CN209962089U - Direct-writing type exposure machine - Google Patents
Direct-writing type exposure machine Download PDFInfo
- Publication number
- CN209962089U CN209962089U CN201920726893.6U CN201920726893U CN209962089U CN 209962089 U CN209962089 U CN 209962089U CN 201920726893 U CN201920726893 U CN 201920726893U CN 209962089 U CN209962089 U CN 209962089U
- Authority
- CN
- China
- Prior art keywords
- exposure
- direct
- substrate
- exposure machine
- machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The utility model provides a write-through exposure machine, it includes the base, arranges in parallel arrangement's first portal mechanism, second portal mechanism, step shaft motion subassembly on the base, arrange first portal mechanism's counterpoint mechanism in, arrange second portal mechanism exposure mechanism in on the step shaft motion subassembly, first portal mechanism and second portal mechanism will the base divide into upper plate district, counterpoint district, exposure district and hypoplastron district, the upper plate district is located before the first portal mechanism, the counterpoint district is located first portal mechanism below, the exposure district is located second portal mechanism below, the hypoplastron district with the coincidence of exposure district or partial coincidence or being located second portal mechanism rear, step shaft motion subassembly drives the base plate platform subassembly passes above-mentioned region in proper order. The direct-writing exposure machine is more beneficial to being applied to a full-automatic mode.
Description
Technical Field
The invention relates to the technical field of laser direct-writing exposure machines, in particular to the field of full-automatic direct-writing exposure machines.
Background
The laser direct writing type exposure is used for printing a composition with characteristics on the surface of a substrate, and compared with the traditional image direct transfer technology of exposure of a mask plate, a film negative film and the like, the direct writing type exposure technology has high productivity and high contraposition precision. Has very important function in the field of semiconductor and PCB production.
The direct-writing type exposure machine comprises a single-table direct-writing type lithography machine and a double-table direct-writing type exposure machine, in a time period of the single-table direct-writing type exposure machine, exposure of a single substrate needs to be completed through upper and lower plates, alignment and exposure operation, and exposure needs to be completed through multiple times of step scanning. In order to increase the productivity of the direct-writing type exposure machine, a double-table direct-writing type exposure machine was produced. The double-table direct-writing exposure machine comprises two substrate bearing tables, wherein when one substrate bearing table is used for carrying out upper and lower plate positioning operation, the other substrate bearing table is used for carrying out exposure operation, the two substrate tables can be arranged in parallel and can also be arranged up and down, so that the waiting time of the direct-writing exposure machine can be saved, and the productivity of the direct-writing exposure machine is improved. However, in either the single-stage direct-writing type lithography machine or the double-stage direct-writing type exposure machine, the upper plate is the lower plate, the material needs to be stacked manually, the upper plate operation is performed manually or by a mechanical arm, the substrate is stacked after the lower plate, and then the substrate is pushed to the next process manually, so that the connection between the upper process and the lower process is poor, and the full-automatic operation cannot be applied. In addition, the table top of the substrate needs to be exposed for multiple times in two directions, so that the efficiency of the direct-writing exposure machine is reduced.
Disclosure of Invention
The invention aims to provide a direct-writing photoetching machine which can adapt to automatic operation.
In order to solve the problems, the invention provides a direct-writing exposure machine, which comprises a base, a first gantry mechanism, a second gantry mechanism, a stepping shaft motion assembly, a substrate platform assembly, an alignment mechanism and an exposure mechanism, wherein the first gantry mechanism, the second gantry mechanism, the stepping shaft motion assembly, the substrate platform assembly, the alignment mechanism and the exposure mechanism are arranged on the base in parallel, the first gantry mechanism and the second gantry mechanism divide the base into an upper plate area, a registration area, an exposure area and a lower plate area, the upper plate area is positioned in front of the first gantry mechanism, the alignment area is positioned below the first gantry mechanism, the exposure area is positioned below the second gantry mechanism, the lower plate area is overlapped or partially overlapped with the exposure area or positioned behind the second gantry mechanism, and the stepping shaft motion assembly drives the substrate platform assembly to sequentially penetrate through the areas.
Furthermore, the exposure mechanism comprises a plurality of exposure lenses, and the exposure range of the exposure lenses covers the substrate on the substrate bearing table.
Furthermore, the number of the stepping shaft motion assemblies is two, and the stepping shaft motion assemblies are arranged on the base in parallel.
