CN202884548U - Light source - Google Patents

Abstract

The utility model discloses a light source which comprises a radiator, a base shell body, an integral lighting module, a light-emitting diode (LED) on a base board and an electronic driving circuit, wherein the radiator is provided with an installation area and a cooling fin, the base shell is provided with an inner cavity and connected with the radiator in a coupling mode, and the integral lighting module comprises a printed circuit board. The LED on the base board is connected with the printed circuit board in a first horizontal area of the printed circuit board in a coupling mode, and the electronic driving circuit is used for providing electric power for the LED and connected with the printed circuit board in a second horizontal area of the printed circuit board in a coupling mode. The bottom face of the base board is thermally coupled to the installation area of the radiator, and the second horizontal area of the integral lighting module is arranged in an inner cavity of the base shell body. According to the light source, light output can be improved under the condition that cost or size of a device are not increased, a plurality of bean angles can be covered, and products with long service life and high reliability can be provided.

Description

Light source

Technical field

The utility model relates to lighting apparatus.More specifically, the utility model relates to high efficiency light source.

Background technology

The epoch of Edison's vacuum filament lamp close to an end soon.In many countries and many states, ordinary incandescent lamp is just becoming and is not conforming to the rules, and requires to use more effective light source.Some alternative source of light comprise fluorescent lamp, Halogen lamp LED and light emitting diode (LED) at present.Although these other select available and efficient is improved, many people alternative source of light of still being unwilling to use instead.

The inventor thinks that the main cause of not active adoption of user new technology has several.Such reason is that light source has used noxious material.For example, fluorescence light source relies on the mercury generating of vapor form usually.Because mercuryvapour is regarded as dangerous material, so useless lamp can not arbitrarily be discarded in the roadside, and must be transported to the hazardous waste processing field of appointment.In addition, some fluorescent lamp manufacturer instructs the user to avoid the sensitizing range (for example bedroom, kitchen etc.) in the house to use this bulb unexpectedly.

The inventor thinks that also the Another reason of not active adoption alternative source of light is, compares with incandescent lamp, and the performance of alternative source of light is lower.For example, fluorescence light source relies on independent starter or ballast mechanism to start illumination usually.Thus, fluorescent lamp can not and require ground " moment " to open such as user's expectation sometimes.In addition, fluorescent lamp can not provide the light of full brightness usually immediately, but usually rises to full brightness within a period of time (for example 30 seconds).In addition, most of fluorescent lamps are frangible, can not carry out light modulation, have the ballast transformer that sends tedious noise, and if frequently open or close at short notice and will break down.Thus, fluorescent lamp does not have the performance of customer requirements.

Not long ago the another kind of alternative source of light that proposes relies on uses light emitting diode (LED).Relative fluorescence lamp, the advantage of LED comprise robustness and the reliability that solid-state device is intrinsic, are not contained in d/d toxic chemical substance in unexpected breakage or the processing procedure, and moment starts ability, tunable optical, and noiselessness.Yet the inventor thinks that just there is the huge shortcoming that allows the user be unwilling to use in current led light source itself.

The significant drawbacks of current led light source is that light output (for example lumen) is relatively low.Although the amount of the power that current led light source extracts significantly is lower than its incandescent counterpart (for example 5-10 watt to 50 watts), it is believed that these light sources are too dark and can not be used as principal light source.For example, 5 watts of LED lamps of typical MR16 form factor can provide the 200-300 lumen, and 50 watts of incandescent lamps of typical identical shaped factor can provide the 700-1000 lumen.Therefore, current LED only is used for outside accent light, secret room, basement, shed or other little spaces usually.

Another shortcoming of current led light source comprises that the front-end fee of LED concerning the user is usually amazingly high.For example, for floodlight, the retail price of the LED lamp of current 30 watts of equivalences is more than 60 dollars, and the retail price of typical incandescent floodlight is 12 dollars.Although the user consumes less power by LED reasoningly and remedies difference on the service life of LED, the inventor thinks that obvious higher price has suppressed user's demand to a great extent.Thus, current led light source does not have price or the performance of user's expectation and requirement.

