CN201590953U - PCB surface treatment water removing facility - Google Patents
PCB surface treatment water removing facility Download PDFInfo
- Publication number
- CN201590953U CN201590953U CN2010201122018U CN201020112201U CN201590953U CN 201590953 U CN201590953 U CN 201590953U CN 2010201122018 U CN2010201122018 U CN 2010201122018U CN 201020112201 U CN201020112201 U CN 201020112201U CN 201590953 U CN201590953 U CN 201590953U
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- CN
- China
- Prior art keywords
- osp
- pcb board
- pcb
- liquid feeding
- surface treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A PCB (Printed circuit board) surface treatment water removing facility includes two groups of transmission sheet wheels for carrying PCB, high-pressure blasting nozzles provided on both upper and lower sides of the forepart position of the transmission sheet wheels, OSP liquid feeding tanks are provided on the rear portion position of the transmission sheet wheels, water absorption tackles provided between the high-pressure blasting nozzles and the OSP liquid feeding tanks, wherein the water absorption tackles are distributed at the upper and lower sides of the PCB transmission path, and are respectively in juxtaposition mounting with the two groups of transmission sheet wheels, and absorbent cotton is distributed on the surface of the water absorption tackle. Before the PCB enters into the OSP liquid feeding tank, the utility model make the tiny solder pad moist by water, to improve the surface tension between the tiny solder pad and the green oil surface, so that the liquid medicine can completely infiltrate the solder pad after the PCB enters into the OSP liquid feeding tank, which has stable coating and better coating effect.
Description
Technical field
The utility model relates to the improvement technology of pcb board production equipment.
Background technology
Catch up with the wetting system schematic diagram for existing pcb board surface treatment as shown in Figure 1, this equipment is to smear the employed equipment of OSP (Organic Solderability Preservatives has organizational security weldering film) in the pcb board production process.Number in the figure 1 indicating device is provided with two groups up and down for passing film advancing wheel, is used for carrying and transmits pcb board; Label 2 indicating devices are high pressure air blowing mouth 2, and the moisture content that is used for pre-treatment is remained in pcb board aperture the inside blows away so that OSP liquid medicine enters in the sky, guarantee in the hole on film good; Label 3 indicating devices are that OSP goes up liquid bath, when pcb board is gone up liquid bath by OSP, finish the last membrane process to the pcb board surface.In last membrane process, the high pressure air blowing mouth also can be driven moisture content before small pad on the pcb board face and the green oil face away when catching up with water, like this when pcb board enters OSP and goes up liquid bath, owing to can in liquid, cause some small bubbles in the soup cyclic process, and micro-bubble can push up the small pad of pcb board lower surface in the process that rises, the surface tension that forms before small pad and the green oil face and cause OSP liquid medicine can not enter small pad fully, and finally causing film bad (or not going up film) problem on the small pad, this phenomenon generally only can occur in the lower surface of pcb board.
The utility model content
The technical problems to be solved in the utility model is to overcome the deficiencies in the prior art, provide a kind of OSP to go up the good pcb board surface treatment of film to catch up with wetting system.
For solving the problems of the technologies described above, the utility model by the following technical solutions:
Wetting system is caught up with in a kind of pcb board surface treatment, comprise two groups of biography film advancing wheels that are used to transmit pcb board that are set up in parallel up and down, both sides are provided with the high pressure air blowing mouth about passing the film advancing wheel forward position, be provided with liquid bath on the OSP in biography film advancing wheel rear positions, at the rumble that absorbs water between the liquid bath on high pressure air blowing mouth and the OSP, the suction rumble is distributed in pcb board transfer path both sides up and down, installs side by side with two groups of biography film advancing wheels respectively.
Wherein, above-mentioned suction rumble surface is furnished with absorbent wool.
The utility model gets wet moistening on pcb board enters on the OSP before the liquid bath just with small pad, improves the surface tension between small pad and the green oil face, make pcb board enter OSP go up liquid bath after liquid medicine can soak into pad fully, last film is stable, go up the film better effects if.