Furthermore, the substrate platform assembly respectively arranged on the stepping shaft motion assembly comprises a Z-axis motion assembly and a substrate bearing table top, and the substrate bearing table tops are arranged one above the other.
Furthermore, the substrate platform assembly respectively arranged on the stepping shaft motion assembly comprises a Z-axis motion assembly and a substrate bearing table top, and the substrate bearing table tops are arranged side by side in a consistent height.
Furthermore, the substrate platform assembly comprises a Z-axis motion assembly and a substrate bearing table board, and the Z-axis motion assembly drives the substrate bearing table board to move up and down.
Further, the device comprises a control device, wherein the control device controls the alignment mechanism, the exposure mechanism, the stepping shaft motion assembly and the substrate platform assembly, and controls each operation step according to different exposure information.
Further, the control means controls the speed of the stepping shaft moving assembly according to the time of each operation step.
The substrate processing device further comprises a first direct-writing exposure machine and a second direct-writing exposure machine, wherein a plate turnover machine is arranged between the first direct-writing exposure machine and the second direct-writing exposure machine, and the plate turnover machine turns over the substrate exposed by the first direct-writing exposure machine.
Further, the substrate is moved between the first direct-write exposure machine, the plate turnover machine and the second direct-write exposure machine by a transplanting machine, and the transplanting machine can be a mechanical arm or a transmission wheel.
Through the use of the direct-writing exposure machine, the substrate is subjected to plate loading operation from one side of the direct-writing exposure machine, and is subjected to plate unloading operation from the other side of the direct-writing exposure machine, so that the direct-writing exposure machine is more favorably applied to a full-automatic mode, and an exposure system of the direct-writing exposure machine is used for carrying out one-time exposure on the substrate, the substrate bearing table board is prevented from being moved for multiple times to be exposed, the efficiency can be improved, the direct-writing exposure machine can be more applied to a double-table-board, and the efficiency of the double-table-board direct-writing exposure machine is ensured.
Drawings
FIG. 1 is a top view of the direct write exposure machine of the present invention.
FIG. 2 is a schematic structural diagram of a double-mesa direct-writing exposure machine of the present invention.
Fig. 3 is a side view of the double-mesa direct write exposure machine of the present invention.
FIG. 4 is a schematic structural diagram of a double-side exposed double-mesa direct-writing exposure machine of the present invention.
Fig. 5 is a side view of the double-side exposed double-table direct write exposure machine of the present invention.
Detailed Description
In order that the objects, aspects and advantages of the invention will become more apparent, the invention will be described by way of example only, and in connection with the accompanying drawings.
As shown in fig. 1, the direct-writing exposure machine of the present invention comprises a base 1, a first gantry mechanism 2, a second gantry mechanism 3, a stepping axis motion assembly 4, a substrate platform assembly 5 and a control device (not shown) which are arranged on the base in parallel, an alignment mechanism 6 arranged on the first gantry mechanism 2, and an exposure mechanism 7 arranged on the second gantry mechanism 3. In this embodiment, the base 1 is a marble base, the first gantry mechanism 2 and the second gantry mechanism 3 divide the base 1 into an upper plate area 10, a registration area 11, an exposure area 12 and a lower plate area 13, the upper plate area 10 is located in front of the first gantry mechanism 2, the registration area 11 is located below the first gantry mechanism 2, the exposure area 12 is located below the second gantry mechanism 3, and the lower plate area 13 is located behind the second gantry mechanism 3 or coincides with or partially coincides with the exposure area 12. The stepping shaft motion assembly 4 passes through the upper plate area 10, the alignment area 11, the exposure area 12 and the lower plate area 13, and the stepping shaft motion assembly 4 can drive the substrate platform assembly 5 to sequentially pass through the upper plate area 10, the alignment area 11, the exposure area 12 and the lower plate area 13.
The direct-writing exposure machine can adopt a single-table-board mode and a double-table-board mode, and preferably adopts a double-table-board mode.
