CN202888233U - Chip-type LED - Google Patents
Chip-type LED Download PDFInfo
- Publication number
- CN202888233U CN202888233U CN2012205250885U CN201220525088U CN202888233U CN 202888233 U CN202888233 U CN 202888233U CN 2012205250885 U CN2012205250885 U CN 2012205250885U CN 201220525088 U CN201220525088 U CN 201220525088U CN 202888233 U CN202888233 U CN 202888233U
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- CN
- China
- Prior art keywords
- annular
- chip
- insulated substrate
- groove
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a chip-type LED, comprising an annular insulating substrate, a chip, a seal lens and a heat-dissipating plate. The bottom of the annular insulating substrate is provided with an annular groove. The central part of the annular insulating substrate is provided with annular through hole. The edge part of the top of the annular insulating substrate is provided with a groove in a circle. Positive and negative electrode plates are arranged on the annular insulating substrate between the groove and the annular through hole. A white reflective membrane is arranged on the surface of the annular insulating substrate surrounding the positive and negative electrode plates. The heat-dissipating plate is attached in the annular groove. The central part of the heat-dissipating plate is protruded in the annular groove and is located in the same level as the annular insulating substrate. The chip is welded on the protruded heat-dissipating plate. A fluorescent glue surface is arranged on a light-emitting surface of the chip. The chip is connected with the positive and negative electrode plates via lead wires, respectively. The seal lens is buckled in the groove, in a circle, of the edge part of the annular insulating substrate and is sealedly connected together with the groove via sealants. The chip-type LED of the utility model is simple in structure and good in heat-dissipating performance, and white lights that are emitted by the LED are uniform.
Description
Technical field
The utility model relates to the LED lighting technical field, particularly relates to a kind of chip-type LED.
Background technology
At present, along with the development of lighting technology, shortcoming is replaced by the LED lamp traditional incandescent lamp just gradually because highly energy-consuming, photoelectric conversion rate be low etc., compares with traditional incandescent lamp, the LED light fixture has that energy consumption is little, spotlight effect is good, reaction speed is fast, long service life, the characteristics such as environmental protection.
But, along with LED is more and more extensive in the application of lighting field, heat dissipation problem is perplexing the LED lighting technical field always, the LED lamp dispels the heat and can cause serious light decay or electrically bad when bad, and dead lamp phenomenon, and chip surface is because the lack of homogeneity of fluorescent material, and the white light that has caused LED to send is inhomogeneous.
Also there is complex structure in existing LED lamp, the problem that parts are many.
The utility model content
For solving the problems of the technologies described above, the utility model provides a kind of white light simple in structure, that thermal diffusivity good, LED sends uniform chip-type LED.
Chip-type LED of the present utility model, comprise annular insulated substrate, chip and sealing lens, also comprise heating panel, the bottom of described annular insulated substrate is provided with annular groove, the middle part of annular insulated substrate is provided with annular through-hole, the edge part at annular insulated substrate top is provided with a circle groove, annular insulated substrate between described groove and annular through-hole just is provided with, negative electrode plate, just described, the surface of the annular insulated substrate around the negative electrode plate is provided with the white reflection film, described heating panel fits in the annular groove, and the middle part of heating panel protruding in annular groove with annular insulated substrate level, described chips welding is on the heating panel that protrudes, the light-emitting area of chip is provided with the fluorescent glue face, chip respectively will be just by wire, negative electrode plate connects, described sealing lens are fastened in the circle groove of annular insulated substrate edge part, are connected together by sealant sealing.
Further, described positive and negative electrode plate passes the bottom that annular insulated substrate extends annular insulated substrate.
Further, be welded with chip piece on the heating panel of described protrusion.
Compared with prior art the beneficial effects of the utility model are:
Chip-type LED of the present utility model, by being set, heating panel solved the bad problem of dispelling the heat in the annular groove of annular insulated substrate, by the fluorescent glue face is set at chip, solved traditional sprayed with fluorescent powder that passes through, and sprayed with fluorescent powder can't guarantee that spraying evenly, finally affect the inhomogeneous problem of white light that LED sends, by the edge part at annular insulated substrate top one circle groove is set, the edge part of sealing lens is connected with groove, reduced the ring apron that is used for connecting the sealing lens, simple in structure.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail.Following examples are used for explanation the utility model, but are not used for limiting scope of the present utility model.
