CN202668322U - Pressure ring for polishing machine - Google Patents
Pressure ring for polishing machine Download PDFInfo
- Publication number
- CN202668322U CN202668322U CN 201220177113 CN201220177113U CN202668322U CN 202668322 U CN202668322 U CN 202668322U CN 201220177113 CN201220177113 CN 201220177113 CN 201220177113 U CN201220177113 U CN 201220177113U CN 202668322 U CN202668322 U CN 202668322U
- Authority
- CN
- China
- Prior art keywords
- pressure coil
- pressure ring
- polishing machine
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to a pressure ring for a polishing machine. The pressure ring for the polishing machine comprises a pressure ring body, wherein a slotting structure is arranged on the surface of the pressure ring body. The pressure ring for the polishing machine utilizes an uneven surface of the pressure ring to break a water film which is placed between a ceramic plate and the pressure ring, so that a problem that a silicone slice absorbs the ceramic plate in the process of polishing is thoroughly solved and the crushing rate of the ceramic plate and the silicone slice is reduced.
Description
Technical field
The utility model relates to the silicon wafer polishing technical field, particularly relates to a kind of pressure coil for polishing machine.
Background technology
The continuous increase of die size and reducing of characteristic line breadth, IC makes and uses in a large number large-diameter silicon wafer, and it will be increasingly strict therefore the silicon wafer surface flatness being required, because this is the key that realizes large scale integrated circuit three-dimensional structure.And in numerous planarization techniques, chemically mechanical polishing is unique planarization techniques that can obtain the leveling effect, and as the Main Means of present silicon chip ultraprecise leveling processing, the silicon chip that requires on the one hand to process reaches the nanoscale surface roughness; In order to improve the silicon chip utilization rate, increase chip output on the other hand, also require whole silicon chip surface to reach the submicron order surface precision.Reach above-mentioned these requirements, the chemically mechanical polishing rubbing head has vital effect with respect to the motion of polishing disk to the machining accuracy that guarantees silicon chip.Although the speed of CMP technical development is very fast, theory and technical problem that they need to solve are a lot, such as people on the impact of burnishing parameters (such as pressure, rotating speed, temperature etc.) on flatness.Excision speed type according to the CMP process of Preston model is:
R
λ＝KP
λV
Wherein: R is the excision speed on each point surface, P
λBe each point pressure, V is the relative velocity of wafer and polishing pad, and K is proportionality coefficient, can above-mentioned formula quality of finish and its pressure distribution of CMP is closely related as can be known.Although the used pressure coil of traditional handicraft has the dividing potential drop effect, pressure coil and ceramic disk gap are minimum causes ceramic disk and pressure coil part to be vacuum state to cause silicon chip ceramic disk in polishing process to be adsorbed on the rubbing head easily but have, and causes ceramic disk and silicon chip fragment risk to increase.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of pressure coil for polishing machine, can reduce silicon chip and ceramic disk risk of rupture.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of pressure coil for polishing machine is provided, comprises the pressure coil body, the surface of described pressure coil body is provided with notching construction.
The spacing of described notching construction is 10*10mm, 5*5mm or 20*20mm.
The groove width of described notching construction is 1-3mm.
The interior diameter of described pressure coil body is 250-350mm, and overall diameter is 350-450mm.
Described pressure coil body is made by the polyurethane material of fluff structures.
Beneficial effect
Owing to adopted above-mentioned technical scheme, the utility model compared with prior art, have following advantage and good effect: the utility model utilizes the moisture film between the rough surface breakdown ceramic disk of pressure coil and the pressure coil, thereby thoroughly solved the problem of absorption ceramic disk in the silicon wafer polishing process, reduced the probability of ceramic disk and silicon chip fragmentation.
Description of drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 uses the utility model to carry out polishing operation planar structure schematic diagram.
The specific embodiment
Below in conjunction with specific embodiment, further set forth the utility model.Should be understood that these embodiment only are used for explanation the utility model and are not used in the scope of the present utility model that limits.Should be understood that in addition those skilled in the art can make various changes or modifications the utility model after the content of having read the utility model instruction, these equivalent form of values fall within the application's appended claims limited range equally.
