CN202549930U - LED (light emitting diode) module structure with fluorescence sheet - Google Patents
LED (light emitting diode) module structure with fluorescence sheet Download PDFInfo
- Publication number
- CN202549930U CN202549930U CN 201220115278 CN201220115278U CN202549930U CN 202549930 U CN202549930 U CN 202549930U CN 201220115278 CN201220115278 CN 201220115278 CN 201220115278 U CN201220115278 U CN 201220115278U CN 202549930 U CN202549930 U CN 202549930U
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- led
- light source
- fin
- flourescent sheet
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- Expired - Fee Related
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- 230000003287 optical effect Effects 0.000 claims description 20
- 238000004806 packaging method and process Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model provides an LED (light emitting diode) module structure with a fluorescence sheet. The LED module structure comprises a radiating sheet, and is characterized by further comprising a fluorescence sheet, a light source module and a light source cover plate, wherein the light source cover plate is used for fixing the light source module on the light source module; a step is arranged on the light source cover plate; and the fluorescence sheet is arranged on the step. The utility model provides the LED module structure with the fluorescence sheet; one fluorescence sheet is added in the LED module structure; the fluorescence sheet is far away from the LED chip and is not directly contacted with a heat source, so that the heating attenuation problem caused by fluorescent powder directly contacting the LED chip is solved, and the problem that an LED module chromaticity coordinate drifts along time is reduced.
Description
Technical field
The utility model relates to the light-emitting diode field, especially relates to a kind of LED modular structure with flourescent sheet.
Background technology
Present existing white light emitting diode module generally comprises a plurality of white light-emitting diode package structures, and each white light-emitting diode package structure generally comprises blue chip and covers this blue chip and have the encapsulated layer of yellow fluorescent powder.The blue light of blue chip can excite yellow fluorescent powder to send green-yellow light; Thereby the blue light that is sent by blue chip mixes with the green-yellow light that yellow fluorescent powder sends and forms white light; This kind method for packing led chip directly contacts with fluorescent material, thus, and with making that the fluorescent material in the fluorescent glue is nearer from this heater of led chip; Cause fluorescent material in long-term the use, to receive the degree of heat fade bigger, influence the stability of led light source.
The utility model content
The purpose of the utility model is to solve that thereby fluorescent material receives heat fade to influence the stable shortcoming of led light source with the nearer fluorescent material that causes of led chip in the existing white light emitting diode modular structure, and a kind of LED modular structure with flourescent sheet is provided.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of LED modular structure with flourescent sheet; Comprise fin and light source module; Also comprise flourescent sheet and can said light source module be fixed in the optical source cover board on the said fin; Said optical source cover board is provided with a step, and said flourescent sheet places on the said step.
Further, also comprise the heat conductive insulating pad that is used for heat conduction and insulation, said heat conductive insulating pad places between said fin and the light source module.
Further, said fin is provided with fixing hole, and said optical source cover board is provided with the connecting hole that cooperates with the fixing hole of said fin.
Further, said light source module comprises substrate, is integrated in the led array of being made up of at least one led chip on the said substrate and places the packaging body on the said led chip.
Further, be provided with can be with the hollow out grid of said led array fixed placement on said fin for said optical source cover board.
Particularly, said hollow out mesh shape and said led array are suitable.
The beneficial effect of the utility model is:
(1), the utility model provides a kind of LED modular structure with flourescent sheet; The utility model is in the LED modular structure, to increase by a flourescent sheet; Flourescent sheet distance L ED chip is the direct contact heat source far and not; Solved fluorescent material and received the problem of heat fade, reduced the problem that LED module chromaticity coordinates changes drift in time because of direct contact led chip;
(2), a kind of LED modular structure of providing of the utility model with flourescent sheet, simple in structure; Optical source cover board is pressed the light source module and is attached on the fin, and optical source cover board is provided with adaptive screwed hole each other with fin, in the use, get final product with screw is fastening, and this structure assembling is simple, is convenient to operation, is suitable for extensive industrial use; Between light source module and fin, increase simultaneously one deck heat conductive insulating pad, reduced the thermal resistance of whole LED modular structure, improved stability and reliability when the LED light fixture uses; Led array in the utility model can be set to the spread geometry of rectangular matrix, ring quasi array or any product needs according to product needed.