As shown in Figure 1, a kind of chip-type LED comprises annular insulated substrate 1, chip 2, sealing lens 3, heating panel 4, positive electrode plate 5, negative electrode plate 6 and fluorescent glue face 7;
The bottom of annular insulated substrate 1 is provided with annular groove 11, the middle part of annular insulated substrate 1 is provided with annular through-hole 12, the edge part at annular insulated substrate 1 top is provided with a circle groove 13, annular insulated substrate between groove 13 and annular through-hole 12 is respectively equipped with positive electrode plate 5 and negative electrode plate 6, the surface of the annular insulated substrate 1 around positive electrode plate 5 and negative electrode plate 6 is provided with white reflection film 8, white reflection film 8 can reflect away the light that chip 2 sends, to reduce the waste of light;
Heating panel 4 fits in the annular groove 11, and the middle part of heating panel 4 protruding in annular groove 11 with annular insulated substrate 4 levels, chip 2 is welded on the heating panel 4 of protrusion, the light-emitting area of chip 2 is fitted with fluorescent glue face 7, chip 2 is connected positive electrode plate 5 respectively connection by wire 9 with negative electrode plate, sealing lens 3 are fastened in the circle groove 13 of annular insulated substrate 1 edge part, are connected together by sealant sealing;
Chip-type LED of the present utility model is welded with chip piece 2 on the heating panel 4.
Chip-type LED of the present utility model, solved the bad problem of dispelling the heat by the annular groove 11 interior heating panels 4 that arrange at annular insulated substrate 1, by at chip 2 fluorescent glue face 7 being set, solved traditional sprayed with fluorescent powder that passes through, and sprayed with fluorescent powder can't guarantee that spraying evenly, finally affect the inhomogeneous problem of white light that LED sends, by the edge part at annular insulated substrate 1 top one circle groove 13 is set, the edge part of sealing lens 3 is connected with a circle groove 13 of annular insulated substrate 1 edge part, reduced the ring apron that is used for connecting sealing lens 3, simple in structure.
The above only is preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvement and modification, these improve and modification also should be considered as protection range of the present utility model.
Claims (3)
1. chip-type LED, comprise annular insulated substrate, chip and sealing lens, it is characterized in that: also comprise heating panel, the bottom of described annular insulated substrate is provided with annular groove, the middle part of annular insulated substrate is provided with annular through-hole, the edge part at annular insulated substrate top is provided with a circle groove, annular insulated substrate between described groove and annular through-hole just is provided with, negative electrode plate, just described, the surface of the annular insulated substrate around the negative electrode plate is provided with the white reflection film, described heating panel fits in the annular groove, and the middle part of heating panel protruding in annular groove with annular insulated substrate level, described chips welding is on the heating panel that protrudes, the light-emitting area of chip is provided with the fluorescent glue face, chip respectively will be just by wire, negative electrode plate connects, described sealing lens are fastened in the circle groove of annular insulated substrate edge part, are connected together by sealant sealing.
2. chip-type LED as claimed in claim 1, it is characterized in that: described positive and negative electrode plate passes the bottom that annular insulated substrate extends annular insulated substrate.
3. chip-type LED as claimed in claim 2 is characterized in that: be welded with chip piece on the heating panel of described protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205250885U CN202888233U (en) | 2012-10-15 | 2012-10-15 | Chip-type LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205250885U CN202888233U (en) | 2012-10-15 | 2012-10-15 | Chip-type LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202888233U true CN202888233U (en) | 2013-04-17 |
Family
ID=48079628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012205250885U Expired - Fee Related CN202888233U (en) | 2012-10-15 | 2012-10-15 | Chip-type LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202888233U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103247742A (en) * | 2013-04-22 | 2013-08-14 | 广州有色金属研究院 | LED heat radiation substrate and manufacturing method thereof |
| CN103390714A (en) * | 2013-07-10 | 2013-11-13 | 陕西光电科技有限公司 | Integral type LED (Light Emitting Diode) encapsulation structure and method |
| CN103489993A (en) * | 2013-10-10 | 2014-01-01 | 晶科电子（广州）有限公司 | High-reliability flip LED light source and LED module light source |
-
2012
- 2012-10-15 CN CN2012205250885U patent/CN202888233U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103247742A (en) * | 2013-04-22 | 2013-08-14 | 广州有色金属研究院 | LED heat radiation substrate and manufacturing method thereof |
| CN103390714A (en) * | 2013-07-10 | 2013-11-13 | 陕西光电科技有限公司 | Integral type LED (Light Emitting Diode) encapsulation structure and method |
| CN103390714B (en) * | 2013-07-10 | 2015-10-28 | 陕西光电科技有限公司 | A kind of all-in-one-piece LED encapsulation structure and method for packing |
| CN103489993A (en) * | 2013-10-10 | 2014-01-01 | 晶科电子（广州）有限公司 | High-reliability flip LED light source and LED module light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20141204 Granted publication date: 20130417 |
|
| RINS | Preservation of patent right or utility model and its discharge | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20150604 Granted publication date: 20130417 |
|
| RINS | Preservation of patent right or utility model and its discharge | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20141015 |
|
| EXPY | Termination of patent right or utility model |