As shown in fig. 2-3, for example, in a dual-stage direct-write lithography machine, the number of the spindle movement assemblies 4 is two, and the spindle movement assemblies include guide rails 40 arranged in parallel on the base 1, and a stepping spindle movement module 41 moving on the guide rails 40. The substrate platform assembly 5 is respectively installed on the stepping shaft motion module 41 of the stepping shaft motion assembly 4, the substrate platform assembly 5 comprises a Z-axis motion assembly 50 and a substrate bearing table 51, the Z-axis motion assembly 50 is arranged on the stepping shaft motion assembly 4, and the stepping shaft motion assembly 4 can drive the Z-axis motion assembly 50 to move back and forth to pass through the upper plate area 10, the alignment area 11, the exposure area 12 and the lower plate area 13. The substrate supporting table 51 is fixedly connected to the Z-axis moving assembly 50, the substrate supporting table 51 is disposed in two layers one above the other, or the substrate supporting tables 51 may be disposed side by side at the same height, preferably, the substrate supporting table 51 is disposed in two layers one above the other. The Z-axis moving assembly 50 can drive the substrate bearing table 51 to move up and down within a small range to align with the exposure focal plane, or move up and down within a large range, so as to avoid collision between the two substrate bearing table 51. In this embodiment, the substrate bearing table 51 is fixed on the Z-axis cantilever of the Z-axis moving assembly 50 by screws, so that the levelness and flatness of the substrate bearing table 51 can be ensured to be good, and the substrate bearing table 51 is provided with a hollow sucker structure, so that the substrate can be firmly sucked, and the exposure quality can be ensured. The control device controls the alignment mechanism 6, the exposure mechanism 7, the stepping axis moving unit 4, and the substrate stage unit 5, controls each operation step according to different exposure information, and controls the speed of the stepping axis moving unit 4 according to the time of each operation step.
Specifically, in the present embodiment, the alignment mechanism 6 includes an alignment axis moving assembly mounted on the first gantry mechanism 2, the alignment axis moving assembly includes a linear guide 60 and an alignment system 61, and the alignment system 61 includes a CCD camera, an alignment lens, and an illumination light source.
Specifically, in the present embodiment, the exposure mechanism 7 includes a plurality of exposure lenses 70, and the exposure range of the exposure lenses 70 covers the substrate on the substrate bearing table 51, so that the substrate can be exposed at one time by the exposure mechanism 7, and the substrate bearing table 51 does not move in two directions to perform multiple exposures.
During use, the exposure steps for each substrate are as follows:
(1) and (3) plate loading operation: the substrate after the previous step is placed on the substrate carrying table 51 by the transplanter 400, and the Z-axis moving assembly 50 drives the substrate carrying table 51 to be raised to a high position;
(2) and (3) alignment operation: the substrate bearing table 51 moves to the lower part of the alignment system 61 for alignment operation, and according to the alignment information, the Z-axis motion assembly 50 drives the substrate bearing table 51 to move up or down along the Z-axis to complete the alignment operation;
(3) and (3) exposure operation: the stepping shaft motion assembly 4 drives the substrate bearing table 51 to move to the initial position of the exposure mechanism 7, and the exposure mechanism 7 adjusts digital graphic information according to the alignment information to perform one-time exposure on the substrate;
(4) and (3) carrying out a plate-making operation: after the exposure is completed, the substrate bearing table 51 moves to the lower plate area 13, the Z-axis motion assembly 50 drives the substrate bearing table 51 to lower, and the transplanter 400 sends the substrate to the next process;
(5) and (3) returning operation: the stepping shaft moving assembly 4 drives the substrate supporting table 51 to return to the initial position.
Preferably, how the double-table-board moves relatively is determined according to the time of each operation step, and the exposure of the substrate is completed with the maximum efficiency.
In the five steps, the exposure time is relatively long and is relatively difficult to adjust, the time of other steps is relatively controllable, and how the two substrate bearing tables move relatively is determined according to the time relationship between the exposure time and the other four steps.
The following description is divided into several cases
In this case, when the exposure time is the same as the time of the other four steps, the second substrate supporting table starts to perform the plate loading operation when the exposure time of the first substrate supporting table is half. As shown in the following table
TABLE 1
The exposure time is one half of the sum of the other four steps, and the time of the upper plate and the alignment is the same as the time of the lower plate and the return
In this case, it may be set that the second substrate holding stage starts the loading operation when the first substrate holding stage starts the exposure. As shown in the following table
TABLE 2
(III) the exposure time is three-quarters of the sum of the other four step times
In this case, it may be set that the second substrate stage completes the loading and positioning operations at the end of the exposure of the first substrate carrying stage. As shown in the following table
TABLE 3
(IV) the exposure time is longer than the time of the other four steps
In this case, there is necessarily a waiting period to avoid collision of the two substrate carrying mesas. As shown in the following table, the first substrate support table starts at time T3
TABLE 4
Therefore, for the double-mesa direct-writing exposure machine, preferably, the exposure time is less than the sum of the time required by the other four steps, so that the utilization rate of the double-mesa direct-writing exposure machine can be improved. The double-table direct-writing exposure machine adopts one-time exposure operation, so that the exposure time is greatly shortened, the exposure time can be shorter than the time required by the other four steps, and the efficiency of the double-table direct-writing exposure machine is improved.
