CN201819597U - Pressure-driven loop type thermosyphon device - Google Patents
Pressure-driven loop type thermosyphon device Download PDFInfo
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- CN201819597U CN201819597U CN201020299086XU CN201020299086U CN201819597U CN 201819597 U CN201819597 U CN 201819597U CN 201020299086X U CN201020299086X U CN 201020299086XU CN 201020299086 U CN201020299086 U CN 201020299086U CN 201819597 U CN201819597 U CN 201819597U
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- pressure
- type thermal
- evaporation part
- driven loop
- thermal siphon
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Abstract
The utility model discloses a pressure-driven loop type thermosyphon device, which comprises a shell, a plate, a tube, and at least one radiating component, wherein the shell is provided with a cavity filled with working fluid; the cavity is provided with an evaporating part having a plurality of liquid diversion elements; the liquid diversion elements are arranged at intervals; at least a first flow channel is formed between the liquid diversion elements; at least one end of the first flow channel is a free end and is connected to a free area; the plate is correspondingly covered on the shell and seals the cavity; the tube is provided with a second flow channel; two ends of the tube are connected to the shell; the second flow channel is communicated with the evaporating part; the radiating component is communicated with the external of the tube; and the radiating component and the tube form a condensation part together. The utility model can enhance the vapor-liquid circulation of the loop type heat pipe and reduce the driving pressure of a thermal resistor. Besides, the utility model requires no capillary-firing process so as to reduce the production cost.
Description
Technical field:
The utility model relates to a kind of pressure-driven loop-type thermal siphon device, refers to a kind of vapour-liquid circulation that does not need any capillary structure can increase loop-type thermal siphon structure especially, and the barometric gradient that reduces thermal resistance drives loop-type thermal siphon device.
Background technology:
In recent years along with the progress of the flourish and process technique of electronic semi-conductor's industry, and under the trend of the market demand, electronic equipment moves towards compact form gradually, but in the diminishing process of appearance and size, function and operational capability but are growing on and on.For example at family expenses or business computer and communication cabinet and family expenses or industrial heat exchanger/device during in actual operation; its inside just has multinomial electronic component to produce heat; wherein again to carry out the heat maximum that electron crystal or assembly were produced of computing; the radiator that this moment, fin cooperated fan to form provides heat sinking function promptly to play the part of the key player who protects electronic building brick, makes electronic building brick can maintain normal working temperature to bring into play due function.
And Water Cooling Technology its only begin to be used in widely on the personal computer, but by with and other are such as communication and family expenses or industrial heat exchanger/device, though seeming, Water Cooling Technology saves bulky fin, but be that hot piece with system's endogenous pyrogen focuses in the working fluid in fact, do the action of heat exchange then at and air unified by heat exchanger, because pipeline length can change voluntarily, so the position of heat exchanger is elasticity comparatively also, also allow the design of heat exchanger (radiating fin) can not be subjected to restriction on the space; The flowing of fluid but pump of water-cooling system needs pushes the work forward, but also need a storage tank, so whole system still has pump reliability issues, pipeline leakage problem etc., but because the evaporative component heat dissipation capacity in the personal computer constantly increases, so though the water-cooled heat dissipation technology is not all roses, remain one of optimal selection of heat management and control in the market, but, this is because the volume of personal computer is huger, and the outside restriction of also not having on the space; But it is just different on communication cabinet and family expenses or industrial heat exchanger/device, above-mentioned this device is at present all towards compact characteristic development, the limited heat dissipation technology that at all just can't use water-cooled of its overall space, use heat pipe or directly do transfer so remain at present with small-sized radiator, can't re-use radiating fin then and do the heat exchange action, in view of this, industry is actively sought the higher heat dissipation technology of heat flux invariably, to tackle following one by one huge radiating requirements.
