CN201893373U

CN201893373U - LED (Light-Emitting Diode) packaging structure and LED light-emitting display module

Info

Publication number: CN201893373U
Application number: CN2010205893503U
Authority: CN
Inventors: 熊周成
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-11-03
Filing date: 2010-11-03
Publication date: 2011-07-06
Anticipated expiration: 2020-11-03

Abstract

The embodiment of the utility model relates to an LED (Light-Emitting Diode) packaging structure and an LED light-emitting display module. The LED packaging structure comprises a base plate, a LED chip and an epoxy resin layer, wherein the LED chip is fixed on one side of the base plate, the epoxy resin layer is packaged outside the LED chip. As the surface of an LED adopts the surface-mounted packaging structure, the size is smaller; and as the epoxy resin layer is packaged outside the LED chip, the waterproofness, corrosion resistance and UV (ultraviolet) resistance are better. In the LED light-emitting display module, as the LED packaging structure is adopted as a light source, the chip mounting and soldering can be automatically carried out through a chip mounter and reflow soldering, the production efficiency is higher, the structure cost of the product is low, the reliability is higher, and the waterproofness, corrosion resistance and UV resistance are better. The LED light-emitting display module can be applicable to the outdoors.

Description

The luminous demonstration module of LED encapsulating structure and LED

Technical field

The utility model relates to the LED encapsulation technology, relates in particular to the luminous demonstration module of a kind of LED encapsulating structure and LED.

Background technology

Existing LED encapsulation mainly is divided into the pinned encapsulation and surface mount encapsulates two types, wherein the pin of lead frame as various encapsulation external forms adopted in the pinned encapsulation, with square tube core bonding or sintering on lead frame, its top is with epoxy resin enclosed, epoxy resin has moisture-proof, characteristics such as insulating properties and corrosion resistance, so the pinned encapsulated LED often is applied to be arranged on outdoor display screen, it has waterproof preferably, anticorrosive property, but this encapsulating structure volume is bigger, and need manually be welded on the circuit board, artificial welding efficiency is lower and reliability is low.The surface mount packaged LED adopts elargol that chip is fixed on the substrate, pressure injection one deck silica gel on chip again, this packaged type volume is less, can pass through machine paster and welding, so but since the water proofing property of silica gel and corrosion resistance not the LED of strong this encapsulating structure be not suitable for being applied to outdoor display screen, more than the application of two kinds of LED encapsulation all have certain limitation.

The utility model content

The utility model embodiment technical problem to be solved is, a kind of LED encapsulating structure is provided, and its volume is less, have better waterproof, corrosion resistance and anti-UV.

The utility model embodiment another technical problem to be solved is, a kind of LED is provided luminous demonstration module, has better waterproof, corrosion resistance and anti-UV, is suitable for being applied to the open air.

For solving the problems of the technologies described above, on the one hand, provide a kind of LED encapsulating structure, comprising:

Substrate; Be fixed on the led chip of described substrate one side; Be encapsulated in the outer epoxy resin layer of described led chip.

Further, described substrate is metal substrate, ceramic substrate, plastic cement PC substrate or glass substrate.

Further, described led chip is a kind of in following: red LED chips, green LED chip, blue led chip, yellow led chip, purple led chip and White LED chip.

Further, described led chip is fixed on the described substrate by elargol.

On the other hand, a kind of LED is provided luminous demonstration module, comprise drain pan, be fixed on the LED lamp plate in the described drain pan and be sealed on face shield on the LED lamp plate, described LED lamp plate comprises that pcb board and a plurality of array are arranged on the led light source group on the described pcb board, each led light source group comprises 3 led light sources, and described led light source comprises:

Further, the substrate of described led light source is metal substrate, ceramic substrate, plastic cement PC substrate or glass substrate.

Further, the led chip of described led light source is fixed on the described substrate by elargol.

Further, apply embedding on the described pcb board waterproof sealing glue-line is arranged.

Technique scheme has following beneficial effect at least:

The LED encapsulating structure of the utility model embodiment is the surface-adhered type encapsulating structure, and its volume is less, at led chip outer envelope epoxy resin layer, has better waterproof, thermal endurance, anticorrosive property and anti-UV; The luminous demonstration module of the LED of the utility model embodiment adopts above-mentioned LED encapsulating structure as light source, can carry out automatic chip mounting and welding by chip mounter and Reflow Soldering, production efficiency is higher, the product configurations cost is low, reliability is higher and have better waterproof, thermal endurance, anticorrosive property and anti-UV, is suitable for being applied in the open air.

Description of drawings

Fig. 1 is the structural representation of the LED encapsulating structure of the utility model embodiment;

Fig. 2 is the structural representation of the luminous demonstration module of the LED of the utility model embodiment;

Fig. 3 is an A place enlarged diagram among Fig. 2.

