CN202952160U

CN202952160U - Chemical-mechanical polishing finisher

Info

Publication number: CN202952160U
Application number: CN 201220680068
Authority: CN
Inventors: 唐强
Original assignee: Semiconductor Manufacturing International Beijing Corp
Current assignee: Semiconductor Manufacturing International Beijing Corp
Priority date: 2012-12-11
Filing date: 2012-12-11
Publication date: 2013-05-29
Anticipated expiration: 2022-12-11

Abstract

The utility model provides a chemical-mechanical polishing finisher. The finisher at least comprises a disc and abrasive particles arranged on the disc, wherein the abrasive particles are arranged on the disc at intervals; the abrasive particles respectively protrude out of the surface of the disc with different preset heights; and the abrasive particles are diamond particles. According to the chemical-mechanical polishing finisher, since the large and small diamond particles are arranged on the disc at intervals, the disc hardware structure is optimized, so that the diamond particles hardly fall off or are fractured in the polishing process, the service life of the finisher is prolonged, the dirt removal rate is enhanced, the chip is prevented from being scraped, and the chip yield is increased. The chemical-mechanical polishing finisher is simple in structure, convenient to operate and suitable for industrial production.

Description

A kind of chemically mechanical polishing trimmer

Technical field

The utility model relates to a kind of field of semiconductor manufacture, particularly relates to a kind of chemically mechanical polishing trimmer.

Background technology

In semiconductor process flow, chemically mechanical polishing (Chemical Mechanical Polishing, CMP) is a very important procedure, sometimes also is referred to as chemical-mechanical planarization (Chemical Mechanical Planarization, CMP).So-called chemically mechanical polishing, it is to adopt chemistry and mechanical integrated effect to remove excess stock from semi-conductor silicon chip, and makes it obtain the technical process of flat surfaces.Specifically, this finishing method normally is pressed on chip on the polishing pad of one High Rotation Speed, and reaches the purpose of planarization under the effect of the polishing slurries that includes chemical polishing agent and abrasive grains by polishing pad and the phase mutual friction of wafer.In view of this, the quality of pad interface performance directly can affect the quality of polishing.In CMP process, the polishing slurries of the polished chip got off and pad interface can be inserted in polishing pad at leisure, and the time one is long, and pad interface will be hardened shinny, form glaze, become and skid, and can't carry out polishing again.Thereby, be requisite step in glossing to the maintenance of pad interface, otherwise can affect the quality of wafer polishing.

Traditional chemical mechanical polishing dresser as shown in Figure 1, for pad interface is carried out to the reconditioning adjustment.This trimmer is a rotating circular disk 1A, be fixed with the superabrasive particles 2A--diamond of size homogeneous on its surface, with this disk with diamond particles, 1A carries out the mechanical type friction combing to pad interface, chip on polishing pad is removed, thereby made polishing pad recover good polishing performance.But due to adamantine fragility, in friction process, diamond is subject to very large active force, be easy to rupture or drop on polishing pad from disk 1A, as shown in Figure 2, so not only shortened the life-span of trimmer, also will cause the scratch of wafer, reduce the productive rate of wafer, increase cost payout.

Therefore, providing a kind of modified chemically mechanical polishing trimmer is the problem that those skilled in the art need to solve.

The utility model content

The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of chemically mechanical polishing trimmer, for solving on prior art chemically mechanical polishing trimmer that diamond particles is easy to come off or the problem such as fracture, polishing pad spreading mass clearance be low.

Reach for achieving the above object other relevant purposes, the utility model provides a kind of chemically mechanical polishing trimmer, and described trimmer at least comprises: disk and be arranged at the abrasive grain on disk; Described abrasive grain is distributed in distance on disk; Described abrasive grain protrudes respectively the surface of described disk with different predetermined altitudes.

Preferably, described trimmer also comprises and being connected with described disk and for the power arm of described disk motion active force is provided.

Preferably, be provided with for accommodating described abrasive grain on described disk and there is the grid of predetermined pattern.

Preferably, described predetermined pattern is circular.

Preferably, described abrasive grain has the cusp of disk dorsad.

Preferably, described abrasive grain is fixed on disk with welding manner.

Preferably, the centre distance between described abrasive grain is 4 ~ 6 μ m.

