array and array combination |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220743207 CN203013727U (en) | 2012-12-28 | 2012-12-28 | Wafer-Level Lens module array and array combination |
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| CN203013727U true CN203013727U (en) | 2013-06-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020010641A1 (en) * | 2018-07-12 | 2020-01-16 | 安徽省东超科技有限公司 | Processing method for multi-row, multi-column flat lens with equivalent negative refractive index |
-
2012
- 2012-12-28 CN CN 201220743207 patent/CN203013727U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020010641A1 (en) * | 2018-07-12 | 2020-01-16 | 安徽省东超科技有限公司 | Processing method for multi-row, multi-column flat lens with equivalent negative refractive index |
| US11092888B2 (en) | 2018-07-12 | 2021-08-17 | Anhui Dongchao Science And Tech Company Limited | Processing method for multi-row, multi-column flat lens with equivalent negative refractive index |
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