CN209358533U

CN209358533U - Shielding case, wireless communication components, radar and moveable platform

Info

Publication number: CN209358533U
Application number: CN201920255933.3U
Authority: CN
Inventors: 唐照成; 贺翔; 黄稀荻; 王春明
Original assignee: Shenzhen Dajiang Innovations Technology Co Ltd
Current assignee: Shenzhen Dajiang Innovations Technology Co Ltd
Priority date: 2019-02-28
Filing date: 2019-02-28
Publication date: 2019-09-06
Anticipated expiration: 2029-02-28

Abstract

The utility model provides a kind of shielding case, wireless communication components, radar and moveable platform.Wherein, the shielding case (10) covers on the mainboard (10) of radar (200), shielding case is the fixing seat of mainboard, for fixing mainboard, the shielding case includes: conductive part (21), between the radio frequency transmitter circuitry (22) and RF receiving circuit (23) of mainboard；Ontology (11) and set on ontology and it is capable of conductive contact portion (12), the shape of contact portion and conductive part matches, for being connected with conductive part；Contact portion has side wall and encloses the fluting for setting and being formed by side wall；And compliant conductive structure, it is filled in fluting, and contacted with side wall；When mainboard is fixedly connected with shielding case, contact portion is provide with conductive part, and conductive part is in sealing contact by compliant conductive structure and contact portion.The shielding case of the utility model ensures that the consistency of effectiveness is good, while can flexibly be adapted to actual circuit cabling.

Description

Shielding case, wireless communication assembly, radar and movable platform

Technical Field

The utility model relates to an electromagnetic shield field especially relates to a shield cover, wireless communication subassembly, radar and movable platform.

Background

Along with the diversification of application scenes, the requirement on the performance of the radar is higher and higher, the detection capability of the radar on a long-distance target is improved, and a short-distance target needs to be well detected. However, due to the coupling of the receiving and transmitting antenna, the radio frequency wiring and the radio frequency device, the receiving and transmitting signals generate large low frequency leakage (noise), the signal to noise ratio of the system is greatly reduced, and the short-distance detection performance of the radar is seriously affected. The shielding is to perform metal isolation between two spatial regions to control the induction and radiation of an electric field, a magnetic field and electromagnetic waves from one region to the other region, and the shielding cover is added on the radio frequency circuit part to greatly reduce the transceiving coupling energy, thereby reducing the low frequency leakage (noise).

The traditional technology has the problems that the shielding cover and the radio frequency circuit board are easy to deform after being assembled, and the consistency of the shielding effect is not ensured well; and the shape of the shielding case is generally regular polygon, which can not flexibly adapt to the actual circuit wiring, resulting in unsatisfactory electromagnetic shielding effect.

SUMMERY OF THE UTILITY MODEL

The utility model provides a shield cover, wireless communication subassembly, radar and movable platform.

Specifically, the utility model discloses a realize through following technical scheme:

according to the utility model discloses an aspect provides a shield cover, and the cover is located on the mainboard of radar, the shield cover does the fixing base of mainboard is used for fixing the mainboard, include:

the conductive part is arranged between the radio frequency transmitting circuit and the radio frequency receiving circuit of the mainboard;

the contact part is matched with the shape of the conductive part and is used for being connected with the conductive part; the contact part is provided with a side wall and a slot formed by the side wall in an enclosing way; and

the flexible conductive structure is filled in the open groove and is in contact with the side wall;

when the mainboard is fixedly connected with the shielding case, the contact part covers the conductive part, and the conductive part is in sealing contact with the contact part through the flexible conductive structure.

Optionally, the flexible conductive structure is provided with an accommodating groove;

when the main board is fixedly connected with the shielding case, the conductive part is accommodated in the accommodating groove.

Optionally, the depth of the accommodating groove is 0.6mm ± 0.05 mm; alternatively, the holding tank is cylindrical, U-shaped or V-shaped.

Optionally, the flexible conductive structure is a conductive adhesive structure; or the conductive part is in press fit with the flexible conductive structure.

Optionally, the contact portion is integrally formed with the body; or the contact part is hermetically connected with the body through threaded connection, snap connection or gluing.

Optionally, the slot is cylindrical, U-shaped or V-shaped; or the height of the groove is 3mm +/-0.1 mm; or the width of the slot is 6mm +/-0.5 mm; or the thickness of the side wall is 1.2mm plus or minus 0.1 mm; or, the side wall is a continuous structure; or the side wall comprises a plurality of sections, and the side walls of the adjacent sections are arranged at intervals.

Optionally, the motherboard is a circuit board.

Optionally, the conductive part is a conductive layer of the circuit board; or, the conductive part is a ground layer of the circuit board.

