CN208317094U - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
- Publication number
- CN208317094U CN208317094U CN201690000587.9U CN201690000587U CN208317094U CN 208317094 U CN208317094 U CN 208317094U CN 201690000587 U CN201690000587 U CN 201690000587U CN 208317094 U CN208317094 U CN 208317094U
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- CN
- China
- Prior art keywords
- side ground
- flexible circuit
- circuit board
- layer
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a kind of flexible circuit boards.The flexible circuit board of the utility model includes: first medium layer；Second dielectric layer corresponds to the first medium layer；And a pair of of side ground, the pair of side ground separate the first spacing across the signal wire for a certain dielectric layer being set in the first medium layer and the second dielectric layer and are arranged.
Description
Technical field
The utility model relates to a kind of flexible circuit boards.
Background technique
In the wireless terminal devices such as mobile phone, have RF (Radio Frequency, radio frequency) signal line, and it is existing
RF signal line is installed in the form of coaxial cable, the space benefit if being installed in the form of coaxial cable, in wireless terminal device
Declined with rate, therefore, recently, it is common to use flexible circuit board.
In existing flexible circuit board, the area for increasing signal wire carrys out the signal lost when supplementary signal transmission, in turn
Ensure necessary semaphore.
On the one hand, if signal wire area increases, impedance can reduce, therefore, attach most importance to and newly increase reduced impedance, also utilize
The mode for reducing the area of ground connection realizes impedance matching.
However, if the part contact in the area reduction of ground connection has electric conductor or close to configured with electric conductor, electric conductor
It will be electrically connected with ground connection, so that the increased effect of entire area is grounded by generating, in this way, not only reducing impedance, but also in correspondence
It can be directly exposed to electric conductor in the signal wire of the grounded part of reduction, so that there are the semaphore lost when signal transmission increasings
The problem of adding.
To which for the generation for preventing impedance variations, flexible circuit board should be installed on and mainboard, daughter board, battery appropriate intervals
Position, therefore, when being applicable in flexible circuit board, there is can be rated as the space of premier great advantage with property decline
Problem.
It is of course also possible to be configured at by impedance matching with mainboard, daughter board, battery close position, but nonetheless,
As long as the shape or position change of any one of mainboard, daughter board, battery are still remained, for impedance matching, flexible electrical
The shortcomings that shape of road plate will also change therewith.
Utility model content
The purpose of the utility model is to provide a kind of losses for making signal wire and the signal flowed into from outside to minimize,
And regardless of the position being configured inside wireless terminal device, since no resistance changes, without separately being changed for impedance matching
The flexible circuit board of its shape.
Above-mentioned the purpose of this utility model can be achieved through the following technical solutions.
The flexible circuit board of the utility model includes: first medium layer；Second dielectric layer corresponds to the first medium
Layer；And a pair of of side ground, the pair of side ground is across being set to the first medium layer or the second dielectric layer
In the signal wire of a certain dielectric layer separate the first spacing and be arranged.
The side ground can be plate shape.
The side ground can be formed along the length direction of the signal wire.
The side ground can be disc-shape.
The side ground can be provided with multiple with separating third spacing along the length direction of the signal wire.
The side ground may include first side ground connection and the face contact for being contacted with the first medium layer on one side
It is grounded in the second side of the second dielectric layer, can be laminated respectively in the one side of the first medium layer and second dielectric layer
There are the first ground plane and the second ground plane, the respective another side that the first side ground connection and second side are grounded can be with viscous
Sheeting is medium combination, and the diameter of the side ground can be less than the width of the bonding sheet.
At least it could be formed with hole on a certain ground plane in first ground plane and the second ground plane.
It could be formed with the air surrounded by the first medium layer, the pair of side ground and the second dielectric layer
Layer, a certain dielectric layer that the signal wire can be formed in the first medium layer and the second dielectric layer and be exposed to institute
State air layer.
The effect of the utility model is as follows.