For substrates exposed on both sides, a fully automated direct write exposure machine is more desirable, and a double-table direct write exposure machine capable of performing double-sided exposure is described in detail below.
As shown in fig. 4 to 5, the double-side exposed double-mesa direct-writing exposure machine includes a first direct-writing exposure machine 100 and a second direct-writing exposure machine 200, a plate turnover machine is disposed between the first direct-writing exposure machine and the second direct-writing exposure machine, the plate turnover machine performs plate turnover operation on a substrate exposed by the first direct-writing exposure machine, the substrate is transferred from the first direct-writing exposure machine to the plate turnover machine through a transfer machine 400, and is transferred from the plate turnover machine to the second direct-writing exposure machine through the transfer machine 400.
When the exposure device is used, the substrate is exposed on one side of the first direct-writing exposure machine 100, after the exposure operation is completed, the transplanting machine 400 grabs the substrate and places the substrate on the plate turnover machine 300, the plate turnover machine 300 turns over the substrate to enable the unexposed side of the substrate to face upwards, the transplanting machine 400 grabs the substrate and places the substrate on the second direct-writing exposure machine 200, the second direct-writing exposure machine 200 exposes the unexposed side of the substrate, and after the exposure operation is completed, the transplanting machine 400 moves to the next process. The transplanter can be a mechanical arm or a transmission wheel.
Through the use of the direct-writing exposure machine, the substrate is subjected to plate loading operation from one side of the direct-writing exposure machine, and is subjected to plate unloading operation from the other side of the direct-writing exposure machine, so that the direct-writing exposure machine is more favorably applied to a full-automatic mode, and an exposure system of the direct-writing exposure machine is used for carrying out one-time exposure on the substrate, the substrate bearing table board is prevented from being moved for multiple times to be exposed, the efficiency can be improved, the direct-writing exposure machine can be more applied to a double-table-board, and the efficiency of the double-table-board direct-writing exposure machine is ensured.
Claims (10)
1. The utility model provides a direct-write exposure machine, its includes the base, arranges in parallel arrangement's first portal mechanism, second portal mechanism, step shaft motion subassembly on the base, arrange in base plate platform subassembly on the step shaft motion subassembly, arrange first portal mechanism's counterpoint mechanism in, arrange second portal mechanism exposure mechanism in, its characterized in that: the base is divided into an upper plate area, a registration area, an exposure area and a lower plate area by the first gantry mechanism and the second gantry mechanism, the upper plate area is located in front of the first gantry mechanism, the registration area is located below the first gantry mechanism, the exposure area is located below the second gantry mechanism, the lower plate area is overlapped or partially overlapped with the exposure area or located behind the second gantry mechanism, and the substrate platform assembly is driven by the stepping shaft motion assembly to sequentially pass through the areas.
2. A direct write exposure machine according to claim 1, characterized in that: the exposure mechanism comprises a plurality of exposure lenses, and the exposure range of the exposure lenses covers the substrate on the substrate bearing table.
3. A direct write exposure machine according to claim 1, characterized in that: the number of the stepping shaft motion assemblies is two, and the stepping shaft motion assemblies are arranged on the base in parallel.
4. A direct write exposure machine according to claim 3, characterized in that: the substrate platform assembly respectively arranged on the stepping shaft motion assembly comprises a Z-axis motion assembly and a substrate bearing table top, and the substrate bearing table tops are arranged one above the other.
5. A direct write exposure machine according to claim 3, characterized in that: the substrate platform assembly is respectively arranged on the stepping shaft motion assembly and comprises a Z-axis motion assembly and a substrate bearing table board, and the substrate bearing table boards are arranged side by side in a consistent height.
6. A direct write exposure machine according to claim 1, characterized in that: the substrate platform assembly comprises a Z-axis motion assembly and a substrate bearing table board, and the Z-axis motion assembly drives the substrate bearing table board to move up and down.
