CN209911692U - Binding structure and display device - Google Patents
Binding structure and display device Download PDFInfo
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- CN209911692U CN209911692U CN201920873002.XU CN201920873002U CN209911692U CN 209911692 U CN209911692 U CN 209911692U CN 201920873002 U CN201920873002 U CN 201920873002U CN 209911692 U CN209911692 U CN 209911692U
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- 239000002313 adhesive film Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
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- 238000010295 mobile communication Methods 0.000 description 1
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Abstract
The utility model discloses a binding structure and display device, wherein, binding structure includes cover brilliant film and a plurality of second pin, cover brilliant film is used for binding the setting with the display panel part overlap of display device, cover brilliant film is equipped with a plurality of first pins in binding regional correspondence, a plurality of first pins include first standard pin, a plurality of second pins are used for setting up in the binding region of display panel, a plurality of second pins include second standard pin, wherein, a plurality of first pins still include the tensile pin, the tensile pin is the area increase setting relative to first standard pin; and/or the plurality of second pins further comprise tensile pins, and accordingly the tensile pins are arranged in an area increasing mode relative to the second standard pins, the area of the pins arranged in the binding area is increased, the tensile resistance between the display panel and the chip on film is improved, and the binding quality between the chip on film and the display panel is further improved.
Description
Technical Field
The utility model relates to a flat panel display technical field, in particular to bind structure and display device.
Background
With the development of the liquid crystal display field, the liquid crystal display has been widely applied in the fields of television, mobile communication, medical treatment, etc., the connection between the display panel and the Printed Circuit Board (PCBA) is through a Chip On Film (COF), and they are bound by an anisotropic conductive Film, which may cause the situation of loose binding and easy peeling.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a bind structure and display device aims at improving the quality of binding between cover brilliant film and the display panel.
In order to achieve the above object, the utility model provides a binding structure, include:
the chip on film is used for being overlapped and bound with a display panel part of the display device, a plurality of first pins are correspondingly arranged in a binding area of the chip on film, and the plurality of first pins comprise first standard pins; and the number of the first and second groups,
the plurality of second pins are used for being arranged in a binding area of the display panel and comprise second standard pins;
the first pins further comprise tensile pins, and the tensile pins are arranged in an area increasing mode relative to the first standard pins; and/or the plurality of second pins further comprise tensile pins, and correspondingly, the tensile pins are arranged in an area increasing mode relative to the second standard pins.
Optionally, the plurality of second pins include a tensile pin, and the tensile pin is arranged to be increased in width relative to the second standard pin.
Optionally, the width of the second standard pin is B1The distance between two adjacent second standard pins is B2The width of the tensile pin is W, wherein: w ═ n × B1+(n-1)*B2And n is the number of the second standard pins.
Optionally, W ═ 2B1+B2。
Optionally, the tensile pins are disposed at two opposite ends of the binding region in the length direction.
Optionally, at least two tensile pins are arranged and are respectively arranged at two opposite ends of the binding region in the length direction; or,
the tensile pins are arranged on the display panel, and one ends of the tensile pins, which are close to the middle position of the chip on film, are arranged in a chamfer way at the side angles departing from the middle position of the binding region; or,
the tensile pins are arranged on the chip on film, and one end, close to the middle position of the display panel, of each tensile pin is arranged in a chamfer mode at a side angle deviating from the middle position of the binding area.
Optionally, the chamfer comprises a straight chamfer section.
Optionally, the width of the tensile pin is W, and the length of the tensile pin is L;
the linear chamfer section has a span L/4 corresponding to the length direction of the tensile pin;
the linear chamfer section has a span in the width direction of the tensile pin of W/4.
