CN201413836Y - Packaging structure of light-emitting device - Google Patents

Abstract

The utility model provides a packaging structure of light-emitting device, include: a base, comprising: a substrate; at least one light emitting diode arranged on the substrate; and a first transparent resin for covering and protecting the at least one light emitting diode; a wavelength conversion assembly comprising: a transparent body; the fluorescent body layer is coated on the bottom surface of the transparent body, and is arranged between the substrate and the transparent body when the wavelength conversion assembly is combined with the base; the supporting part is arranged between the base and the wavelength conversion assembly and surrounds the at least one light emitting diode, and the supporting part is used for supporting the wavelength conversion assembly and maintaining a gap between the fluorescent body layer and the surface of the first transparent resin; a plurality of through holes are formed on the supporting portion. The base and the wavelength conversion component are manufactured respectively and then combined to form the light-emitting device, so that the scrapping of the whole base caused by the poor manufacture of the transparent body or the fluorescent body layer can be eliminated. In addition, the plurality of through holes formed on the supporting part can reduce the temperature of the light-emitting diode.

Description

Packaging structure of light emitting device

technical field

The utility model relates to a package structure of a light-emitting device with a light-emitting diode inside.

Background technique

FIG. 1A is a top view of a conventional LED device. FIG. 1B is a cross-sectional view of the conventional LED device shown in FIG. 1A . Referring to FIG. 1B , the existing light emitting diode device is fabricated in a layer-by-layer manner. For example, a plurality of LEDs 102 are disposed on the substrate 101, and a beam portion 103 is formed around the plurality of LEDs 102 on the substrate 101, as shown in FIG. 1A. Next, the light-transmitting resin layer 104 containing fluorescent material is used to cover the plurality of light-emitting diodes 102 and fill up the area surrounded by the localized portion 103 . Then, a transparent body 105 is disposed on the light-transmitting resin layer 104 , and the light-transmitting resin layer 104 and the transparent body 105 are laminated and contacted. When the LED 102 is energized to emit light, the fluorescent material in the transparent resin layer 104 is excited by part of the light from the LED 102 to emit light with a wavelength different from that of the LED 102 .

However, because the fluorescent material in the light-transmitting resin layer 104 has a relatively large specific gravity, it often gradually sinks to the bottom of the area surrounded by the local beam portion 103 over time, that is, the surface close to the substrate 101, thereby affecting the light emission. Luminous efficiency and optical performance of the device. To solve this problem, a larger amount of fluorescent material must be used in the light-transmitting resin layer 104 to achieve the desired light conversion effect. In addition, the existing light-emitting diode devices are manufactured in a layer-by-layer manner. If mistakes occur when coating the light-transmitting resin layer 104 containing fluorescent materials, the entire substrate 101 and light-emitting diodes 102 will often be damaged. Scrap, thus increasing the cost of wear and tear.

Furthermore, due to the layer-by-layer structure of the existing light-emitting diode devices, when the light-emitting device is in operation, the heat generated by the light-emitting diodes 102 cannot be effectively dissipated, and it is easy for the light-transmitting resin layer 104 to dissipate. The fluorescent material in the light-emitting device is deteriorated by heat, thereby affecting the luminous efficiency and optical performance of the light-emitting device. Therefore, in the existing light-emitting diode device, it is necessary to use expensive fluorescent materials that can withstand high temperature, so as to prolong the service life of the light-emitting diode device, so the manufacturing cost cannot be reduced.

