CN209962188U - High-efficient heat dissipation mainframe box - Google Patents
High-efficient heat dissipation mainframe box Download PDFInfo
- Publication number
- CN209962188U CN209962188U CN201920991039.2U CN201920991039U CN209962188U CN 209962188 U CN209962188 U CN 209962188U CN 201920991039 U CN201920991039 U CN 201920991039U CN 209962188 U CN209962188 U CN 209962188U
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- China
- Prior art keywords
- heat dissipation
- plate
- top plate
- radiator unit
- cooling module
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 44
- 238000001816 cooling Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims 1
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Abstract
The utility model discloses a high-efficiency heat dissipation mainframe box, which comprises a box body, wherein the box body comprises a bottom plate, a top plate, a front plate, a back plate and a mainboard, the mainboard is arranged at the inner side part of the box body, and a hardware component is arranged on the mainboard; the middle part of the top plate and the middle part of the back plate are divided into a left end part and a right end part along the length direction, first heat dissipation holes are formed in the right end parts of the top plate and the back plate, and the inner sides of the left end parts of the top plate and the back plate are connected with the main board; the outer side of the left end part of the top plate is provided with an interface and a switch key which are connected with the hardware component; still include first radiator unit, first radiator unit includes water-cooling module and air-cooling module, and water-cooling module and air-cooling module are mutually supported and are connected, and roof right-hand member inboard and backplate right-hand member inboard all are equipped with first radiator unit, and first radiator unit locates first radiating hole department. The utility model discloses the inboard overall arrangement science of mainframe box is compact, can effectively dispel the heat fast to the quick-witted box body.
Description
Technical Field
The utility model relates to a mainframe box especially relates to a high-efficient heat dissipation mainframe box.
Background
The computer mainframe box generally produces a large amount of heats in the use, in order to reduce the heat that the computer produced, generally install radiator fan on the mainframe box, nevertheless because structural design is unreasonable in the quick-witted incasement, lead to the mainframe box radiating effect poor, need improve urgently.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome the not enough of prior art, provide a high-efficient heat dissipation mainframe box.
In order to solve the technical problem, the utility model provides a technical scheme does:
a high-efficiency heat dissipation mainframe box comprises a box body, wherein the box body comprises a bottom plate, a top plate, a front plate, a back plate and a main plate, the main plate is arranged on the side part of the inner side of the box body, and a hardware assembly is arranged on the main plate; the middle part of the top plate and the middle part of the back plate are divided into a left end part and a right end part along the length direction, the right end parts of the top plate and the back plate are provided with first heat dissipation holes, and the inner sides of the left end parts of the top plate and the back plate are connected with the mainboard; an interface and a switch key which are connected with the hardware component are arranged on the outer side of the left end part of the top plate;
still include first radiator unit, first radiator unit includes water-cooling module and air-cooling module, water-cooling module and air-cooling module are mutually supported and are connected, roof right-hand member portion inboard with backplate right-hand member portion inboard all is equipped with first radiator unit, first radiator unit locates first radiating hole department.
The utility model discloses in, furtherly, be equipped with the second louvre on the front bezel, the front bezel inboard is equipped with second radiator unit.
The utility model discloses in, furtherly, second radiator unit includes three radiator fan, first radiator unit includes two radiator fan.
The utility model discloses in, furtherly, the left end portion outside of backplate be equipped with the power connector that hardware component connects.
The utility model discloses in, furtherly, the bottom plate is equipped with the third louvre.
The utility model discloses in, furtherly, all be equipped with the side cap board on the box both sides face.
The utility model discloses in, furtherly, the bottom plate bottom is equipped with fills up the foot.
Compared with the prior art, the utility model has the advantages of: the main board is provided with most hardware components and wires, the top board is installed in a biased mode, the left end portion of the top board is provided with an interface and a switch key, the bottom board, the top board, the front board, the back board and the main board are enclosed to form a heat dissipation cavity, the right end portions of the top board and the back board are provided with a first heat dissipation hole and a first heat dissipation component, and heat is timely discharged outwards through the heat dissipation cavity; the utility model discloses the inboard overall arrangement science of mainframe box is compact, can effectively dispel the heat fast to the quick-witted box body.
Drawings
FIG. 1 is a schematic structural view of a host type of the present invention;
illustration of the drawings: 1-bottom plate, 2-top plate, 3-front plate, 4-back plate, 5-main plate, 6-first heat dissipation hole, 7-interface, 8-first heat dissipation component, 9-second heat dissipation hole, 10-third heat dissipation hole and 11-foot pad.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully and specifically with reference to the preferred embodiments, but the scope of the present invention is not limited to the specific embodiments described below.
It should be particularly noted that when an element is referred to as being "fixed to, connected to or communicated with" another element, it can be directly fixed to, connected to or communicated with the other element or indirectly fixed to, connected to or communicated with the other element through other intermediate connecting components.
Unless otherwise defined, all terms of art used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present invention.
