CN201696943U - LED lamp with radiator - Google Patents
LED lamp with radiator Download PDFInfo
- Publication number
- CN201696943U CN201696943U CN201020236471XU CN201020236471U CN201696943U CN 201696943 U CN201696943 U CN 201696943U CN 201020236471X U CN201020236471X U CN 201020236471XU CN 201020236471 U CN201020236471 U CN 201020236471U CN 201696943 U CN201696943 U CN 201696943U
- Authority
- CN
- China
- Prior art keywords
- radiator
- lampshade
- led
- interface
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 55
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 55
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 17
- 239000011230 binding agent Substances 0.000 claims abstract description 8
- 239000004411 aluminium Substances 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 239000003570 air Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201020236471XU CN201696943U (en) | 2010-06-24 | 2010-06-24 | LED lamp with radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201020236471XU CN201696943U (en) | 2010-06-24 | 2010-06-24 | LED lamp with radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201696943U true CN201696943U (en) | 2011-01-05 |
Family
ID=43398188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201020236471XU Expired - Fee Related CN201696943U (en) | 2010-06-24 | 2010-06-24 | LED lamp with radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201696943U (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102095190A (en) * | 2011-03-16 | 2011-06-15 | 上海宏源照明电器有限公司 | Shell of semiconductor light source |
WO2013139295A1 (en) * | 2012-03-22 | 2013-09-26 | Zhao Yijun | Led bulb-type lamp having strong heat dissipation capability and manufacturing method thereof |
CN103448206A (en) * | 2012-05-29 | 2013-12-18 | 宝理塑料株式会社 | Method for manufacturing composite molded body |
WO2014172411A1 (en) * | 2013-04-19 | 2014-10-23 | Bayer Materialscience Llc | In mold electronic printed circuit board encapsulation and assembly |
CN105739654A (en) * | 2016-02-19 | 2016-07-06 | 苏州国量量具科技有限公司 | Novel computer mainboard cooler |
CN108870106A (en) * | 2017-05-09 | 2018-11-23 | 上海德士电器有限公司 | The pin type LED bulb of injection molding packaging |
CN110464856A (en) * | 2019-09-16 | 2019-11-19 | 北京中科优唯科技有限公司 | A kind of deep ultraviolet LED dodging device |
CN113531503A (en) * | 2021-07-08 | 2021-10-22 | 中节能晶和科技有限公司 | LED lamp heat dissipation structure and manufacturing method thereof |
-
2010
- 2010-06-24 CN CN201020236471XU patent/CN201696943U/en not_active Expired - Fee Related
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102095190A (en) * | 2011-03-16 | 2011-06-15 | 上海宏源照明电器有限公司 | Shell of semiconductor light source |
WO2013139295A1 (en) * | 2012-03-22 | 2013-09-26 | Zhao Yijun | Led bulb-type lamp having strong heat dissipation capability and manufacturing method thereof |
CN103448206B (en) * | 2012-05-29 | 2016-06-08 | 宝理塑料株式会社 | The manufacture method of composite shaped body |
CN103448206A (en) * | 2012-05-29 | 2013-12-18 | 宝理塑料株式会社 | Method for manufacturing composite molded body |
CN110360467A (en) * | 2013-04-19 | 2019-10-22 | 科思创有限公司 | Electronic printing circuit board encapsulation and component in mould |
CN105339732A (en) * | 2013-04-19 | 2016-02-17 | 科思创有限公司 | In mold electronic printed circuit board encapsulation and assembly |
US10156352B2 (en) | 2013-04-19 | 2018-12-18 | Covestro Llc | In mold electronic printed circuit board encapsulation and assembly |
WO2014172411A1 (en) * | 2013-04-19 | 2014-10-23 | Bayer Materialscience Llc | In mold electronic printed circuit board encapsulation and assembly |
US11112103B2 (en) | 2013-04-19 | 2021-09-07 | Covestro Llc | In mold electronic printed circuit board encapsulation and assembly |
CN105739654A (en) * | 2016-02-19 | 2016-07-06 | 苏州国量量具科技有限公司 | Novel computer mainboard cooler |
CN108870106A (en) * | 2017-05-09 | 2018-11-23 | 上海德士电器有限公司 | The pin type LED bulb of injection molding packaging |
CN110464856A (en) * | 2019-09-16 | 2019-11-19 | 北京中科优唯科技有限公司 | A kind of deep ultraviolet LED dodging device |
CN113531503A (en) * | 2021-07-08 | 2021-10-22 | 中节能晶和科技有限公司 | LED lamp heat dissipation structure and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HELF NEW MATERIAL TECHNOLOGY (WUXI) CO., LTD. Free format text: FORMER OWNER: SHANGHAI HEFU NEW MATERIALS TECHNOLOGY CO., LTD. Effective date: 20120601 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201600 SONGJIANG, SHANGHAI TO: 214213 WUXI, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20120601 Address after: 214213 D6, Pioneer Park, Yixing economic and Technological Development Zone, Jiangsu Patentee after: Hefu New Material Technology (Wuxi) Co., Ltd. Address before: 4, 118, 201600 Yang Yang Road, Shanghai, Songjiang District Patentee before: Shanghai Hefu New Materials Technology Co., Ltd. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Heat-dissipating device and LED (light emitting diode) lamp with heat-dissipating device Effective date of registration: 20130131 Granted publication date: 20110105 Pledgee: Agricultural Bank of China Limited by Share Ltd Wuxi science and Technology Branch Pledgor: Hefu New Material Technology (Wuxi) Co., Ltd. Registration number: 2013990000073 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20140224 Granted publication date: 20110105 Pledgee: Agricultural Bank of China Limited by Share Ltd Wuxi science and Technology Branch Pledgor: Hefu New Material Technology (Wuxi) Co., Ltd. Registration number: 2013990000073 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Heat-dissipating device and LED (light emitting diode) lamp with heat-dissipating device Effective date of registration: 20140224 Granted publication date: 20110105 Pledgee: Agricultural Bank of China Limited by Share Ltd Wuxi science and Technology Branch Pledgor: Hefu New Material Technology (Wuxi) Co., Ltd. Registration number: 2014990000116 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110105 Termination date: 20180624 |