Utility model content

Based on the above reasons, it is necessary to provide a light emitting device structure that can reduce costs and improve heat dissipation. A packaging structure of a light emitting device is provided, the packaging structure includes a separable base and a wavelength conversion component. The base includes: a substrate; at least one light-emitting diode disposed on the substrate; and a first transparent resin used to cover and protect the at least one light-emitting diode; a wavelength conversion component includes: a transparent body; and a fluorescent light A body layer, coated on the bottom surface of the transparent body, wherein when the wavelength conversion component is combined with the base, the phosphor layer is interposed between the substrate and the transparent body, and when the at least one light emitting diode emits light, the The phosphor layer is excited by part of the light of the at least one light-emitting diode, and emits light with a wavelength different from that of the light of the at least one light-emitting diode; and a support part is arranged between the base and the wavelength conversion component, and surrounds Next to the at least one light emitting diode, the supporting part is used to support the wavelength conversion component and maintain the gap between the phosphor layer and the surface of the first transparent resin; wherein a plurality of through holes are formed in the supporting part, and the plurality of The through hole is used to make the gap between the phosphor layer and the surface of the first transparent resin communicate with the external environment to generate convection when the light emitting device is in operation after the wavelength conversion component is combined with the base, thereby reducing the The temperature of at least one LED.

Wherein the gap is between 0.3mm and 1.0mm.

Wherein the bottom surface of the transparent body further includes a notch for filling the phosphor layer.

Wherein the transparent body is a hemisphere, any convex surface body or flat surface body.

Wherein the thickness of the first transparent resin is no more than 0.3mm.

Compared with the prior art, the utility model has the following beneficial effects:

The utility model makes the base and the wavelength conversion component separately and combines them to form a light-emitting device, which can eliminate the scrapping of the whole base caused by the poor manufacture of the transparent body or the phosphor layer, thereby avoiding unnecessary waste of cost. In addition, the plurality of through holes formed in the supporting part of the present invention allow the gap between the phosphor layer and the surface of the first transparent resin to communicate with the external environment and generate convection, thereby reducing the temperature of the at least one LED.

Description of drawings

The present invention can be easily understood by the above detailed description and the corresponding accompanying drawings, and like reference numerals represent similar structural components.

FIG. 1A is a top view of a conventional light emitting diode light emitting device.

FIG. 1B is a cross-sectional view of the conventional LED device shown in FIG. 1A .

FIG. 2A is a cross-sectional view of a light emitting device base according to an embodiment of the invention.

FIG. 2B is a top view of FIG. 2A.

FIG. 2C is a top view of the structure shown in FIG. 2A when through holes are provided.

FIG. 3 is a cross-sectional view of a wavelength conversion device according to an embodiment of the present invention.

4 is a cross-sectional view of a package showing the submount depicted in FIG. 2C combined with the wavelength conversion device depicted in FIG. 3 according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view of a package according to another embodiment of the present invention.

Brief description of component symbols:

101 substrate

102 LEDs

103 local bundle

104 transparent resin layer

105 transparent body

200 base

202 substrate

204 LEDs

209 support department

211 first transparent resin

213 through holes

300 wavelength conversion components

301 Bottom

302 Phosphor layer

306 transparent body

Detailed ways

Embodiments of the present utility model will be described with reference to the accompanying drawings. When reading the detailed description, you can refer to the attached drawings at the same time, and the drawings are also regarded as a part of the detailed description.

FIG. 2A is a cross-sectional view of a light emitting device base 200 according to an embodiment of the present invention. FIG. 2B is a top view of the light emitting device base 200 shown in FIG. 2A . Substrate 202 may be semiconductor, metal, ceramic or metal matrix composite. A plurality of LEDs 204 are disposed on the substrate 202 . In this embodiment, as shown in FIG. 2B , a support portion 209 is provided around the LEDs 204 on the substrate 202 . It should be noted that the support portion 209 used in this embodiment is a circular structure, but in fact it is not limited thereto. Next, the first transparent resin 211 is covered on the plurality of LEDs 204 with a thickness of about 0.3 mm. The first transparent resin 211 is used to protect the plurality of light emitting diodes 204, so that these light emitting diodes are isolated from the air, and are not polluted and corroded by any gas and moisture. When coating the first transparent resin 211 , the support portion 209 can be used as a limited boundary, which is used to prevent the first transparent resin 211 from overflowing a predetermined range. After the first transparent resin 211 is cured, as shown in FIG. 2C , a plurality of through holes 213 parallel to the surface of the substrate 202 can be provided on the support portion 209 , for example, four, but in fact it is not limited thereto.