Description of drawings
Fig. 1 is the full sectional view of the LED modular structure with flourescent sheet that provides of the utility model embodiment;
Fig. 2 is the partial enlarged drawing at A place among Fig. 1;
Fig. 3 is the structural representation of the light source module that provides of the utility model embodiment;
Fig. 4 is the structural representation of the optical source cover board that provides of the utility model embodiment;
Among the figure: 1-fin, 11-fin fixing hole, 2-light source module, 21-substrate, 22-LED array, 221-LED chip, 23-packaging body, 3-optical source cover board, 31-cover plate connecting hole, 32-cover plate hollow out grid, 4-heat conductive insulating pad, 5-flourescent sheet.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Referring to Fig. 1-Fig. 2, the full sectional view of a kind of New LED modular structure that Fig. 1 provides for the utility model, Fig. 2 is the partial enlarged drawing at Figure 1A place.A kind of LED modular structure that the utility model provides with flourescent sheet; Comprise fin 1 and light source module 2; Also comprise flourescent sheet 5 and said light source module 2 is fixed in the optical source cover board 3 on the said fin 1; Said optical source cover board 3 is provided with a step 33, and said flourescent sheet 5 places on the said step 33.The utility model is that the fluorescent material carrier that fluorescent material and process are taken out grain is fully mixed, and processes flourescent sheet 5 through injection molding way.Far and not directly contact of flourescent sheet 5 distance L ED chips in the utility model structure solved fluorescent material because of directly contacting the problem that led chip receives heat fade, reduced the problem that LED module chromaticity coordinates changes drift in time.This flourescent sheet the phenomenon that fluorescent material comes off can not occur, and fluorescent material is evenly distributed, and high conformity is not easy to occur aberration, and is beneficial to large-scale commercial production.
As shown in Figure 1, the utility model also comprises the heat conductive insulating pad 4 that is used for heat conduction and insulation, and said heat conductive insulating pad 4 places between said fin 1 and the light source module 2.Between light source module 2 and fin 1, increase one deck heat conductive insulating pad 4, reduced the thermal resistance of whole LED modular structure, improved stability and reliability when the LED light fixture uses.
Visible from Fig. 2, said fin 1 is provided with fixing hole 11, and said optical source cover board 3 is provided with the connecting hole 31 that cooperates with the fixing hole 11 of said fin 1.Particularly, the fixing hole 11 in the utility model on the fin 1 is a screwed hole, and the connecting hole 31 on the said optical source cover board 3 is a through hole, and said optical source cover board 3 is fixed on the said fin 1 through screw.The utility model adopts the mode of screw threads for fastening that light source module 2 is fixed on the fin 1; Optical source cover board 3 is provided with adaptive screwed hole each other with fin 1; Replaced the mode that cover plate and fin are fixing that to make through the operation of Reflow Soldering when traditional independent LED encapsulates; This structure assembling is simple, is convenient to operation, is fit to industrial going up extensively and promotes.
Further, please again referring to Fig. 3, the structural representation of the light source module 2 that provides for the utility model embodiment.Led array is 4 * 4 matrix structures among the figure.Said light source module comprises substrate 21, be integrated in the led array of being made up of at least one led chip 221 22 on the said substrate 21 and place the packaging body 23 on the said led chip.The led array 22 of the utility model is to be positioned in the reflector of led support by at least one led chip fixedly to form, and packaging body 23 has comprised the packaging plastic of the solid brilliant crystal-bonding adhesive that uses, bonding wire and some glue needs.In the existing LED encapsulating structure, the packaging plastic in the packaging body 23 is mixed with fluorescent material, carries out gluing process again.And in the encapsulating structure of the utility model, the packaging plastic in the packaging body 23 need not mixed fluorescent powder again, can directly carry out gluing process.
Further, see also Fig. 4, the hollow out grid on the optical source cover board 3 that the utility model embodiment provides is 4 * 4 rectangle arrays.Said optical source cover board 3 is provided with can be with the hollow out grid 32 of said led array 22 fixed placement on said fin 1.Said hollow out grid 32 shapes and said led array 22 are suitable.The LED array that the utility model provided is not limited only to 4 * 4 matrix structures, and LED array 22 also can be the ring quasi array structure, and corresponding with it hollow out grid 32 also should be the loop configuration (not shown).Perhaps, according to the needs of LED light fixture product, LED array 22 can be the shape of any arrangement, and the hollow out grid 32 on the optical source cover board 3 is suitable with LED array 22 shapes.