In addition; conventional art also can see through heat pipe; radiating subassemblies such as temperature-uniforming plate use as hot transmitting assembly; and be by using as capillary structure in its inwall moulding one sintered body when making heat pipe and temperature-uniforming plate; its main processing procedure is earlier copper particle or powder to be filled in this inwall; again with its metal (copper) particle or powder densification compacting; send at last and impose sintering processing in the sintering furnace; make this copper particle or powder form the capillary structure of porous character; making it can be by the capillary force of this sintered body; but, make the volume of heat pipe and temperature-uniforming plate have certain thickness and effectively slimming also because of this sintered body.In addition, vaporium (Vapor Chamber) is to use the core or the structures such as network or groove of sintering, and then produces the carbonated drink circulation in capillary force phenomenon driving heat pipe or the vaporium (Vapor Chanber), but the manufacture of this structure quite bothers, increase manufacturing cost, so very improper.
Also can use traditional loop-type thermal siphon device to use in addition as heat conducting component, though should can reach heat biography effect by tradition loop-type thermal siphon device, but owing to mainly use capillary and weight-driven vapour, liquid circulation, because be vulnerable to the restriction of weight-driven, in addition the overall thermal resistance of loop-type thermal siphon device higher outside, the side tilt angle restriction of loop-type thermal siphon device is also higher, and restriction increased when design was used.
Therefore, all in the market personal computers and communication module all use the heat-pipe radiator solution, but radiating tube has heat load restriction, must use many and then cause the higher shortcoming of cost, and this heat radiation thermal resistance also not necessarily can reach the CPU thermal resistance requirement of dispelling the heat simultaneously.
Moreover, select suitable radiating core quite important, this radiating core must keep the flow velocity of condensate liquid and keep enough capillary pressure to overcome the influence of gravity.
In sum, there are following shortcoming in the heat pipe of conventional art or vaporium: (1) processing inconvenience; (2) can't realize slimming; (3) cost is higher; (4) expend man-hour.
The utility model content:
The purpose of this utility model is the weak point that exists at prior art and a kind of pressure-driven loop-type thermal siphon structure is provided that it can increase the vapour-liquid circulation of loop-type heat pipe, reduces the pressure-driven of thermal resistance; In addition, it need not to use the processing procedure of sintering capillary, can reduce production costs.
For achieving the above object, the utility model adopts following technical scheme:
Pressure-driven loop-type thermal siphon device is characterized in that including:
One housing has one and irritates the chamber that working fluid is arranged, and has an evaporation part in the chamber, the evaporation part has a plurality of baffles, this baffle is spaced, and baffle forms at least one first flow at interval, and at least one end of this first flow is free end and connects a free space;
One plate body, correspondence covers housing, and the sealing chamber;
One body has one second runner, and described body two ends connect housing, and this second runner is communicated with the evaporation part;
At least one radiating subassembly is ganged up in the body outside, and described body and radiating subassembly constitute the condensation part jointly.
Preferred as technique scheme, described radiating subassembly is radiating fin group or radiator.
Preferred as technique scheme, described working fluid are a kind of among pure water, methyl alcohol, acetone, the R-134A.
Preferred as technique scheme, described baffle is a strip rib, and this strip rib is spaced, and described first flow is formed between rectangular rib.
Preferred as technique scheme, described baffle longitudinal separation is arranged.
Preferred as technique scheme, described baffle is circle, ellipse, rectangle, triangle, waveform, cross or V-arrangement.
The beneficial effects of the utility model are: it is provided with first flow between baffle, make the first flow that contacts with thermal source produce overheated vapour, set up and drive the required high pressure of carbonated drink circulation, before the condensation part, design by suitable decompression, produce low-pressure end, form the pressure that drives the carbonated drink circulation, promptly can drive working fluid and in housing and body, transmit heat, and promote heat transference efficiency significantly and reduce manufacturing cost without any need for capillary structure.