FIG. 3 is a cross-sectional view of a wavelength conversion component 300 according to an embodiment of the present invention. The wavelength conversion component 300 includes a transparent body 306 . It should be noted that the shape of the transparent body 306 used in this embodiment is a hemisphere, but in fact it is not limited thereto. The transparent body can also be any convex surface body or flat surface body. A phosphor layer 302 is coated on the bottom surface 301 of the transparent body 306 . In this way, compared with the light emitting diode device shown in FIG. 1B , only a small amount of phosphor can be used to achieve the expected thickness and uniformity of the entire coating area, thereby reducing the waste of phosphor.

FIG. 4 is a cross-sectional view of a package showing the combination of the submount 200 shown in FIG. 2C and the wavelength conversion device 300 shown in FIG. 3 according to an embodiment of the present invention. When the base 200 is combined with the wavelength conversion component 300 , the support portion 209 can be used to support the wavelength conversion component 300 and maintain a gap between the phosphor layer 302 and the surface of the first transparent resin 211 . The gap is preferably between 0.3mm and 1.0mm. When the plurality of LEDs 204 are energized to emit light, the phosphor layer 302 is excited by part of the light from these LEDs to emit light with a wavelength different from that of the LEDs. When the light-emitting device (the combination of the base 200 and the wavelength conversion component 300) is in operation, the through hole 213 on the support part 209 can make the gap between the phosphor layer 302 and the first transparent resin 211 communicate with the external environment to generate convection, In this way, the heat generated by the plurality of LEDs 204 can be transferred to the outside by convection, thereby reducing the temperature of the plurality of LEDs 204 .

FIG. 5 is a cross-sectional view of a package according to another embodiment of the present invention. The difference from the package diagram in FIG. 4 is that the bottom surface 301 of the transparent body 306 in FIG. 5 has a notch. The phosphor layer 302 is filled in the notch, so that the thickness and uniformity of the phosphor layer 302 can be controlled more precisely.

The above is only a preferred embodiment of the utility model, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the utility model, some improvements and modifications can also be made. These improvements and modifications It should also be regarded as the protection scope of the present utility model.

Claims (5)

1. A packaging structure for a light emitting device, comprising: A base, comprising: a substrate; at least one light emitting diode disposed on the substrate; and a first transparent resin for covering and protecting the at least one light emitting diode; A wavelength conversion component, comprising: a transparent body; and a phosphor layer coated on the bottom surface of the transparent body, Wherein when the wavelength conversion component is combined with the base, the phosphor layer is interposed between the substrate and the transparent body, and when the at least one light emitting diode emits light, the phosphor layer is affected by part of the light from the at least one light emitting diode excite to emit light at a wavelength different from that of the at least one light emitting diode; and A support part is arranged between the base and the wavelength conversion component and surrounds the at least one light emitting diode. The support part is used to support the wavelength conversion component and maintain the contact between the phosphor layer and the first transparent resin gaps between surfaces; Wherein a plurality of through holes are formed in the supporting part, and the plurality of through holes are used to make the surface of the phosphor layer and the first transparent resin The gap between them communicates with the external environment to generate convection, thereby reducing the temperature of the at least one LED. 2 . The packaging structure of a light emitting device according to claim 1 , wherein the gap is between 0.3 mm and 1.0 mm. 3 . The packaging structure of a light emitting device according to claim 1 , wherein the bottom surface of the transparent body further comprises a notch for filling the phosphor layer. 4 . 4. The packaging structure of a light emitting device according to claim 1, wherein the transparent body is a hemisphere, any convex surface body or a flat surface body. 5. The packaging structure of a light-emitting device according to claim 1, wherein the thickness of the first transparent resin is no more than 0.3 mm.

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