Other shortcomings of current led light source comprise that these light sources have a plurality of parts, and producing can a large amount of manpower of cost.For example, a manufacturer of MR16 led light source utilizes the parts (not comprising electronic chip) more than 14, and another manufacturer of MR16 led light source utilizes the parts more than 60.Inventor of the present utility model think these Computer-Assisted Design, Manufacture And Test techniques and part still less, manufacturing process more the Computer-Assisted Design, Manufacture And Test of Modular LED device compare more complicated and more consuming time.

Other shortcomings of current led light source are that the radiator volume has limited output performance.More specifically, the inventor thinks, for replace led light source (for example MR16 light source), the heat that current radiator can not dissipate in large quantities and be produced by LED in the free convection situation.In many application, the LED lamp is put into the shell (for example concave crown canopy) that ambient air temperature has surpassed 50 degrees centigrade.Under this temperature, the emissivity on surface only plays the effect of very little heat radiation.In addition, because conditional electronic package technique and LED reliability factor are 85 degrees centigrade with the temperature limiting of pcb board, so the power stage of LED also is restricted to a great extent.Under higher temperature, the inventor finds that radiation plays prior effect, and therefore concerning radiator, high emissivity is expected.

Traditionally, output improves by the quantity that increases simply LED from the light of led light source, and this has caused installation cost to increase and the device size increases.In addition, this light once had limited beam angle and limited output.

Therefore, expectation is a kind of high efficiency light source that does not have above-mentioned shortcoming.

The utility model content

The utility model relates to high efficiency light source.More specifically, the utility model relates to a kind of led light source and manufacture method thereof of novelty.Some overall goals comprise, the high reliability product (ROI) that improve light output in the situation that does not increase installation cost or plant bulk, can cover a plurality of beam angles and the long life is provided.

Each embodiment of the present utility model comprises a kind of modularized light source of novelty.More specifically, each embodiment comprises MR16 form factor light source.Lighting module comprises 20 to 110 LED on the end face that in series is arranged in heat-conducting substrate (for example silicon substrate).The end face of silicon substrate is welded in the first of flexible printed circuit substrate (FPC).The underrun hot epoxy resin of thermal conductive silicon substrate physically is bonded to the recess of MR16 form factor radiator.In each embodiment, electric driver part is welded on the second portion of FPC, and the second portion of FPC is inserted in the inner chamber of heat conduction plug base.Then potting compound is injected in the cavity of plug base in a step and is injected into the recess of radiator.The heat that potting compound allows silicon substrate and electric driver part to produce is passed to radiator or heat conduction plug base.Then lens are fixed to radiator.

In one embodiment, electric drive part/module is higher dc voltage with input power from 12 volts of AC voltage transitions, for example 40 volts, 120 volts.So drive part drives lighting module with higher voltage, and lighting module is luminous.Utilize lens that light is adjusted to the illumination of desired type, for example spotlighting, floodlighting etc.At work, driver module and lighting module produce heat, and the heat of generation is dissipated by MR16 form factor radiator.Under stable state, these modules can be worked in being roughly 75 ℃ to 130 ℃ scope.

In each embodiment of the present utility model, MR16 form factor radiator is very beneficial for the dissipation of heat.Radiator comprises inner core (inner core), and the diameter of described inner core is less than half of the external diameter of radiator.In each embodiment, inner core is less than 1/3rd, 1/4th and 1/5th of external diameter.The silicon substrate of LED directly is bonded to the inner core district by hot epoxy resin.

In each embodiment, because the diameter of inner core is more much smaller than external diameter, so a large amount of fin (heat dissipating fin) can be set.The inventor has developed and has studied multiple Structure of radiating fin.Typical Structure of radiating fin comprises a plurality of radial air-cooling fins " trunk (trunk) " that extend from inner core.In certain embodiments, the quantity of trunk is 8 to 35.Place, end at each trunk arranges the two or more fin " branch (branch) " with " U " branch shape.In each embodiment, the place, end in each branch arranges equally the two or more fin " sub-branch " with " U " branch shape.In each embodiment, the fin thickness of the comparable branch of fin thickness of trunk is thick, and the fin thickness of the comparable sub-branch of fin thickness of branch is thick etc.Thereby carefully design the amount, air-flow and the surface area that flow to the heat of external diameter from inner core, greatly to improve heat-sinking capability.