Optionally, the motherboard includes a power supply circuit, and the conductive parts are respectively disposed between the power supply circuit and the radio frequency transmitting circuit and between the power supply circuit and the radio frequency receiving circuit, so as to respectively separate the power supply circuit and the radio frequency transmitting circuit from each other and between the power supply circuit and the radio frequency receiving circuit from each other; or,

the mainboard comprises a clock circuit, and the conductive parts are respectively arranged between the clock circuit and the radio frequency transmitting circuit and between the clock circuit and the radio frequency receiving circuit so as to respectively separate the clock circuit from the radio frequency transmitting circuit and between the clock circuit and the radio frequency receiving circuit; or,

the main board comprises a local oscillator circuit, and the conducting parts are respectively arranged between the local oscillator circuit and the radio frequency transmitting circuit as well as between the local oscillator circuit and the radio frequency receiving circuit so as to respectively separate the local oscillator circuit from the radio frequency transmitting circuit as well as between the local oscillator circuit and the radio frequency receiving circuit.

Optionally, the shield is secured to the motherboard by a threaded connection, a snap connection, or gluing.

Optionally, the conductive part is provided with a protrusion, and the conductive part is in sealing contact with the contact part through the flexible conductive structure; or,

the conductive part is provided with a groove and is in sealing contact with the contact part through the flexible conductive structure.

Optionally, the radio frequency transmitting circuit and the radio frequency receiving circuit are located on one side of the main board; and the other side of the main board is provided with an antenna for transmitting and/or receiving signals.

According to the utility model discloses a second aspect provides a radar, the radar includes the mainboard, the radar still includes the utility model discloses a first aspect the shield cover, the shield cover with the mainboard cooperation.

According to a third aspect of the present invention, there is provided a movable platform, comprising:

a body;

the power device is arranged on the machine body and used for providing power; and

the second aspect of the present invention provides a radar.

According to the utility model discloses a fourth aspect provides a wireless communication subassembly, is applied to the radar, include:

the main board is provided with a radio frequency circuit and is used for processing radio frequency transmitting signals and radio frequency receiving signals;

the radio frequency circuit comprises a radio frequency transmitting circuit and a radio frequency receiving circuit, the radio frequency transmitting circuit is used for processing the radio frequency transmitting signal, and the radio frequency receiving circuit is used for processing the radio frequency receiving signal; a conductive part capable of conducting electricity is arranged on the surface of the mainboard, and the conductive part is positioned between the radio frequency circuit of the transmitting circuit and the radio frequency receiving circuit;

the shielding cover is arranged on the mainboard; the shielding cover comprises a body and a contact part which is arranged on the body and can conduct electricity, wherein the contact part corresponds to the position of the conducting part and is used for being connected with the conducting part in a sealing mode;

when the contact part is connected with the conductive part in a sealing manner, the contact part is electrically connected with the conductive part, so that an electromagnetic shielding retaining wall is formed between the radio frequency transmitting circuit and the radio frequency receiving circuit.

Optionally, the conductive portion matches a shape of the contact portion.

Optionally, a flexible conductive structure is filled between the contact portion and the conductive portion, and the contact portion and the conductive portion are hermetically connected through the flexible conductive structure.

Optionally, the conductive part is press-fitted with the flexible conductive structure; or the flexible conductive structure is conductive adhesive; or the flexible conductive structure is provided with an accommodating groove for accommodating the conductive part, and the depth of the accommodating groove is 0.6mm +/-0.05 mm.

Optionally, the contact portion is provided with a side wall and a slot surrounded by the side wall.

Optionally, the slot is cylindrical, U-shaped or V-shaped; or,

the height of the slot is 3mm plus or minus 0.1 mm; or,

the width of the slot is 6mm +/-0.5 mm; or,

the thickness of the side wall is 1.2mm plus or minus 0.1 mm; or,

the side wall is of a continuous structure; or

The side wall comprises a plurality of sections, and the side walls of adjacent sections are arranged at intervals.

Optionally, the conductive part is provided with a protrusion, the contact part is provided with a groove, and the conductive part and the contact part can be mutually matched to realize sealed connection; or,

the conductive part is provided with a groove, the contact part is provided with a protrusion, and the conductive part and the contact part can be mutually matched to realize sealing connection.

Optionally, the motherboard is a circuit board.

According to the fifth aspect of the present invention, there is provided a radar, including the fourth aspect of the present invention.

Optionally, the radar is a millimeter wave radar.

According to the utility model discloses a sixth aspect provides a movable platform, include:

a body;

the fifth aspect of the present invention provides the radar.

According to the technical scheme provided by the embodiment of the utility model, the utility model discloses a set up the conductive part between the radio frequency transmitting circuit and the radio frequency receiving circuit of radar mainboard, and be provided with the contact site that matches with the conductive part in the cover body inboard of shield cover, when the contact site is sealed with the conductive part, electrically connect, realize the isolation of radio frequency receiving and dispatching line, and the isolation between radio frequency receiving and dispatching line and other circuits, promote the performance of mainboard, and ensure that the uniformity of electromagnetic shield effect is good; meanwhile, the shape design of the conductive part and the contact part can be flexibly adapted to the actual circuit wiring; in addition, the shielding cover is directly arranged on the fixed seat of the mainboard, the shielding cover is not easy to deform after the shielding cover and the radio frequency circuit board are assembled, the space is saved, and the design is simplified.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive effort.