The utility model discloses still provide a display device, display device is including binding structure, binding structure includes:
the chip on film is used for being overlapped and bound with a display panel part of the display device, a plurality of first pins are correspondingly arranged in a binding area of the chip on film, and the plurality of first pins comprise first standard pins; and the number of the first and second groups,
the plurality of second pins are used for being arranged in a binding area of the display panel and comprise second standard pins;
the first pins further comprise tensile pins, and the tensile pins are arranged in an area increasing mode relative to the first standard pins; and/or the plurality of second pins further comprise tensile pins, and correspondingly, the tensile pins are arranged in an area increasing mode relative to the second standard pins.
Optionally, the method further comprises:
the display panel is bound with the chip on film, and a plurality of second pins are arranged in a binding area of the display panel;
the printed circuit board is arranged at one end of the chip on film, which is opposite to the display panel; and the number of the first and second groups,
and the anisotropic conductive adhesive film is arranged between the display panel and the chip on film and corresponds to the binding area, and the anisotropic conductive adhesive film is also arranged between the printed circuit board and the chip on film.
The utility model provides an among the technical scheme, display panel with the cover chip film binds the setting be provided with the tensile pin on display panel and/or the cover chip film, the relative standard pin of tensile pin is the area increase setting, has increased the pin and has bound the area that regional set up, has improved display panel with stretching resistance between the cover chip film, and then has improved bind the quality between cover chip film and the display panel.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of an embodiment (including a first embodiment and a second embodiment) of a binding structure provided in the present invention;
FIG. 2 is a schematic top view of a first embodiment of the binding structure of FIG. 1;
FIG. 3 is an enlarged schematic view of detail A of FIG. 2;
FIG. 4 is a schematic top view of a second embodiment of the binding structure of FIG. 1;
FIG. 5 is an enlarged schematic view of detail B of FIG. 4;
fig. 6 is a schematic top view of the tensile lead in fig. 5.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a display device, display device can be computer monitor or TV etc. and following will with display device is computer monitor introduces for the example, display device includes binding structure, as long as include binding structure display device all is the utility model discloses a content, fig. 1 to fig. 6 are the utility model provides a binding structure's embodiment.
Referring to fig. 1 to 3, the bonding structure 100 includes a chip on film 1 and a plurality of second pins 21, the chip on film 1 is used for being partially overlapped and bonded with a display panel 2 of a display device, the chip on film 1 is correspondingly provided with a plurality of first pins 11 in a bonding area, the plurality of first pins 11 include first standard pins 11a, the plurality of second pins 21 are used for being disposed in the bonding area of the display panel 2, the plurality of second pins 21 include second standard pins 21a, wherein the plurality of first pins 11 further include tensile pins 4, and the tensile pins 4 are arranged in an area increasing manner relative to the first standard pins 11 a; and/or, the plurality of second pins 21 further include a tensile pin 4, and accordingly, the tensile pin 4 is arranged in an area increasing manner relative to the second standard pin 21 a.
The utility model provides an among the technical scheme, display panel 2 with flip chip film 1 binds the setting display panel 2 and/or flip chip film 1 is last to be provided with tensile pin 4, the relative standard pin of tensile pin 4 is the area increase setting, has increased the pin and is binding the area that regional 3 set up, has improved display panel 2 with stretch resistance between flip chip film 1, and then has improved flip chip film 1 and display panel 2 between bind the quality.
It should be noted that, in the embodiment of the present invention, the specific manner of the tensile pin 4 relative to the standard pin area increase is not limited, for example, the width may be increased, the length is increased or the local area is increased, specifically, the second pin 21 includes the tensile pin 4, the tensile pin 4 is arranged in the width increasing manner relative to the second standard pin 21a, the tensile area is increased by increasing the width, the structure is simple, the implementation is easy, in addition, the tensile pin 4 is a non-standard pin, and the forming process and the cost are considered, the tensile pin 4 is arranged on the display panel 2, and the forming is easy.