Other aspects of each embodiment comprise: be convenient to a large amount of simplified construction of making, be used for removing manual wiring flexible interconnect, be used for realizing the modular member structure of parallel processing.Other features comprise the heat management aspect: the air-flow at the core that fin branching algorithm, cross section reduce, lens rear, single hot interface, directly wafer is set up, flexible print circuit, the base profile that pouring material minimizes, recessed front, the air-flow of guaranteeing cover; Low cost fabrication: the locking binding characteristic of flexible print circuit interconnection (major part and insert), flexible circuit lamp chip insert, redundancy etc.Other aspects comprise: obtain that the high-temperature operation of the led array of intensive encapsulation, higher part reliability, significantly heat radiation, maximized surface are long-pending, the minimum length hot path in the maximum airflow, minimum thermal interface loss, electronic module etc.The advantage of embodiment of the present utility model comprises and at high temperature operates reliably led light source, when operating simultaneously a large amount of LED with higher power level, allows above-mentioned a large amount of LED are concentrated in the little space.

According to an aspect of the present utility model, a kind of light source has been described.A kind of equipment comprises: radiator, described radiator comprise installing zone and a plurality of fin; And base housing, be coupled to described radiator, wherein, described base housing comprises inner chamber.A kind of device can comprise the integrated lighting module that is coupled to described radiator and is coupled to described base housing.Described integrated lighting module can comprise: printed circuit board (PCB); Be formed at the light emitting source on the end face of substrate, wherein, the end face of described substrate is coupled to the first surface of described printed circuit board (PCB) in the first transverse region of described printed circuit board (PCB); And be constructed to the electronic drive circuit that described light emitting source provides electric power, wherein, described electronic drive circuit is coupled to the first surface of described printed circuit board (PCB) in the second transverse region of described printed circuit board (PCB).In each equipment, the bottom surface heat of described substrate is coupled to the installing zone of described radiator, and wherein, the second transverse region of described integrated lighting module is positioned at the inner chamber of described base housing.

Further, in according to light source of the present utility model, the described underrun heat-conduction epoxy resin heat of described substrate is coupled to the described installing zone of described radiator, and described radiator comprises aluminium or copper.

And, further comprise potting compound according to light source of the present utility model, described first transverse region of described potting compound and described printed circuit board (PCB) is arranged in the described installing zone in contact, and be arranged in contact in the described inner chamber with described second transverse region of described printed circuit board (PCB), described potting compound is configured to the heat that described integrated lighting module produces is conducted to described radiator and described base housing.

Further, in according to light source of the present utility model, described electronic drive circuit is configured to receive AC voltage and is configured to provides electric power in response to described AC voltage for described light emitting source, and described electronic drive circuit comprises at least one resistor, at least one capacitor, at least one integrated circuit and at least one switch block.

Further, in according to light source of the present utility model, described printed circuit board (PCB) comprises the flexible printed circuit board that comprises polyimides.

Further, in according to light source of the present utility model, described first transverse region of described flexible printed circuit board is directed with 90 degree with respect at least a portion of described second transverse region of described flexible printed circuit board.

Further, in according to light source of the present utility model, described base housing comprises the compatible base housing of GU 5.3 form factors.

Further, in according to light source of the present utility model, described printed circuit board (PCB) comprises a plurality of electric power pins (power pin) that are configured to receive from the described AC voltage of external power source.

Further, in according to light source of the present utility model, described light emitting source comprises a plurality of light emitting diodes, and described radiator comprises the compatible radiator of MR-16 form factor.

And, comprise further that according to light source of the present utility model the gathering that is coupled to described radiator is from the lens of the light of described a plurality of light emitting diodes outputs.

According to again one side of the present utility model, a kind of method for the assembling light source has been described.A kind of technology comprises the reception radiator, and described radiator comprises installing zone and a plurality of radiator structure, and comprises that reception is coupled to the base housing of described radiator, and wherein, described base housing comprises inner chamber.A kind of technique can comprise reception integrated lighting module, wherein, described integrated lighting module comprises the printed circuit board (PCB) with the first transverse region and second transverse region, wherein, the first surface of described printed circuit board (PCB) is coupled to the end face of light emitting source substrate in described the first transverse region, and wherein, the first surface of described printed circuit board (PCB) is coupled to a plurality of electronic drivers in described the second transverse region.A kind of method can comprise that the second transverse region with described integrated lighting module is arranged in the inner chamber of described base housing, and the bottom surface of described light emitting source substrate is coupled to the installing zone of described radiator.