Description of drawings:
Below in conjunction with accompanying drawing the utility model is described further:
Fig. 1 is the structural representation of the utility model embodiment one;
Fig. 2 is the structural representation of the utility model embodiment two;
Fig. 3 is the structural representation of the utility model embodiment three;
Fig. 4 is one of structural representation of evaporation part;
Fig. 5 be the evaporation part structural representation two;
Fig. 6 be the evaporation part structural representation three;
Fig. 7 be the evaporation part structural representation four;
Fig. 8 be the evaporation part structural representation five;
Fig. 9 be the evaporation part structural representation six;
Figure 10 be the evaporation part structural representation seven;
Figure 11 be the evaporation part structural representation eight;
Figure 12 be the evaporation part structural representation nine;
Figure 13 be the evaporation part structural representation ten;
Figure 14 be the evaporation part structural representation 11;
Figure 15 be the evaporation part structural representation 12;
Figure 16 be the evaporation part structural representation 13;
Figure 17 be the evaporation part structural representation 14;
Figure 18 be the evaporation part structural representation 15;
Figure 19 be the evaporation part structural representation 16;
Figure 20 be the evaporation part structural representation 17;
Figure 21 be the evaporation part structural representation 18;
Figure 22 be the evaporation part structural representation 19;
Figure 23 be the evaporation part structural representation 20;
Figure 24 be the evaporation part structural representation 21;
Figure 25 be the evaporation part structural representation 22;
Figure 26 be the evaporation part structural representation 23;
Figure 27 be the evaporation part structural representation 24;
Figure 28 be the evaporation part structural representation 25;
Figure 29 be the evaporation part structural representation 26;
Figure 30 be the evaporation part structural representation 27;
Figure 31 be the evaporation part structural representation 28.
The specific embodiment:
Therefore the following stated only for embodying the preferred embodiment of the utility model principle, does not limit protection domain of the present utility model.
See that accompanying drawing 1 is to shown in the accompanying drawing 3: pressure-driven loop-type thermal siphon device of the present utility model includes:
One housing 10, have one and irritate the chamber 11 that working fluid is arranged, has an evaporation part in the chamber, the evaporation part has the baffle 12 that a plurality of longitudinal separations are arranged, are the strip rib, form a plurality of at least first flows 13 between the baffle 12, the front end of first flow 13 is free end and connects the free space 14 that the steam supply bubble is overflowed;
One plate body 20, correspondence covers housing 10, and sealing chamber 11;
One body 30 has one second runner 31, and body 30 two ends connect housing 10, and this second runner 31 is communicated with the evaporation part;
One radiating subassembly (can be radiating fin group or radiator) 40 is ganged up in body 30 outsides, body 30 and radiating subassembly 40 common formation condensation parts.
The utility model is provided with first flow 13 in 12 of baffles, make the first flow 13 that contacts with thermal source produce overheated vapour, set up and drive the required high pressure of carbonated drink circulation, before the condensation part, design by suitable decompression, produce low-pressure end, form the pressure that drives the carbonated drink circulation, promptly can drive working fluid and in housing 10 and body 30, transmit heat, and promote heat transference efficiency significantly and reduce manufacturing cost without any need for capillary structure.
In Fig. 1, housing 10 horizontal positioned; In Fig. 2, housing 10 is vertically placed, and in Fig. 3, housing 10 horizontal positioned have added direction valve 32 on the body 30, and these three kinds of its operation principles of structure are identical, repeat no more here.
Claims (6)
1. pressure-driven loop-type thermal siphon device is characterized in that including:
One housing has one and irritates the chamber that working fluid is arranged, and has an evaporation part in the chamber, the evaporation part has a plurality of baffles, this baffle is spaced, and baffle forms at least one first flow at interval, and at least one end of this first flow is free end and connects a free space;
One plate body, correspondence covers housing, and the sealing chamber;
One body has one second runner, and described body two ends connect housing, and this second runner is communicated with the evaporation part;
At least one radiating subassembly is ganged up in the body outside, and described body and radiating subassembly constitute the condensation part jointly.
2. pressure-driven loop-type thermal siphon device according to claim 1, it is characterized in that: described radiating subassembly is radiating fin group or radiator.
3. pressure-driven loop-type thermal siphon device according to claim 1 is characterized in that: described working fluid is a kind of among pure water, methyl alcohol, acetone, the R-134A.
4. according to each described pressure-driven loop-type thermal siphon device in the claim 1 to 3, it is characterized in that: described baffle is a strip rib, and this strip rib is spaced, and described first flow is formed between rectangular rib.
5. pressure-driven loop-type thermal siphon device according to claim 3 is characterized in that: described baffle longitudinal separation is arranged.