Description of drawings
Accompanying drawing 1 is the prior art structural representation;
Accompanying drawing 2 is the utility model example structure schematic diagram.
Embodiment
For the ease of those skilled in the art's understanding, the utility model structural principle is described in further detail below in conjunction with specific embodiment and accompanying drawing:
As shown in drawings, the pcb board surface treatment that present embodiment disclosed catch up with the improvement project of wetting system to be used to eliminate when pcb board carries out film on the OSP, to exist on the bad problem of film.This equipment comprises two groups of biography film advancing wheels 1 that are used to transmit pcb board 5 that are set up in parallel up and down, both sides are provided with high pressure air blowing mouth 2 about passing film advancing wheel 1 forward position, be provided with liquid bath 3 on the OSP in biography film advancing wheel 1 rear positions, at the rumble 4 that absorbs water between the liquid bath 3 on high pressure air blowing mouth 2 and the OSP, suction rumble 4 is distributed in pcb board transfer path both sides up and down, install side by side with two groups of biography film advancing wheels 1 respectively, and be furnished with absorbent wool on suction rumble 4 surfaces, when pcb board passes through suction rumble 4, suction rumble 4 can soak into small pad on the pcb board, make bond pad surface form liquid film, no tension force exists between small pad and the pcb board green oil face, liquid medicine can successfully soak on the small pad when whole pcb board immersion OSP goes up liquid bath 3, finishes OSP well and goes up film.
More than be the preferred version of embodiment for the utility model realization; and indefiniteness is exhaustive; the utility model can also have other variations under same idea; need to prove; under the prerequisite that does not break away from the present utility model design, any conspicuous replacement is all within the utility model protection range.
Claims (2)
1. wetting system is caught up with in a pcb board surface treatment, comprise two groups of biography film advancing wheels (1) that are used to transmit pcb board that are set up in parallel up and down, both sides are provided with high pressure air blowing mouth (2) about passing the film advancing wheel forward position, be provided with liquid bath on the OSP (3) in biography film advancing wheel rear positions, it is characterized in that: at the rumble (4) that absorbs water between the liquid bath on high pressure air blowing mouth and the OSP, the suction rumble is distributed in pcb board transfer path both sides up and down, installs side by side with two groups of biography film advancing wheels respectively.
2. wetting system is caught up with in pcb board surface treatment according to claim 1, it is characterized in that: described suction rumble surface is furnished with absorbent wool.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201122018U CN201590953U (en) | 2010-02-03 | 2010-02-03 | PCB surface treatment water removing facility |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201122018U CN201590953U (en) | 2010-02-03 | 2010-02-03 | PCB surface treatment water removing facility |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201590953U true CN201590953U (en) | 2010-09-22 |
Family
ID=42750748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010201122018U Expired - Fee Related CN201590953U (en) | 2010-02-03 | 2010-02-03 | PCB surface treatment water removing facility |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201590953U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103521390A (en) * | 2013-09-10 | 2014-01-22 | 镇江华印电路板有限公司 | Surface treatment device for printed circuit board copper foil |
CN110881249A (en) * | 2019-10-21 | 2020-03-13 | 信丰福昌发电子有限公司 | FQC back-pass surface treatment method for double-sided circuit board |
CN110913599A (en) * | 2019-10-21 | 2020-03-24 | 信丰福昌发电子有限公司 | Processing technology of stepped circuit board with gold-surface copper-plating mixed surface technology |
-
2010
- 2010-02-03 CN CN2010201122018U patent/CN201590953U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103521390A (en) * | 2013-09-10 | 2014-01-22 | 镇江华印电路板有限公司 | Surface treatment device for printed circuit board copper foil |
CN110881249A (en) * | 2019-10-21 | 2020-03-13 | 信丰福昌发电子有限公司 | FQC back-pass surface treatment method for double-sided circuit board |
CN110913599A (en) * | 2019-10-21 | 2020-03-24 | 信丰福昌发电子有限公司 | Processing technology of stepped circuit board with gold-surface copper-plating mixed surface technology |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100922 Termination date: 20170203 |