CN208638058U - Wireless charger - Google Patents

Abstract

The utility model discloses a kind of wireless chargers, it include: the base shell and top panel, Working mould group and refrigeration module in the receiving cavity for being oppositely arranged and crossing jointly receiving cavity, wherein, the Working mould is mounted on above the refrigeration module；The Working mould group include working cavity and be set to the intracorporal transmitting coil of the working chamber；The material of the top panel and the working cavity is Heat Conduction Material, and can be realized hot transmitting between the top panel and the working cavity；The refrigeration module includes the semiconductor refrigerating unit being set side by side in the plane for being parallel to the top panel and blowing heat-sink unit.The wireless charger of the utility model has lesser thickness, and can be realized excellent heat dissipation effect.

Description

Wireless charger

Technical field

The utility model relates to wireless charging technical field more particularly to a kind of wireless chargers.

Background technique

With popularizing for mobile electronic device such as mobile phone, people's lives are greatly facilitated, frequency of use is increasingly Height, also high speed development, especially wireless charging technology also come into the application stage to the charging technique of mobile electronic device therewith.

Wireless charger is can to charge the battery in the case where not physical connection direct with the electrical contact of battery Equipment, and generally include the terminal body that power transmission coil is wound about.

At present in mobile phone wireless charging process, due to the fever of the electromagnetic coil in wireless charging base, it is attached to mobile phone back Power coil operation fever and mobile phone charging process in itself fever, three kinds of heats superpositions cause current Fever is serious when mobile phone wireless charges, and damages mobile phone.On the other hand, some mobile phones are detecting temperature to keep safe charging When degree is increased to a certain threshold value, it can force to reduce charging current, cause the extension in charging time.With the in-built electrical of electronic equipment Tankage is increasing, and radiating requirements when charging are also increasing.

Utility model content

The purpose of this utility model is to provide a kind of wireless charger, there is lesser thickness, and can be realized excellent Heat dissipation effect.

To realize above purpose of utility model, the utility model provides a kind of wireless charger, comprising: be oppositely arranged and The base shell and top panel, Working mould group and refrigeration module in the receiving cavity of receiving cavity are crossed jointly, Wherein, the Working mould is mounted on above the refrigeration module；

The Working mould group include working cavity and be set to the intracorporal transmitting coil of the working chamber；The top panel Material with the working cavity is Heat Conduction Material, and can be realized heat between the top panel and the working cavity Transmitting；

The refrigeration module includes the semiconductor refrigerating unit being set side by side in the plane for being parallel to the top panel With blowing heat-sink unit.

Optionally, the top panel is equipped with heat conduction ring towards the surface of the Working mould group, and the heat conduction ring is corresponding The transmitting coil periphery setting, and it is corresponding with the top surface of the working cavity.

Optionally, heat-conducting glue is equipped between the heat conduction ring and the top surface of the working cavity.

Optionally, the semiconductor refrigerating unit includes semiconductor chilling plate, set on the semiconductor chilling plate periphery Thermal-insulated frame, the cooling fin below the semiconductor chilling plate, the semiconductor chilling plate have the chill surface being oppositely arranged With heating surface, the chill surface of the semiconductor chilling plate is in contact with the working cavity, the fever of the semiconductor chilling plate Face is in contact with the cooling fin.

Optionally, the semiconductor refrigerating unit further includes being set to the semiconductor chilling plate close to the working cavity one First heat conduction silicone of side, set on the semiconductor chilling plate close to the second heat conduction silicone of the cooling fin side.

Optionally, the cooling fin includes plates and sets multiple lug bosses on the plates, wherein the sheet Body directly contacted with the heating surface of the semiconductor chilling plate or by heat-conducting layer realize heat transmitting, the multiple lug boss with The cooling fin directly contacts or realizes heat transmitting by heat-conducting layer.

Optionally, the blowing heat-sink unit includes fan and the heat shield above the fan.

Optionally, the base shell includes bottom plate and the side plate that is connected with bottom plate, and blowing is corresponded on the bottom plate Region below heat-sink unit is equipped with air inlet, and the side plate is equipped with air outlet.