Fig. 1 is a schematic structural view of a shield according to an exemplary embodiment of the present invention;

fig. 2 is a schematic perspective view of a shield according to an exemplary embodiment of the present invention;

FIG. 3 is an enlarged partial schematic view of the shield of the embodiment of FIG. 2;

fig. 4 is a schematic structural diagram of a main board according to an exemplary embodiment of the present invention;

fig. 5A is a diagram illustrating the effect of rf transmitting/receiving energy of a motherboard without a shielding cover according to an exemplary embodiment of the present invention;

fig. 5B is a diagram illustrating the rf transmit/receive energy effect of a motherboard with a shielding according to an exemplary embodiment of the present invention;

fig. 6 is a schematic structural diagram of a movable platform according to an exemplary embodiment of the present invention.

Reference numerals:

100: a body; 110: a body; 120: a foot rest; 130: a horn;

200: a radar; 10: a shield case; 11: a body; 111: a fixed part; 12: a contact portion; 121: a side wall; 122: grooving; 20: a main board; 21: a conductive portion; 22: a radio frequency transmission circuit; 221: a radio frequency transmitting chip; 222: a radio frequency transmission wire; 23: a radio frequency receiving circuit; 231: a radio frequency receiving chip; 232: radio frequency receiving wiring; 24: a power supply circuit; 25: a clock circuit; 26: a local oscillation circuit; 27: an intermediate frequency circuit; 28: a plug-in unit;

300: a propeller;

400: a material box;

500: a spraying mechanism.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, the first information may also be referred to as second information, and similarly, the second information may also be referred to as first information, without departing from the scope of the present invention. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

The utility model provides a shield cover, this shield cover can be arranged in wireless communication subassembly, radar and movable platform for wait to keep apart between the electricity subassembly, and/or wait to keep apart the barricade that forms the electromagnetic shield between electricity subassembly and other electricity subassemblies.

In some embodiments, the shielding case is disposed on the motherboard for fixing the motherboard. The shielding case comprises a body, a contact part arranged on the body and a conductive part arranged on the mainboard. The conductive part on the mainboard is arranged along the routing of the electrical component on the mainboard. The contact part corresponds to the position of the conductive part and is used for being connected with the conductive part in a sealing mode. When the contact part is hermetically connected with the conductive part, the contact part is electrically connected with the conductive part so as to form an electromagnetic shielding retaining wall between the electrical components.

The utility model also provides a wireless communication subassembly, this wireless communication subassembly has the shield cover to treat on this wireless communication subassembly to keep apart between the electricity subassembly and/or electricity subassembly treats to keep apart and can form the electromagnetic shield between electricity subassembly and other electricity subassemblies.

In some embodiments, a wireless communication assembly includes a motherboard and a shield removably mounted on the motherboard. The shielding case is arranged on the mainboard and used for fixing the mainboard and forming a retaining wall which resists electromagnetic shielding between the electrical devices on the mainboard, thereby saving space and simplifying design. The main board is provided with a radio frequency transmitting circuit and a radio frequency receiving circuit. The shielding cover comprises a body and a contact part which is arranged on the body and can conduct electricity, wherein the contact part corresponds to the position of the conducting part and is used for being connected with the conducting part in a sealing mode. When the contact part is hermetically connected with the conductive part, the contact part is electrically connected with the conductive part so as to form an electromagnetic shielding retaining wall between the radio frequency transmitting circuit and the radio frequency receiving circuit.

The following describes the shield, the wireless communication module, the radar and the movable platform according to the embodiments of the present invention in detail with reference to the accompanying drawings. The features of the following examples and embodiments may be combined with each other without conflict.

Example one

With reference to fig. 1 to 4, an embodiment of the present invention provides a shielding case 10, where the shielding case 10 covers a main board 20 of a radar, and the shielding case 10 of this embodiment is a fixing seat of the main board 20, and is used for fixing the main board 20.

In this embodiment, the main board 20 may be provided with a radio frequency circuit, and the radio frequency circuit may be configured to process a radio frequency transmitting signal and a radio frequency receiving signal. Specifically, the rf circuit includes an rf transmitting circuit 22 and an rf receiving circuit 23, where the rf transmitting circuit 22 is configured to process an rf transmitting signal, and the rf receiving circuit 23 is configured to process an rf receiving signal. Referring to fig. 4, the rf transmitting circuit 22 may include an rf transmitting chip 221 and an rf transmitting trace 222, and the rf receiving circuit 23 may include an rf receiving chip 231 and an rf receiving trace 231.

Optionally, the motherboard 20 is a circuit board, and the motherboard 20 has a simple structure. It is understood that the motherboard 20 of the present embodiment is not necessarily a circuit board, and may have other structures.

