CN208352324U - A kind of micro-led transfer system - Google Patents
A kind of micro-led transfer system Download PDFInfo
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- CN208352324U CN208352324U CN201821123736.8U CN201821123736U CN208352324U CN 208352324 U CN208352324 U CN 208352324U CN 201821123736 U CN201821123736 U CN 201821123736U CN 208352324 U CN208352324 U CN 208352324U
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Abstract
The utility model discloses a kind of micro-led transfer systems, including computer system, Electrostatic Control system, measurement system, kinetic control system, control parts of motion I, control parts of motion II, optical alignment component, gripper components, transfer base substrate, transfer head array, load plate, recovery part, microscope carrier, micro-led, bearing substrate；Wherein: gripper components are connect with transfer base substrate, and for grabbing transfer base substrate, and using the transfer base substrate as transfer head, the transfer base substrate is micro-led for grabbing.Utility model has the advantages that carrying out micro-led transfer as transfer head using transfer base substrate, reduce by a transfer step compared with the prior art, it can effectively improve transfer efficiency, it may be implemented to test micro-led in transfer process simultaneously, it is underproof micro-led to exclude, so as to realize the micro-led transfer of quick, high yield.
Description
Technical field
The utility model relates to LED technology field more particularly to a kind of micro-led transfer systems.
Background technique
Micro-led (Micro LED) refers to size reduction to micron-sized light-emitting diode chip for backlight unit.Due to micro-
Type light emitting diode has many advantages, such as that high brightness, low-power consumption, reaction speed are fast, ultrahigh resolution and color saturation, will be miniature
Light emitting diode is applied to display field and has become current research hot topic and following important development direction.
It is micro-led to need for growth on substrate micro-led to be transferred to applied to display field
It drives on backboard, a core technology during being somebody's turn to do is exactly micro-led transfer techniques.In the prior art, generally
It is shifted using the technology of Electrostatic Absorption mode, electrostatic transfer technology is needed using transfer head array, by applying to transfer head
Making alive makes it take electrostatic to grab to micro-led, removes voltage in transfer head for miniature and shines two
Pole pipe release is on receiving substrate.Micro-led display technology is for micro-led transfer rate and yield
It is required that it is relatively high, generally require the yield close to 100%.However the transfer techniques of Electrostatic Absorption mode are in transfer rate and yield
It is upper limited, constrain micro-led development and application in display field.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of micro-led transfer system, solves
Micro-led transfer rate and the relatively low problem of yield in the prior art.
(2) technical solution
To achieve the above object, the utility model provides the following technical solutions: a kind of micro-led transfer system,
Including computer system, Electrostatic Control system, measurement system, kinetic control system, control parts of motion I, control parts of motion
II, optical alignment component, gripper components, transfer base substrate, transfer head array, load plate, recovery part, microscope carrier, miniature light-emitting diodes
Pipe, bearing substrate；Wherein: gripper components are connect with transfer base substrate, for grabbing transfer base substrate, and using the transfer base substrate as
Transfer head, the transfer base substrate is micro-led for grabbing, and measurement system passes through in gripper components and transfer base substrate
Integrated circuit connection, the measurement system to grab on transfer base substrate it is micro-led test, the measurement
System is connect with computer system, has microswitch array, Electrostatic Control system and computer system in Electrostatic Control system
Connection, Electrostatic Control system are connect by gripper components with the integrated circuit on transfer base substrate, and kinetic control system and movement are controlled
Component I processed connects, and control parts of motion I is connect with control parts of motion II, and kinetic control system passes through I He of control parts of motion
Control parts of motion II is mobile to control gripper components, and kinetic control system is connect with computer system, control parts of motion II
It is connect with gripper components, gripper components are equipped with optical alignment component, and optical alignment component has identification to bit function for examining
The motion profile of gripper components is surveyed, and the result that will test feeds back to computer system, is placed with load plate below transfer base substrate, carries
Bearing substrate is placed on disk, load plate is placed on microscope carrier.
