CN209028102U - A kind of low-resistance test fixture - Google Patents
A kind of low-resistance test fixture Download PDFInfo
- Publication number
- CN209028102U CN209028102U CN201821607700.7U CN201821607700U CN209028102U CN 209028102 U CN209028102 U CN 209028102U CN 201821607700 U CN201821607700 U CN 201821607700U CN 209028102 U CN209028102 U CN 209028102U
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- CN
- China
- Prior art keywords
- deck
- test
- core aviation
- aviation plugs
- contact
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of low-resistance test fixtures, including pedestal, deck, test circuit, termination and three core aviation plugs, deck is installed on pedestal, test circuit is equipped in pedestal below deck, test circuit is connected to deck bottom by contact and fills insulating layer between contacts;Termination includes link plate and activity test probe, is separately mounted to deck two sides, and the link plate and activity test probe are electrically connected with three core aviation plugs, and test circuit is electrically connected by ground wire with three core aviation plugs.The utility model increases ground wire on test circuit and is connected to three core aviation plugs, and the electrostatic charge on semiconductor is discharged by ground wire in advance before test, and point discharge is avoided to damage component, can also shield when testing circuit and electric leakage accident occurring.And using three core aviation plugs as connection type, it is no longer necessary to solder joint is frequently repaired, it is more durable.
Description
Technical field
The utility model relates to a kind of fixture, in particular to a kind of low-resistance test fixture.
Background technique
Semiconductor components and devices will do it a series of tests before the use, to determine whether semiconductor components and devices is qualified production
Product.Test fixture generally can be all used, semiconductor components and devices is fixed, general test fixture is all interior tape test circuit,
Then the contact of semiconductor components and devices and test circuit is in electrical contact, and is then contacted by test equipment with the conductive contact of semiconductor
To do simulated experiment or test, to obtain relevant parameter.It can all be filled with insulating layer between general contact, partly leading
It is electrostatic charges accumulated on semiconductor components and devices to generate that friction inevitably occurs during body installation or unloading, once with survey
The metal probe of test instrument carries out contact and easily causes point discharge, damages the internal structure of semiconductor components and devices.And it is existing
Some tests are all directly to contact the probe of test equipment with component, and the solder joint of get off for a long time probe and electric wire often takes off
It falls, needs maintenance repeatedly.
Utility model content
The technical problem to be solved by the present invention is to provide one kind to put to avoid semiconductor original part in test
The low-resistance test fixture of electrical breakdown.
The technical solution of the utility model are as follows:
A kind of low-resistance test fixture, including pedestal, deck, test circuit, termination and three core aviation plugs, the card
Seat is installed on pedestal, is equipped with test circuit in the pedestal below deck, and the test circuit is connected to by contact
Insulating layer is simultaneously filled between contacts in deck bottom;The termination includes link plate and activity test probe, difference
Deck two sides are mounted on, the link plate and activity test probe are electrically connected with three core aviation plugs, the test electricity
Road is electrically connected by ground wire with three core aviation plugs.
Further, activity test probe includes the horizontal threaded hole for being provided with deck side wall and connects with the threaded hole
The metallic sheath connect further includes popping one's head in across the spiral of the threaded hole and metallic sheath.
Further, spiral probe tip is arc tip.
Further, the number of contact is 2-4.
Further, the resistance of contact is less than 103Ohm.
The utility model has the beneficial effect that
The utility model increases ground wire on test circuit, and is connected to three core aviation plugs, is carrying out electrical contact
Before test, the electrostatic charge on semiconductor is discharged by ground wire in advance, when the conductive contact of activity test probe and semiconductor connects
It not will cause point discharge when touching, lead to semiconductor components and devices internal damage, and ground wire can also guarantee in test circuit hair
Conduction is completed when raw electric leakage accident, increases the safety coefficient used.And the utility model additionally uses three core aviation plugs work
For the mode of connection, it is no longer necessary to solder joint is frequently repaired, it is more durable.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model.
In figure: 1- pedestal, 2- insulating layer, 3- deck, 4- test circuit, the contact 41-, 42- ground wire, 51- link plate,
Probe, 52a- spiral probe, 52b- metallic sheath, 52c- threaded hole, tri- core aviation plug of 6- are tested in 52- activity.
Specific embodiment
Specific embodiment of the present utility model is described further with reference to the accompanying drawing.It should be noted that
The explanation of these embodiments is used to help to understand the utility model, but does not constitute the restriction to the utility model.This
Outside, technical characteristic involved in the various embodiments of the present invention described below is as long as they do not conflict with each other
It can be combined with each other.
