CN208738898U - Wireless charger - Google Patents
Wireless charger Download PDFInfo
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- CN208738898U CN208738898U CN201821622784.1U CN201821622784U CN208738898U CN 208738898 U CN208738898 U CN 208738898U CN 201821622784 U CN201821622784 U CN 201821622784U CN 208738898 U CN208738898 U CN 208738898U
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Abstract
A kind of wireless charger, for carrying out wireless charging to mobile electronic device, it include: to be made of thermally conductive nonmetallic materials, for placing the panel of the mobile electronic device, for wirelessly transmitting electric power to the mobile electronic device, thus the transmitting coil to charge to the mobile electronic device, the semiconductor chilling plate for cooling down to the transmitting coil and the panel, the heat-conducting plate for conducting the heat that the semiconductor chilling plate generates and heat sink assembly and the fan for cooling down to the heat sink assembly；The panel, transmitting coil and semiconductor chilling plate are cascading, and there is the semiconductor chilling plate chill surface being oppositely arranged and heating surface, the transmitting coil to be fitted on the chill surface；The heat-conducting plate includes thermally conductive vertical plate and forms the conductive base plate of predetermined angle with the thermally conductive vertical plate, and the thermally conductive vertical plate is fitted in the heating surface, and the conductive base plate is fitted on the heat sink assembly.
Description
Technical field
The utility model relates to the charging technique field of mobile electronic device, in particular to a kind of wireless charger.
Background technique
With popularizing for mobile electronic device such as mobile phone, people's lives are greatly facilitated, frequency of use is increasingly
Height, the charging technique of mobile electronic device, especially wireless charging technology also high speed development therewith, comes into practical application rank
Section.
Wireless charger is can to charge the battery in the case where not physical connection direct with the electrical contact of battery
Equipment, generally comprise wirelessly in mobile electronic device such as mobile phone battery transmission electric power electromagnetic wire
Circle.As long as not needing in use, mobile electronic device is placed on the predetermined charge position of wireless charger to mobile electron
Apparatus connecting conducting wire, electromagnetic coil can charge directly to the battery of mobile electronic device, very easy to use.
Currently, during the wireless charging of mobile electronic device, electromagnetic coil in wireless charger and receive charging
Mobile electronic device can all generate a large amount of heat, if the charging time is longer, then these heats are possible to mobile electron
Equipment and wireless charger all damage.Therefore, the heat dissipation of wireless charger is always the important technology of a urgent need to resolve
Problem.With the development of consumer electrical product, mobile electronic device is increasing to the capacity requirement of internal battery, to them
It carries out being also required to provide stronger heat-sinking capability when wireless charging, to ensure the efficiency and safety of wireless charging.
Summary of the invention
The utility model provides a kind of wireless charger, for the wireless charging of mobile electronic device such as mobile phone, tool
There are lesser size and excellent heat dissipation effect.
Better embodiment according to the present utility model provides a kind of wireless charger, for mobile electronic device
Wireless charging is carried out, the wireless charger includes: to be made of thermally conductive nonmetallic materials, for placing the mobile electronic device
Panel, for wirelessly to the mobile electronic device transmit electric power, to be filled to the mobile electronic device
It is the transmitting coil of electricity, the semiconductor chilling plate for cooling down to the transmitting coil and the panel, described for conducting
The heat-conducting plate and heat sink assembly of the heat that semiconductor chilling plate generates and for cooling down to the heat sink assembly
Fan；The panel, transmitting coil and semiconductor chilling plate are cascading, and the semiconductor chilling plate, which has, to be oppositely arranged
Chill surface and heating surface, the transmitting coil be fitted on the chill surface；The heat-conducting plate include thermally conductive vertical plate and with
The thermally conductive vertical plate forms the conductive base plate of predetermined angle, and the thermally conductive vertical plate is fitted in the heating surface, the thermally conductive bottom
Plate is fitted on the heat sink assembly.