Preferably, described abrasive grain comprises large abrasive grain and little abrasive grain, and the size range of described large abrasive grain is 7 ~ 9 μ m; The size range of described little abrasive grain is 5 ~ 7 μ m; The predetermined altitude of described large abrasive grain is 2 ~ 2.5mm; The predetermined altitude of described little abrasive grain is 1.5 ~ 2mm.

Preferably, described abrasive grain is diamond particles.

Preferably, described disc material is stainless steel.

As mentioned above, chemically mechanical polishing trimmer of the present utility model, there is following beneficial effect: by the big or small diamond particles on disk, be spaced design, optimize the disk hardware configuration, made diamond particles difficult drop-off or fracture in polishing process, extended the life-span of trimmer, strengthen the clearance of dirt, and avoid the wafer scratch, increase the productive rate of wafer, reduce cost payout.

The accompanying drawing explanation

Fig. 1 is shown as the schematic diagram of traditional chemically mechanical polishing trimmer.

Fig. 2 is shown as the schematic diagram after the diamond particle detachment is divided on traditional chemically mechanical polishing trimmer top.

Fig. 3 is shown as the disk schematic diagram of the utility model chemically mechanical polishing trimmer

Fig. 4 is shown as the diamond particles distribution schematic diagram of the utility model chemically mechanical polishing trimmer.

Fig. 5 is shown as the utility model chemically mechanical polishing trimmer work schematic diagram.

The element numbers explanation

The specific embodiment

Below by particular specific embodiment, embodiment of the present utility model is described, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this specification.

Refer to Fig. 3 to Fig. 5.Notice, appended graphic the illustrated structure of this specification, ratio, size etc., equal contents in order to coordinate specification to disclose only, understand and read for person skilled in the art scholar, not in order to limit the enforceable qualifications of the utility model, therefore the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under the effect that the utility model can produce and the purpose that can reach, all should still drop on the technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, in this specification, quote as " on ", D score, " left side ", " right side ", " centre " reach the term of " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under without essence change technology contents, when also being considered as the enforceable category of the utility model.

As shown in Figure 4, the utility model provides a kind of chemically mechanical polishing trimmer, and described trimmer at least comprises: disk 1 and abrasive grain 2.

Be provided with for accommodating abrasive grain 2 on described disk 1 and have the grid 11 of predetermined pattern, as shown in Figure 3, the shape of described predetermined pattern is determined according to the shape of accommodating abrasive grain 2, preferred, and described predetermined pattern be circle.Described disk 1 has upper surface and the lower surface corresponding with described upper surface.Wherein, grid 11 is the lower surfaces in described disk, and grid 11 spacings are predefined for the distances that can make 2 required intervals of generation of abrasive grain.

Described disk 1 is made by metal material.In the present embodiment, the material of described disk 1 is stainless steel.

Described abrasive grain 2 is arranged on described disk 1.As a kind of preferred structure, described abrasive grain 2 is arranged in the grid 11 on disk 1.Further, described abrasive grain 2 is fixed in the grid 11 on disk 1 in the mode of welding, and certainly, the mode of fixed-abrasive particle 2 is not limited to welding, comprises that any abrasive grain 2 that can make firmly adheres to the fixed form on disk 1.

Further, described abrasive grain 2 is distributed in distance on disk 1, as shown in Figure 4.As the structure of an optimization of the present utility model, abrasive grain 2 is divided into to large abrasive grain 21 and little abrasive grain 22, the size range of described large abrasive grain 21 is 7 ~ 9 μ m, the size range of little abrasive grain 22 is 5 ~ 7 μ m.

After the grid 11 of making required size on disk 1, the big or small abrasive grain 2 sorted can be filled in each grid 11, more preferably, each grid 11 only can hold an abrasive grain 2, and the centre distance between described abrasive grain 2 is 4 ~ 6 μ m.As shown in Figure 5, these abrasive grains 2 protrude respectively the surface of described disk 1 with different predetermined altitudes, and the predetermined altitude that described large abrasive grain 21 protrudes disc surfaces is 2 ~ 2.5mm, and the predetermined altitude of little abrasive grain 22 is 1.5 ~ 2mm.