As shown in Figure 1:
A kind of low-resistance test fixture, including pedestal 1, deck 3, test circuit 4, termination and three core aviation plugs 6, institute
It states deck 3 to be installed on pedestal 1, is equipped with test circuit 4 in the pedestal 1 below deck 3, the test circuit 4 passes through
Contact 41 is connected to 3 bottom of deck and fills insulating layer 2 between contact 41;The termination includes 51 He of link plate
Activity test probe 52, is separately mounted to 3 two sides of deck, and the link plate 51 and activity test probe 52 navigate with three cores
Blind plug 6 is electrically connected, and test circuit 4 is electrically connected by ground wire 42 with three core aviation plugs 6.
When testing semiconductor components and devices, semiconductor original part is put into clamp base, semiconductor and stretching
The contact of clamp base is directly in electrical contact, and activity test probe is then removed the model that can be contacted with the conductive contact of semiconductor
It encloses.Three core aviation plugs are connect with tester again at this time, since semiconductor and contact are in electrical contact after connection, electrostatic charge thereon
It will be finished by test circuit by ground wire release in the moment of connection, at this time again move to activity test probe and semiconductor
Conductive contact contact opens up energization test, since before carrying out electrical contact test, the electrostatic charge on semiconductor has passed through
Ground wire release not will cause point discharge when the conductive contact of activity test probe and semiconductor contacts, lead to semiconductor element
Device inside damage, and ground wire can also guarantee to complete conduction when testing circuit and electric leakage accident occurring, and increase the peace used
Overall coefficient.
Specifically, activity test probe 52 is mobile for convenience, mobile activity test probe 52 includes that level is provided with card
The threaded hole 52c of 3 side walls of the seat and metallic sheath 52b connecting with the threaded hole 52c, further includes across the threaded hole 52c
And metallic sheath 52b spiral pop one's head in 52a, precession or back-out are carried out by screw thread, with complete with or without
Movement, spiral probe 52a contact completion fax always with metal probe and pass.And the utility model additionally uses three core aviations and inserts
Mode of the head as connection, it is no longer necessary to solder joint is frequently repaired, it is more durable.
Specifically, in order to protect semiconductor components and devices, spiral pops one's head in the top 52a as arc tip.
Specifically, the number of contact 41 is 2-4, specific quantity can be formulated according to actual testing requirement.
Specifically, the resistance of contact 41 is less than 103Ohm.
The embodiments of the present invention is explained in detail in conjunction with attached drawing above, but the utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, right in the case where not departing from the utility model principle and spirit
These embodiments carry out a variety of change, modification, replacement and modification, still fall in the protection scope of the utility model.
Claims (5)
1. a kind of low-resistance test fixture, including pedestal (1), deck (3), test circuit (4), termination and three core aviation plugs
(6), it is characterised in that: the deck (3) is installed on pedestal (1), is equipped with and surveys below deck (3) in the pedestal (1)
It tries circuit (4), the test circuit (4) is connected to deck (3) bottom by contact (41) and fills between contact (41) exhausted
Edge layer (2);The termination includes link plate (51) and activity test probe (52), is separately mounted to deck (3) two
Side, the link plate (51) and activity test probe (52) are electrically connected with three core aviation plugs (6), the test circuit
(4) it is electrically connected by ground wire (42) with three core aviation plugs (6).
2. low-resistance test fixture according to claim 1, it is characterised in that: activity test probe (52) includes level
The metallic sheath (52b) for being provided with the threaded hole (52c) of deck (3) side wall and connecting with the threaded hole (52c), further includes wearing
Cross the spiral probe (52a) of the threaded hole (52c) and metallic sheath (52b).
3. low-resistance test fixture according to claim 2, it is characterised in that: the spiral probe top (52a) is arc
Tip.
4. low-resistance test fixture according to claim 1, it is characterised in that: the number of the contact (41) is 2-4.
5. low-resistance test fixture according to claim 1-4, it is characterised in that: the resistance of the contact (41) is small
In 103Ohm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821607700.7U CN209028102U (en) | 2018-09-30 | 2018-09-30 | A kind of low-resistance test fixture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821607700.7U CN209028102U (en) | 2018-09-30 | 2018-09-30 | A kind of low-resistance test fixture |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209028102U true CN209028102U (en) | 2019-06-25 |
Family
ID=66905349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821607700.7U Expired - Fee Related CN209028102U (en) | 2018-09-30 | 2018-09-30 | A kind of low-resistance test fixture |
Country Status (1)
Country | Link |
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CN (1) | CN209028102U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112485529A (en) * | 2020-11-26 | 2021-03-12 | 大连理工大学 | Impedance spectrum testing and fitting method of memristor |
-
2018
- 2018-09-30 CN CN201821607700.7U patent/CN209028102U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112485529A (en) * | 2020-11-26 | 2021-03-12 | 大连理工大学 | Impedance spectrum testing and fitting method of memristor |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190625 Termination date: 20190930 |
|
CF01 | Termination of patent right due to non-payment of annual fee |