CN201796891U

CN201796891U - Radiating device for integrated LED

Info

Publication number: CN201796891U
Application number: CN2010205443499U
Authority: CN
Inventors: 李刚; 刘北斗; 赵青松
Original assignee: Sichuan Sunfor Light Co Ltd
Current assignee: Sichuan Sunfor Light Co Ltd
Priority date: 2010-09-27
Filing date: 2010-09-27
Publication date: 2011-04-13
Anticipated expiration: 2020-09-27

Abstract

The utility model discloses a radiating device, in particular a radiating device for an integrated light-emitting diode (LED). The utility model provides a radiating device for an integrated LED to effectively radiate concentrated heat generated by the integrated LED. The radiating device comprises radiating fins, a heat pipe and the integrated LED, and also comprises a radiating substrate which is provided with the integrated LED, wherein the radiating fins and the heat pipe are arranged on the radiating substrate; the heat pipe and the integrated LED are positioned on the same side of the radiating substrate; and the radiating fins are positioned on the other side of the radiating substrate.

Description

The heat abstractor that is used for integrated LED

Technical field

The utility model relates to a kind of heat abstractor, especially relates to a kind of heat abstractor that is used for integrated LED.

Background technology

The power of the illumination level LED of present main flow is about 1W, and the power that wherein distributes as heat accounts for about 70%.The LED of single 1W is very complicated in the technology of aspects such as mounting means, welding, assembling, and cost control is difficulty.Along with development of technology, high-power integrated LED has appearred, and promptly the monomer package power so just greatly reduces the production and processing cost up to the integrated LED of 30W, 50W even 100W.Along with power increases, and the area of dissipation of monomer encapsulation is limited, therefore heat will be very concentrated, and the node temperature of illumination level LED work need be controlled at below 80 ℃ usually, therefore the heat transferred that will concentrate very much fast is dispersed into radiator and dispels the heat, and the node temperature of assurance high-power integrated LED just seems extremely important in the temperature range of operate as normal.And the heat abstractor that does not still have a kind of heat of concentrating very much that high-power integrated LED can be produced to transmit and distribute in the prior art.

The utility model content

Technical problem to be solved in the utility model is: the heat abstractor that is used for integrated LED that provides a kind of heat of concentrating very much that integrated LED can be produced effectively to distribute.

The technical scheme that adopts for solving the problems of the technologies described above is: be used for the heat abstractor of integrated LED, comprise fin, heat pipe and integrated LED, also comprise the heat-radiating substrate that described integrated LED is installed; Described fin and heat pipe are installed on the described heat-radiating substrate, and described heat pipe and described integrated LED are positioned at the homonymy of heat-radiating substrate, and described fin is positioned at the opposite side of heat-radiating substrate.

Further be, described heat pipe dish folding be installed in the integrated LED next door or under heat-radiating substrate on.

Further be to be Welding Structure or bonded structure or integrated formed structure between described fin and the described heat-radiating substrate.

Further be that described fin is provided with the heat loss through convection hole.

Further be that the thickness at the position of installation integrated LED is greater than the thickness at other position on the heat-radiating substrate.

Further be between integrated LED and heat-radiating substrate, to have high thermal conductive silicon fat or liquid metal sheet.

Further be that described heat-radiating substrate and fin are made for all aluminium alloy material.

The beneficial effects of the utility model are: be equipped with on the heat-radiating substrate of fin and heat pipe on it by integrated LED being installed to one, a large amount of heats that integrated LED is produced are transmitted on the heat-radiating substrate by heat pipe uniformly, be transmitted on the fin of upside by heat-radiating substrate again, distribute in the mode of free convection then, thereby effectively a large amount of heats of concentrating very much that integrated LED is produced dissipate to greatest extent, make the node temperature of integrated LED can guarantee in the temperature range of operate as normal, to have guaranteed the operate as normal of integrated LED.

Description of drawings

Fig. 1 is used for the front view of the heat abstractor of integrated LED for the utility model;

Fig. 2 is that the A of the utility model Fig. 1 is to view;

Fig. 3 be the utility model Fig. 1 A to another kind of view

Fig. 4 is the B-B view of the utility model Fig. 2 and Fig. 3.

Be labeled as among the figure: fin 1, heat-radiating substrate 2, heat pipe 3, integrated LED 4, heat loss through convection hole 5.

Embodiment

As described in background information, heat radiation for high-power integrated LED, also there is not at present a kind of device that its heat can be dissipated, and the conventional radiator of using on a lot of products in the prior art one all include at least can be very fast the fin that dissipates of the heat that exterior conductive is come, and the heat pipe that heat can be conducted fast, the utility model is a design feature of summing up above-mentioned radiator, the heat abstractor that is used for integrated LED that a kind of heat of concentrating very much that integrated LED can be produced that the high-power integrated LED product characteristics of rejoining proposes effectively distributes.

As Fig. 1, Fig. 2, Fig. 3, shown in Figure 4, described heat abstractor comprises fin 1 and heat pipe 3, also comprises the heat-radiating substrate 2 that described integrated LED 4 is installed; Described fin 1 and heat pipe 3 are installed on the described heat-radiating substrate 2, and described heat pipe 3 and described integrated LED 4 are positioned at the downside of heat-radiating substrate 2, and described fin 1 is positioned at the upside of heat-radiating substrate 2.Like this integrated LED 4 being installed to one is equipped with on the heat-radiating substrate 2 of fin 1 and heat pipe 3 on it, a large amount of heats that integrated LED 4 is produced are transmitted on the heat-radiating substrate 2 uniformly by heat pipe 3, be transmitted on the fin 1 of upside by heat-radiating substrate 2 again, distribute in the mode of free convection then, thereby effectively a large amount of heats of concentrating very much that integrated LED 4 is produced dissipate to greatest extent, the node temperature of integrated LED 4 can be guaranteed in the temperature range of operate as normal, guaranteed the operate as normal of integrated LED 4.