Description of drawings

With reference to accompanying drawing with comprehend the utility model.Should understand these figure and not be regarded as restriction to the utility model scope, utilize accompanying drawing to describe in addition present described embodiment and the present optimal mode of the present utility model of understanding in detail, wherein:

Figure 1A-Figure 1B shows each embodiment of the present utility model;

Fig. 2 A-Fig. 2 B shows embodiment of the present utility model;

Fig. 3 shows the block diagram according to the manufacturing process of embodiment of the present utility model;

Fig. 4 shows the example according to the integrated lighting module of embodiment of the present utility model; And

Fig. 5 A-Fig. 5 B shows according to the example in the process for making of embodiment of the present utility model.

The specific embodiment

Figure 1A shows embodiment of the present utility model.More specifically, Figure 1A-Figure 1B shows the embodiment of the MR-16 form factor compatible with LED light source 100 with the compatible base 120 of GU 5.3 form factors.The MR-16 light source is usually in the lower work of 12 volts of alternating currents (for example VAC).In the example shown, led light source 100 is configured to provide the spotlight with 10 degree beam size.In other embodiments, led light source can be configured to provide the floodlight with 25 or 40 degree beam size or any other lighting pattern.

In each embodiment, LED assembly and modification thereof described in the above-mentioned pending application application can be used in the led light source 100.These LED assemblies are developed by the agent of present patent application at present.In each embodiment, led light source 100 can provide the peak value output brightness that is roughly 7600 to 8600 candelas (being roughly 360 to 400 lumens), provide the roughly peak value output brightness of 1050 to 1400 candelas for 40 degree floodlights (being roughly 510 to 650 lumens), the peak value output brightness of 2300 to 2500 candelas roughly etc. is provided for 25 degree floodlights (being roughly 620 to 670 lumens).Therefore each embodiment of the present utility model is considered to the brightness that reaches identical with traditional MR-16 Halogen lamp LED.

Figure 1B shows the modularization sketch according to each embodiment of the present utility model.Can find out that from Figure 1B in each embodiment, lamp 200 comprises lens 210, integrated LED modules/components 220, radiator 230 and base housing 240.As will be discussed further, in each embodiment, the modular method of assembling lamp 200 is considered to reduce the manufacturing complexity, has reduced manufacturing cost, has improved the reliability of this lamp.

In each embodiment, lens 210 are made by the transparent material (such as glass, makrolon material etc.) of anti-UV.In each embodiment, lens 210 can be solids.With regard to lens 210, solid material produces folded optical path, so that the light source that integrated LED assembly 220 produces carried out internal reflection more than once in lens 210 before output.This folded optical lens so that lamp 200 have than by the common more closely light beam that provides of the conventional reflector of equivalent depth.

In each embodiment, in order to improve the durability of lamp, transparent material should be in the temperature (for example 120 degrees centigrade) that raises lower long-term (for example several hours) work.Known a kind of material that can be used for lens 210 is the Makrolon that is provided by Bayer Material Science company ^TMLED 2045 or LED 2245 Merlon.In other embodiments, also can use other similar materials.

In Figure 1B, lens 210 can be fixed on the radiator 230 by the anchor clamps on one or more edges that are formed on lens 210.In addition, lens 210 also can be fixed near integrated LED assembly 220 by adhesive and be fixed on position on the radiator 230.In each embodiment, independent anchor clamps can be used for limiting lens 210.These anchor clamps can be made by heat-resisting plastic material, and this material is preferably white so that reflect to the light scioptics of backscatter.

In each embodiment of the present utility model, the LED assembly can be put into case according to every watt of usefulness of lumen.For example, in certain embodiments, have from the integrated LED modules/components of every watt of (L/W) usefulness of lumen of 53 to 66L/W and can put into case to be used for 40 degree floodlights, LED assembly with the usefulness that is roughly 60L/W can be put into case to be used for spotlight, have the LED assembly that is roughly 63 to 67L/W usefulness and can be used for 25 degree floodlights, etc.In other embodiments, can be used for other target application based on other ranks of L/W usefulness or the LED assembly of classification.

