CN208937209U - A kind of high-temp glue encapsulation thermocouple - Google Patents
A kind of high-temp glue encapsulation thermocouple Download PDFInfo
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- CN208937209U CN208937209U CN201821920147.2U CN201821920147U CN208937209U CN 208937209 U CN208937209 U CN 208937209U CN 201821920147 U CN201821920147 U CN 201821920147U CN 208937209 U CN208937209 U CN 208937209U
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- filament
- negative electrode
- section
- thermocouple
- positive polar
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 87
- 239000003292 glue Substances 0.000 title claims abstract description 45
- 230000001154 acute effect Effects 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 229920002379 silicone rubber Polymers 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The utility model belongs to temperature element technical field, thermocouple is encapsulated more particularly to a kind of high-temp glue, specifically it is made of the positive polar filament of thermocouple and thermocouple negative electrode filament, the end point of the positive polar filament of thermocouple and one end of the thermocouple negative electrode filament are spot welded to form exposed pad, the positive polar filament of thermocouple further includes that positive polar filament encapsulation section and positive polar filament extend reserved section, the thermocouple negative electrode filament further includes that negative electrode filament encapsulation section and negative electrode filament extend reserved section, the angle α of the positive polar filament encapsulation section and negative electrode filament encapsulation section is acute angle or right angle, the exposed pad, positive polar filament encapsulation section, negative electrode filament encapsulation section is encapsulated in high-temp glue.High-temp glue described in the utility model encapsulates the exposed pad surface size consistency of thickness of thermocouple, and response time stable and consistent requires operator's level of skill low；S type, which extends reserved section, can effectively prevent measured object expanded by heating to lead to thermocouple tension failure.
Description
Technical field
The utility model belongs to temperature element technical field, and in particular to a kind of high-temp glue encapsulation thermocouple.
Background technique
Currently, for the response time for shortening thermocouple, leading to when body surface carries out thermometric using thermocouple under hot environment
Insulated wire thermocouple is often chosen, and is fixed by stickup form.Existing method is directly to use high-temp glue by the exposed weldering of thermocouple
Contact is pasted at test point, pastes multiple fixed points further along thermocouple silk thread.The installation method of the prior art exists as follows
Problem: (1) being influenced by site operation personnel's level of skill, easily occurs that gluing is uneven, and thickness deviation is big, leads to the response time not
Consistent problem；(2) when measured object length is larger, high-temperature expansion amount is big, the exposed pad sticking area of thermocouple with
Thermocouple insulating sleeve junction causes thermocouple to fail vulnerable to tension failure.Therefore, research and develop it is a kind of standardization it is easy to install and pacify
Easy thermocouple is filled, avoids causing the thermocouple response time inconsistent because of operator's difference, while avoiding because of thermal expansion
Caused by pad and insulating sleeve junction be broken.
Utility model content
The purpose of this utility model is to provide a kind of high-temp glues to encapsulate thermocouple, solves in the prior art because of operator
It is different and cause that the thermocouple response time is inconsistent, pad is asked with what insulating sleeve junction was broken because of caused by thermal expansion
Topic.
The realization process of the utility model is as follows:
A kind of high-temp glue encapsulation thermocouple, is made of the positive polar filament of thermocouple and thermocouple negative electrode filament, the thermocouple anode
The end point of silk and one end of the thermocouple negative electrode filament are spot welded to form exposed pad, and the positive polar filament of thermocouple further includes
Positive polar filament encapsulation section and positive polar filament extend reserved section, the exposed pad, positive polar filament encapsulation section, positive polar filament extend reserved section according to
Secondary connection, the thermocouple negative electrode filament further include that negative electrode filament encapsulation section and negative electrode filament extend reserved section, and the exposed pad is born
Polar filament encapsulation section, negative electrode filament extend reserved section and are sequentially connected, and the angle α of the positive polar filament encapsulation section and negative electrode filament encapsulation section is sharp
Angle or right angle, the exposed pad, positive polar filament encapsulation section, negative electrode filament encapsulation section are encapsulated in high-temp glue.