7. A direct write exposure machine according to claim 1, characterized in that: the device comprises a control device, wherein the control device controls the alignment mechanism, the exposure mechanism, the stepping shaft motion assembly and the substrate platform assembly, and controls each operation step according to different exposure information.
8. A direct write exposure machine according to claim 7, characterized in that: the control device controls the speed of the stepping shaft motion assembly according to the time of each operation step.
9. A double-sided exposure direct-write exposure machine comprising the direct-write exposure machine according to any one of claims 1 to 8, characterized in that: the device comprises a first direct-writing exposure machine and a second direct-writing exposure machine, wherein a plate turnover machine is arranged between the first direct-writing exposure machine and the second direct-writing exposure machine, and the plate turnover machine turns over a substrate exposed by the first direct-writing exposure machine.
10. A double-sided exposure direct-write exposure machine according to claim 9, characterized in that: the substrate is moved among the first direct-write exposure machine, the plate turnover machine and the second direct-write exposure machine through a transplanting machine, and the transplanting machine can be a mechanical arm or a transmission wheel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920726893.6U CN209962089U (en) | 2019-05-21 | 2019-05-21 | Direct-writing type exposure machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920726893.6U CN209962089U (en) | 2019-05-21 | 2019-05-21 | Direct-writing type exposure machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209962089U true CN209962089U (en) | 2020-01-17 |
Family
ID=69245955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920726893.6U Active CN209962089U (en) | 2019-05-21 | 2019-05-21 | Direct-writing type exposure machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209962089U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112415859A (en) * | 2020-10-23 | 2021-02-26 | 江苏迪盛智能科技有限公司 | Exposure machine and pre-feeding method thereof |
-
2019
- 2019-05-21 CN CN201920726893.6U patent/CN209962089U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112415859A (en) * | 2020-10-23 | 2021-02-26 | 江苏迪盛智能科技有限公司 | Exposure machine and pre-feeding method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110187608A (en) | A kind of exposure method of write-through exposure machine | |
| CN108873622B (en) | Double-side exposure machine with double loading parts and double-side exposure method | |
| CN212433581U (en) | Photoetching system and substrate handover system thereof | |
| CN209962089U (en) | Direct-writing type exposure machine | |
| CN109240048A (en) | A kind of multistation work stage single exposure molding direct-write photoetching system | |
| CN109143797A (en) | A kind of dual stage face write-through exposure machine and its exposure method | |
| CN211741826U (en) | Double-table-board direct-writing exposure machine | |
| CN215219413U (en) | Photoetching machine | |
| CN111221223B (en) | Inner-layer plate exposure machine and marking method thereof | |
| CN210803974U (en) | Exposure machine | |
| CN111273521A (en) | Automatic material loading and unloading single-table-board double-station exposure machine | |
| CN105487349A (en) | Laser direct writing system realizing vertical double-side exposure and based on DMD (digital micromirror device) projection light paths | |
| CN106325007A (en) | Multi-scanning-driving-shaft movable polygon-prism light-path directly-writing device | |
| CN113848683A (en) | Multi-station digital photoetching device and method based on vertical double-mesa structure | |
| CN213023938U (en) | Double-sided exposure device | |
| CN217787600U (en) | Photovoltaic cell piece metallization exposure device | |
| CN114077162A (en) | Photoetching system, substrate handover system and exposure method | |
| JP2008306109A (en) | Substrate transfer mechanism for exposing device | |
| CN113189850A (en) | Double-sided exposure device for RTR flexible printed circuit board | |
| JP2013113767A (en) | Thickness measuring instrument and thickness measurement method | |
| CN216387740U (en) | Lifting type photoetching machine | |
| JP5099318B2 (en) | Exposure apparatus and exposure method | |
| JP4860966B2 (en) | Exposure pattern transfer method and exposure apparatus | |
| CN203689009U (en) | Contraposition exposure rack applicable to exposure machine | |
| CN218848570U (en) | Double-table laser direct writing exposure equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215026 Room 102, building C5, No. 192, Tinglan lane, Suzhou Industrial Park, Jiangsu Province Patentee after: Yuanzhuo Micro Nano Technology (Suzhou) Co.,Ltd. Address before: 215026 Room 102, building C5, No. 192, Tinglan lane, Suzhou Industrial Park, Jiangsu Province Patentee before: ADVANCED MICRO OPTICS.INC |
|
| CP01 | Change in the name or title of a patent holder |