In certain embodiments, as hereinafter will discussing, integrated LED components/modules 220 generally includes 36 series connection or and the LED that arranges of series connection etc. (for example three connection in series-parallel, the LED of 12 series connection of every string).In other embodiments, can use any amount LED of (such as 1,10,16 etc.).In other embodiments, LED (such as whole series connection etc.) electric coupling otherwise.More details about this LED assembly are provided above in the patent application that is incorporated into this by quoting as proof.

In each embodiment, the target power consumption of LED assembly is less than 13 watts.This general power consumption than MR16 Halogen lamp LED (50 watts) is much smaller.Therefore, embodiment of the present utility model only utilizes brightness or the intensity that just can be comparable to the MR16 Halogen lamp LED less than 20% energy.

In each embodiment of the present utility model, LED assembly 220 directly is fixed on the radiator 230.As hereinafter discussing, LED assembly 220 generally includes flat substrate, such as silicon substrate etc.In each embodiment, the operating temperature of imagination LED assembly 220 is about 125 to 140 degrees centigrade.Then utilize high thermal conductivity epoxy resin (thermal conductivity ~ 96W/m.k.) silicon substrate is fixed on the radiator for example.In certain embodiments, can use thermoplasticity/thermosetting epoxy resin, such as the TS-369 that is provided by Tianzhonggui Metal Industrial Co., Ltd, TS-3332-LD etc.Also can use other epoxy resin.In certain embodiments, use screw useless is fixed on the LED assembly on the radiator, yet, in other embodiments, also can use screw or other fasteners.

In each embodiment, radiator 230 can be made by the material of low heat resistant/high thermal conductivity.In certain embodiments, radiator 230 can be by thermal conductivity k=167W/m.k., and the anodization 6061-T6 aluminium alloy of thermal emissivity e=0.7 is made.In other embodiments, can use other materials, for example thermal conductivity k=225W/m.k., the 6063-T6 of thermal emissivity e=0.9 or 1050 aluminium alloys.In other embodiments, can use the other alloy, such as AL 1100 etc.Also can add other coating and improve thermal emissivity, for example, utilize the coating that is provided by ZYP coating Co., Ltd of CR2O3 or CeO2 that thermal emissivity e=0.9 can be provided; Be Duracon by trade mark ^TMThe coating that provides of material Science and Technology Ltd. thermal emissivity e can be provided 0.98, etc.In other embodiments, radiator 230 can comprise other metals, such as copper etc.

In some instances, under 50 degrees centigrade environment temperature, and in free free convection, record radiator 230 and have and be roughly 8.5 degrees centigrade/watt thermal resistance, and record radiator 290 and have and be roughly 7.5 degrees centigrade/watt thermal resistance.By further development﹠ testing, think to obtain in other embodiments little thermal resistance to 6.6 degrees centigrade/watt.Open according to this patent, think that those of ordinary skill in the art can dream up the other materials with different qualities in embodiment of the present utility model.

In each embodiment, the base assembly/module 240 among Figure 1B provides standard GU 5.3 physics and the electrical interface with lamp socket.As hereinafter discussing in more detail, the cavity in the base module 240 comprises the high temperature resistant electronic circuit for driving LED module 220.In each embodiment, utilize led drive circuit that the input voltage of the 12VAC of lamp is converted to 120VAC, 40VAC or other voltage.Driving voltage can arrange as required according to specific LED structure (for example series connection, parallel/series etc.).

The shell of base assembly 240 can be made by aluminium alloy, perhaps can by with alloy manufacturing like the used alloy type of radiator 230 and/or radiator 290.In an example, can use alloy such as AL 1100.In another embodiment, can use the high-temp plastic material.In embodiment more of the present utility model, base assembly 240 can form with radiator 230 integral body, rather than as independent unit.

As shown in Figure 1B, contact radiator 230 in the recess of the part of LED assembly 220 (silicon substrate of LED matrix) in radiator 230.In addition, another part of LED assembly 220 (comprising led drive circuit) is bent downwardly and is inserted in the inner chamber of base assembly 240.