According to the utility model, following multi-effect may be implemented.
First, there is which space no matter being configured inside wireless terminal device, the unconverted advantage of impedance.
Second, due to without impedance matching can also be configured at mainboard, daughter board, battery close position, have without become
The advantages of being more used for the flexible circuit board shape of impedance matching.
Third has the advantages that minimize signal wire loss amount.
4th, have the advantages that prevent external signal from flowing into.
Detailed description of the invention
Fig. 1 is the exploded perspective view for showing an embodiment of the utility model.
Fig. 2 is the perspective view of an embodiment of the utility model.
Fig. 3 is the exploded perspective view of another embodiment of the utility model.
Fig. 4 is the exploded perspective view of the another embodiment of the utility model.
Fig. 5 a is the figure of the side ground of one layer of formation in an embodiment of the utility model.
Fig. 5 b be formed in an embodiment of the utility model two layers side ground figure.
Fig. 6 a is the figure of the side ground of one layer of formation in another embodiment of the utility model.
Fig. 6 b be formed in another embodiment of the utility model two layers side ground figure.
Fig. 7 is the figure for showing the ground plane of the utility model.
Specific embodiment
The purpose of this utility model, some specified advantages and new feature will be from following detailed descriptions relevant to attached drawing
It is become more apparent upon in embodiment.It should be noted that in this specification, in the reference marks for the constituent element for marking each figure
When, for identical constituent element, even if it is shown in other accompanying drawings, also make to number as far as possible identical.In addition, first,
Second-class term can be used for illustrating a variety of constituent elements, but the constituent element should not necessarily be limited by the term.The constituent element
It is used only as distinguishing the purpose of a constituent element and other constituent elements.In addition, working as judgement during illustrating the utility model
For to related known technology illustrate redundantly do not know the purport of the utility model when, description is omitted.
The embodiments of the present invention are described in detail with reference to the accompanying drawings.
As shown in Figure 1 to Figure 3, the flexible circuit board of the utility model includes first medium layer 200, second dielectric layer 300
And side ground 400.
The flexible circuit board of the utility model is in first medium layer 200 and second dielectric layer with corresponding shape
Setting signal line 100 on a certain layer in 300, and across signal wire 100, between the signal wire 100 has been respectively separated first
Away from position a pair of of side ground 400 is set, so that anti-stop signal is flowed into from outside.
Side ground 400 include the first side for being contacted with first medium layer 200 be grounded 410 and while be contacted with the
The second side ground connection 420 of second medium layer 300, is laminated with respectively in the one side of first medium layer 200 and second dielectric layer 300
First ground plane 500 and the second ground plane 600, and first side ground connection 410 and second side ground connection 420 it is respective another
Face can be medium combination with bonding sheet 700.
Other than the function of preventing external signal from flowing into, first side ground connection 410 and second side ground connection 420 are also acted as
Strengthen the function of the first ground plane 500 with the second ground plane 600 being electrically connected.
Bonding sheet 700 is filled out in the formation of flexible circuit intralamellar part together with first side ground connection 410 and second side ground connection 420
There is the empty space of air, and playing makes first side ground connection 410 and second side ground connection 420 be attached to first medium layer 200
With the function of second dielectric layer 300.
On the one hand, the first ground plane 500, the second ground plane 600, first side ground connection 410, second side ground connection 420,
Bonding sheet 700, first medium layer 200, second dielectric layer 300 are formed through through-hole VH to vertical direction, in this through-hole VH
In be filled with electric conductor so that the first ground plane 500, the second ground plane 600, first side ground connection 410, second side ground connection
420 electrical connections.
On the one hand, as shown in Figure 1 and Figure 2, side ground 400 can be the plate shape formed along the length direction of signal wire,
Or be formed as plate shape as illustrated in fig. 3, and partly reduce its area, and form multiple subtract with separating the second spacing
The shape of the part of few area, or separate third spacing along the length direction of signal wire as illustrated in fig. 4 and be formed with
Multiple disc-shapes.