A kind of micro-led transfer system, in which: be placed with recovery part on the microscope carrier.
A kind of micro-led transfer system, in which: the transfer base substrate can be using TFT driving backboard or silicon substrate
CMOS drives backboard.
A kind of micro-led transfer system, in which: the material that the bearing substrate selects can be glass, silicon, poly-
Carbonic ester or any combination thereof.
A kind of micro-led transfer system, in which: the transfer base substrate is grabbed close to micro-led
When taking, the distance controlling of the two is at 2~10 μm.
(3) beneficial effect
Compared with prior art, the utility model provides a kind of micro-led transfer system, and having following has
Beneficial effect: the transfer system carries out micro-led transfer as transfer head using transfer base substrate, subtracts compared with the prior art
A few transfer step, can effectively improve transfer efficiency, while may be implemented in transfer process to micro-led
It is tested, it is underproof micro-led to exclude, so as to realize the micro-led of quick, high yield
Transfer.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the schematic diagram of micro-led transfer process in the utility model.
Appended drawing reference: computer system 101, Electrostatic Control system 102, measurement system 103, kinetic control system 104, fortune
Dynamic control unit I 105, control parts of motion II 106, optical alignment component 107, gripper components 108, transfer base substrate 109, transfer
Head array 110, load plate 111, recovery part 112, microscope carrier 113, micro-led 114, bearing substrate 115.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Embodiment 1, as shown in Figure 1, a kind of micro-led transfer system, including computer system 101, electrostatic control
System 102 processed, measurement system 103, kinetic control system 104, control parts of motion I 105, control parts of motion II 106, optics
Positioning element 107, gripper components 108, transfer base substrate 109, transfer head array 110, load plate 111, recovery part 112, microscope carrier
113, micro-led 114, bearing substrate 115；Wherein: gripper components 108 are connect with transfer base substrate 109, for grabbing
Transfer base substrate 109, and it regard the transfer base substrate 109 as transfer head, the transfer base substrate 109 is for grabbing miniature light-emitting diodes
Pipe 114, measurement system 103 are connect by gripper components 108 with the integrated circuit on transfer base substrate 109, the measurement system 103
Micro-led 114 grabbed on transfer base substrate 109 are tested, the measurement system 103 and computer system
101 connect, and have microswitch array in Electrostatic Control system 102, and Electrostatic Control system 102 is connect with computer system 101,
Electrostatic Control system 102 is connect by gripper components 108 with the integrated circuit on transfer base substrate 109, kinetic control system 104 and
Control parts of motion I 105 connects, and control parts of motion I 105 is connect with control parts of motion II 106, kinetic control system 104
It is mobile that gripper components 108 are controlled by control parts of motion I 105 and control parts of motion II 106, kinetic control system 104
It is connect with computer system 101, control parts of motion II 106 is connect with gripper components 108, and gripper components 108 are equipped with optics
Positioning element 107, the motion profile that there is optical alignment component 107 identification to be used to detect gripper components 108 to bit function, and will
The result of detection feeds back to computer system 101, and load plate 111 is placed with below transfer base substrate 109, is placed with and holds on load plate 111
Carried base board 115, load plate 111 are placed on microscope carrier 113.
Embodiment 2, a kind of micro-led transfer system, in which: be placed with recovery part on the microscope carrier 113
112, for being recycled to micro-led the 114 of test failure.Remaining is the same as embodiment 1.
Embodiment 3, a kind of micro-led transfer system, in which: the transfer base substrate 109 can be driven using TFT
Dynamic backboard or silicon base CMOS drive backboard.Remaining is the same as embodiment 1.
Embodiment 4, a kind of micro-led transfer system, in which: the material that the bearing substrate 115 selects can be for
Glass, silicon, polycarbonate or any combination thereof.Remaining is the same as embodiment 1.
Embodiment 5, a kind of micro-led transfer system, in which: the transfer base substrate 109 is close to miniature luminous two
When pole pipe 114 is grabbed, the distance controlling of the two is at 2~10 μm.Remaining is the same as embodiment 1.