Preferably, the wireless charger further includes main casing, and the main casing includes being used for holding movable electronic equipment
Shelf and the support for preventing mobile electronic device from sliding from the shelf that is formed on the shelf；The shelf
Accommodating hole is offered, the transmitting coil and the semiconductor chilling plate are contained in the accommodating hole, and the panel closes institute
Opening of the accommodating hole on a side surface of the shelf is stated, another side surface of the shelf is bonded with the heat-conducting plate, and
The main casing is fixed to each other with the heat-conducting plate.
Preferably, the wireless charger further includes the conduction cooling part being made from a material that be thermally conductive, the conduction cooling part be annular or
Cylindrical shape is contained in the accommodating hole and is set in outside the transmitting coil and the semiconductor chilling plate, and described is led
The EDGE CONTACT of cold part to the panel towards the accommodating hole inside surface, make the panel, conduction cooling part and semiconductor
The chill surface of cooling piece surrounds the refrigerating chamber for being accommodated in the inner the transmitting coil jointly.
Preferably, being in inside the conduction cooling part but not by the semiconductor system on the outer surface of the thermally conductive vertical plate
Cold covering be partially coated with thermal insulation layer.
Preferably, the wireless charger further includes the supporting plate made of hard insulating material, and the supporting plate includes
Bracket vertical plate and the bracket bottom plate that the predetermined angle is formed with the bracket vertical plate, the bracket vertical plate are fitted in described lead
The inside of hot vertical plate is simultaneously fixed to each other with the conductive base plate, the bracket bottom plate be fitted in the inside of the conductive base plate and with
The conductive base plate is fixed to each other.
Preferably, the main casing, the heat-conducting plate and the supporting plate are integrally formed.
Preferably, the heat sink assembly is made of aluminum or aluminum alloy, and the shape of the heat sink assembly is the plate of rectangle
Body or framework, outer periphery are formed with multiple for increasing surface area to improve the heat radiation fin structure of heat dissipation effect.
Preferably, the wireless charger further includes the bottom case made of heat-barrier material, the bottom case by the fan and
Heat sink assembly is accommodated in the inner or is only accommodated in the inner the fan.
Preferably, the predetermined angle that the thermally conductive vertical plate and conductive base plate are formed is greater than 30 degree and less than 90 degree.
Preferably, the predetermined angle that the thermally conductive vertical plate and conductive base plate are formed is greater than 60 degree and less than 80 degree.
The wireless charger provided according to better embodiment as described above can carry out mobile electronic device wireless
Charging, and which provide a variety of effective refrigeration and sinking paths, can be the wireless charging during wireless charging
Multiple components of device itself and by the wireless charger carry out wireless charging mobile electronic device all effectively dropped
Temperature, moreover it is possible to the waste heat generated in discharge work in time, thus the heat generated during effectively preventing wireless charging
It influences charge efficiency or carries out the mobile electron of wireless charging to the wireless charger itself and by the wireless charger
Equipment damages, and greatly improves the security performance and charge efficiency of wireless charging.In addition, the wireless charger shape
Novelty, heat dissipation path setting is ingenious, easy to use and more humanized.
Detailed description of the invention
The perspective view for the wireless charger that the embodiment that Fig. 1 shows the utility model provides.
Fig. 2 shows the exploded views of wireless charger shown in FIG. 1.
Specific embodiment
For the purpose of this utility model, technical solution and advantage is more clearly understood, combines implement referring to the drawings
The utility model is further described in example.
Fig. 1 and Fig. 2 is please referred to, the better embodiment of the application provides a kind of wireless charger 100, can be used for
Wirelessly charge to the battery of mobile electronic device (such as mobile phone, tablet computer etc.).The wireless charger
100 include panel 1, transmitting coil 2, conduction cooling part 3, semiconductor chilling plate 4, main casing 5, heat-conducting plate 6, supporting plate 7, cooling fin group
Part 8, fan 9, bottom case 10.
Panel 1 is in tabular, its exterior contour is preferably rounded in present embodiment, in other embodiments can also be with
Other proper shapes are set by its exterior contour.Panel 1 is preferably using the nonmetallic materials example with Thermal conductivity
If carbon fiber is made, it can prevent neighbouring transmitting coil 2 from leaking electricity by panel 1 and abundant conducted emission line in this way
The heat that circle 2 generates.