Optionally, the refrigeration module further includes framework, the framework include the upper substrate being oppositely arranged and lower substrate with And it is separately connected the connecting plate of the upper substrate and lower substrate；

The semiconductor chilling plate and the fan are juxtaposed in the framework, and the cooling fin, which corresponds to, described partly leads It is set in the framework below body cooling piece；

The upper substrate is equipped with through-hole, and the chill surface of the semiconductor chilling plate is exposed to outside the through-hole；Under described Substrate is equipped with the second air inlet of corresponding first air inlet, and the fan corresponds to the second air inlet setting, described Second air inlet is used to provide air intake passage for the fan；The connecting plate is equipped with the second air outlet, second outlet air Mouth is for providing air exhaust passage for the fan.

Optionally, the fan includes shell and the flabellum that is set in the housing, the shell be equipped with third air inlet with Third air outlet, the third air inlet are corresponding with second air inlet；

The cooling fin includes plates and multiple lug bosses for being fixedly connected with the plates, and the plates are remote Side from the multiple lug boss is arranged close to the heating surface of the semiconductor chilling plate；

The multiple lug boss is in vertical bar shape, and the spaced and parallel arrangement of the multiple lug boss, thus described more Multiple grooves are formed between a lug boss；

The both ends of the multiple groove are corresponding with second air outlet and the third air outlet respectively.

Optionally, the material of the framework is Heat Conduction Material；The heat shield be set to above the upper substrate with it is described The corresponding position of fan, and the heat shield is fixedly connected by bonding glue-line with the upper substrate.

The utility model has the beneficial effects that the wireless charger of the utility model use include semiconductor refrigerating unit with blow Refrigeration module including wind heat-sink unit cools down to the transmitting coil in wireless charger and the electronic equipment being electrically charged, It can guarantee the charging process safety of electronic equipment and guarantee higher charge efficiency；By making semiconductor refrigerating unit and blowing Heat-sink unit is set side by side, and can significantly reduce the thickness of wireless charger, and realizes excellent heat dissipation effect.

Detailed description of the invention

It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by Regard the restriction to the scope of the utility model as.

Fig. 1 is the explosive decomposition schematic diagram of one embodiment of the utility model wireless charger；

Fig. 2 is that the top panel of the utility model wireless charger and the explosive decomposition of one embodiment of Working mould group are shown It is intended to；

Fig. 3 is the structural representation of one embodiment of the cooling fin in the refrigeration module of the utility model wireless charger Figure；

Fig. 4 is the schematic cross-sectional view of one embodiment of the refrigeration module of the utility model wireless charger；

Fig. 5 is that semiconductor chilling plate and fan exist in one embodiment of the refrigeration module of the utility model wireless charger The schematic diagram being set side by side in framework；

Fig. 6 is the schematic top plan view of the upper substrate of the frame in the refrigeration module of the utility model wireless charger.

Main element symbol description:

10- base shell；11- bottom plate；12- side plate；The first air inlet of 115-；The first air outlet of 125-；20- top surface Plate；21- heat conduction ring；30- Working mould group；31- working cavity；32- transmitting coil；33-PCB plate；40- refrigeration module；41- is partly led Body refrigeration unit；411- semiconductor chilling plate；412- thermal-insulated frame；413- cooling fin；The first heat conduction silicone of 415-；416- second Heat conduction silicone；401- plates；402- lug boss；42- blowing heat-sink unit；421- fan；51- shell；512- third goes out Air port；52- flabellum；422- heat shield；43- framework；431- upper substrate；4315- through-hole；432- lower substrate；4321- second is entered the wind Mouthful；433- connecting plate；The second air outlet of 4331-；427- bonds glue-line.

Specific embodiment

Below in conjunction with attached drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out clear Chu is fully described by, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole realities Apply example.

The component of the utility model embodiment being usually described and illustrated herein in the accompanying drawings can be matched with a variety of different It sets to arrange and design.Therefore, the detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to below The range of claimed invention is limited, but is merely representative of the selected embodiment of the utility model.It is practical based on this Novel embodiment, those skilled in the art's every other implementation obtained without making creative work Example, fall within the protection scope of the utility model.

It hereinafter, can the term " includes " used in the various embodiments of the utility model, " having " and its homologous Word is meant only to indicate special characteristic, number, step, operation, the combination of element, component or aforementioned item, and is understood not to The combined presence or increasing of one or more other features, number, step, operation, element, component or aforementioned item is excluded first A possibility that adding the combination of one or more features, number, step, operation, element, component or aforementioned item.