Optionally, the rf transmitting circuit 22 and the rf receiving circuit 23 are located on one side of the motherboard 20. The other side of the main board 20 is provided with an antenna which can be used for transmitting and/or receiving signals. Specifically, the rf transmitting circuit 22 and the rf receiving circuit 23 are located on a side of the motherboard 20 facing the shielding case 10, and the antenna is located on a side of the motherboard 20 away from the shielding case 10. The structural distribution of the radio frequency transmitting circuit 22, the radio frequency receiving circuit 23 and the antenna can avoid the influence of the radio frequency transmitting circuit 22 and the radio frequency receiving circuit 23 on the performance of the antenna. Further, the number of the antennas corresponds to the number of the radio frequency receiving traces 231, and each antenna is matched with the corresponding radio frequency receiving trace 231 to obtain one path of echo signals. Specifically, each antenna is connected to a corresponding rf receiving trace 231 through a via on the motherboard 20. In addition, the number of the antennas and the number of the rf receiving traces 231 may be set as required, for example, if the number of the rf receiving traces 231 and the number of the antennas are respectively 8, the main board 20 may obtain 8 echo signals at the same time.

Referring to fig. 1 to 4, the shielding case 10 may include a conductive portion 21, a body 11, a contact portion 12, and a flexible conductive structure. The conductive portion 21 is provided on the surface of the main board 20, and the conductive portion 21 can conduct electricity. Alternatively, the conductive portion 21 of the present embodiment may be a conductive layer of a circuit board, and may also be a ground layer of the circuit board, and the conductive portion 21 may be configured as a conductive layer or a ground layer as required.

The conductive part 21 of the present embodiment is disposed between the rf transmitting circuit 22 and the rf receiving circuit 23 of the motherboard 20, and the rf transmitting circuit 22 and the rf receiving circuit 23 are separated by the conductive part 21.

Of course, it is understood that the motherboard 20 may be provided with other modules besides the rf circuit, such as a power circuit 24, a clock circuit 25, a local oscillator circuit 26, and/or other circuits.

Optionally, referring to fig. 4, in some embodiments, the main board 20 may further include a power circuit 24, and conductive parts 21 are respectively disposed between the power circuit 24 and the radio frequency transmitting circuit 22 and between the power circuit 24 and the radio frequency receiving circuit 23, so as to respectively space the power circuit 24 and the radio frequency transmitting circuit 22 and between the power circuit 24 and the radio frequency receiving circuit 23.

Referring further to fig. 4, in other embodiments, the main board 20 may further include a clock circuit 25, and conductive portions 21 are respectively disposed between the clock circuit 25 and the rf transmitting circuit 22 and between the clock circuit 25 and the rf receiving circuit 23, so as to respectively space the clock circuit 25 and the rf transmitting circuit 22 and between the clock circuit 25 and the rf receiving circuit 23.

Referring to fig. 4, in still other embodiments, the main board 20 may further include a local oscillation circuit 26, and conductive parts 21 are disposed between the local oscillation circuit 26 and the radio frequency transmitting circuit 22 and between the local oscillation circuit 26 and the radio frequency receiving circuit 23, respectively, so as to separate the local oscillation circuit 26 and the radio frequency transmitting circuit 22 and between the local oscillation circuit 26 and the radio frequency receiving circuit 23, respectively.

Referring further to fig. 4, in other embodiments, the motherboard 20 may further include an intermediate frequency circuit 27 and/or a plug 28. Optionally, the rf transmitting circuit 22 and the rf receiving circuit 23 are disposed on one side of the motherboard 20, and the if circuit 27 and/or the connector 28 are disposed on the other side of the motherboard 20. In the present embodiment, conductive parts 21 are respectively disposed between the intermediate frequency circuit 27 and the rf transmitting circuit 22, and between the intermediate frequency circuit 27 and the rf receiving circuit 23, so as to respectively separate the intermediate frequency circuit 27 and the rf transmitting circuit 22, and between the intermediate frequency circuit 27 and the rf receiving circuit 23. Further, conductive portions 21 are provided between the plug 28 and the rf transmission circuit 22 and the if circuit 27, respectively, to space the plug 28 from the rf transmission circuit 22 and the if circuit 27, respectively. The connector 28 of the present embodiment can be used to connect an external device, so as to realize communication between the motherboard 20 and the external device.

The shielding case 10 may be fixed to the main board 20 by screwing, snapping or gluing, but the shielding case 10 may be fixed to the main board 20 by other methods, not limited to the above-mentioned fixing methods. Specifically, in the present embodiment, the shielding case 10 fixes the main board 20 through the body 11, and the main board 20 may be fixedly connected to the body 11 by a screw connection, a snap connection, or an adhesive. In this embodiment, the shape of the body 11 is not limited, and the body 11 may have a regular shape such as a rectangle or a square, or may have an irregular shape. As in the shield can 10 of the embodiment shown in fig. 2. The main body 11 is substantially square, the fixing portions 111 may be respectively disposed around the main body 11, and the main board 20 may be fixedly connected to the fixing portions 111 by means of screw connection, snap connection, or gluing.

