CN208490032U - A kind of integrated microelectrode plate - Google Patents
A kind of integrated microelectrode plate Download PDFInfo
- Publication number
- CN208490032U CN208490032U CN201821284507.4U CN201821284507U CN208490032U CN 208490032 U CN208490032 U CN 208490032U CN 201821284507 U CN201821284507 U CN 201821284507U CN 208490032 U CN208490032 U CN 208490032U
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- heat sink
- heat
- mainboard
- insulation board
- insulating shield
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Abstract
The utility model discloses a kind of integrated microelectrode plates, including integrating microelectrode plate ontology, the inside of integrated microelectrode plate ontology is equipped with mainboard, the top side of dress is equipped with connector, the side of connector is equipped with capacitor, the side of capacitor is equipped with electrolytic capacitor, one end of heat-insulating shield is equipped with insulation board, the side of insulation board is equipped with heat sink, there are four heating columns for one end installation of heat sink, and heating column runs through insulation board, heat-insulating shield, it is connect with mainboard, the top end surface of heat sink is provided with several equally distributed radiating grooves, the surface of heat sink, which is run through, several equally distributed ventilation holes.The utility model is connected to mainboard by heating column, the heat absorption of mainboard is transmitted in the heat sink being made by grapheme material by heating column, the top of heat sink is provided with radiating groove, the surface of heat sink, which is run through, ventilation hole, radiating groove and ventilation hole are provided to increase the contact area of heat sink and air, can accelerate the heat dissipation effect of heat sink.
Description
Technical field
The utility model relates to a kind of integrated microelectrode plate, in particular to a kind of integrated microelectrode plate.
Background technique
It is well known that microelectrode plate has the characteristics that Distribution density is high, light-weight, thickness is thin, the good and soft or hard knot of bending
The birth and development of plywood-FPC and PCB has expedited the emergence of this new product of Rigid Flex, and therefore, Rigid Flex is exactly flexible
Wiring board and rigid wiring board are combined by processes such as pressings by related process requirement.But traditional, microelectrode
The heat dissipation performance of plate is poor, and element can generate high temperature at work, can be to the effect of microelectrode plate if heat disperses not in time
Rate lowers significantly, and the working efficiency of equipment is caused to reduce.
Utility model content
The technical problems to be solved in the utility model is to overcome the deficiencies of existing technologies, and provides a kind of integrated microelectrode plate,
It can accomplish the heat dissipation of increase microelectrode plate.
In order to solve the above-mentioned technical problem, the utility model provides the following technical solution:
A kind of integrated microelectrode plate of the utility model, including integrated microelectrode plate ontology, the integrated microelectrode plate ontology
Inside mainboard is installed, the top side of the dress is equipped with connector, and the side of the connector is equipped with capacitor, described
The side of capacitor is equipped with electrolytic capacitor, and the side far from the capacitor is equipped with resistance, and one end of the mainboard is equipped with absolutely
Hot plate, one end of the heat-insulating shield are equipped with insulation board, and the side of the insulation board is equipped with heat sink, and the one of the heat sink
There are four heating columns for end installation, and heating column is connected through insulation board, heat-insulating shield and mainboard, and the top end surface of the heat sink is opened
There are several equally distributed radiating grooves, the surface of the heat sink, which is run through, there are several equally distributed ventilation holes.
As a kind of optimal technical scheme of the utility model, the heat-insulating shield is mainly made by asbestos material.
As a kind of optimal technical scheme of the utility model, the material of the insulation board is mainly by polyimide material system
It forms.
As a kind of optimal technical scheme of the utility model, the material of the heat sink is mainly made by grapheme material
It forms.
As a kind of optimal technical scheme of the utility model, the mainboard is connected by heat-insulating shield with insulation board.
Compared with prior art, the beneficial effects of the utility model are as follows:
The utility model is connected to mainboard by heating column, and the heat absorption of mainboard is transmitted to by graphene material by heating column
Expect in the heat sink that is made, the top of heat sink is provided with radiating groove, the surface of heat sink through there is a ventilation hole, radiating groove and
Ventilation hole is provided to increase the contact area of heat sink and air, can accelerate the heat dissipation effect of heat sink.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is one of partial structural diagram of the utility model；
Fig. 3 is the two of the partial structural diagram of the utility model；
In figure: 1, integrating microelectrode plate ontology；2, mainboard；3, connector；4, capacitor；5, electrolytic capacitor；6, resistance；7, absolutely
Hot plate；8, insulation board；9, heat sink；10, heating column；11, radiating groove；12, ventilation hole.
Specific embodiment
It is illustrated below in conjunction with preferred embodiment of the attached drawing to the utility model, it should be understood that described herein excellent
It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
Wherein identical label all refers to identical component in attached drawing.
In addition, if the detailed description of known technology for show the utility model be characterized in it is unnecessary, then by it
It omits.It should be noted that word "front", "rear" used in the following description, "left", "right", "up" and "down" refer to it is attached
Direction in figure, word "inner" and "outside" refer respectively to the direction towards or away from geometric center of specific component.