Embodiment of the present utility model relates to a kind of pressure coil for polishing machine, as shown in Figure 1, comprises pressure coil body 1, and the surface of described pressure coil body 1 is provided with notching construction 2.Wherein, the spacing of notching construction 2 is 10*10mm, 5*5mm or 20*20mm, and groove width is 1-3mm; The interior diameter of pressure coil body 1 is 250-350mm, and overall diameter is 350-450mm.Pressure coil body 1 is made by the polyurethane material of fluff structures.
As shown in Figure 2, the utility model utilizes the moisture film between the rough surface breakdown ceramic disk 3 of pressure coil and the pressure coil 1, thereby has thoroughly solved the problem of absorption ceramic disk in the silicon wafer polishing process, has reduced the probability of ceramic disk 3 and silicon chip 4 fragmentations.
Claims (5)
1. a pressure coil that is used for polishing machine comprises pressure coil body (1), it is characterized in that the surface of described pressure coil body (1) is provided with notching construction (2).
2. the pressure coil for polishing machine according to claim 1 is characterized in that, the spacing of described notching construction (2) is 10*10mm, 5*5mm or 20*20mm.
3. the pressure coil for polishing machine according to claim 1 is characterized in that, the groove width of described notching construction (2) is 1-3mm.
4. the pressure coil for polishing machine according to claim 1 is characterized in that, the interior diameter of described pressure coil body (1) is 250-350mm, and overall diameter is 350-450mm.
5. the pressure coil for polishing machine according to claim 1 is characterized in that, described pressure coil body (1) is made by the polyurethane material of fluff structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220177113 CN202668322U (en) | 2012-04-24 | 2012-04-24 | Pressure ring for polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220177113 CN202668322U (en) | 2012-04-24 | 2012-04-24 | Pressure ring for polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202668322U true CN202668322U (en) | 2013-01-16 |
Family
ID=47489255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220177113 Expired - Lifetime CN202668322U (en) | 2012-04-24 | 2012-04-24 | Pressure ring for polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202668322U (en) |
-
2012
- 2012-04-24 CN CN 201220177113 patent/CN202668322U/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106312796B (en) | Two-sided planarization system of processing | |
| CN105992805A (en) | Abrasive particles and abrasion means with high abrasive power | |
| CN103506904B (en) | A kind of using method of thin-wall bearing ferrule both ends of the surface grinder | |
| CN107398779A (en) | A kind of final polishing method of wafer | |
| CN103537981B (en) | A kind of superfine processing method of high accuracy circular cylindrical parts cylindrical | |
| TW200643157A (en) | Abrasive for semiconductor integrated circuit device, method for polishing semiconductor integrated circuit device and semiconductor integrated circuit device manufacturing method | |
| JP2021503170A5 (en) | ||
| CN103419118A (en) | Grinding and polishing method | |
| CN202668322U (en) | Pressure ring for polishing machine | |
| CN101456150A (en) | Chemical mechanical polishing method | |
| CN103934741B (en) | Surface roughness reaches 0. 1 nano level design techniques | |
| CN101780662A (en) | Soft abrasive grinding wheel of ultra-precision and low-damage ground silicon wafer | |
| CN103551957B (en) | Single side polishing machine | |
| CN204621732U (en) | A kind of polishing base and adopt the Digit Control Machine Tool of this base | |
| CN204525207U (en) | The double-layer ceramic emery wheel of surface band groove | |
| CN102751187A (en) | Polishing method and grid forming method | |
| CN202985291U (en) | Rapid polisher | |
| CN204248633U (en) | A kind of chemical-mechanical grinding device | |
| CN204639964U (en) | Frosted cloth | |
| CN204149028U (en) | A kind of lapping device | |
| CN105127880B (en) | A kind of Ultraprecise polished method of active control workpiece material cutting mechanisms transformation | |
| CN203485012U (en) | Automatic elevating cover for grinding and polishing machine and grinding and polishing machine | |
| CN104308744A (en) | Chemical mechanical grinding liquid supply device | |
| CN203650229U (en) | Grinding tool | |
| CN216504315U (en) | Chemical mechanical polishing grinding head film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130116 |