In each embodiment, for the ease of heat is passed to the housing of base assembly from led drive circuit, and heat is passed to the housing of base assembly from the silicon substrate of LED matrix, a kind of potting compound is provided.Potting compound can be applied to the inner chamber of base assembly 240 and the recess in the radiator 230 in single step.In each embodiment, can use biddability (compliant) potting compound, for example provided by Omega engineering company

Or the 50-1225 that is provided by ounce Australia trade (Shenzhen) Co., Ltd.In other embodiments, can use the heat-transfer matcrial of other types.

Fig. 2 A-Fig. 2 B shows embodiment of the present utility model.More specifically, Fig. 2 A shows the LED package parts (led module) according to each embodiment.More specifically, showing a plurality of LED300 is arranged on the silicon substrate 310.In certain embodiments, imagine that a plurality of LED 300 are connected in series and by being roughly 120 volts of AC(VAC) voltage fed.Enough voltage drops are arranged (for example 3 to 4 volts) on each LED 300 in order to make, in each embodiment, imagination is used 30 to 40 LED.In a particular embodiment, 37 to 39 LED in series couple.In other embodiments, LED 300 and be connected in series and by the voltage fed that is approximately 40VAC.For example, a plurality of LED 300 comprise and are arranged to three groups and every group 36 LED with 12 LED 300 that in series couple.Therefore every group the voltage source (40VAC) that provides by led drive circuit is provided in parallel, thereby obtains enough voltage drops (for example 3 to 4 volts) at each LED 300.In other embodiments, imagination is used other driving voltages, and other layouts of imagination LED 300.

In each embodiment, LED 300 is installed on silicon substrate 310 or other heat-conducting substrates.In each embodiment, thin electric insulation layer and/or reflecting layer can be separated LED 300 and silicon substrate 310.As mentioned above, usually by heat-conduction epoxy resin the heat that LED 300 produces is passed to silicon substrate 310 and radiator.

In each embodiment, the size of silicon substrate is roughly 5.7mm * 5.7mm, and the degree of depth is roughly 0.6 micron.Size can change according to concrete lighting requirement.For example, for low luminous intensity, can less LED be installed at substrate, can reduce thus the size of substrate.In other embodiments, other baseplate materials can be used, also other shape and size can be used.

Shown in Fig. 2 A, a circle silicones 315 is arranged on LED 300 on every side to limit well structure.In each embodiment, the phosphorus supporting material is arranged in the well construction.At work, LED 300 provides light blue light output, purple light output or the output of UV light.Conversely, the phosphorus supporting material is excited and sends white light output by blue laser output/UV light output.By quote as proof be incorporated into this and above other details of the embodiment of a plurality of LED 300 and substrate 310 have been described in the mentioned common pending application.

Shown in Fig. 2 A, for example 2 to 4 pads of a plurality of pad 320(can be set at the end face of substrate 310).Then, conventional solder layer (for example 96.5% tin and 5.5% gold medal) can be arranged on the silicon substrate 310, thereby form one or more solder balls 330 at silicon substrate.In Fig. 2 A illustrated embodiment, four combinations pad 320 is set, the pad in each angle, each power supply connect two pads of use.In other embodiments, can only use two pads, each AC power supplies connects pad of use.

Fig. 2 A is depicted as flexible print circuit (FPC) 340.In each embodiment, FPC 340 can comprise flexible substrate material, and polyimides for example is for example from the Kapton of E.I.Du Pont Company ^TMDeng.As directed, FPC 340 has be used to a series of pads 350 that are bonded to silicon substrate 310 and for the pad 360 that is coupled to high power supply voltage (such as 120VAC, 40VAC etc.).In addition, in certain embodiments, be provided with opening 370, the light that LED 300 sends will pass this opening.In certain embodiments, opening 370 can be close-shaped, and such as circular, square etc., yet in other embodiments, opening 370 is opening shape, for example is similar to tuning fork.

In each embodiment of the present utility model, the various shape and size of imagination FPC 340.For example, shown in Fig. 2 A, can make a series of otch 380 with the expansion that reduces FPC 340 and shrink impact on substrate 310 at FPC 340.For another example, the pad 350 of varying number can be set, for example two pads.For another example, FPC 340 can be half moon-shaped, and opening 370 is not through hole.In other embodiments, other shapes of FPC 340 and large I are openly imagined according to this patent.