In the various embodiments of the utility model, statement " A or/and B " includes any combination of the text listed file names with Or all combinations, it may include A, may include B or may include A and B both.

In the description of the present invention, it should be understood that term " longitudinal direction ", " transverse direction ", "upper", "lower", " preceding ", The orientation or positional relationship of the instructions such as " rear ", "left", "right", "vertical", " transverse direction ", "top", "bottom", "inner", "outside" be based on Orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than instruction or dark Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair The limitation of the utility model.In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, and should not be understood as referring to Show or imply relative importance.

In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term Stating may not refer to the same embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be It can be combined in any suitable manner in any one or more embodiment or examples.

In the description of the present invention, unless otherwise specified and limited, it should be noted that term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be mechanical connection, the connection being also possible to inside two elements can be It is connected directly, can also indirectly connected through an intermediary, for the ordinary skill in the art, it can be according to specific Situation understands the concrete meaning of above-mentioned term.Unless otherwise defined, otherwise all terms used herein (including technical term With scientific term) with identical as the various normally understood meanings of embodiment one skilled in the art of the utility model Meaning.The term (term such as limited in the dictionary generally used) is to be interpreted as having and lead in the relevant technologies The identical meaning of situational meaning in domain and it will be interpreted as having Utopian meaning or meaning too formal, unless It is clearly defined in the various embodiments of the utility model.

Fig. 1 to Fig. 6 is please referred to, the utility model provides a kind of wireless charger, comprising: is oppositely arranged and crosses jointly The base shell 10 and top panel 20 of receiving cavity, the Working mould group 30 in the receiving cavity and refrigeration module 40, Wherein, the Working mould group 30 is set to 40 top of refrigeration module；

The Working mould group 30 includes working cavity 31 and the transmitting coil 32 in the working cavity 31；It is described The material of top panel 20 and the working cavity 31 is Heat Conduction Material, and the top panel 20 and the working cavity It can be realized hot transmitting between 31；

The refrigeration module 40 includes the semiconductor refrigerating being set side by side in the plane for being parallel to the top panel 20 Unit 41 and blowing heat-sink unit 42.

The cool principle of the wireless charger of the utility model is: by the refrigeration module 40 to the Working mould group 30 working cavity 31 cools down, can not only be to transmitting coil 32 in work by cooling down to the working cavity 31 The heat generated during making is absorbed, additionally it is possible to be passed using the heat between the working cavity 31 and the top panel 20 It leads and cools down to the top panel 20, thus to electronic equipment (such as the hand to charge on the top panel 20 is placed in Machine) cool down.In other words, the utility model can not only cool down to the transmitting coil 32 in wireless charger, moreover it is possible to Cool down to the electronic equipment being electrically charged, to guarantee the charging process safety of electronic equipment and realize higher charging effect Rate.

The utility model, can be utmostly by the way that semiconductor refrigerating unit 41 and blowing heat-sink unit 42 to be set side by side Reduction wireless charger thickness, and guarantee it is described blowing heat-sink unit 42 blow out wind can disperse the semiconductor system Heat caused by the heat production end of cold unit 41.

Preferably, the material of the top panel 20 is heat-conducting insulation material, such as glass, this is because the top surface Plate 20 is possible to directly contact with transmitting coil 32, and when the top panel 20 is insulating materials, the top panel 20 is just The magnetic signal of transmitting coil 32 will not be impacted.Since the top panel 20 is also needed the transmitting coil 32 and work Make in the electronic equipment that the cooling capacity on cavity 31 is transferred on the top panel 20, therefore the top panel 20 is necessary For Heat Conduction Material.

Optionally, the material of the working cavity 31 is metal, preferably aluminium.

Optionally, as shown in Fig. 2, the top panel 20 is equipped with heat conduction ring towards the surface of the Working mould group 30 21, the corresponding 32 periphery setting of transmitting coil of the heat conduction ring 21, and it is opposite with the top surface of the working cavity 31 It answers.The cooling capacity that the heat conduction ring 21 can speed up on the working cavity 31 is transferred to the process on the top panel 20, makes The temperature rapid decrease of the top panel 20.

