CN201129667Y

CN201129667Y - Side light type back light module unit using LED light source

Info

Publication number: CN201129667Y
Application number: CNU2007200759864U
Authority: CN
Inventors: 蔡文彬
Original assignee: SVA Group Co Ltd
Current assignee: SVA Group Co Ltd
Priority date: 2007-11-26
Filing date: 2007-11-26
Publication date: 2008-10-08
Anticipated expiration: 2017-11-26

Abstract

The utility model discloses a side light type backlight module which uses an LED light source and mainly comprises a PCB base plate, LED chips and a photoconductive board, wherein a plurality of LED chips are fixed on the PCB base plate with equal spaces, all LED chips on the PCB base plate are integrally packaged with a packaging structure whose shape is a rectangular parallelepiped, wherein the length and the width of the rectangular parallelepiped are same as the photoconductive board, the other surfaces of the packaging structure except a glaring surface which is contacted with the photoconductive board are applied or sticked with reflecting materials, and each LED chip in the packaging structure has a cavity which can accommodate the LED chip. The side light type backlight module which uses the LED light source enables distributed spot light of the LED light source to be changed into a rectangular surface light source which is inosculated with a plane of light incidence of the photoconductive board and enables the side light type backlight module to be equably light-emitted on the plane side of light incidence of the photoconductive board as a CCFL light source.

Description

A kind of side-light type module backlight that uses led light source

Technical field

The utility model relates to a kind of side-light type module backlight of LCD, particularly a kind of side-light type module backlight that uses led light source.

Background technology

At present, LCD has been the main flow in FPD field.Module backlight is one of key part and component of LCD, because LCDs itself is not luminous, the function of module backlight just provides enough brightness and the light source that is evenly distributed, and makes its normally show image.Compare with other back light, the most significant advantage of led light source is that unprecedented color reducibility can be provided.By LED that selects suitable wavelength and the color film that is complementary with it, the color rendition scope in LED-backlit source can reach more than 105% even 120% of NTSC (NTSC) standard.Comparatively speaking, traditional cathode ray tube (CRT) TV has only about 85%, and the LCD TV of CCFL backlight has only 65%～75% especially.In image quality is exactly the demonstration industry of life, and having more, gay colours will be an overwhelming advantage.On service life, LED can reach more than 100,000 hours.To contain fatal mercuryvapour different with CCFL, and LED is a semiconductor solid-state optical source, is a kind of ideal green light source fully.

The side-light type module backlight of the use led light source of prior art is equidistantly to arrange many packaged led light sources (can be approximated to be spot light) and form a row spot light at the incidence surface of LGP (LGP), when forming module backlight, make the exiting surface of LED corresponding with the incidence surface of LGP, will on LGP, produce a clear zone like this with the corresponding position of LED, and the position between two adjacent LED can produce a leg-of-mutton dark space, will form light and dark zone at the incidence surface of LGP like this.In order to improve this light and dark area distribution, at present main solution has light guide plate mesh point to arrange to adjust and in incidence surface and the corresponding position of LED particle of LGP prism structure or groove structure or the like is set, and above method all is difficult to the phenomenon that this clear zone of elimination and dark space distribute alternately.

The utility model content

The purpose of this utility model provides a kind of side-light type module backlight that uses led light source, the problem that clear zone that exists when solving the use led light source and dark space distribute alternately.

For achieving the above object, the side-light type of use led light source of the present utility model module backlight, mainly comprise PCB substrate, led chip and LGP, a plurality of led chips equidistantly are fixed on the PCB substrate, adopt encapsulating structure that all led chips on the described PCB substrate are carried out overall package, be shaped as and the LGP of encapsulating structure has the cuboid of equal length and width, encapsulating structure except with exiting surface that LGP contacts other each faces coatings or paste reflective material; All there is a cavity that can hold described led chip at each led chip place in described encapsulating structure.

Described led chip adopts White-light LED chip or RGB mixed light led chip.

Described encapsulating structure adopts epoxy resin or silica gel material.

Described reflective material is the silverskin or the tunica albuginea of high reflectance.

On the exiting surface of described encapsulating structure the coating or etch the site, the position of described site is corresponding with the position of led chip.

Described cavity is hemispherical or taper shape.

The surface of described cavity constitutes the hemispherical micro-structural for the rhombus micro-structural that is made of a plurality of rhombuses or by a plurality of hemisphericals.

The side-light type of use led light source of the present utility model module backlight becomes the distributed dot light source of led light source and rectangle area source that the LGP incidence surface coincide, makes it can be luminous equably in LGP light inlet side as the CCFL light source.

Description of drawings

Fig. 1 is the perspective diagram of the side-light type module backlight of use led light source of the present utility model;

Fig. 2 is the schematic top plan view of the side-light type module backlight of the use led light source among Fig. 1;

Fig. 3 is the schematic diagram that adopts the side-light type module backlight of RGB mixed light led chip;

Fig. 4 is the site schematic diagram on the exiting surface of encapsulating structure;

Fig. 5 is the surface texture schematic diagram of cavity.