Transmitting coil 2 can be the existing Electromagnetic Launching coil for wireless charger, its shape in present embodiment
Preferably planar spiral winding, diameter are preferably not greater than the diameter of the panel 1.When the transmitting coil 2 is set with mobile electron
Standby such as the distance between mobile phone no more than scheduled maximum charge apart from when, which can use electromagnetic induction original
Electric power from other power supplys is wirelessly transferred to mobile electronic device, and stores the electricity for arriving mobile electronic device by reason
Chi Zhong, to realize wireless charging.The more specific structure feature and working method of the transmitting coil 2 can be referring to existing
Technology, here without repeating.
Conduction cooling part 3 can be made of the material with Thermal conductivity, such as metal material, it is preferred to use aluminium or aluminium
Alloy is made.The conduction cooling part 3 is preferably shaped to annular or cylinder-shaped, and internal diameter is preferably not less than the diameter of transmitting coil 2, makes
Obtaining the conduction cooling part 3 can be set in outside transmitting coil 2.
Semiconductor chilling plate 4 can use existing semiconductor chilling plate, its in present embodiment is preferably shaped to pros
It is appropriate can also to set other for the exterior contour of semiconductor chilling plate 4 in other embodiments certainly for shape tabular
Shape.The specific structure feature and working method of the semiconductor chilling plate 4 can be referring to the prior arts, here without superfluous
It states.According to state of the art it is found that the opposing sides of the semiconductor chilling plate 4 is respectively chill surface 41 and heating surface 42,
The chill surface 41 can cool down at work, and the heating surface 42 can generate heat.In the present embodiment, the semiconductor chilling plate
4 chill surface 41 is arranged towards the transmitting coil 2, and heating surface 42 is arranged backwards to the chill surface 41.Preferably, the drop
Heat-conductive coating such as heat conductive silica gel is may be coated on warm face 41 and heating surface 42, for protecting to semiconductor chilling plate 41
Protect and further increase heat-conductive characteristic.The axial length of the conduction cooling part 3 is preferably not less than the axial width of transmitting coil 2
The sum of with the thickness of semiconductor chilling plate 4, the catercorner length of the semiconductor chilling plate 4 is preferably no greater than the conduction cooling part 3
Internal diameter so that the transmitting coil 2 and the semiconductor chilling plate 4 can be enclosed in completely inside the conduction cooling part 3.
Main casing 5 is preferably made of hard insulating material such as plastics.The main casing 5 includes shelf 51 and support
52, the shelf 51 be preferably rectangle or approximate rectangular plate (in other embodiments or other shapes it is flat
Plate), size and the mobile electronic device using the wireless charger 100 charging are adapted, and are filled using the wireless charger 100
The front surface or rear surface of the mobile electronic device of electricity can be stably placed on the shelf 51.It is opened in the middle part of the shelf 51
Equipped with the accommodating hole for being used to accommodate panel 1, transmitting coil 2, conduction cooling part 3, semiconductor chilling plate 4 for penetrating through the shelf 51
50, the conveniently of circular shape of the accommodating hole 50 (can also be in other embodiments other shapes, as long as being capable of receiving face
Plate 1, transmitting coil 2, conduction cooling part 3, semiconductor chilling plate 4), internal diameter is preferably not less than the outer diameter of the conduction cooling part 3, with
Ease of assembly.The support 52 be preferably the plate come out from one end of the shelf 51 and the vertically projection of shelf 51 or
Boss, preferably rectangular in shape or cuboid (in other embodiments or other shapes), size and use
The mobile electronic device of the wireless charger 100 charging is adapted, the mobile electronic device to be charged using the wireless charger 100
One end can be stably placed on the support 52.It is appreciated that the shelf and the support 52 can be one at
Type.