Optionally, heat-conducting glue is equipped between the heat conduction ring 21 and the top surface of the working cavity 31.It is described thermally conductive Glue can not only be such that the top panel 20 is fixedly connected with the working cavity 31, additionally it is possible to promote the heat conduction ring 21 and institute State the heat conduction efficiency between working cavity 31.

Optionally, the material of the heat conduction ring 21 can be metal or graphene, preferably graphene.Due to the hair The upper surface of ray circle 32 may be in contact with the top panel 20, and metal and graphene are conductive, therefore will be described Heat conduction ring 21 is set to 32 periphery of transmitting coil, can be avoided the heat conduction ring 21 to the magnetic signal of the transmitting coil 32 It impacts.

Optionally, the top surface of the working cavity 31 position corresponding with the heat conduction ring 21 is coated with graphene material Material, to accelerate the heat transmitting between the working cavity 31 and the top panel 20.

Optionally, as shown in Figure 1, the semiconductor refrigerating unit 41 is partly led including semiconductor chilling plate 411, set on described The thermal-insulated frame 412 of 411 periphery of body cooling piece, the cooling fin 413 set on 411 lower section of semiconductor chilling plate, the semiconductor Cooling piece 411 has the chill surface being oppositely arranged and heating surface, the chill surface and the working chamber of the semiconductor chilling plate 411 Body 31 directly contacts or realizes heat transmitting, the heating surface of the semiconductor chilling plate 411 and the cooling fin by heat-conducting layer 413 directly contact or pass through heat-conducting layer realization heat transmitting.

Optionally, the material of the thermal-insulated frame 412 is bakelite, rubber (such as silicon rubber) or plastic cement.

Optionally, the material of the cooling fin 413 is metal, preferably copper.

Specifically, the structure of the semiconductor chilling plate 411 is the common knowledge of this field, it is not described in detail herein.

Optionally, as shown in figure 4, the semiconductor refrigerating unit 41 further includes being set to the semiconductor chilling plate 411 to lean on First heat conduction silicone 415 of nearly 31 side of working cavity is set to the semiconductor chilling plate 411 close to the cooling fin Second heat conduction silicone 416 of 413 sides.First heat conduction silicone 415 can be realized the semiconductor chilling plate 411 with Being fixedly connected between the working cavity 31, and be conducive to the cooling capacity of the chill surface of the semiconductor chilling plate 411 is fast Speed is transferred in the working cavity 31；Second heat conduction silicone 416 can be realized the semiconductor chilling plate 411 and institute Being fixedly connected between cooling fin 413 is stated, and is conducive to quickly pass the heat of the heating surface of the semiconductor chilling plate 411 It is handed in the cooling fin 413.

Optionally, as shown in Figure 1, the blowing heat-sink unit 42 includes fan 421 and is set to above the fan 421 Heat shield 422.

Specifically, the effect of the heat shield 422 is: the heat shield 422 can be avoided on the working cavity 31 Cooling capacity be transferred directly on object in air or below.

Specifically, the effect of the fan 421 is, air is made to generate flowing, air takes away institute during flowing The heat on cooling fin 413 is stated, to radiate to the cooling fin 413, and then to the hair of the semiconductor chilling plate 411 It radiates in hot face.

Optionally, as shown in Figure 1, the base shell 10 includes bottom plate 11 and the side plate 12 being connected with bottom plate 11, institute It states and corresponds to the region of blowing heat-sink unit 42 lower section on bottom plate 11 and be equipped with the first air inlet 115, the side plate 12 is equipped with the One air outlet 125.First air inlet 115 is used to provide air inlet for fan 421, and first air outlet 125 is used for as warp The hot wind for crossing heat exchange provides outlet.

Optionally, first air inlet 115 includes spaced multiple circular holes.

Optionally, as shown in Figures 4 to 6, the refrigeration module 40 further includes framework 43, and the framework 43 includes opposite sets The upper substrate 431 set and lower substrate 432 and the connecting plate 433 for being separately connected the upper substrate 431 and lower substrate 432；

The semiconductor chilling plate 411 is juxtaposed in the framework 43 with the fan 421, the cooling fin 413 It is set in the framework 43 below the corresponding semiconductor chilling plate 411；

The upper substrate 431 is equipped with through-hole 4315, and the chill surface of the semiconductor chilling plate 411 is exposed to the through-hole Outside 4315；The lower substrate 432 is equipped with the second air inlet 4321 of corresponding first air inlet 115, and the fan 421 is right Second air inlet 4321 is answered to be arranged, second air inlet 4321 is used to provide air intake passage for the fan 421；It is described Connecting plate 433 is equipped with the second air outlet 4331, and second air outlet 4331 is used to provide air draft for the fan 421 logical Road.