Examples
As shown in fig. 1
A high-efficiency heat dissipation mainframe box comprises a box body, wherein the box body comprises a bottom plate 1, a top plate 2, a front plate 3, a back plate 4 and a mainboard 5, the mainboard 5 is arranged on the side part of the inner side of the box body, and a hardware assembly is arranged on the mainboard 5; the middle part of the top plate 2 and the middle part of the back plate 4 are divided into a left end part and a right end part along the length direction, the right end parts of the top plate 2 and the back plate 4 are provided with first heat dissipation holes 6, and the inner sides of the left end parts of the top plate 2 and the back plate 4 are connected with a mainboard; an interface 7 and a switch key which are connected with the hardware component are arranged on the outer side of the left end part of the top plate 2, and the interface 7 comprises a USB interface and an audio interface;
still include first radiator unit 8, first radiator unit 8 includes water-cooling module and air-cooled module, and water-cooling module and air-cooled module mutually support and connect, and 2 right-hand member inboard of roof and 4 right-hand member inboard of backplate all are equipped with first radiator unit 8, and 6 departments of first louvre are located to first radiator unit 8.
This quick-witted inboard structural design scientific and reasonable of this embodiment, the radiating effect is good, roof 2 adorns partially, and the left end portion of roof 2 is equipped with interface 7 and switch button, and bottom plate 1, roof 2, front bezel 3, backplate 4 and mainboard 5 enclose to close and form the heat dissipation cavity, are equipped with first louvre 6 and first radiator unit 8 on the right-hand member portion of roof 2 and backplate 4, and the structural design science makes the interior heat of box in time outwards discharge through the heat dissipation cavity.
In this embodiment, the front plate 3 is further provided with a second heat dissipation hole 9, and the inner side of the front plate 3 is provided with a second heat dissipation assembly.
The second heat dissipation assembly includes three heat dissipation fans, and the first heat dissipation assembly 8 includes two heat dissipation fans.
In this embodiment, a power supply connector connected to the hardware component is disposed on the outer side of the left end of the back plate 4.
In this embodiment, the bottom plate 1 is provided with a third heat dissipation hole 10.
In this embodiment, two side surfaces of the box body are provided with side cover plates (not shown in the figure), and the bottom of the bottom plate 1 is provided with a foot pad 11.
Compared with the prior art, the utility model has the advantages of: the main board is provided with most hardware components and wires, the top board is installed in a biased mode, the left end portion of the top board is provided with an interface and a switch key, the bottom board, the top board, the front board, the back board and the main board are enclosed to form a heat dissipation cavity, the right end portions of the top board and the back board are provided with a first heat dissipation hole and a first heat dissipation component, and heat is timely discharged outwards through the heat dissipation cavity; the utility model discloses the inboard overall arrangement science of mainframe box is compact, can effectively dispel the heat fast to the quick-witted box body.
Claims (7)
1. A high-efficiency heat dissipation mainframe box comprises a box body, wherein the box body comprises a bottom plate, a top plate, a front plate, a back plate and a main plate, the main plate is arranged on the side part of the inner side of the box body, and a hardware assembly is arranged on the main plate; the method is characterized in that: the middle part of the top plate and the middle part of the back plate are divided into a left end part and a right end part along the length direction, the right end parts of the top plate and the back plate are provided with first heat dissipation holes, and the inner sides of the left end parts of the top plate and the back plate are connected with the mainboard; an interface and a switch key which are connected with the hardware component are arranged on the outer side of the left end part of the top plate;
still include first radiator unit, first radiator unit includes water-cooling module and air-cooling module, water-cooling module and air-cooling module are mutually supported and are connected, roof right-hand member portion inboard with backplate right-hand member portion inboard all is equipped with first radiator unit, first radiator unit locates first radiating hole department.
2. An efficient heat dissipation mainframe box as claimed in claim 1, wherein said front board has second heat dissipation holes, and a second heat dissipation assembly is disposed inside said front board.
3. A heat dissipation main chassis as recited in claim 2, wherein said second heat dissipation assembly comprises three heat dissipation fans, and said first heat dissipation assembly comprises two heat dissipation fans.
4. An efficient heat dissipation mainframe box as recited in claim 1, wherein a power connection port connected with said hardware component is provided on the outer side of the left end of said back plate.
5. An efficient heat dissipation mainframe box as recited in claim 1, wherein said bottom plate is provided with a third heat dissipation hole.
6. A high efficiency heat dissipating main cabinet as claimed in claim 1, wherein side cover plates are provided on both sides of the cabinet.
7. A heat sink mainframe box as claimed in claim 1 wherein the bottom of said base plate is provided with feet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920991039.2U CN209962188U (en) | 2019-06-27 | 2019-06-27 | High-efficient heat dissipation mainframe box |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920991039.2U CN209962188U (en) | 2019-06-27 | 2019-06-27 | High-efficient heat dissipation mainframe box |
Publications (1)
Publication Number | Publication Date |
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CN209962188U true CN209962188U (en) | 2020-01-17 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201920991039.2U Expired - Fee Related CN209962188U (en) | 2019-06-27 | 2019-06-27 | High-efficient heat dissipation mainframe box |
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CN (1) | CN209962188U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11409210B2 (en) | 2011-08-31 | 2022-08-09 | Brother Kogyo Kabushiki Kaisha | Developing cartridge having coupling and developing roller |
-
2019
- 2019-06-27 CN CN201920991039.2U patent/CN209962188U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11409210B2 (en) | 2011-08-31 | 2022-08-09 | Brother Kogyo Kabushiki Kaisha | Developing cartridge having coupling and developing roller |
US11693334B2 (en) | 2011-08-31 | 2023-07-04 | Brother Kogyo Kabushiki Kaisha | Developing cartridge having coupling and developing roller |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200117 |
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CF01 | Termination of patent right due to non-payment of annual fee |