More than be merely the preferred embodiment of the utility model,, any modification of being done within all spirit at the utility model and the principle, be equal to and replace and improvement etc., all should be included within the protection range of the utility model not in order to restriction the utility model.
Claims (6)
1. LED modular structure with flourescent sheet; Comprise fin and light source module, it is characterized in that, also comprise flourescent sheet and can said light source module be fixed in the optical source cover board on the said fin; Said optical source cover board is provided with a step, and said flourescent sheet places on the said step.
2. a kind of LED modular structure with flourescent sheet as claimed in claim 1 is characterized in that: also comprise the heat conductive insulating pad that is used for heat conduction and insulation, said heat conductive insulating pad places between said fin and the light source module.
3. a kind of LED modular structure as claimed in claim 1 with flourescent sheet, it is characterized in that: said fin is provided with fixing hole, and said optical source cover board is provided with the connecting hole that cooperates with the fixing hole of said fin.
4. like each described a kind of LED modular structure with flourescent sheet of claim 1-3, it is characterized in that: said light source module comprises substrate, be integrated in the led array of being made up of at least one led chip on the said substrate and place the packaging body on the said led chip.
5. a kind of LED modular structure with flourescent sheet as claimed in claim 1 is characterized in that: said optical source cover board is provided with can be with the hollow out grid of said led array fixed placement on said fin.
6. a kind of LED modular structure with flourescent sheet as claimed in claim 5, it is characterized in that: said hollow out mesh shape and said led array are suitable.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220115278 CN202549930U (en) | 2012-03-23 | 2012-03-23 | LED (light emitting diode) module structure with fluorescence sheet |
| PCT/CN2013/073097 WO2013139313A1 (en) | 2012-03-23 | 2013-03-22 | Led module structure having a fluorescence sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220115278 CN202549930U (en) | 2012-03-23 | 2012-03-23 | LED (light emitting diode) module structure with fluorescence sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202549930U true CN202549930U (en) | 2012-11-21 |
Family
ID=47170510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220115278 Expired - Fee Related CN202549930U (en) | 2012-03-23 | 2012-03-23 | LED (light emitting diode) module structure with fluorescence sheet |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202549930U (en) |
| WO (1) | WO2013139313A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013139313A1 (en) * | 2012-03-23 | 2013-09-26 | 深圳市瑞丰光电子股份有限公司 | Led module structure having a fluorescence sheet |
| CN107477530A (en) * | 2017-09-07 | 2017-12-15 | 湖南粤港模科实业有限公司 | Illuminator |
| CN108922881A (en) * | 2018-06-29 | 2018-11-30 | 江苏绿色照明工程有限公司 | A kind of LED light illuminating module connection structure and its installation method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101865378A (en) * | 2010-05-17 | 2010-10-20 | 中山大学佛山研究院 | LED surface light-emitting lamp |
| CN102226504A (en) * | 2011-03-24 | 2011-10-26 | 上海新凯元照明科技有限公司 | Multi-chip integration packaged LED (light emitting diode) light source module and preparation process thereof |
| CN202534688U (en) * | 2012-03-23 | 2012-11-14 | 深圳市瑞丰光电子股份有限公司 | LED module structure with remote phosphor powder |
| CN202549930U (en) * | 2012-03-23 | 2012-11-21 | 深圳市瑞丰光电子股份有限公司 | LED (light emitting diode) module structure with fluorescence sheet |
-
2012
- 2012-03-23 CN CN 201220115278 patent/CN202549930U/en not_active Expired - Fee Related
-
2013
- 2013-03-22 WO PCT/CN2013/073097 patent/WO2013139313A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013139313A1 (en) * | 2012-03-23 | 2013-09-26 | 深圳市瑞丰光电子股份有限公司 | Led module structure having a fluorescence sheet |
| CN107477530A (en) * | 2017-09-07 | 2017-12-15 | 湖南粤港模科实业有限公司 | Illuminator |
| CN108922881A (en) * | 2018-06-29 | 2018-11-30 | 江苏绿色照明工程有限公司 | A kind of LED light illuminating module connection structure and its installation method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013139313A1 (en) | 2013-09-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121121 Termination date: 20150323 |
|
| EXPY | Termination of patent right or utility model |