The utility model discloses in, refer to the width of a plurality of second standard pins 21a and do tensile pin 4's width, specifically, second standard pin 21 a's width is B1The distance between two adjacent second standard pins 21a is B2The width of the tensile pin 4 is W, wherein: w ═ n × B1+(n-1)*B2And n is the number of the second standard pins 21a, that is, the width of the pull-out pin 4 is the sum of the width between the second standard pins 21a and the gap between the second standard pins, so that the pull-out pin 4 can be more easily disposed without affecting the disposition of the second standard pins 21a, and in an optional embodiment, W is 2B1+B2The width of the tensile lead 4 is equal to the sum of the widths of the two second standard leads 21a and the gap therebetween.
The utility model discloses in, do not restrict the number of tensile pin 4, for example, can set up to 1, 2, n (n is more than or equal to 2) and so on, satisfying second pin 21 reaches under the condition of the electric conductance number of first pin 11, can set up as much as possible the number of tensile pin 4 improves the quality of binding between chip on film 1 and display panel 2.
The utility model discloses in, do not restrict the concrete position that tensile pin 4 set up, for example, can be bind regional 3 optional position, consider display panel 2 with follow when flip chip package 1 peels off bind regional 3's both ends and begin to peel off, set up tensile pin 4 to this region, specifically, tensile pin 4 locates bind regional 3 ascending relative both ends in length direction, improved flip chip package 1 and the quality of binding between display panel 2.
Further, when the display panel 2 and the flip chip film 1 are peeled off, the peeling force generated in the peeling process is concentrated at a point, in the present invention, the peeling force is dispersed, specifically, referring to fig. 4 to 6, when the tensile pins 4 are arranged on the display panel 2, one end of each tensile pin 4 close to the middle of the flip chip film 1 is arranged in a chamfer way at one side angle departing from the middle of the binding region 3, when the tensile pins 4 are arranged on the chip on film 1, one end of each tensile pin 4, which is close to the middle position of the display panel 2, is arranged in a chamfer at a side angle departing from the middle position of the binding region 3, so that the peeling force is dispersed, the tensile resistance between the display panel 2 and the chip on film 1 is improved, and the binding quality between the chip on film 1 and the display panel 2 is further improved.
The utility model discloses in, do not restrict the concrete form of chamfer, for example, can be circular chamfer, sharp chamfer or the combination of circular and sharp chamfer and so on form, specifically, the chamfer includes sharp chamfer section, should set up the form simply, be convenient for take shape.
Specifically, referring to fig. 4, the width of the tensile pin 4 is W, the length of the tensile pin 4 is L, the span of the straight chamfer section corresponding to the length direction of the tensile pin 4 is L/4, and the span of the straight chamfer section corresponding to the width direction of the tensile pin 4 is W/4, so that the peeling force is well dispersed on the basis of ensuring the appropriate area of the tensile pin 4, the tensile force between the display panel 2 and the flip chip film 1 is improved, and the binding quality between the flip chip film 1 and the display panel 2 is further improved.
It should be noted that the display device includes the above-mentioned binding structure 100, that is, includes all technical features of the above-mentioned binding structure 100, and has all technical effects brought by the above-mentioned technical features, in addition, the display device further includes a display panel 2, a printed circuit board 5 and an anisotropic conductive film 6, the display panel 2 is bound with the flip-chip film 1, the binding area of the display panel 2 is provided with a plurality of second pins 21, the printed circuit board 5 is arranged on one end of the flip-chip film 1 opposite to the display panel 2, the anisotropic conductive film 6 is arranged between the display panel 2 and the flip-chip film 1 and is arranged corresponding to the binding area 3, the anisotropic conductive film 6 is also arranged between the printed circuit board 5 and the flip-chip film 1, the area of the tensile pins 4 is increased, namely, the contact area between the pins and the anisotropic conductive film 6 is increased, the binding force between the pins and the anisotropic conductive film 6 is improved, and the binding quality between the chip on film 1 and the display panel 2 is improved.
The above is only the optional embodiment of the present invention, and not therefore the scope of the present invention, all of which are in the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the protection scope of the present invention.