Optionally, the upper substrate 431 is with lower substrate 432 each parallel to the top panel 20.

Optionally, as shown in Figure 1, the fan 421 includes shell 51 and the flabellum 52 in shell 51, the shell 51 are equipped with third air inlet (not shown) and third air outlet 512, the third air inlet and second air inlet 4321 It is corresponding；

As shown in figure 3, the cooling fin 413 includes plates 401 and is fixedly connected with the plates 401 multiple Lug boss 402, hair of side of the plates 401 far from the multiple lug boss 402 close to the semiconductor chilling plate 411 Hot face setting；

The multiple lug boss 402 is in vertical bar shape, and the spaced and parallel arrangement of the multiple lug boss 402, thus Multiple grooves are formed between the multiple lug boss 402；

The both ends of the multiple groove are corresponding with second air outlet 4331 and the third air outlet 512 respectively.

Optionally, the material of the framework 43 is Heat Conduction Material, such as metal, the metal are preferably copper.When the frame When the material of body 43 is Heat Conduction Material, there are two heat dissipation paths for the cooling fin 413: one of heat dissipation path is: described to dissipate Backing 413 directly carries out heat exchange with the outlet air of the fan 421 and radiates；Another heat dissipation path is: due to the heat dissipation Piece 413 is directly contacted with the framework 43, therefore can also be by the heat transfer between the cooling fin 413 and framework 43 to described Cooling fin 413 radiates, and the framework 43 is radiated and carrying out heat exchange with air.

Specifically, as shown in figure 4, when material of the refrigeration module 40 including framework 43 and the framework 43 is thermally conductive When material, the heat shield 422 is set to 431 top of upper substrate position corresponding with the fan 421.Optionally, As shown in figure 4, the heat shield 422 is fixedly connected by bonding glue-line 427 with the upper substrate 431.The heat shield 422 is used Keep apart in by the working cavity 31 and the framework 43, the cooling capacity on the working cavity 31 is avoided to be transferred to the framework On 43, cooling capacity is caused to be lost.

Optionally, first air outlet 125 includes spaced multiple vertical strip apertures, the multiple vertical item Shape aperture respectively corresponds multiple grooves between multiple lug bosses 402 on the cooling fin 413.

Specifically, as shown in Figure 1, the Working mould group 30 further includes being set in the working cavity 31 and set on described The pcb board 33 of 32 periphery of transmitting coil, the pcb board 33 and the transmitting coil 32 are in electrical contact, for being transmitting coil 32 Power supply.

Optionally, the wiring of the semiconductor chilling plate 411 is drawn from the pcb board 33, is not necessarily to other wiring.

Optionally, the top surface of the top panel 20 and the side plate 12 of the base shell 10 is connected together.

Preferably, the material of the base shell 10 is heat-barrier material, such as bakelite, rubber (such as silicon rubber) or modeling Glue, the cooling capacity for preventing the base shell 10 from absorbing the top panel 20 cause the cooling capacity of the top panel 20 to be lost.

Optionally, the working cavity 31 is fixedly connected with base shell 10 by screw, thus by the working cavity 31 are connected as an entirety with base shell 10, and the refrigeration module 40 is pressed on the working cavity 31 and base shell 10 Between.

As known to those skilled in the art, the bottom of the working cavity 31 is equipped with antifreeze plate (not shown), the hair Ray circle 32 is correspondingly arranged on the antifreeze plate, and directly contacting to avoid the working cavity 31 with transmitting coil 32 causes to institute The magnetic signal for stating transmitting coil 32 impacts.

It will be appreciated by those skilled in the art that the accompanying drawings are only schematic diagrams of a preferred implementation scenario, module in attached drawing or Process is not necessarily implemented necessary to the utility model.

It will be appreciated by those skilled in the art that the module in device in implement scene can be described according to implement scene into Row is distributed in the device of implement scene, can also be carried out corresponding change and is located at the one or more dresses for being different from this implement scene In setting.The module of above-mentioned implement scene can be merged into a module, can also be further split into multiple submodule.