Heat-conducting plate 6 can be made of the material with Thermal conductivity, such as metal material, it is preferred to use copper or copper
Alloy is made.The heat-conducting plate 6 includes thermally conductive vertical plate 61 and conductive base plate 62, and the thermally conductive vertical plate 62 is preferably rectangle or approximation
The plate (in other embodiments or plate of other shapes) of rectangle, shape and size and the main casing 5
Shelf 51 be adapted, can be closely adhered on the surface of shelf 51 and firm support is provided main casing 5.It is described to lead
Hot bottom plate 62 is preferably rectangle or approximate rectangular plate (in other embodiments or plate of other shapes), is connected
It connects one end in the thermally conductive vertical plate 61 and forms scheduled angle with the thermally conductive vertical plate 61, the angle is preferably greater than 30
Degree and less than 90 degree, further preferably greater than 60 degree and less than 80 degree.It is appreciated that the thermally conductive vertical plate 61 and conductive base plate
62 can be it is integrally formed.
Supporting plate 7 is preferably made of hard insulating material such as plastics.The supporting plate 7 includes bracket vertical plate 71 and branch
Erect plate 72, the bracket vertical plate 72 be preferably rectangle or approximate rectangular plate (in other embodiments or its
The plate of his shape), shape and size and the thermally conductive vertical plate 61 of the heat-conducting plate 6 are adapted, and can be closely adhered to institute
State on the medial surface of thermally conductive vertical plate 61 is that the thermally conductive vertical plate 61 provides support and protection.The bracket bottom plate 72 is preferably rectangle
Or approximate rectangular plate (in other embodiments or plate of other shapes), it is connected to the bracket vertical plate 71
One end and being formed with the bracket vertical plate 71 be greater than 30 degree and less than 90 degree, preferably greater than 60 degree and the folder less than 80 degree
Angle；The shape and size of the bracket vertical plate 72 and the conductive base plate 62 of the heat-conducting plate 6 are adapted, and can be closely adhered to
It is that the conductive base plate 62 provides support and protection on the medial surface of the conductive base plate 62.In this way, with thermally conductive vertical plate 61 and leading
Bottom plate 62 is similar, is also formed between bracket vertical plate 71 and bracket bottom plate 72 greater than 30 degree and less than 90 degree, preferably greater than 60
It spends and the angle less than 80 degree.It is appreciated that the bracket vertical plate 71 and bracket vertical plate 72 can be it is integrally formed.
Heat sink assembly 8 can be made of the material with Thermal conductivity, such as metal material, it is preferred to use aluminium
Or aluminium alloy is made.The shape of the heat sink assembly 5 is the plate body or framework of rectangle, shape and size and the heat-conducting plate 6
Conductive base plate 62 be adapted, can be closely adhered on the lateral surface of the conductive base plate 62.Outside the heat sink assembly 8
Portion periphery is formed with multiple heat radiation fin structures 82, for increasing the surface area of heat sink assembly 8 to improve heat dissipation effect.
Fan 9 uses centrifugal fan in the present embodiment, and heat sink assembly 8 can court backwards to 62 one side of conductive base plate
It is arranged to fan 9, the heat of heat sink assembly 8 can be discharged when fan 9 rotates.
Bottom case 10 be preferably rectangular-shape shell, be preferably made of heat-barrier material such as plastics, can be set in fan 9 and
Fan 9 and heat sink assembly 8 are accommodated in the inner or only will by the outside that the outside of heat sink assembly 8 is perhaps only set in fan 9
Fan 9 is accommodated in the inner.Preferably, air inlet (not shown) can be offered in the bottom surface of bottom case 7, the side of bottom case 10 is opened
Equipped with multiple air outlets 12, air-breathing and air draft when for working to fan 9 provide convenience, help more efficiently to shed partly
The heat that conductor cooling piece 4 generates.It is also provided on bottom case 10 for the transmitting coil 2,4 and of semiconductor chilling plate
The power interface (not shown) of the offer electric power of fan 9.The power interface can be for example existing mains plug or insert
Seat or USB interface etc., connection type and working principle with the transmitting coil 2, semiconductor chilling plate 4 and fan 9
The prior art can be used, therefore herein without repeating.