Further, a contact portion 12 is provided to the body 11, and the contact portion 12 is capable of conducting electricity. The contact portion 12 can be formed on the body 11 in different manners, for example, in some examples, the contact portion 12 is integrally formed with the body 11, no additional welding or assembling is required, and the body 11 and the contact portion 12 have good consistency. In other examples, the contact portion 12 is assembled with the body 11, for example, the contact portion 12 may be sealed with the body 11 by a threaded connection, a snap connection, or an adhesive, to facilitate independent machining of the contact portion 12 and the body 11.

In this embodiment, the shapes of the contact portion 12 and the conductive portion 21 are matched, so that the contact portion 12 can better seal the conductive portion 21, and thus electromagnetic shielding can be formed between the electrical components to be isolated on the motherboard 20 and/or between the electrical components to be isolated and other electrical components, for example, electromagnetic shielding can be formed between the radio frequency transmitting circuit 22 and the radio frequency receiving circuit 23, between the power circuit 24 and the radio frequency transmitting circuit 22 and the radio frequency receiving circuit 23, between the local oscillator circuit 26 and the radio frequency transmitting circuit 22 and the radio frequency receiving circuit 23, and between the plug 28 and the radio frequency transmitting circuit 22 and the intermediate frequency circuit 27, respectively. Note that, matching the shapes of the contact portion 12 and the conductive portion 21 may mean: the shape of the contact portion 12 is completely the same as the shape of the conductive portion 21, or the shape of the contact portion 12 is substantially the same as the shape of the conductive portion 21.

The contact portion 12 of the present embodiment is used for connecting with the conductive portion 21. Alternatively, as shown in fig. 2 and 3, the contact portion 12 has a sidewall 121 and a slot 122 formed by the sidewall 121. It is understood that the structure of the contact portion 12 is not limited to the structural form of the sidewall 121 and the slot 122, and other structures can be designed.

The flexible conductive structure of the present embodiment is filled in the slot 122, and the flexible conductive structure is in contact with the sidewall 121. In this embodiment. When the motherboard 20 is fixedly connected with the shielding case 10, the contact portion 12 is covered with the conductive portion 21, the conductive portion 21 is in sealing contact with the contact portion 12 through the flexible conductive structure, the flexible conductive structure is deformed under pressure to realize firm contact between the conductive portion 21 and the contact portion 12, and the conductive portion 21 is in contact with the contact portion 12 for conduction, so that metal isolation between each region is realized, and mutual influence of an electric field, a magnetic field and electromagnetic waves between two adjacent regions is controlled; meanwhile, the conductive part 21 on the motherboard 20 is in contact with the contact part 12 through the flexible conductive structure, and heat generated in the working process of the motherboard 20 can be led out through the flexible conductive structure and the contact part 12, so that the function of radiating the motherboard 20 is realized.

When the flexible conductive structure is used to bring the conductive portion 21 into sealing contact with the contact portion 12, as a possible implementation, the conductive portion 21 is provided with a protrusion, and the conductive portion 21 is in sealing contact with the contact portion 12 through the flexible conductive structure. When the main board 20 is fixedly connected to the shield case 10, the flexible conductive structure is pressed by the protrusion, so that the conductive portion 21 is ensured to be more firmly contacted with the contact portion 12.

As another possible implementation, the conductive portion 21 is provided with a recess, and the conductive portion 21 is in sealing contact with the contact portion 12 through a flexible conductive structure. When the main board 20 is fixedly connected to the shielding case 10, the flexible conductive structure can be deformed to be embedded in the groove, so that the conductive portion 21 is ensured to be more firmly contacted with the contact portion 12.

The thickness of the sidewall 121 can be set as required, and optionally, the thickness of the sidewall 121 is 1.2mm ± 0.1mm, such as 1.2 mm. The sidewall 121 of the present embodiment is thin, which facilitates the design of the shape of the contact portion 12, so that the shape of the contact portion 12 fits the shape of the conductive portion 21 as much as possible; meanwhile, the side wall 121 is thin, which saves space.

In some examples, the sidewall 121 is a continuous structure, i.e., the sidewall 121 is a complete and uninterrupted structure, thereby ensuring that the flexible conductive structure is uniform and complete.

In other examples, the sidewall 121 includes multiple segments, and the sidewall 121 is spaced apart from adjacent segments. Compared with the continuous sidewall 121, the segmented sidewall 121 may have a gap between adjacent segments of the sidewall 121, for example, the sidewall 121 may be provided in multiple segments, and the corners of the continuous sidewall 121 may be removed, so that the shape of the contact portion 12 formed by the splicing process of the segments of the sidewall 121 is substantially the same as the shape of the conductive portion 21.

The shape of the slot 122 can be selected as desired, and the slot 122 of the present embodiment can be cylindrical, U-shaped, V-shaped, or other shapes.

In addition, the slot 122 may also be sized as desired. Optionally, the height of the slot 122 is 3mm ± 0.1 mm. Optionally, the width of the slot 122 is 6mm ± 0.5mm, such as 6 mm. Of course, it is to be understood that the height and width of the slot 122 are not limited to the above-listed ranges of heights and widths, and that other ranges of heights and widths may be selected.