Further, the exposed pad, positive polar filament encapsulation section, positive polar filament extend reserved section and are integrally formed connection.
Further, the exposed pad, negative electrode filament encapsulation section, negative electrode filament extend reserved section and are integrally formed connection.
Further, one end of the positive polar filament encapsulation section and one end of institute's negative electrode filament encapsulation section are exposed pad, described
The spacing of the other end of the other end and institute's negative electrode filament encapsulation section of positive polar filament encapsulation section is 0.5~5mm.
Further, the positive polar filament extends reserved section and negative electrode filament extends between reserved section equidistantly, described to be equidistantly
0.5~5mm.
Further, the positive polar filament encapsulation section is the positive polar filament of straight line, and institute's negative electrode filament encapsulation section is straight line negative electrode filament；It is described just
It is that S-shaped is bent positive polar filament that polar filament, which extends reserved section, and it is that S-shaped is bent negative electrode filament that the negative electrode filament, which extends reserved section,.
Further, the expansion elongation that the reserved section of the positive polar filament elongation, negative electrode filament extend reserved section is all larger than measured
Maximal tensility after object is heated.
Further, the positive polar filament extends reserved section and negative electrode filament extends and is respectively arranged with insulating sleeve in reserved section.
Further, the high-temp glue is chosen according to measured object Facing material.
Further, the angle α of the positive polar filament encapsulation section and negative electrode filament encapsulation section is 10 °~90 °.
The good effect of the utility model:
(1) high-temp glue described in the utility model encapsulates the exposed pad surface size consistency of thickness of thermocouple, response time
Stable and consistent requires operator's level of skill low；
(2) S type, which extends reserved section, can effectively prevent measured object expanded by heating to lead to thermocouple tension failure.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that high-temp glue described in the utility model encapsulates thermocouple；
Fig. 2 is the structural schematic diagram of silicon rubber mould described in the utility model；
Fig. 3 is the usage state diagram that high-temp glue described in the utility model encapsulates thermocouple；
In figure, 1 exposed pad, 21 positive polar filament encapsulation sections, 22 positive polar filaments, which extend, reserves section, 31 negative electrode filament encapsulation sections, and 32
Negative electrode filament extends reserved section, 4 high-temp glues, 5 insulating sleeves, 6 silicon rubber moulds, 61 grooves, 7 measured objects, 8 adhesive tapes, α folder
Angle.
Specific embodiment
The utility model is described further below with reference to embodiment.
In order to solve in the prior art because operator difference due to cause the thermocouple response time it is inconsistent, due to thermal expansion
The problem of caused pad and insulating sleeve junction are broken, the utility model provide a kind of high-temp glue encapsulation thermocouple.