It can be, but not limited to carry out according to following assembling processing procedure when the wireless charger 100 is assembled: will send out
Ray circle 2 is fitted on the chill surface 41 of semiconductor chilling plate 4, and by existing means such as bonding way by transmitting coil 2
It is fixed on semiconductor chilling plate 4；The electricity for power supply is provided by existing manner for transmitting coil 2 and semiconductor chilling plate 4
Property connection (such as transmitting coil 2 and semiconductor chilling plate 4 are electrically connected on earth by existing conducting wire or feeder line connection type
Power interface on shell 10)；The lateral surface of the thermally conductive vertical plate 61 of heat-conducting plate 6 is fitted to the surface backwards to support 52 of shelf 51
On, so that support 52 extends out to the direction far from heat-conducting plate 6, and for example bonding, riveting or screw connect by existing manner
It connects etc. and heat-conducting plate 6 and main casing 5 is fixed to each other；Conduction cooling part 11 is embedded in the accommodating hole 50 in the shelf 51 of main casing 5,
And for example conduction cooling part 11 is fixed in accommodating hole 50 by bonding or engaging etc. by existing manner；Semiconductor chilling plate 4 is put
Enter in the accommodating hole 50 (that is, being put into the conduction cooling part 11), the heating surface 42 of semiconductor chilling plate 4 is fitted in thermally conductive
On the lateral surface of vertical plate 61, the heat that heating surface 42 is generated sufficiently is conducted to thermally conductive vertical plate 61, and passes through existing side
Formula is for example bonded, rivet or semiconductor chilling plate 4 is fixed on thermally conductive vertical plate 61 by the modes such as screw connection；By panel 1 from putting
In the side surface insertion accommodating hole 50 for being convexly equipped with support 52 of plate 51, the opening on the surface of shelf 51 of accommodating hole 50 is closed
Mouthful, and for example panel 1 is fixed in accommodating hole 50 by bonding or engaging etc. by existing manner, to by transmitting coil 2, lead
Cold part 3 and semiconductor chilling plate 3 are enclosed in accommodating hole 50, and make the EDGE CONTACT of conduction cooling part 3 to panel 1 towards accommodating hole
Surface inside 50, so that the chill surface 41 of panel 1, conduction cooling part 3 and semiconductor chilling plate 4 be made to surround one jointly for institute
State the refrigerating chamber that transmitting coil 2 is accommodated in the inner；The lateral surface of conductive base plate 62 is fitted in a surface (example of heat sink assembly 8
As shown in Fig. 2, being fitted in the upper surface of heat sink assembly 8) on, allow heat to be sufficiently conducted to heat dissipation from conductive base plate 62
Piece component 8, and be for example bonded, rivet or screw connection etc. is by semiconductor chilling plate 4 and heat sink assembly 8 by existing manner
It is fixed to each other；By fan 9 by existing manner as screw connection is installed to the conductive base plate 62 backwards of heat sink assembly 8
Another side (such as shown in Fig. 2, is installed to the lower surface of heat sink assembly 8), provides by existing manner for fan 9 for powering
Electric connection (such as the power supply that fan 9 is electrically connected on bottom case 10 is connect by existing conducting wire or feeder line connection type
Mouthful)；The side surface without installing panel 1 of the shelf 51 of main casing 5 (is gone out into the side table of support 52 i.e. without projection
Face) it fits on the outer surface of thermally conductive vertical plate 61, by the placement pose adjustment of shelf 51 and thermally conductive vertical plate 61 to so that shelf
The length direction of 51 length direction and thermally conductive vertical plate 61 is completely the same, and support 52 is placed in adjacent thermal conductive bottom plate 62 and bracket bottom
The position of plate 72, then for example bonding, riveting or screw connection etc. are mutual by main casing 5 and heat-conducting plate 6 by existing manner
It is fixed；Bottom case 10 is set in outside fan 9 and heat sink assembly 8, or only set is set to outside fan 9, passes through existing side
Formula is for example bonded, is clamped, bottom case 10 and at least main casing 5 are fixed to each other by screw connection etc.；By the bracket vertical plate of supporting plate 7
71 are fitted in the medial surface of thermally conductive vertical plate 61, and bracket bottom plate 72 is fitted in the medial surface of conductive base plate 62, such as by existing means
Supporting plate 7 and heat-conducting plate 6 are fixed to each other by bonding, riveting etc., i.e. completion overall package.