It should be noted that, described abrasive grain 2 comprises any shape, and as the present embodiment preferred embodiment, abrasive grain 2 has the cusp of disk 1 dorsad, so that more effectively to the pad interface adjustment that places under repair.Described abrasive grain 2 is superhard material, and preferably, described abrasive grain 2 is diamond particles.

Described trimmer also comprises a power arm 3, and described power arm 3 is connected with aforementioned disk 1 and, for the active force of disk 1 motion is provided, power arm 3 is positioned at the upper surface of disk 1, as shown in Figure 5.

As a kind of structure of more optimizing, can apply on the surface of diamond particles an anticorrosive coat (diagram), for preventing diamond surface, to be polluted, easy to clean, extend adamantine service life.

In order to describe the working effect of chemically mechanical polishing trimmer of the present utility model in detail, refer again to Fig. 5.Disk 1 is pressed on eligible for repair polishing pad 4, makes diamond abrasive grains 2 and polishing pad 4 close contacts, described polishing pad 4 has groove 41, carries out the mud 5 of polishing wafer and the surface that dirt is packed in described groove 41 and polishing pad 4 in glossing.Trimmer of the present utility model has two kinds of diamond abrasive grains of size 2 to be arranged, and king kong stone mill material particle 21 has higher protrusion height, can stretch in the groove 41 of polishing pad 4, clears up better the mud 5 in groove 41; 22 of little diamond abrasive grains have lower protrusion height, can be used for the mud on combing polishing pad 4 surfaces, thereby make the mud of pad interface evenly smooth, and then reach mud clearance preferably.In addition, the two-layer diamond lattic structure of height is more firm, makes diamond difficult drop-off or fracture in the whole process of cleaning.

In sum, the utility model provides a kind of chemically mechanical polishing trimmer, this chemically mechanical polishing trimmer is by the design that is spaced of the big or small diamond particles on disk, optimize the disk hardware configuration, made diamond particles difficult drop-off or fracture in polishing process, extended the life-span of trimmer, strengthen the clearance of dirt, and avoid the wafer scratch, increase the productive rate of wafer, reduce cost payout.This chemically mechanical polishing trimmer is simple in structure, easy to operate, is applicable to suitability for industrialized production.

So the utility model has effectively overcome various shortcoming of the prior art and the tool high industrial utilization.

Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, be modified or be changed above-described embodiment.Therefore, have in technical field under such as and usually know that the knowledgeable modifies or changes not breaking away from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.

Claims

1. a chemically mechanical polishing trimmer, is characterized in that, described trimmer at least comprises: disk and be arranged at the abrasive grain on disk; Described abrasive grain is distributed in distance on disk; Described abrasive grain protrudes respectively the surface of described disk with different predetermined altitudes.

2. chemically mechanical polishing trimmer according to claim 1 is characterized in that: described trimmer also comprises and being connected with described disk and for the power arm of described disk motion active force is provided.

3. chemically mechanical polishing trimmer according to claim 1 is characterized in that: be provided with for accommodating described abrasive grain on described disk and have the grid of predetermined pattern.

4. chemically mechanical polishing trimmer according to claim 2 is characterized in that: described predetermined pattern is for circular.

5. chemically mechanical polishing trimmer according to claim 1, it is characterized in that: described abrasive grain has the cusp of disk dorsad.

6. according to the described chemically mechanical polishing trimmer of claim 1 or 4, it is characterized in that: described abrasive grain is fixed on disk with welding manner.

7. the chemically mechanical polishing trimmer of stating according to claim 5 is characterized in that: the centre distance between described abrasive grain is 4 ~ 6 μ m.

8. chemically mechanical polishing trimmer according to claim 1, it is characterized in that: described abrasive grain comprises large abrasive grain and little abrasive grain, the size range of described large abrasive grain is 7 ~ 9 μ m; The size range of described little abrasive grain is 5 ~ 7 μ m; The predetermined altitude of described large abrasive grain is 2 ~ 2.5mm; The predetermined altitude of described little abrasive grain is 1.5 ~ 2mm.

9. chemically mechanical polishing trimmer according to claim 1, it is characterized in that: described abrasive grain is diamond particles.

10. chemically mechanical polishing trimmer according to claim 1, it is characterized in that: described disc material is stainless steel.