Working principle:
After optical positioning system 107 positions, location information is fed back to computer system 101, and passes through kinetic control system
104 control control parts of motion I 105 and control parts of motion II 106, the gripper components 108 for grabbing transfer base substrate 109 are moved
It is dynamic, make to be transferred micro-led 114 of the gripper components 108 on bearing substrate 115；
It is discharged by gripper components 108 the transfer head array 110 on transfer base substrate 109 by Electrostatic Control system 102,
Make its surface corresponding position static electrification, to be transferred micro-led 114 on bearing substrate 115 are grabbed, are grabbed
It takes component 108 to grab transfer base substrate 109, and after shifting micro-led 114 by Electrostatic Absorption, is overturn, passed through
103 pairs of measurement system shifted micro-led 114 test, or directly by the micro-led of crawl
114 are placed on recovery part 112, and to micro-led 114 apply certain pressure make its with receive it is right on substrate
The electrode position answered comes into full contact with to be tested, to the micro-led by eliminating on its electrode of test failure
Voltage makes it lose electrostatic and the mode that falls off, is recycled using recovery part 112.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of micro-led transfer system, including computer system (101), Electrostatic Control system (102), measurement system
System (103), kinetic control system (104), control parts of motion I (105), control parts of motion II (106), optical alignment component
(107), gripper components (108), transfer base substrate (109), transfer head array (110), load plate (111), recovery part (112), load
Platform (113), micro-led (114), bearing substrate (115)；It is characterized by: gripper components (108) and transfer base substrate
(109) it connects, is used as transfer head, the transfer base substrate for grabbing transfer base substrate (109), and by the transfer base substrate (109)
(109) for grabbing micro-led (114), measurement system (103) passes through gripper components (108) and transfer base substrate
(109) the integrated circuit connection on, the measurement system (103) is to the miniature light-emitting diodes grabbed on transfer base substrate (109)
Pipe (114) is tested, and the measurement system (103) connect with computer system (101), and Electrostatic Control system has on (102)
There is microswitch array, Electrostatic Control system (102) is connect with computer system (101), and Electrostatic Control system (102) is by grabbing
Component (108) is taken to connect with the integrated circuit on transfer base substrate (109), kinetic control system (104) and control parts of motion I
(105) it connects, control parts of motion I (105) is connect with control parts of motion II (106), and kinetic control system (104) passes through fortune
Control unit I (105) and control parts of motion II (106) are moved to control gripper components (108) movement, kinetic control system
(104) it is connect with computer system (101), control parts of motion II (106) is connect with gripper components (108), gripper components
(108) optical alignment component (107) are equipped with, optical alignment component (107) has identification to bit function for detecting crawl section
The motion profile of part (108), and the result that will test is fed back to computer system (101), is placed with below transfer base substrate (109)
Load plate (111) is placed with bearing substrate (115) on load plate (111), and load plate (111) is placed on microscope carrier (113).
2. a kind of micro-led transfer system according to claim 1, it is characterised in that: the microscope carrier (113)
On be placed with recovery part (112).
3. a kind of micro-led transfer system according to claim 1, it is characterised in that: the transfer base substrate
(109) backboard can be driven using TFT driving backboard or silicon base CMOS.
4. a kind of micro-led transfer system according to claim 1, it is characterised in that: the bearing substrate
(115) material selected can be glass, silicon, polycarbonate or any combination thereof.