6. according to each described pressure-driven loop-type thermal siphon device in the claim 1 to 3, it is characterized in that: described baffle is circle, ellipse, rectangle, triangle, waveform, cross or V-arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020299086XU CN201819597U (en) | 2010-08-20 | 2010-08-20 | Pressure-driven loop type thermosyphon device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020299086XU CN201819597U (en) | 2010-08-20 | 2010-08-20 | Pressure-driven loop type thermosyphon device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201819597U true CN201819597U (en) | 2011-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020299086XU Ceased CN201819597U (en) | 2010-08-20 | 2010-08-20 | Pressure-driven loop type thermosyphon device |
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| Country | Link |
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| CN (1) | CN201819597U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801351A (en) * | 2016-09-05 | 2018-03-13 | 宏碁股份有限公司 | evaporator and manufacturing method thereof |
| CN108282983A (en) * | 2018-01-12 | 2018-07-13 | 奇鋐科技股份有限公司 | Two-phase flow heat transfer structure |
| CN108692599A (en) * | 2017-04-11 | 2018-10-23 | 迈萪科技股份有限公司 | Heat conduction structure with liquid-gas separation mechanism |
| CN109425246A (en) * | 2017-08-25 | 2019-03-05 | 珠海格力电器股份有限公司 | Radiator, outdoor unit and air conditioner |
| CN109425248A (en) * | 2017-08-25 | 2019-03-05 | 珠海格力电器股份有限公司 | Radiator, outdoor unit and air conditioner |
| CN109425247A (en) * | 2017-08-25 | 2019-03-05 | 珠海格力电器股份有限公司 | Radiator, outdoor unit and air conditioner |
| CN111615290A (en) * | 2019-02-25 | 2020-09-01 | 龙大昌精密工业有限公司 | The cooling structure of the condenser |
| CN114838606A (en) * | 2022-03-28 | 2022-08-02 | 华北电力大学 | A diode phase separation evaporator |
| TWI807158B (en) * | 2020-01-20 | 2023-07-01 | 大陸商深圳興奇宏科技有限公司 | Reinforcement connection structure for thermosyphon heat dissipation device |
-
2010
- 2010-08-20 CN CN201020299086XU patent/CN201819597U/en not_active Ceased
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801351A (en) * | 2016-09-05 | 2018-03-13 | 宏碁股份有限公司 | evaporator and manufacturing method thereof |
| CN107801351B (en) * | 2016-09-05 | 2023-08-01 | 宏碁股份有限公司 | Evaporator and its manufacturing method |
| CN108692599A (en) * | 2017-04-11 | 2018-10-23 | 迈萪科技股份有限公司 | Heat conduction structure with liquid-gas separation mechanism |
| CN109425246A (en) * | 2017-08-25 | 2019-03-05 | 珠海格力电器股份有限公司 | Radiator, outdoor unit and air conditioner |
| CN109425248A (en) * | 2017-08-25 | 2019-03-05 | 珠海格力电器股份有限公司 | Radiator, outdoor unit and air conditioner |
| CN109425247A (en) * | 2017-08-25 | 2019-03-05 | 珠海格力电器股份有限公司 | Radiator, outdoor unit and air conditioner |
| CN108282983A (en) * | 2018-01-12 | 2018-07-13 | 奇鋐科技股份有限公司 | Two-phase flow heat transfer structure |
| CN108282983B (en) * | 2018-01-12 | 2020-03-10 | 奇鋐科技股份有限公司 | Two-phase flow heat transfer structure |
| CN111615290A (en) * | 2019-02-25 | 2020-09-01 | 龙大昌精密工业有限公司 | The cooling structure of the condenser |
| CN111615290B (en) * | 2019-02-25 | 2022-07-26 | 龙大昌精密工业有限公司 | Cooling structure of condenser |
| TWI807158B (en) * | 2020-01-20 | 2023-07-01 | 大陸商深圳興奇宏科技有限公司 | Reinforcement connection structure for thermosyphon heat dissipation device |
| CN114838606A (en) * | 2022-03-28 | 2022-08-02 | 华北电力大学 | A diode phase separation evaporator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C35 | Partial or whole invalidation of patent or utility model | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20120723 Decision number of declaring invalidation: 18985 Granted publication date: 20110504 |