Embodiment 1
High-temp glue described in the present embodiment encapsulates thermocouple, sees Fig. 1, is made of the positive polar filament of thermocouple and thermocouple negative electrode filament,
The end point of the positive polar filament of thermocouple and one end of the thermocouple negative electrode filament are spot welded to form exposed pad 1, the heat
The positive polar filament of galvanic couple further includes positive polar filament encapsulation section 21 and positive polar filament extends reserved section 22, the exposed pad 1, the encapsulation of positive polar filament
Section 21, positive polar filament extend reserved section 22 and are successively integrally formed connection, and the thermocouple negative electrode filament further includes negative electrode filament encapsulation section 31
Reserved section 32 is extended with negative electrode filament, and the exposed pad 1, negative electrode filament encapsulation section 31, negative electrode filament extend reserved section 32 successively one
The angle α of body formed connection, the positive polar filament encapsulation section 21 and negative electrode filament encapsulation section 31 is acute angle or right angle, and the angle α is
10 °~90 °, one end of one end of the positive polar filament encapsulation section 21 and institute's negative electrode filament encapsulation section 31 is exposed pad 1, it is described just
The spacing of the other end of the other end and institute's negative electrode filament encapsulation section 31 of polar filament encapsulation section 21 is 0.5~5mm.The positive polar filament elongation
Reserved section 22 and negative electrode filament extend between reserved section 32 equidistantly, and described is equidistantly 0.5~5mm.The positive polar filament encapsulation section
21 be the positive polar filament of straight line, and institute's negative electrode filament encapsulation section 31 is straight line negative electrode filament；It is that S-shaped is bent just that the positive polar filament, which extends reserved section 22,
Polar filament, it is that S-shaped is bent negative electrode filament that the negative electrode filament, which extends reserved section 32,.The positive polar filament extends reserved section 22 and negative electrode filament elongation
Insulating sleeve 5 is respectively arranged in reserved section 32.The exposed pad 1, positive polar filament encapsulation section 21, negative electrode filament encapsulation section 31 are equal
It is encapsulated in high-temp glue 4, the high-temp glue 4 is chosen according to measured object Facing material.The positive polar filament extend reserved section 22,
The expansion elongation that negative electrode filament extends reserved section 32 is all larger than the maximal tensility after measured object is heated.
Embodiment 2
High-temp glue described in the present embodiment encapsulates thermocouple, is made of the positive polar filament of thermocouple and thermocouple negative electrode filament, the heat
One end of the end point of the positive polar filament of galvanic couple and the thermocouple negative electrode filament is spot welded to form exposed pad 1, and the thermocouple is just
Polar filament further includes that positive polar filament encapsulation section 21 and positive polar filament extend reserved section 22, the exposed pad 1, positive polar filament encapsulation section 21,
Positive polar filament extends reserved section 22 and is sequentially connected, and the thermocouple negative electrode filament further includes that negative electrode filament encapsulation section 31 and negative electrode filament elongation are pre-
Section 32 is stayed, the exposed pad 1, negative electrode filament encapsulation section 31, negative electrode filament extend reserved section 32 and be sequentially connected, the positive polar filament envelope
The angle α for filling section 21 and negative electrode filament encapsulation section 31 is 30 °, one end of the positive polar filament encapsulation section 21 and institute's negative electrode filament encapsulation section 31
One end be exposed pad 1, between the other end of the positive polar filament encapsulation section 21 and the other end of institute's negative electrode filament encapsulation section 31
Away from for 0.5~5mm.The positive polar filament extends reserved section 22 and negative electrode filament extends between reserved section 32 equidistantly, described equidistant
For 0.5~5mm.The positive polar filament encapsulation section 21 is the positive polar filament of straight line, and institute's negative electrode filament encapsulation section 31 is straight line negative electrode filament；It is described just
It is that S-shaped is bent positive polar filament that polar filament, which extends reserved section 22, and it is that S-shaped is bent negative electrode filament that the negative electrode filament, which extends reserved section 32,.It is described just
Polar filament extends reserved section 22 and negative electrode filament extends and is respectively arranged with insulating sleeve 5 in reserved section 32.The exposed pad 1, just
Polar filament encapsulation section 21, negative electrode filament encapsulation section 31 are encapsulated in high-temp glue 4, and the high-temp glue 4 is according to measured object surface material
Matter is chosen.
Positive polar filament encapsulation section 21 described in the utility model, the length of negative electrode filament encapsulation section 31 are true according to the performance of high-temp glue 4
It is fixed, it is ensured that not fall off.The positive polar filament extends reserved section 22, negative electrode filament extends the length of reserved section 32 to may be connected to survey
Test instrument.The positive polar filament of the thermocouple and thermocouple negative electrode filament only have exposed pad 1 to connect, in addition to this thermocouple anode
Silk and thermocouple negative electrode filament keep insulation.The positive polar filament of thermocouple is different with the material of thermocouple negative electrode filament, the exposed weldering
Contact 1 is heated to generate electric signal.