Embodiment 1
As shown in Figure 1-3, the utility model provides a kind of integrated microelectrode plate, including integrated microelectrode plate ontology 1, integrate
The inside of microelectrode plate ontology 1 is equipped with mainboard 2, and the top side of mainboard 2 is equipped with connector 3, the side installation of connector 3
There is capacitor 4, the side of capacitor 4 is equipped with electrolytic capacitor 5, and the side far from capacitor 4 is equipped with resistance 6, one end installation of mainboard 2
There is heat-insulating shield 7, one end of heat-insulating shield 7 is equipped with insulation board 8, and the side of insulation board 8 is equipped with heat sink 9, one end of heat sink 9
There are four heating columns 10 for installation, and heating column 10 is connect through insulation board 8, heat-insulating shield 7 with mainboard 2, the top end surface of heat sink 9
Several equally distributed radiating grooves 11 are provided with, the surface of heat sink 9, which is run through, there are several equally distributed ventilation holes 12.
Further, heat-insulating shield 7 is mainly made by asbestos material, and asbestos have good heat-insulating property, can be with
Damage the mainboard 2 of fever to insulation board 8.
The material of insulation board 8 is mainly made by polyimide material, and polyimide material has high-intensitive insulation
Property, mainboard 2 can be made not influenced by external electricity.
The material of heat sink 9 is mainly made by grapheme material, and graphene has very good thermal diffusivity, can be with
It is cracking to disperse heat.
Mainboard 2 is connected by heat-insulating shield 7 with insulation board 8, and insulation board 8 influences mainboard 2 by external electricity, heat-insulating shield
7 damage the mainboard 2 of fever to insulation board 8.
Specifically, connector 3 can connect external equipment and carry out signal when being powered on as microelectrode plate ontology 1
Transmission, resistance 6 can limit the size of current by its institute's chord road, and after a period of work, component can begin to send out heat,
Mainboard 2 is set integrally to generate heat, fever can then reduce the working efficiency of the component on mainboard 2, install heating column in one end of mainboard
10, heating column 10 is connected to the heat sink 9 being mainly made by grapheme material, and graphene has good thermal diffusivity, dissipates
The top of hot plate 9 is provided with radiating groove 11, and through there is ventilation hole 12, radiating groove 11 and ventilation hole 12 are all to increase on the surface of heat sink 9
Add the contact area of heat sink 9 Yu air, the heat dissipation effect of heat sink 9 can be accelerated, pacifies between mainboard 2 and heat sink 9
Heat-insulating shield 7 and insulation board 8 are filled, insulation board 8 is in order to protect mainboard 2 not interfered by external electric power, because outer incoming call can damage master
Component on plate 2 or mainboard 2 impacts microelectrode plate ontology 1, and heat-insulating shield 7 makes the mainboard 2 of fever will not be to insulation
Plate 8 damages, in order to preferably protect mainboard 2 not damaged.
In conclusion the utility model is connected to mainboard 2 by heating column 10, heating column 10 is by the heat absorption of mainboard 2
It is transmitted in the heat sink 9 being made by grapheme material, the top of heat sink 9 is provided with radiating groove 11, the surface of heat sink 9
Through there is ventilation hole 12, radiating groove 11 and ventilation hole 12 are provided to increase the contact area of heat sink 9 and air, can accelerate
The heat dissipation effect of heat sink 9.
Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of integrated microelectrode plate, including integrated microelectrode plate ontology (1), which is characterized in that the integrated microelectrode plate sheet
The inside of body (1) is equipped with mainboard (2), and the top side of the mainboard (2) is equipped with connector (3), the connector (3)
Side is equipped with capacitor (4), and the side of the capacitor (4) is equipped with electrolytic capacitor (5), and the side far from the capacitor (4) is pacified
Equipped with resistance (6), one end of the mainboard (2) is equipped with heat-insulating shield (7), and one end of the heat-insulating shield (7) is equipped with insulation board
(8), the side of the insulation board (8) is equipped with heat sink (9), and there are four heating columns for one end installation of the heat sink (9)
(10), and heating column (10) is connect through insulation board (8), heat-insulating shield (7) with mainboard (2), the top end surface of the heat sink (9)
Several equally distributed radiating grooves (11) are provided with, the surface of the heat sink (9), which is run through, there are several equally distributed ventilation holes
(12)。
2. a kind of integrated microelectrode plate according to claim 1, which is characterized in that the heat-insulating shield (7) mainly by stone
Cotton material is made.
3. a kind of integrated microelectrode plate according to claim 1, which is characterized in that the material of the insulation board (8) is main
It is made by polyimide material.
4. a kind of integrated microelectrode plate according to claim 1, which is characterized in that the material of the heat sink (9) is main
It is made by grapheme material.
5. a kind of integrated microelectrode plate according to claim 1, which is characterized in that the mainboard (2) passes through heat-insulating shield (7)
It is connected with insulation board (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821284507.4U CN208490032U (en) | 2018-08-10 | 2018-08-10 | A kind of integrated microelectrode plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821284507.4U CN208490032U (en) | 2018-08-10 | 2018-08-10 | A kind of integrated microelectrode plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208490032U true CN208490032U (en) | 2019-02-12 |
Family
ID=65246993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821284507.4U Active CN208490032U (en) | 2018-08-10 | 2018-08-10 | A kind of integrated microelectrode plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208490032U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110737161A (en) * | 2019-09-28 | 2020-01-31 | 广东联大光电有限公司 | laser projection light path engine shell |
-
2018
- 2018-08-10 CN CN201821284507.4U patent/CN208490032U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110737161A (en) * | 2019-09-28 | 2020-01-31 | 广东联大光电有限公司 | laser projection light path engine shell |
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