In each embodiment, silicon substrate 310 is bonded to the first of FPC 340.Shown in Fig. 2 A and Fig. 2 B, FPC 340 extends to the second portion that is combined with the electric drive parts at this.In certain embodiments, the side that is combined with silicon substrate 310 of FPC 340 is same side with a side that also is combined with the electric drive parts.

In Fig. 2 B, arrange with traditional flip chip type of the end face of silicon by solder ball 330 substrate 310 to be bonded to FPC 340.Be electrically connected by the end face at silicon, make the heating surface electricity isolation of end face and the silicon of silicon.This allows the whole bottom surface of silicon substrate 310 to transfer heat to radiator.In addition, this allows LED directly to be bonded to radiator so that maximum heat transfer, and replaces usually suppressing the PCB material that conducts heat.As finding out from this structure, it is luminous that LED 300 is oriented to pass opening 370.In each embodiment, above-mentioned potting compound also is used for bottom padding etc., with the space 380 between hermetic sealing substrate 310 and the FPC 340.

After electronic driver and silicon substrate 310 are bonded to FPC 340, assemble thus LED package parts or module 220.In each embodiment, can test separately subsequently these led modules and whether suitably work.

Fig. 3 shows the block diagram according to the manufacturing process of the utility model embodiment.In each embodiment, some manufacturing process of separating can be carried out concurrently or continuously.In order to understand, can be with reference to the feature among the figure of front.

In each embodiment, carry out following technique and form the LED components/modules.At first, a plurality of LED 300 are arranged on the silicon substrate 310 of electric insulation and carry out wiring (wire), step 400.Shown in Fig. 2 A, silicones barriers (dam) 315 is placed on the silicon substrate 310 to limit a well, fill this well, step 410 with the phosphorus supporting material subsequently.Next, silicon substrate 310 is bonded to flexible print circuit 340, step 420.As mentioned above, in each embodiment, for welding procedure, can use solder ball and flip chip bonding (for example 330).

Next, a plurality of electronic drive circuit devices and contact (contact) can be soldered to flexible print circuit 340, step 430.Contact is used for receiving the driving voltage that is roughly 12VAC.As mentioned above, different from the present situation of this area MR-16 bulb, in each embodiment, electronic-circuit device can bear high temperature (for example 120 degrees centigrade) work.

In each embodiment, be inserted into the second portion that comprises electronic drive circuit of flexible print circuit in the radiator and be inserted in the inner chamber of base module step 440.As directed, subsequently with crooked about 90 degree of the first of flexible print circuit, so that the recess of the contiguous radiator of silicon substrate.Then, use epoxy resin etc. in the recess of radiator, the back side of silicon substrate to be bonded to radiator, step 450.Subsequently, use potting compound to fill the interior spatial domain of base module also with the bottom filling mixture of this potting compound as silicon substrate, step 460.

Subsequently, lens can be fixed to radiator, step 470, and then can test led light source and whether suitably work step 480.

Fig. 4 shows embodiment of the present utility model.More specifically, Fig. 4 shows the side view of flexible print circuit 500.In each embodiment, the end face that comprises light-emitting component that shows silicon substrate 510 is bonded to the bottom surface of FPC 500 in the first district.In addition, also show electronic drive circuit 520 and electrical connector 530 are bonded to FPC 500 in Second Region bottom surface.In each embodiment, FPC normally insulate between the first district and Second Region.

Fig. 5 A-Fig. 5 B shows each embodiment of the present utility model.More specifically, Fig. 5 A-Fig. 5 B shows the cross-sectional view of implementing plan example of the present utility model.

Although can imagine other form factors, Fig. 5 A shows the cross section of the embodiment of the MR-16 form factor compatible with LED light source 600 with the compatible base of GU 5.3 form factors.In each embodiment, light source 600 comprises lens 610, integrated LED components/modules 620, radiator 630 and base assembly 640.As directed, integrated LED components/modules 620 can comprise one or more bends.Also show clear area (white-spaced region) 650, described clear area shows the air gap district of the imagination between FPC and radiator 630 and the base assembly 640.