In some embodiments, the flexible conductive structure is provided with a receiving groove. When the main board 20 is fixedly connected to the shield case 10, the conductive portion 21 is received in the receiving groove. By providing the accommodating groove in the flexible conductive structure, it is convenient to fix the conductive portion 21, and the contact between the conductive portion 21 and the contact portion 12 is more secure.

Wherein the depth of the receiving groove can be set as desired, for example, in some embodiments, the depth of the receiving groove is 0.6mm ± 0.05mm, such as 0.6 mm. In addition, the shape of the receiving groove can be set according to the requirement, for example, the receiving groove can be cylindrical, U-shaped or V-shaped or other shapes.

It will be appreciated that the conductive portion 21 may be secured to the flexible conductive structure by other means.

In this embodiment, the conductive portion 21 is press-fitted with the flexible conductive structure, so as to ensure that the contact between the conductive portion 21 and the contact portion 12 is firmer.

The flexible conductive structure of this embodiment is the conductive adhesive structure, can adopt the gluing machine to form the conductive adhesive structure in fluting 122, and automatic gluing mode realizes the process simply, and can ensure that the homogeneity of conductive adhesive structure is good.

It is understood that the flexible conductive structure is not limited to the conductive adhesive material, and may be other flexible conductive materials.

The shielding case 10 of the embodiment of the present invention, by providing the conductive portion 21 between the rf transmitting circuit 22 and the rf receiving circuit 23 of the radar main board 20, and providing the contact portion 12 matching with the conductive portion 21 on the inner side of the shielding case 10, when the contact portion 12 is sealed and conductively connected with the conductive portion 21, the isolation of the rf transmitting/receiving wires and the isolation between the rf transmitting/receiving wires and other circuits are realized, so as to improve the performance of the main board 20 and ensure good consistency of the electromagnetic shielding effect; meanwhile, the shape design of the conductive part 21 and the contact part 12 can be flexibly adapted to the actual circuit wiring; in addition, directly set up shield cover 10 on the fixing base of mainboard 20, shield cover 10 is difficult for the deformation after equipment shield cover 10 and the radio frequency circuit board to, through processing formation contact part 12 on the body 11 that is used for fixed mainboard 20, still practiced thrift the space, and simplified the design.

Based on fig. 4, fig. 5A is a radio frequency emission/reception energy effect diagram of the main board 20 without the shielding case 10 according to an exemplary embodiment of the present invention, and fig. 5B is a radio frequency emission/reception energy effect diagram of the main board 20 with the shielding case 10 (i.e., the shielding case 10 is disposed on the main board 20) according to an exemplary embodiment of the present invention. In fig. 5A and 5B, the abscissa represents the distance of the target object, the ordinate represents the energy value (i.e., the size of the echo signal), and channels 1 to 8 represent the detection of the energy values received by 8 receiving antennas on the main board 20, so as to obtain 8 channels of signals. In the effect graph corresponding to each channel, the curve positioned above is a relation curve of the constant false alarm limit value along with the distance, and the curve positioned below is a relation curve of the actual energy value detected by the corresponding channel along with the distance. In fig. 5A, 8 paths of signals respectively show a relationship curve of constant false alarm limit values corresponding to energy values received by 8 receiving antennas along with distance and a relationship curve of actual energy values detected by corresponding channels along with distance when the main board 20 is not provided with the shielding case 10; in fig. 5B, 8 paths of signals respectively represent a relationship curve of the constant false alarm limit values corresponding to the energy values received by the 8 receiving antennas along with the distance and a relationship curve of the actual energy values detected by the corresponding channels along with the distance when the motherboard 20 and the shielding case 10 are added. Based on fig. 5A and 5B, it can be derived that: the amount of energy coupled to the unshielded reception of the motherboard 20 is greater, and the amount of energy coupled to the unshielded reception of the motherboard 20 is much less than the amount of energy coupled to the unshielded reception of the motherboard 20. After the motherboard 20 and the shielding case 10 are added, the actual energy value is reduced in the same channel, which means that the energy value received and coupled after the motherboard 20 and the shielding case 10 are small, i.e. the noise is small. After the shielding case 10 is added to the motherboard 20, even if the target is very weak, the actual energy value detected by the motherboard 20 is higher than the background noise, and the target is more easily detected.

It should be noted that the motherboard 20 and the shielding case 10 of the above embodiments can be applied to radar, and the motherboard 20 and the shielding case 10 are combined to transmit/receive/process the echo signal of radar.

The first embodiment of the present invention further provides a radar, which can include a main board 20 and the shielding case 10 of the above embodiments, the shielding case 10 cooperates with the main board 20, and the description of the corresponding portion in the above embodiments can be referred to in the cooperation mode of the shielding case 10 and the main board 20, which is not repeated here.