In the above-described embodiment, for a large amount of heats that to greatest extent integrated LED 4 produced are transmitted on the heat-radiating substrate 2, as shown in Figure 2, on the heat-radiating substrate 2 that is installed in integrated LED 4 next doors with described heat pipe 3 dish foldings; Perhaps as shown in Figure 3, on the heat-radiating substrate 2 that is installed in integrated LED 4 next doors and below with described heat pipe 3 dish foldings; Certainly being installed on the heat-radiating substrate 2 under the integrated LED 4 of heat pipe 3 dish foldings, this structure is not shown.The length of increase heat pipe 3 that so just can be a large amount of, and then increase the area that heat pipe 3 conducts heats, improve conduction efficiency.After a large amount of heats are transmitted on the heat-radiating substrate 2, give fin 1 by heat-radiating substrate 2 conduction again, at this moment, for make heat on the heat-radiating substrate 2 can be smoothly and also conduction fast give fin 1, just must guarantee to be connected between heat-radiating substrate 2 and the fin 1 reliably with unimpeded, so be connected by Welding Structure or bonded structure or integrated formed structure between described fin 1 and the described heat-radiating substrate 2, so just can guarantee can not have between fin 1 and the heat-radiating substrate 2 gap that influences the heat conduction.After a large amount of heats is transmitted on the fin 1, fin 1 can be preferably with heat diffusion in air, but integrally-built fin 1 space certain distance of polylith and parallel being arranged together, because adjacent fin 1 ambient air can't form convection current, so the effect of its heat radiation is also bad, in order to improve the convection current ability of fin ambient air, improve radiating effect, described fin 1 is provided with heat loss through convection hole 5.

A large amount of heats that integrated LED 4 produces are given the heat-radiating substrate 2 except relying on heat pipe 3 conduction, because integrated LED 4 itself is installed on the heat-radiating substrate 2, its contact-making surface also can be directly passed to heat heat-radiating substrate 2, give fin by heat-radiating substrate 2 conduction again, in the process of heat conduction, the volume of conductor is big more, the ability of its thermal capacitance is strong more, in order to increase heat-radiating substrate 2 thermal capacitance abilities, the thickness at the position of installation integrated LED 4 is greater than the thickness at other position on the described heat-radiating substrate 2, so just, can increase the volume of heat-radiating substrate 2, and then increase the thermal capacity of heat-radiating substrate 2, reduce the node temperature of integrated LED 4.As previously mentioned, integrated LED 4 is to transmit heat by the surface of direct contact heat-radiating substrate 2, in order to improve the ability that it transmits heat, between integrated LED 4 and heat-radiating substrate 2, scribble high thermal conductive silicon fat or the liquid metal sheet is installed, thereby the heat that integrated LED 4 is produced passes to heat-radiating substrate 2 smoothly and efficiently, has improved the emission capabilities of a large amount of heats of integrated LED 4 generations.

Make described heat-radiating substrate 2 and fin 1 material so long as highly heat-conductive material get final product, such as copper, iron etc.No matter be copper or iron, its density is all bigger, so weight is heavier, for both weight reductions, can well play the effect of conduction heat again, described heat-radiating substrate 2 and fin 1 are made for all aluminium alloy material, thereby the overall weight of heat abstractor is under control, very light, can use widely at street lamp, flood light etc. needs to use on the light fixture of high-power integrated LED 4, can play good heat conduction and heat again simultaneously and distribute effect.

Claims

1. the heat abstractor that is used for integrated LED comprises fin (1), heat pipe (3) and integrated LED, it is characterized in that: also comprise the heat-radiating substrate (2) that described integrated LED (4) are installed; Described fin (1) and heat pipe (3) are installed on the described heat-radiating substrate (2), and described heat pipe (3) and described integrated LED (4) are positioned at the homonymy of heat-radiating substrate (2), and described fin (1) is positioned at the opposite side of heat-radiating substrate (2).

2. the heat abstractor that is used for integrated LED according to claim 1 is characterized in that: described heat pipe (3) dish folding be installed in integrated LED (4) next door and/or under heat-radiating substrate (2) on.

3. the heat abstractor that is used for integrated LED according to claim 1 is characterized in that: be Welding Structure or bonded structure or integrated formed structure between described fin (1) and the described heat-radiating substrate (2).

4. the heat abstractor that is used for integrated LED according to claim 3 is characterized in that: described fin (1) is provided with heat loss through convection hole (5).

5. the heat abstractor that is used for integrated LED according to claim 1 is characterized in that: heat-radiating substrate (2) is gone up the thickness of the thickness at the position that integrated LED (4) is installed greater than other position.

6. according to the described heat abstractor that is used for integrated LED in arbitrary top in the claim 1～5, it is characterized in that: between integrated LED (4) and heat-radiating substrate (2), have high thermal conductive silicon fat or liquid metal sheet.

7. the heat abstractor that is used for integrated LED according to claim 1 is characterized in that: described heat-radiating substrate (2) and fin (1) are made for all aluminium alloy material.