Embodiment

With reference to accompanying drawing LED encapsulating structure of the present utility model and the luminous demonstration module of LED are described.

LED encapsulating structure as shown in Figure 1 comprises: substrate 11, led chip 12 and the epoxy resin layer 13 that is encapsulated in led chip 12 outsides.

Described substrate 11 can adopt ceramic substrate, metal substrate, plastic cement PC substrate or glass substrate, also can adopt the substrate of other types as required.

Described led chip 12 is fixed on a side of substrate 11 by elargol, and led chip 12 can adopt red LED chips, green LED chip, blue led chip, yellow led chip, purple led chip and White LED chip etc.

It is hemispherical that described in the present embodiment epoxy resin layer 13 is translucent, and the shape that also can as required epoxy resin layer 13 be designed to other is to realize better illumination effect.According to the led chip 12 that is adopted, in epoxy resin layer 13, be filled with and the identical pigment of led chip 12 glow colors accordingly.

Because the epoxy resin after solidifying has good physical and chemical performance, it has excellent adhesive strength to the surface of metal and nonmetallic materials, dielectric property are good, the set shrinkage is little, the hardness height, pliability is better, and to alkali and most of solvent-stable, thereby the LED encapsulating structure of the utility model embodiment has better waterproof and anticorrosive property.

The luminous demonstration module of LED as shown in Figures 2 and 3 comprises: drain pan 1, LED lamp plate 2 and face shield 3.Wherein, drain pan 1 is used for fixing LED lamp plate 2, and face shield 3 is used for the described LED lamp plate 2 of capping.

Described LED lamp plate 2 comprises that further pcb board 20 and a plurality of array are arranged on the led light source group on the pcb board 20, each led light source group comprises 3 led light sources 10, the LED encapsulating structure that described led light source 10 adopts as shown in Figure 1, each led light source group adopts 3 kinds of different led light sources 10 of glow color can realize the effect of colorful demonstration.

In pcb board 20 surface-coated embeddings one waterproof sealing glue-line 4 is arranged, this waterproof sealing glue-line 4 is sealed in its inside with the substrate 11 of above-mentioned led light source 10, can further improve the water resistance of the luminous demonstration module of LED.

Because this led light source 10 adopts the surface mount packaged type, the luminous demonstration module of LED of using this led light source 10 can carry out automatic chip mounting and welding by chip mounter and Reflow Soldering, production efficiency is higher, reliability is higher, adopt waterproof gasket cement that led light source 10 is sealed the luminous demonstration module of this LED simultaneously and have better waterproof and anticorrosive property, be suitable for being applied in the open air.The luminous demonstration module of the LED of the utility model embodiment can carry out photoelectric parameter segmentation management and use to each led light source 10 monomer, can realize that parameter is segmented management and produced in batches.

The above is an embodiment of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection range of the present utility model.

Claims

1. a LED encapsulating structure is characterized in that, comprising:

Substrate;

Be fixed on the led chip of described substrate one side;

Be encapsulated in the outer epoxy resin layer of described led chip.

2. LED encapsulating structure as claimed in claim 1 is characterized in that, described substrate is metal substrate, ceramic substrate, plastic cement PC substrate or glass substrate.

3. LED encapsulating structure as claimed in claim 1 is characterized in that, described led chip is a kind of in following: red LED chips, green LED chip, blue led chip, yellow led chip, purple led chip and White LED chip.

4. LED encapsulating structure as claimed in claim 1 is characterized in that described led chip is fixed on the described substrate by elargol.

5. luminous demonstration module of LED, comprise drain pan, be fixed on the LED lamp plate in the described drain pan and be sealed on face shield on the LED lamp plate, it is characterized in that, described LED lamp plate comprises that pcb board and a plurality of array are arranged on the led light source group on the described pcb board, each led light source group comprises 3 led light sources, and described led light source comprises:

Substrate;

Be fixed on the led chip of described substrate one side;

Be encapsulated in the outer epoxy resin layer of described led chip.

6. the luminous demonstration module of LED as claimed in claim 5 is characterized in that, the substrate of described led light source is metal substrate, ceramic substrate, plastic cement PC substrate or glass substrate.

7. the luminous demonstration module of LED as claimed in claim 5 is characterized in that, described led chip is a kind of in following: red LED chips, green LED chip, blue led chip, yellow, led chip, purple led chip and White LED chip.

8. the luminous demonstration module of LED as claimed in claim 5 is characterized in that the led chip of described led light source is fixed on the described substrate by elargol.

9. the luminous demonstration module of LED as claimed in claim 5 is characterized in that, applying embedding on the described pcb board has the waterproof sealing glue-line.