It is appreciated that in other embodiments, shelf 51 can also be made into hollow shell, when assembling thermally conductive will stand
Plate 61 is embedded in inside shelf 51 and is fixed, while conductive base plate 62 being also received in bottom case 10, can prevent so thermally conductive
Plate 6 is exposed outside.
When the wireless charger 100 is worked, preferably bracket bottom plate 72, conductive base plate 62 and 10 level of bottom case are put
It sets.It is greater than 30 as previously described since thermally conductive vertical plate 61 and bracket vertical plate 71 are formed with bracket bottom plate 72 and conductive base plate 62 respectively
Degree and less than 90 degree, preferably greater than 60 degree and the angle less than 80 degree, therefore at this moment the shelf 51 of main casing 5 just also can be with water
Plane, which is formed, is greater than 30 degree and less than 90 degree, preferably greater than 60 degree and the angle less than 80 degree, makes the outer surface of shelf 51
Heeling condition is presented in (be installed with panel 1 and be convexly equipped with a side surface of support 52), facilitates and sets mobile electron to be charged
It is standby to be placed on the outer surface, while support 52 is located at the bottom end of the outer surface of shelf 51, can block mobile electron
The end of equipment prevents it from sliding from shelf 51.In this manner it is possible to which mobile electronic device to be charged is steadily put
It sets on the outer surface of shelf 51 and it is made to be bonded panel 1 as far as possible.(such as passing through above-mentioned power interface) by existing manner
Transmitting coil 2, semiconductor chilling plate 4 and fan 9 and external power supply such as commercial power socket, USB interface, automobile storage battery etc. are established
It is electrically connected, obtains electric power from external power supply.The electric power of acquisition is radioed to movement with electromagnetic induction method by transmitting coil 2
Electronic equipment charges to the battery of mobile electronic device.After semiconductor chilling plate 4 obtains electric power, 41 temperature of chill surface
It reduces, cools down to transmitting coil 2, influence working performance because of overheat to prevent transmitting coil 2.Further, it partly leads
The chill surface 41 of body cooling piece 4 is used not only for cooling down to transmitting coil 2, additionally it is possible to for by wireless charging 100 into
The mobile electronic device of row charging cools down.Specifically, due to chill surface 41 generate cooling capacity be all closed in by panel 1,
It does not leak out, therefore can sufficiently drop in the refrigerating chamber that the chill surface 41 of conduction cooling part 3 and semiconductor chilling plate 4 surrounds
The temperature of low conduction cooling part 3, and then the temperature (i.e. by cold quantity transmission to panel 1) of the panel 1 contacted with conduction cooling part 3 is reduced, in this way
Panel 1 can cool down to the mobile electronic device for carrying out wireless charging on it, and mobile electronic device is prevented to charge
Superheating phenomenon occurs in the process.It is appreciated that in order to avoid the cooling capacity in the refrigerating chamber is let out by thermally conductive vertical plate 61,
The part that 3 inside of conduction cooling part can also be on the outer surface of thermally conductive vertical plate 61 but do not covered by semiconductor chilling plate 4
It all applies and is covered with thermal insulation layer (such as existing insulating moulding coating coating).And the heat that the heating surface 42 of semiconductor chilling plate 4 generates is then
Heat sink assembly 8 is transferred to by heat-conducting plate 6.Fan is being driven by electricity lower rotation, the lasting air inlet generated from 10 bottom surface of bottom case
The air-flow that mouth enters, is discharged again from the air outlet 12 of 10 side of bottom case, the heat of heat sink assembly 8 is constantly taken away by the air-flow
Amount, lasting cooling is carried out to heat sink assembly 8, the heat that the heating surface 42 of semiconductor chilling plate 4 can be thus generated
It is constantly shed by heat sink assembly 8, these heats is avoided to adversely affect transmitting coil 2.