Claims (10)
1. A binding structure for a display device, comprising:
the chip on film is used for being overlapped and bound with a display panel part of the display device, a plurality of first pins are correspondingly arranged in a binding area of the chip on film, and the plurality of first pins comprise first standard pins; and the number of the first and second groups,
the plurality of second pins are used for being arranged in a binding area of the display panel and comprise second standard pins;
the first pins further comprise tensile pins, and the tensile pins are arranged in an area increasing mode relative to the first standard pins; and/or the plurality of second pins further comprise tensile pins, and correspondingly, the tensile pins are arranged in an area increasing mode relative to the second standard pins.
2. The bonding structure of claim 1, wherein the plurality of second leads includes a tensile lead, the tensile lead being disposed at an increased width relative to the second standard lead.
3. The bonding structure of claim 2, wherein the second standard pin has a width of B1The distance between two adjacent second standard pins is B2The width of the tensile pin is W, wherein: w ═ n × B1+(n-1)*B2And n is the number of the second standard pins.
4. The binding structure of claim 3, wherein W-2B1+B2。
5. The bonding structure of claim 1, wherein the tensile leads are disposed at opposite ends of the bonding region in a length direction.
6. The bonding structure of claim 5, wherein at least two tensile leads are disposed at two opposite ends of the bonding region in the length direction; or,
the tensile pins are arranged on the display panel, and one ends of the tensile pins, which are close to the middle position of the chip on film, are arranged in a chamfer way at the side angles departing from the middle position of the binding region; or,
the tensile pins are arranged on the chip on film, and one end, close to the middle position of the display panel, of each tensile pin is arranged in a chamfer mode at a side angle deviating from the middle position of the binding area.
7. The binding structure of claim 6, wherein the chamfer comprises a straight chamfer segment.
8. The bonding structure of claim 7, wherein the tensile leg has a width W and a length L;
the linear chamfer section has a span L/4 corresponding to the length direction of the tensile pin;
the linear chamfer section has a span in the width direction of the tensile pin of W/4.
9. A display device characterized by comprising the binding structure according to any one of claims 1 to 8.
10. The display device according to claim 9, further comprising:
the display panel is bound with the chip on film, and a plurality of second pins are arranged in a binding area of the display panel;
the printed circuit board is arranged at one end of the chip on film, which is opposite to the display panel; and the number of the first and second groups,
and the anisotropic conductive adhesive film is arranged between the display panel and the chip on film and corresponds to the binding area, and the anisotropic conductive adhesive film is also arranged between the printed circuit board and the chip on film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920873002.XU CN209911692U (en) | 2019-06-11 | 2019-06-11 | Binding structure and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920873002.XU CN209911692U (en) | 2019-06-11 | 2019-06-11 | Binding structure and display device |
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| CN209911692U true CN209911692U (en) | 2020-01-07 |
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| CN201920873002.XU Active CN209911692U (en) | 2019-06-11 | 2019-06-11 | Binding structure and display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111176037A (en) * | 2020-02-26 | 2020-05-19 | 深圳市华星光电半导体显示技术有限公司 | Flip chip film set, flip chip film set binding method and display device |
| WO2022032718A1 (en) * | 2020-08-11 | 2022-02-17 | 武汉华星光电技术有限公司 | Display panel and display device |
-
2019
- 2019-06-11 CN CN201920873002.XU patent/CN209911692U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111176037A (en) * | 2020-02-26 | 2020-05-19 | 深圳市华星光电半导体显示技术有限公司 | Flip chip film set, flip chip film set binding method and display device |
| WO2022032718A1 (en) * | 2020-08-11 | 2022-02-17 | 武汉华星光电技术有限公司 | Display panel and display device |
| JP2022547752A (en) * | 2020-08-11 | 2022-11-16 | 武漢華星光電技術有限公司 | display panel and display device |
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