CN202737823U - SMD heatproof insulation gasket for miniaturized quartz crystal resonator - Google Patents
SMD heatproof insulation gasket for miniaturized quartz crystal resonator Download PDFInfo
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- CN202737823U CN202737823U CN 201220371908 CN201220371908U CN202737823U CN 202737823 U CN202737823 U CN 202737823U CN 201220371908 CN201220371908 CN 201220371908 CN 201220371908 U CN201220371908 U CN 201220371908U CN 202737823 U CN202737823 U CN 202737823U
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- smd
- shim body
- crystal resonator
- heatproof
- heatproof insulation
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Abstract
The utility model relates to an SMD heatproof insulation gasket for a miniaturized quartz crystal resonator. The SMD heatproof insulation gasket comprises a gasket body made of heatproof insulating non-metal materials, wherein the gasket body is in a plane sheet structure; the gasket body is provided with at least two through holes; and the front face of the gasket body is configured to be a plane structure, and the back face is provided with two grooves which are arranged between the through holes and an edge of the gasket body. The materials for manufacturing the gasket body comprise high-temperature-resistant materials including polyphenylene sulfide (PPS), polyterephthalamide (PPA) and liquid crystal polymer. The thickness of the gasket body is 0.35mm to 0.55mm. Compared with the prior art, according to the SMD heatproof insulation gasket, a conventional all-metal packaged SMD product of electronic components are enabled to be further miniaturized and be in a sheet structure, the volume of the product is reduced, and the product cost is effectively lowered. The SMD heatproof insulation gasket is characterized by novel structure, high production efficiency, excellent performance, application to large-scale production and sound industrialized prospect.
Description
Technical field
The utility model relates to the contact conductor of electronic devices and components by the SMD pedestal of the direct insertion SMD of converting to, especially a kind of miniaturization quartz-crystal resonator SMD heatproof insulation spacer.
Background technology
Development trend along with electronic terminal product Xiao Xingization ﹑ portability, frequency component is subjected to the impact of its insulation spacer, but can not be well to Pian Shiization ﹑ electric polarization future development, existing 49S/SMD insulation spacer is to adopt the thermostability engineering plastic injection mo(u)lding, be subjected to material restriction itself, the actual used thickness of this type of insulation spacer is the thinnest at present is 0.65mm; And SNC/SUB or 2PD/4PD etc. are with the insulation spacer of electrode, be with electrode with injection molded types of engineering plastics such as PPS ﹑ PPA, perhaps electrode is embedded on the insulation spacer of in advance injection mo(u)lding, its actual used thickness is the thinnest to be 1.5mm.
More than two kinds of insulation spacers seriously restricted the piezoelectric crystal metal package and developed to Pian Shiization ﹑ miniaturization.At present, external chip components and parts have been the industry of a maturation, mostly adopt ceramic/metal and ceramic/glass packing forms, yet above-mentioned two kinds of encapsulating structures all are to adopt base of ceramic, just adopt different packing forms.But the restriction (above-mentioned three kinds of material dependence on import) that these two kinds of packing forms are subjected to its encapsulating material (pedestal, loam cake, glass cement) cost and resource provisioning with and the process attribute restriction, affected the development of domestic chip type components and parts always.
The utility model content
The purpose of this utility model provides a kind of miniaturization quartz-crystal resonator SMD heatproof insulation spacer simple in structure, thickness ultrathin.
The purpose of this utility model is achieved by the following technical solution:
Miniaturization quartz-crystal resonator SMD heatproof insulation spacer, comprise the shim body of being made by nonmetallic materials, described shim body is made as the planar sheet structure, shim body is provided with at least two through holes, the front of shim body is made as planar structure, the back side of shim body is provided with two grooves, and described groove is located at described through hole between the edge of shim body.
As optimal technical scheme of the present utility model, described shim body is made as rectangular configuration, and described through hole is made as square, rectangle or circular configuration.
As optimal technical scheme of the present utility model, the thickness of described shim body is between 0.35 millimeter to 0.55 millimeter.
As optimal technical scheme of the present utility model, four edges in described shim body front are respectively equipped with a position-limit foot.
As optimal technical scheme of the present utility model, the end face of described position-limit foot is made of three limits, and wherein two limits are right-angle sides, and another limit is the circular arc limit.
As optimal technical scheme of the present utility model, described shim body is made by the nonmetallic materials of heatproof insulation, and described material comprises the exotic materials such as polyphenylene sulfide (PPS), polyterephthalamide (PPA) and liquid crystal polymer LCP.
The beneficial effects of the utility model are: with respect to prior art, the utility model makes the traditional further Xiao of the metal package SMD product Xingization ﹑ chip type of electronic devices and components, has reduced small product size.The utility model is conducive to the SMD product Xiao Xingization ﹑ chip type of traditional metal package dissimilar various insulation spacers and by same principle insulator and electrode is connected as a single entity, and can effectively reduce product cost; The utlity model has novel structure, production efficiency height, superior performance, be produced on a large scale; has good industrialization prospect; promote the SMD product of metal package to Xiao Xingization ﹑ chip type future development; promote electronic technology and frequency component to update, be conducive to the needs of IT application in the national economy development.