5. a kind of micro-led transfer system according to claim 1, it is characterised in that: the transfer base substrate
(109) when being grabbed close to micro-led (114), the distance controlling of the two is at 2~10 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821123736.8U CN208352324U (en) | 2018-07-16 | 2018-07-16 | A kind of micro-led transfer system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821123736.8U CN208352324U (en) | 2018-07-16 | 2018-07-16 | A kind of micro-led transfer system |
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| CN208352324U true CN208352324U (en) | 2019-01-08 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246785A (en) * | 2019-06-25 | 2019-09-17 | 京东方科技集团股份有限公司 | Transfer apparatus and transfer method |
| CN110311029A (en) * | 2019-07-02 | 2019-10-08 | 厦门乾照光电股份有限公司 | A kind of Mirco LED array substrate and preparation method thereof |
| CN111098330A (en) * | 2020-03-04 | 2020-05-05 | 斯佩(新昌)科技有限公司 | Micro LED array manipulator based on ultrasonic vibration formula |
| CN111168699A (en) * | 2020-03-04 | 2020-05-19 | 斯佩(新昌)科技有限公司 | Micro LED array robot complete machine based on ultrasound and array method |
| CN111247630A (en) * | 2019-09-30 | 2020-06-05 | 重庆康佳光电技术研究院有限公司 | Light emitting diode detection system |
| CN113178408A (en) * | 2021-05-28 | 2021-07-27 | 重庆翰博显示科技研发中心有限公司 | Discharging, transferring and positioning device for miniature electronic assembly and working method of discharging, transferring and positioning device |
| CN113789501A (en) * | 2021-09-09 | 2021-12-14 | 比尔安达(上海)润滑材料有限公司 | Method and system for forming multi-nano coating on surface of shaver cap |
| CN116612699A (en) * | 2023-07-17 | 2023-08-18 | 惠科股份有限公司 | Lamp panel, display device and assembling method of lamp panel |
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2018
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246785A (en) * | 2019-06-25 | 2019-09-17 | 京东方科技集团股份有限公司 | Transfer apparatus and transfer method |
| CN110246785B (en) * | 2019-06-25 | 2022-04-15 | 京东方科技集团股份有限公司 | Transfer apparatus and transfer method |
| CN110311029A (en) * | 2019-07-02 | 2019-10-08 | 厦门乾照光电股份有限公司 | A kind of Mirco LED array substrate and preparation method thereof |
| CN111247630B (en) * | 2019-09-30 | 2022-03-01 | 重庆康佳光电技术研究院有限公司 | Light emitting diode detection system |
| CN111247630A (en) * | 2019-09-30 | 2020-06-05 | 重庆康佳光电技术研究院有限公司 | Light emitting diode detection system |
| WO2021062773A1 (en) * | 2019-09-30 | 2021-04-08 | 重庆康佳光电技术研究院有限公司 | Light emitting diode detection system |
| US11739890B2 (en) | 2019-09-30 | 2023-08-29 | Chongqing Konka Photoelectric Technology Research Institute Co., Ltd. | System for detecting LED |
| CN111168699B (en) * | 2020-03-04 | 2021-03-05 | 斯佩(新昌)科技有限公司 | Micro LED array robot complete machine based on ultrasound |
| CN111168699A (en) * | 2020-03-04 | 2020-05-19 | 斯佩(新昌)科技有限公司 | Micro LED array robot complete machine based on ultrasound and array method |
| CN111098330A (en) * | 2020-03-04 | 2020-05-05 | 斯佩(新昌)科技有限公司 | Micro LED array manipulator based on ultrasonic vibration formula |
| CN113178408A (en) * | 2021-05-28 | 2021-07-27 | 重庆翰博显示科技研发中心有限公司 | Discharging, transferring and positioning device for miniature electronic assembly and working method of discharging, transferring and positioning device |
| CN113789501A (en) * | 2021-09-09 | 2021-12-14 | 比尔安达(上海)润滑材料有限公司 | Method and system for forming multi-nano coating on surface of shaver cap |
| CN113789501B (en) * | 2021-09-09 | 2023-07-25 | 比尔安达(上海)润滑材料有限公司 | Method and system for forming multi-nano coating on surface of shaver cap |
| CN116612699A (en) * | 2023-07-17 | 2023-08-18 | 惠科股份有限公司 | Lamp panel, display device and assembling method of lamp panel |
| CN116612699B (en) * | 2023-07-17 | 2023-11-21 | 惠科股份有限公司 | Lamp panel, display device and assembling method of lamp panel |
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