The processing technology of high-temp glue encapsulation thermocouple described in the utility model:
(1) silicon rubber mould 6 is made, the middle part setting fluted 61 of the silicon rubber mould 6, the groove 61 is acute angle
Or right angled triangle, the outer profile size of the groove 61 is than positive polar filament encapsulation section 21, the outer profile ruler of negative electrode filament encapsulation section 31
Very little big 2mm to 10mm, 61 depth of groove is the positive polar filament of thermocouple, 1.2~5 times of thermocouple negative electrode filament diameter, such as Fig. 2；
(2) one end of the end point of the positive polar filament of thermocouple and the thermocouple negative electrode filament is spot welded to form exposed pad
(1), then exposed pad 1, positive polar filament encapsulation section 21, negative electrode filament encapsulation section 31 are put into silicon rubber mould 6, then in silicon
High-temp glue 4 is inserted in the groove 61 of rubber mold 6, and surface is struck off, and the envelope of thermocouple is completed after high-temp glue 4 solidifies
Dress, packed part is known as thermocouple encapsulation region；
(3) packaged thermocouple is taken out, positive polar filament is extended into reserved section 22, negative electrode filament extends reserved section 32 and is bent respectively
At S-shaped, insulating sleeve 5 is then covered respectively in the outer surface that the reserved section 22 of positive polar filament elongation, negative electrode filament extend reserved section 32, i.e.,
Obtain high-temp glue encapsulation thermocouple described in the utility model.
The application method of high-temp glue encapsulation thermocouple described in the utility model:
(1) one layer of height is brushed in a plane of the thermocouple encapsulation region of high-temp glue described in the utility model encapsulation thermocouple
Warm glue；
(2) the thermocouple encapsulation region plane for brushing high-temp glue is pressed at 7 test point of measured object, to prevent high temperature
Thermocouple sliding or tilting when glue 4 solidifies extend reserved section 22, negative electrode filament in thermocouple encapsulation region and positive polar filament using adhesive tape 8
It extends reserved 32 intersection of section to be fixed, sees Fig. 3, removing adhesive tape 8 after high-temp glue is fully cured can be to measured object 7
Thermometric.
The above content is specific preferred embodiment further description to made by the utility model is combined, no
It can assert that the specific implementation of the utility model is only limitted to these explanations.For the utility model those of ordinary skill in the art
For, without departing from the concept of the premise utility, several simple deduction or replace can also be made, all should be considered as category
In the protection scope of the utility model.
Claims (10)
1. a kind of high-temp glue encapsulates thermocouple, it is made of the positive polar filament of thermocouple and thermocouple negative electrode filament, it is characterised in that: the heat
One end of the end point of the positive polar filament of galvanic couple and the thermocouple negative electrode filament is spot welded to form exposed pad (1), the thermocouple
Positive polar filament further includes that positive polar filament encapsulation section (21) and positive polar filament extend reserved section (22), the exposed pad (1), positive polar filament envelope
Dress section (21), positive polar filament extend reserved section (22) and are sequentially connected, and the thermocouple negative electrode filament further includes negative electrode filament encapsulation section (31)
It is extended reserved section (32) with negative electrode filament, the exposed pad (1), negative electrode filament encapsulation section (31), negative electrode filament extend reserved section
(32) it is sequentially connected, the angle α of the positive polar filament encapsulation section (21) and negative electrode filament encapsulation section (31) is acute angle or right angle, described outer
Dew pad (1), positive polar filament encapsulation section (21), negative electrode filament encapsulation section (31) are encapsulated in high-temp glue (4).
2. high-temp glue encapsulates thermocouple according to claim 1, it is characterised in that: the exposed pad (1), positive polar filament envelope
Dress section (21), positive polar filament extend reserved section (22) and are integrally formed connection.