The wireless charger 100 provided according to better embodiment as described above can carry out nothing to mobile electronic device
Line charge electricity, and which provide a variety of effective refrigeration and sinking paths, can be the wireless charging during wireless charging
Multiple components of electric appliance 100 itself and by the wireless charger 100 carry out wireless charging mobile electronic device all carry out
Effective cooling, moreover it is possible to the waste heat generated in discharge work in time, to be produced during effectively preventing wireless charging
Raw heat influences charge efficiency or carries out wirelessly to the wireless charger 100 itself and by the wireless charger 100
The mobile electronic device of charging damages, and greatly improves the security performance and charge efficiency of wireless charging.In addition, described
100 shape of wireless charger is novel, and heat dissipation path setting is ingenious, easy to use and more humanized.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent substitution, improvement and etc. done should be included in the utility model
Within the scope of protection.
Claims (10)
1. a kind of wireless charger, for carrying out wireless charging to mobile electronic device, which is characterized in that the wireless charger
It include: to be made of thermally conductive nonmetallic materials, for placing the panel of the mobile electronic device, for wirelessly to described
Mobile electronic device transmits electric power, thus the transmitting coil to charge to the mobile electronic device, for the transmitting
Semiconductor chilling plate that coil and the panel cool down, for conducting the thermally conductive of heat that the semiconductor chilling plate generates
Plate and heat sink assembly and fan for cooling down to the heat sink assembly；It the panel, transmitting coil and partly leads
Body cooling piece is cascading, and the semiconductor chilling plate has the chill surface being oppositely arranged and heating surface, the emission lines
Circle is fitted on the chill surface；The heat-conducting plate includes thermally conductive vertical plate and forms leading for predetermined angle with the thermally conductive vertical plate
Hot bottom plate, the thermally conductive vertical plate are fitted in the heating surface, and the conductive base plate is fitted on the heat sink assembly.
2. wireless charger as described in claim 1, which is characterized in that the wireless charger further includes main casing, described
Main casing include the shelf for holding movable electronic equipment and be formed on the shelf for preventing mobile electronic device
The support slid from the shelf；The shelf offers accommodating hole, and the transmitting coil and the semiconductor chilling plate hold
It is contained in the accommodating hole, the panel closes opening of the accommodating hole on a side surface of the shelf, the shelf
Another side surface be bonded with the heat-conducting plate, and the main casing is fixed to each other with the heat-conducting plate.
3. wireless charger as claimed in claim 2, which is characterized in that the wireless charger further includes by Heat Conduction Material system
At conduction cooling part, the conduction cooling part is annular or cylinder-shaped, be contained in the accommodating hole and be set in the transmitting coil and
Outside the semiconductor chilling plate, and the EDGE CONTACT of the conduction cooling part to the panel towards the accommodating hole inside table
Face surrounds the chill surface of the panel, conduction cooling part and semiconductor chilling plate jointly and is accommodated in the inner the transmitting coil
Refrigerating chamber.
4. wireless charger as claimed in claim 3, which is characterized in that be in institute on the outer surface of the thermally conductive vertical plate
It states inside conduction cooling part but is not partially coated with thermal insulation layer by what the semiconductor chilling plate covered.
5. wireless charger as claimed in claim 2, which is characterized in that the wireless charger further includes by hard heat-insulating material
Supporting plate made of expecting, the supporting plate include bracket vertical plate and form the bracket of the predetermined angle with the bracket vertical plate
Bottom plate, the bracket vertical plate are fitted in the inside of the thermally conductive vertical plate and are fixed to each other with the conductive base plate, the bracket bottom
Plate is fitted in the inside of the conductive base plate and is fixed to each other with the conductive base plate.
6. wireless charger as claimed in claim 5, which is characterized in that the main casing, the heat-conducting plate and the bracket
Plate is integrally formed.
7. wireless charger as described in claim 1, which is characterized in that the heat sink assembly is made of aluminum or aluminum alloy,
The shape of the heat sink assembly is the plate body or framework of rectangle, and outer periphery is formed with multiple for increasing surface area to mention
The heat radiation fin structure of high heat dissipation effect.
8. wireless charger as described in claim 1, which is characterized in that the wireless charger further includes by heat-barrier material system
At bottom case, the fan and heat sink assembly be accommodated in the inner or be only accommodated in the inner the fan by the bottom case.
9. the wireless charger as described in any one in claim 1-8, which is characterized in that the thermally conductive vertical plate with it is thermally conductive
The predetermined angle that bottom plate is formed is greater than 30 degree and less than 90 degree.