Description of drawings
The utility model is described in further detail below in conjunction with accompanying drawing and specific embodiment:
Fig. 1 is the structural representation in the utility model front;
Fig. 2 is the structural representation at the utility model back side.
Embodiment
As depicted in figs. 1 and 2, miniaturization quartz-crystal resonator SMD heatproof insulation spacer, comprise the shim body 1 of being made by the nonmetallic materials of heatproof insulation, described shim body 1 is made as the planar sheet structure, shim body 1 is provided with two or more through holes 2, the front of shim body 1 is made as planar structure, and the back side of shim body 1 is provided with two grooves 4, and groove 4 is located at described through hole 2 between the edge of shim body 1.Through hole described in the utility model 2 is used for inserting the pin of quartz-crystal resonator, and described groove 4 is used for holding the pin after the bending, with the thickness of the whole quartz-crystal resonator of further reduction.
In the present embodiment, described shim body 1 is made as rectangular configuration, and described through hole 2 is made as square, rectangle or circular configuration, and the thickness of shim body 1 is between 0.35 millimeter to 0.55 millimeter.The material that present embodiment is made shim body 1 comprises the exotic materials such as polyphenylene sulfide (PPS), polyterephthalamide (PPA) and liquid crystal polymer LCP.
As a kind of embodiment of the present utility model, described shim body 1 is rectangular configuration, and four edges in shim body 1 front are respectively equipped with a position-limit foot 3, and the end face of position-limit foot 3 is made of three limits, wherein two limits are right-angle sides, and another limit is the circular arc limit.The space that four position-limit foots of present embodiment 3 consist of is used for installing quartz-crystal resonator.
Claims (6)
1. a miniaturization quartz-crystal resonator is with SMD heatproof insulation spacer, comprise the shim body of being made by nonmetallic materials, it is characterized in that: described shim body is made as the planar sheet structure, shim body is provided with at least two through holes, the front of shim body is made as planar structure, the back side of shim body is provided with two grooves, and described groove is located at described through hole between the edge of shim body.
2. miniaturization quartz-crystal resonator according to claim 1 is with SMD heatproof insulation spacer, and it is characterized in that: described shim body is made as rectangular configuration, and described through hole is made as square, rectangle or circular configuration.
3. miniaturization quartz-crystal resonator according to claim 1 and 2 is with SMD heatproof insulation spacer, and it is characterized in that: the thickness of described shim body is between 0.35 millimeter to 0.55 millimeter.
4. miniaturization quartz-crystal resonator according to claim 1 is with SMD heatproof insulation spacer, and it is characterized in that: four edges in described shim body front are respectively equipped with a position-limit foot.
5. miniaturization quartz-crystal resonator according to claim 4 is with SMD heatproof insulation spacer, and it is characterized in that: the end face of described position-limit foot is made of three limits, and wherein two limits are right-angle sides, and another limit is the circular arc limit.
6. miniaturization quartz-crystal resonator according to claim 1 is with SMD heatproof insulation spacer, it is characterized in that: described shim body is made by the nonmetallic materials of heatproof insulation, and described nonmetallic materials comprise polyphenylene sulfide, polyterephthalamide and liquid crystal polymer LCP material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220371908 CN202737823U (en) | 2012-07-30 | 2012-07-30 | SMD heatproof insulation gasket for miniaturized quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220371908 CN202737823U (en) | 2012-07-30 | 2012-07-30 | SMD heatproof insulation gasket for miniaturized quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202737823U true CN202737823U (en) | 2013-02-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220371908 Expired - Lifetime CN202737823U (en) | 2012-07-30 | 2012-07-30 | SMD heatproof insulation gasket for miniaturized quartz crystal resonator |
Country Status (1)
| Country | Link |
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| CN (1) | CN202737823U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103178799A (en) * | 2013-03-18 | 2013-06-26 | 江苏泰氟隆科技有限公司 | Temperature-resistant insulating spacer for automatic assembly of electronic components |
| CN103716006A (en) * | 2013-12-24 | 2014-04-09 | 珠海东精大电子科技有限公司 | All-metal packaging quartz crystal resonator pad |
| CN104023470A (en) * | 2014-06-27 | 2014-09-03 | 杨海蓉 | SMD gasket for circuit board |
| CN104080267A (en) * | 2014-06-27 | 2014-10-01 | 杨海蓉 | Circuit board gasket |
| CN108072469A (en) * | 2017-11-21 | 2018-05-25 | 麒盛科技股份有限公司 | For the circuit board mounting structure of inching sensor |
-
2012
- 2012-07-30 CN CN 201220371908 patent/CN202737823U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103178799A (en) * | 2013-03-18 | 2013-06-26 | 江苏泰氟隆科技有限公司 | Temperature-resistant insulating spacer for automatic assembly of electronic components |
| CN103716006A (en) * | 2013-12-24 | 2014-04-09 | 珠海东精大电子科技有限公司 | All-metal packaging quartz crystal resonator pad |
| CN104023470A (en) * | 2014-06-27 | 2014-09-03 | 杨海蓉 | SMD gasket for circuit board |
| CN104080267A (en) * | 2014-06-27 | 2014-10-01 | 杨海蓉 | Circuit board gasket |
| CN108072469A (en) * | 2017-11-21 | 2018-05-25 | 麒盛科技股份有限公司 | For the circuit board mounting structure of inching sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130213 |