3. high-temp glue encapsulates thermocouple according to claim 1, it is characterised in that: the exposed pad (1), negative electrode filament envelope
Dress section (31), negative electrode filament extend reserved section (32) and are integrally formed connection.
4. high-temp glue encapsulates thermocouple according to claim 1, it is characterised in that: one end of the positive polar filament encapsulation section (21)
It is exposed pad (1) with one end of institute's negative electrode filament encapsulation section (31), the other end of the positive polar filament encapsulation section (21) and bears
The spacing of the other end of polar filament encapsulation section (31) is 0.5~5mm.
5. high-temp glue encapsulates thermocouple according to claim 1, it is characterised in that: the positive polar filament extend reserved section (22) with
Negative electrode filament extends between reserved section (32) equidistantly, and described is equidistantly 0.5~5mm.
6. high-temp glue encapsulates thermocouple according to claim 1, it is characterised in that: the positive polar filament encapsulation section (21) is straight line
Positive polar filament, institute's negative electrode filament encapsulation section (31) are straight line negative electrode filament；It is S-shaped bending anode that the positive polar filament, which extends reserved section (22),
Silk, it is that S-shaped is bent negative electrode filament that the negative electrode filament, which extends reserved section (32),.
7. high-temp glue encapsulates thermocouple according to claim 1, it is characterised in that: the positive polar filament elongation reserved section (22),
The expansion elongation that negative electrode filament extends reserved section (32) is all larger than the maximal tensility after measured object is heated.
8. high-temp glue encapsulates thermocouple according to claim 1, it is characterised in that: the positive polar filament extend reserved section (22) and
Negative electrode filament, which extends, is respectively arranged with insulating sleeve (5) on reserved section (32).
9. high-temp glue encapsulates thermocouple according to claim 1, it is characterised in that: the high-temp glue (4) is according to measured object
Body Facing material is chosen.
10. high-temp glue encapsulates thermocouple according to claim 1, it is characterised in that: the positive polar filament encapsulation section (21) and negative
The angle α of polar filament encapsulation section (31) is 10 °~90 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821920147.2U CN208937209U (en) | 2018-11-21 | 2018-11-21 | A kind of high-temp glue encapsulation thermocouple |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821920147.2U CN208937209U (en) | 2018-11-21 | 2018-11-21 | A kind of high-temp glue encapsulation thermocouple |
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| Publication Number | Publication Date |
|---|---|
| CN208937209U true CN208937209U (en) | 2019-06-04 |
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| CN201821920147.2U Active CN208937209U (en) | 2018-11-21 | 2018-11-21 | A kind of high-temp glue encapsulation thermocouple |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112229533A (en) * | 2020-09-29 | 2021-01-15 | 西安交通大学 | Deformation-resistant flexible temperature sensor for temperature detection and preparation method thereof |
| CN114383744A (en) * | 2021-12-03 | 2022-04-22 | 航天科工防御技术研究试验中心 | Thermocouple fixing method |
-
2018
- 2018-11-21 CN CN201821920147.2U patent/CN208937209U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112229533A (en) * | 2020-09-29 | 2021-01-15 | 西安交通大学 | Deformation-resistant flexible temperature sensor for temperature detection and preparation method thereof |
| CN114383744A (en) * | 2021-12-03 | 2022-04-22 | 航天科工防御技术研究试验中心 | Thermocouple fixing method |
| CN114383744B (en) * | 2021-12-03 | 2024-07-02 | 航天科工防御技术研究试验中心 | Thermocouple fixing method |
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Effective date of registration: 20240110 Address after: 210012 First Floor, South Building, Chuangzhi Building, No.1 Xichun Road, Yuhuatai District, Nanjing City, Jiangsu Province, China -046 Patentee after: Nanjing Vigila Intelligent Technology Co.,Ltd. Address before: 215505 No. 2 Jianye Road, High-tech Industrial Park, Changshu Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: CHANGSHU ZHENGHAO ELECTRONIC TECHNOLOGY CO.,LTD. |