The radar can be a millimeter wave radar, which is beneficial to realizing miniaturization and integration design; and the millimeter waves have strong capability of penetrating smoke, fog and dust, and have the advantages of all weather and all day long. Of course, the radar is not limited to the millimeter wave radar, but may be an ultrasonic radar, a laser radar, an infrared radar, or another type of radar.

Example two

With reference to fig. 1 to 4, a second embodiment of the present invention provides a wireless communication module, which can be applied to a radar. Specifically, the wireless communication module of the present embodiment may include a main board 20 and a shield case 10.

The main board 20 is provided with a radio frequency circuit, and the radio frequency circuit can be used for processing a radio frequency transmitting signal and a radio frequency receiving signal. Specifically, the rf circuit includes an rf transmitting circuit 22 and an rf receiving circuit 23, where the rf transmitting circuit 22 is configured to process an rf transmitting signal, and the rf receiving circuit 23 is configured to process an rf receiving signal.

It should be noted that the structure of the motherboard 20 of the second embodiment is similar to the structure of the motherboard 20 of the first embodiment, and the description thereof is omitted here.

Further, a conductive portion 21 capable of conducting electricity is provided on the surface of the main board 20, and the conductive portion 21 is located between the rf transmitting circuit and the rf receiving circuit 23, so that the rf transmitting circuit 22 and the rf receiving circuit 23 are respectively spaced apart by the conductive portion 21.

The shielding case 10 of the present embodiment is disposed on the main board 20, and the shielding case 10 may include a body 11 and a contact portion 12. Wherein the contact portion 12 is provided to the body 11, and the contact portion 12 is capable of conducting electricity. Further, the contact portion 12 of the present embodiment corresponds to the position of the conductive portion 21, and the contact portion 12 is used for sealing connection with the conductive portion 21. In the present embodiment, when the contact portion 12 is hermetically connected to the conductive portion 21, the contact portion 12 is electrically connected to the conductive portion 21 to form an electromagnetic shielding wall between the rf transmitting circuit 22 and the rf receiving circuit 23. The contact portion 12 is hermetically connected to the conductive portion 21, so that heat on the main board 20 can be conducted to the main body 11 through the contact portion 12, thereby accelerating heat dissipation of the main board 20 and contributing to improvement of stability of performance of the electronic components on the main board 20.

Different from the first embodiment, in the second embodiment, the conductive portion 21 is not the structure of the shield case 10, except that the structure of the shield case 10 of the second embodiment is similar to the structure of the shield case 10 of the first embodiment, and specific reference may be made to the description of the shield case 10 of the first embodiment, which is not repeated herein.

It is worth mentioning that the wireless communication component of the above embodiment can be applied to radar, and the wireless communication component can be used for transmitting/receiving/processing the echo signal of radar.

The embodiment two of the utility model provides a radar is still provided, and this radar includes the wireless communication subassembly of above-mentioned embodiment two.

EXAMPLE III

Referring to fig. 6, a third embodiment of the present invention provides a movable platform, which includes a machine body 100, a power device, and the radar 200 of the first or second embodiment. Wherein a power device is installed at the machine body 100, and the power device is used for providing power to move the movable platform.

The movable platform can be an unmanned vehicle, and also can be an unmanned aerial vehicle such as an unmanned aerial vehicle.

Taking the movable platform as an unmanned aerial vehicle as an example, referring to fig. 6, the body 100 may include a body 110 and foot rests 120 connected to both sides of the bottom of the body 110. Further, the body 100 may further include arms 130 connected to both sides of the body 110. Optionally, the radar 200 is fixedly attached to the foot rest 120. Of course, the radar 200 may be fixedly attached to the body 110 or the horn 130.

The unmanned aerial vehicle of this embodiment can be many rotor unmanned aerial vehicle, like four rotor unmanned aerial vehicle or eight rotor unmanned aerial vehicle, also can be fixed wing unmanned aerial vehicle. Referring again to fig. 6, a propeller 300 may be connected to an end of the horn 130 remote from the fuselage 110 to provide flight power for the drone.

In one embodiment, the drone is a plant protection drone, and the bottom of the fuselage 110 is provided with a bin 400 for holding pesticides or seeds. Optionally, the bin 400 may be provided with a spreader mechanism (not shown) that cooperates with the bin 400. Seeds can be arranged in the material box 400 and then sown through the sowing mechanism, so that automatic agricultural operation is realized. Optionally, a spraying mechanism 500 may be further disposed at an end of the arm 130 away from the body 110, and the spraying mechanism 500 is also engaged with the bin 400. The pesticide can be filled in the material box 400 and then sprayed through the spraying mechanism 500, so that the automatic agricultural operation is realized.

The unmanned aerial vehicle of this embodiment still includes flight controller, radar 200's antenna and flight controller communication connection to with the echo signal transmission who detects to flight controller, flight controller can realize unmanned aerial vehicle's obstacle avoidance according to the flight of received echo signal control unmanned aerial vehicle.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a shield cover, the cover is located on the mainboard of radar, the shield cover does the fixing base of mainboard is used for fixing the mainboard, its characterized in that includes:

2. The shielding cage of claim 1, wherein said flexible conductive structure is provided with a receiving groove;

3. The shielding cage of claim 2, wherein the receiving groove has a depth of 0.6mm ± 0.05 mm; alternatively, the holding tank is cylindrical, U-shaped or V-shaped.