The foregoing is merely the preferable implementation examples of the utility model, are not intended to limit the utility model, it is all Within the spirit and principles of the utility model, it is practical new to should be included in this for any modification, equivalent replacement, improvement and so on Within the protection scope of type.

Claims (10)

1. a kind of wireless charger characterized by comprising be oppositely arranged and cross jointly the base shell of receiving cavity with Top panel, Working mould group and refrigeration module in the receiving cavity, wherein the Working mould is mounted on the refrigeration Above mould group；

The Working mould group include working cavity and be set to the intracorporal transmitting coil of the working chamber；The top panel and institute The material for stating working cavity is Heat Conduction Material；

The refrigeration module includes the semiconductor refrigerating unit being set side by side in the plane for being parallel to the top panel and blow Wind heat-sink unit.

2. wireless charger as described in claim 1, which is characterized in that table of the top panel towards the Working mould group Face is equipped with heat conduction ring, and the heat conduction ring corresponds to the transmitting coil periphery setting, and the top table with the working cavity Face is corresponding.

3. wireless charger as claimed in claim 2, which is characterized in that the top table of the heat conduction ring and the working cavity Heat-conducting glue is equipped between face.

4. wireless charger as described in claim 1, which is characterized in that the semiconductor refrigerating unit includes semiconductor refrigerating Piece, thermal-insulated frame, the cooling fin below the semiconductor chilling plate set on the semiconductor chilling plate periphery, it is described partly to lead Body cooling piece has the chill surface being oppositely arranged and heating surface, the chill surface of the semiconductor chilling plate and the working cavity straight Contact or by heat-conducting layer realize heat transmit, the heating surface of the semiconductor chilling plate directly contacted with the cooling fin or Person realizes heat transmitting by heat-conducting layer.

5. wireless charger as claimed in claim 4, which is characterized in that the semiconductor refrigerating unit further includes set on described Semiconductor chilling plate is close to the first heat conduction silicone of the working cavity side, set on the semiconductor chilling plate close to described Second heat conduction silicone of cooling fin side.

6. wireless charger as claimed in claim 4, which is characterized in that the blowing heat-sink unit includes fan and is set to Heat shield above the fan.

7. wireless charger as claimed in claim 6, which is characterized in that the base shell include bottom plate and with bottom plate phase Side plate even, the region corresponded on the bottom plate below blowing heat-sink unit are equipped with the first air inlet, and the side plate is equipped with First air outlet.

8. wireless charger as claimed in claim 7, which is characterized in that the refrigeration module further includes framework, the framework Including the upper substrate and lower substrate that are oppositely arranged and the connecting plate for being separately connected the upper substrate and lower substrate；

The semiconductor chilling plate and the fan are juxtaposed in the framework, and the cooling fin corresponds to the semiconductor system Cold lower section is set in the framework；

The upper substrate is equipped with through-hole, and the chill surface of the semiconductor chilling plate is exposed to outside the through-hole；The lower substrate It is equipped with the second air inlet of corresponding first air inlet, the fan corresponds to second air inlet and is arranged, and described second Air inlet is used to provide air intake passage for the fan；The connecting plate is equipped with the second air outlet, and second air outlet is used In providing air exhaust passage for the fan.

9. wireless charger as claimed in claim 8, which is characterized in that the fan includes shell and the fan that is set in the housing Leaf, the shell are equipped with third air inlet and third air outlet, and the third air inlet is corresponding with second air inlet；

The cooling fin includes plates and multiple lug bosses for being fixedly connected with the plates, and the plates are far from institute The side for stating multiple lug bosses is arranged close to the heating surface of the semiconductor chilling plate；

The multiple lug boss is in vertical bar shape, and the spaced and parallel arrangement of the multiple lug boss, thus the multiple convex Multiple grooves are formed between the portion of rising；

The both ends of the multiple groove are corresponding with second air outlet and the third air outlet respectively.

10. wireless charger as claimed in claim 8, which is characterized in that the material of the framework is Heat Conduction Material；It is described every Backing is set to position corresponding with the fan above the upper substrate, and the heat shield passes through bonding glue-line and institute Upper substrate is stated to be fixedly connected.