10. the wireless charger as described in any one in claim 9, which is characterized in that the thermally conductive vertical plate with it is thermally conductive
The predetermined angle that bottom plate is formed is greater than 60 degree and less than 80 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821622784.1U CN208738898U (en) | 2018-09-30 | 2018-09-30 | Wireless charger |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821622784.1U CN208738898U (en) | 2018-09-30 | 2018-09-30 | Wireless charger |
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| Publication Number | Publication Date |
|---|---|
| CN208738898U true CN208738898U (en) | 2019-04-12 |
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| CN201821622784.1U Active CN208738898U (en) | 2018-09-30 | 2018-09-30 | Wireless charger |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110880803A (en) * | 2019-12-17 | 2020-03-13 | 台达电子企业管理（上海）有限公司 | Wireless charging device |
| CN110932415A (en) * | 2019-12-19 | 2020-03-27 | 昆山联滔电子有限公司 | Wireless charger |
| CN111293787A (en) * | 2020-03-19 | 2020-06-16 | 昆山联滔电子有限公司 | Wireless electric energy transmitting device |
| CN111342511A (en) * | 2020-02-26 | 2020-06-26 | Oppo广东移动通信有限公司 | Electronic equipment, control method and charging system |
| CN111615299A (en) * | 2020-05-15 | 2020-09-01 | 维沃移动通信有限公司 | Wireless charging seat |
| CN113036838A (en) * | 2021-02-09 | 2021-06-25 | 华为技术有限公司 | Wireless charger |
| CN113852144A (en) * | 2020-06-28 | 2021-12-28 | 北京小米移动软件有限公司 | Wireless charging device |
| CN114256904A (en) * | 2020-09-25 | 2022-03-29 | Oppo广东移动通信有限公司 | Wireless charging device, manufacturing method of wireless charging device and wireless charging system |
| WO2023109176A1 (en) * | 2021-12-14 | 2023-06-22 | 荣耀终端有限公司 | Wireless charging apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11581750B2 (en) | 2019-12-17 | 2023-02-14 | Delta Electronics (Shanghai) Co., Ltd. | Wireless charging device with enhanced charging power and increased charging speed |
| CN110880803A (en) * | 2019-12-17 | 2020-03-13 | 台达电子企业管理（上海）有限公司 | Wireless charging device |
| CN110932415A (en) * | 2019-12-19 | 2020-03-27 | 昆山联滔电子有限公司 | Wireless charger |
| CN110932415B (en) * | 2019-12-19 | 2023-08-22 | 昆山联滔电子有限公司 | Wireless charger |
| CN111342511A (en) * | 2020-02-26 | 2020-06-26 | Oppo广东移动通信有限公司 | Electronic equipment, control method and charging system |
| CN111293787A (en) * | 2020-03-19 | 2020-06-16 | 昆山联滔电子有限公司 | Wireless electric energy transmitting device |
| CN111615299A (en) * | 2020-05-15 | 2020-09-01 | 维沃移动通信有限公司 | Wireless charging seat |
| CN113852144A (en) * | 2020-06-28 | 2021-12-28 | 北京小米移动软件有限公司 | Wireless charging device |
| CN114256904A (en) * | 2020-09-25 | 2022-03-29 | Oppo广东移动通信有限公司 | Wireless charging device, manufacturing method of wireless charging device and wireless charging system |
| EP4040625A1 (en) * | 2021-02-09 | 2022-08-10 | Huawei Digital Power Technologies Co., Ltd. | Wireless charger |
| JP2022122262A (en) * | 2021-02-09 | 2022-08-22 | ファーウェイ デジタル パワー テクノロジーズ カンパニー リミテッド | wireless charger |
| CN113036838A (en) * | 2021-02-09 | 2021-06-25 | 华为技术有限公司 | Wireless charger |
| CN113036838B (en) * | 2021-02-09 | 2024-04-09 | 华为数字能源技术有限公司 | Wireless charger |
| WO2023109176A1 (en) * | 2021-12-14 | 2023-06-22 | 荣耀终端有限公司 | Wireless charging apparatus |
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