4. The shielding cage of claim 1, wherein said flexible conductive structure is a conductive gel structure; or the conductive part is in press fit with the flexible conductive structure.

5. The shielding cage of claim 1, wherein said contact portion is integrally formed with said body; or the contact part is hermetically connected with the body through threaded connection, snap connection or gluing.

6. The shielding cage of claim 1, wherein said slot is cylindrical, U-shaped or V-shaped; or the height of the groove is 3mm +/-0.1 mm; or the width of the slot is 6mm +/-0.5 mm; or the thickness of the side wall is 1.2mm plus or minus 0.1 mm; or, the side wall is a continuous structure; or the side wall comprises a plurality of sections, and the side walls of the adjacent sections are arranged at intervals.

7. The shielding cage of claim 1, wherein said motherboard is a circuit board.

8. The shielding cage of claim 7, wherein said conductive portion is a conductive layer of said circuit board; or, the conductive part is a ground layer of the circuit board.

9. The shielding case of claim 1, wherein the main board comprises a power circuit, and the conductive parts are respectively disposed between the power circuit and the rf transmitting circuit and between the power circuit and the rf receiving circuit, so as to respectively space the power circuit and the rf transmitting circuit and between the power circuit and the rf receiving circuit; or,

10. The shielding cage of claim 1, wherein the cage is secured to the main board by a threaded connection, a snap connection, or an adhesive.

11. The shielding cage of claim 1, wherein said conductive portion is provided with a protrusion, said conductive portion being in sealing contact with said contact portion through said flexible conductive structure; or,

12. The shielding cage of claim 1, wherein said radio frequency transmitting circuit and said radio frequency receiving circuit are located on one side of said main board; and the other side of the main board is provided with an antenna for transmitting and/or receiving signals.

13. A radar comprising a main board, characterized in that the radar further comprises a shielding cage according to any one of claims 1 to 12, which cage cooperates with the main board.

14. A movable platform, comprising:

a body;

the radar of claim 13.

15. A wireless communication module for use in a radar, comprising:

16. The wireless communication assembly of claim 15, wherein the conductive portion matches a shape of the contact portion.

17. The wireless communication assembly of claim 15, wherein a flexible conductive structure is filled between the contact portion and the conductive portion, and the contact portion and the conductive portion are hermetically connected by the flexible conductive structure.

18. The wireless communication assembly of claim 17, wherein the conductive portion is press fit with the flexible conductive structure; or the flexible conductive structure is conductive adhesive; or the flexible conductive structure is provided with an accommodating groove for accommodating the conductive part, and the depth of the accommodating groove is 0.6mm +/-0.05 mm.

19. The wireless communication assembly of claim 15, wherein the contact portion is integrally formed with the body; or the contact part is hermetically connected with the body through threaded connection, snap connection or gluing.

20. The wireless communication assembly of claim 15, wherein the contact portion is provided with a sidewall and a slot defined by the sidewall.

21. The wireless communication assembly of claim 20, wherein the slot is cylindrical, U-shaped, or V-shaped; or,

the height of the slot is 3mm plus or minus 0.1 mm; or,

the width of the slot is 6mm +/-0.5 mm; or,

the thickness of the side wall is 1.2mm plus or minus 0.1 mm; or,

the side wall is of a continuous structure; or

22. The wireless communication assembly of claim 15, wherein the conductive portion is provided with a protrusion, the contact portion is provided with a recess, and the conductive portion and the contact portion are capable of cooperating to form a sealed connection; or,

23. The wireless communication assembly of claim 15, wherein the motherboard is a circuit board.

24. The wireless communication assembly of claim 23, wherein the conductive portion is a conductive layer of the circuit board; or, the conductive part is a ground layer of the circuit board.

25. The wireless communication assembly of claim 15, wherein the main board comprises a power circuit, and the conductive parts are respectively disposed between the power circuit and the rf transmitting circuit and between the power circuit and the rf receiving circuit, so as to respectively space the power circuit and the rf transmitting circuit and between the power circuit and the rf receiving circuit; or,

26. The wireless communication assembly of claim 15, wherein the shield is secured to the motherboard by a threaded connection, a snap connection, or an adhesive.

27. The wireless communication assembly of claim 15, wherein the radio frequency transmit circuit and the radio frequency receive circuit are located on one side of the motherboard; and the other side of the main board is provided with an antenna for transmitting and/or receiving signals.

28. A radar comprising a wireless communication assembly according to any one of claims 15 to 27.

29. A radar as claimed in claim 28, wherein the radar is a millimeter wave radar.

30. A movable platform, comprising:

a body;

a radar as claimed in any one of claims 28 to 29.