The specific embodiment

Below in conjunction with accompanying drawing utility model is further described:

Fig. 1 is the perspective diagram of the side-light type module backlight of use led light source of the present utility model, Fig. 2 is the schematic top plan view of the side-light type module backlight of the use led light source among Fig. 1, omitted LGP 14 among Fig. 2, as shown in the figure, the side-light type of use led light source of the present utility model module backlight mainly comprises PCB (printed circuit board (PCB)) substrate 10, encapsulating structure 11, cavity 12, led chip 13 and LGP 14.

A plurality of led chips 13 equidistantly are fixed on the PCB substrate 10 by adhesive or scolder, pass through the electrical interconnection of 10 of lead-in wire bonding realization led chip 13 and PCB substrates again, and promptly COB (Chip On Board) chip on board is directly adorned encapsulation technology.PCB substrate 10 adopts heat conductivility good metal base or ceramic matric composites, as aluminium base or cover copper ceramic substrate etc.The face at led chip 13 places applies reflective material on PCB substrate 10, the silverskin or the tunica albuginea of the high reflectance that uses as present CCFL fluorescent tube reflector.Adopt then that all led chips 13 carry out overall package on 11 pairs of PCB substrates 10 of encapsulating structure of materials such as epoxy resin or silica gel.Encapsulating structure 11 be shaped as the cuboid that has equal length and width with LGP 14.The one side that encapsulating structure 11 contacts with LGP 14 is the exiting surface of encapsulating structure 11, encapsulating structure 11 except with exiting surface that LGP 14 contacts other each faces coatings or paste the silverskin or the tunica albuginea of reflective material such as high reflectance, make light energy concentrate on the exiting surface outgoing of encapsulating structure 11.

All there is a cavity 12 that can hold led chip 13 at each led chip 13 place in encapsulating structure 11, and cavity 12 can be hemispherical, taper shape etc.The light energy that cavity 12 is sent led chip 13 spreads more equably.In the cavity 12 can be that vacuum also can charge into inert gas, and cavity 12 is that encapsulating structure 11 is by emptying or caving in formed.

What the led chip 13 shown in Fig. 2 adopted is White-light LED chip, and at the inner surface coating of cavity 12 and the corresponding phosphor material powder of spectrum of led chip 13, the light excitated fluorescent powder that is sent by led chip 13 sends white light.Thereby make led light source launch needed spectrum and corresponding color domain by certain requirement.

Fig. 3 is the schematic diagram that adopts the side-light type module backlight of RGB mixed light led chip.Led chip 13 can also adopt the form of RGB mixed light led chip to be integrated in respectively on the PCB substrate 10, then it is carried out overall package.The compound mode of RGB mixed light led chip can be adjusted as required, as RGGB, RGGBB etc., to obtain needed spectrum and corresponding color domain.

Fig. 4 is the site schematic diagram on the exiting surface of encapsulating structure 11.As shown in the figure, on the exiting surface of encapsulating structure 11, be coated with or etch site 110.The position of site 110 is corresponding with the position of led chip 13, and arranging for around the middle mind-set with led chip 13 in site 110, arranges density by height on earth.Make on the encapsulating structure 11 that light energy further spreads on the led chip 13 pairing positions, light is scattered more equably.

For the light energy that makes led chip 13 further spreads, can do various multi-form micro-structurals to the surface of cavity 12 and handle, as shown in Figure 5, Fig. 5 is the surface texture schematic diagram of cavity 12.Provided the schematic diagram of two kinds of micro-structurals among Fig. 5, the surface that is cavity 12 constitutes hemispherical micro-structural 122 for the rhombus micro-structural 121 that is made of a plurality of rhombuses with by a plurality of hemisphericals, the surface of the cavity 12 of each led chip 13 can be adopted wherein a kind of micro-structural simultaneously, also can adopt different micro-structurals respectively.

The foregoing description only is used to illustrate the utility model; those skilled in the art can make various modifications or replacement to embodiment of the present utility model; and not departing from spirit of the present utility model, these modifications or replacement should be considered as dropping in the protection domain of the present utility model.

Claims

1, a kind of side-light type module backlight that uses led light source, mainly comprise PCB substrate, led chip and LGP, a plurality of led chips equidistantly are fixed on the PCB substrate, it is characterized in that, adopt encapsulating structure that all led chips on the described PCB substrate are carried out overall package, be shaped as and the LGP of encapsulating structure has the cuboid of equal length and width, encapsulating structure except with exiting surface that LGP contacts other each faces coatings or paste reflective material; All there is a cavity that can hold described led chip at each led chip place in described encapsulating structure.

2, the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, described led chip adopts White-light LED chip or RGB mixed light led chip.

3, the side-light type of use led light source as claimed in claim 2 module backlight is characterized in that, when described led chip adopted White-light LED chip, the inner surface of described cavity applied the corresponding phosphor material powder of spectrum with described led chip.

4, the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, described encapsulating structure adopts epoxy resin or silica gel material.

5, the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, described reflective material is the silverskin or the tunica albuginea of high reflectance.

6, the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, on the exiting surface of described encapsulating structure the coating or etch the site, the position of described site is corresponding with the position of led chip.

7, the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, described cavity is hemispherical or taper shape.

8, the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, the surface of described cavity constitutes the hemispherical micro-structural for the rhombus micro-structural that is made of a plurality of rhombuses or by a plurality of hemisphericals.