In each embodiment, light source 600 representative is a kind of to have the structure of the led light source of the performance characteristic combination that previous led light source can not provide.More specifically, in the spotlight structure, shown in Fig. 5 A, light source is characterised in that the some light beam of high concentration: be roughly 9.8 ° FWHM beam angle, have the full cutoff angle (full cutoff angle) that is roughly 13.3 ° the angle of visual field and is roughly 31.4 °.In addition, light source is characterised in that very large maximum intensity: the light center intensity (CBCP) with 24.60cd/LPKG of 81.9% luminous efficiency.

In the cross section of Fig. 5 B, show the air gap district 650 that is filled with pouring material 660.As mentioned above, pouring material 660 is used for filling cavity in the base assembly 640 around the second portion of integrated LED assembly 620, and is used for filling the recess of the LED silicon substrates contact radiator 630 in the radiator 630.In each embodiment, all pouring materials 660 all apply in single step.

For those of ordinary skills, after having read the disclosure, can imagine other embodiment.In other embodiments, can advantageously carry out combination or the sub-portfolio of above disclosed utility model.In order to should be readily appreciated that, block diagram and the flow chart of structural system divided into groups.Yet it should be understood that the rearranging etc. of interpolation, frame of the combination that in alternate embodiments of the present utility model, can imagine frame, new frame.

Therefore, specification and accompanying drawing should be counted as illustrative and nonrestrictive.Yet, it is evident that, not deviating from the situation of the spirit and scope of broad sense more, can make various modifications and change to it.

Claims (10)

1. a light source is characterized in that, comprising:

Radiator comprises installing zone and a plurality of fin;

Base housing is coupled to described radiator, and described base housing comprises inner chamber; And

The integrated lighting module is coupled to described radiator and described base housing, and described integrated lighting module comprises:

Printed circuit board (PCB);

Light emitting source is formed on the end face of substrate, and the described end face of described substrate is coupled to the first surface of described printed circuit board (PCB) in the first transverse region of described printed circuit board (PCB); And

Electronic drive circuit is constructed to described light emitting source electric power is provided, and described electronic drive circuit is coupled to the described first surface of described printed circuit board (PCB) in the second transverse region of described printed circuit board (PCB); And

Wherein, the bottom surface heat of described substrate is coupled to the described installing zone of described radiator, and described second transverse region of described integrated lighting module is positioned at the described inner chamber of described base housing.

2. light source according to claim 1 is characterized in that,

The described underrun heat-conduction epoxy resin heat of described substrate is coupled to the described installing zone of described radiator; And

Described radiator comprises aluminium or copper.

3. light source according to claim 1, it is characterized in that, further comprise potting compound, described first transverse region of described potting compound and described printed circuit board (PCB) is arranged in the described installing zone in contact, and be arranged in contact in the described inner chamber with described second transverse region of described printed circuit board (PCB), described potting compound is configured to the heat that described integrated lighting module produces is conducted to described radiator and described base housing.

4. light source according to claim 1 is characterized in that,

Described electronic drive circuit is configured to receive AC voltage and is configured to provides electric power in response to described AC voltage for described light emitting source; And

Described electronic drive circuit comprises at least one resistor, at least one capacitor, at least one integrated circuit and at least one switch block.

5. light source according to claim 1 is characterized in that, described printed circuit board (PCB) comprises the flexible printed circuit board that comprises polyimides.

6. light source according to claim 5 is characterized in that, described first transverse region of described flexible printed circuit board is directed with 90 degree with respect at least a portion of described second transverse region of described flexible printed circuit board.

7. light source according to claim 1 is characterized in that, described base housing comprises the compatible base housing of GU 5.3 form factors.

8. light source according to claim 4 is characterized in that,

Described printed circuit board (PCB) comprises a plurality of electric power pins that are configured to receive from the described AC voltage of external power source.

9. light source according to claim 1 is characterized in that,

Described light emitting source comprises a plurality of light emitting diodes; And

Described radiator comprises the compatible radiator of MR-16 form factor.

10. light source according to claim 9 is characterized in that, comprises that further the gathering that is coupled to described radiator is from the lens of the light of described a plurality of light emitting diodes outputs.

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