In this way, if the area of side ground 400 is reduced, capacitor is reduced, therewith, can be with the amount of capacitor reduction correspondingly
Widen the area of signal wire 100 to increase working transmission, if thus by the disc-shape that is shaped as of side ground 400,
This effect can be made to maximize.
On the one hand, side ground 400 can be formed as one layer, is also configured to first side ground connection 410 and second
Side ground 420 is formed as two layers.
The case where Fig. 5 a is side ground 400 for the plate shape to form one layer, Fig. 6 a are the disc-shapes to form one layer
The case where side ground 400, Fig. 5 b and Fig. 6 b are the first side ground connection 410 and second for being utilized respectively plate shape and disc-shape
Side ground 420, the case where forming two layers of side ground 400.
In the case where forming two layers of side ground 400 using first side ground connection 410 and second side ground connection 420,
First side ground connection 410 is attached to the one side of bonding sheet 700, second side ground connection 420 is attached to the another of bonding sheet 700
On one side, so that first side ground connection 410 can be formed in identical layer with signal wire 100.
In the case where side ground 400 is configured to first side ground connection 410 and second side ground connection 420, due to letter
Spacing number between line 100 and the second ground plane 600 becomes remote, has the advantages that capacitor can be further decreased.
As shown in fig. 7, the more than one ground plane preferably at least in the first ground plane 500 and the second ground plane 600
On, pattern landform pore-forming H can be constituted, to reduce capacitor.
On the one hand, as shown in Figure 1 and Figure 2, the signal wire 100 of the flexible circuit board of the utility model can also be exposed to sky
Gas, since signal wire 100 is exposed to the low air of dielectric constant, so that the capacitor on periphery reduces, so that the loss of signal be made to minimize.
If signal wire 100 is exposed to the low air of dielectric constant, so that perimeter capacitance reduces, there will be signals to flow into from outside
And the loss of signal of signal wire is induced, therefore, in the present invention, inhibit external signal to flow into using side ground 400.
More specifically, if a certain dielectric layer in selection first medium layer 200 and second dielectric layer 300 carrys out binding signal
Line 100, and so that first medium layer 200 and second dielectric layer 300 is located at opposite position, and centre is separated with 100 ground of signal wire
With a pair of of side ground 400 be medium combination first medium layer 200 and second dielectric layer 300, then will by first medium layer 200,
Second dielectric layer 300, a pair of of side ground 400 form empty space, and can be filled with air in the space of this sky, thus believe
Number line 100 will be exposed to air.
On the one hand, the present utility model application artificially verifies the effect of the utility model, using existing flexible circuit board and
The flexible circuit board of the utility model measures and compares signal transmission loss amount.
The experiment A occurred in the following table 1 is the experimental result that face contact electric conductor in side carrys out measuring signal loss amount, real
Testing B is the experimental result that the face contact electric conductor in two sides carrys out measuring signal loss amount.
[table 1]
As shown in table 1, it can be confirmed, compared with existing flexible circuit board, according to the utility model, in all frequency ranges,
Loss of signal amount reduces about 50% or so.
Although the utility model is described in detail by specific embodiment above, this is only used for illustrating this
Utility model, rather than the flexible circuit board for making it be limited to the utility model, it is clear that the general technical staff of this field can
To implement deformation within the scope of the technical idea of the utility model or improve.
The simple deformation and change of the utility model each fall within the scope of the utility model, the specific protection of the utility model
Range will be clearly defined by appended patent claims.
Claims (9)
1. a kind of flexible circuit board characterized by comprising
First medium layer；
Second dielectric layer corresponds to the first medium layer；And
A pair of of side ground, the pair of side ground is across being set in the first medium layer or the second dielectric layer
The signal wire of a certain dielectric layer separates the first spacing and is arranged.
2. flexible circuit board according to claim 1, which is characterized in that
The side ground is plate shape.
3. flexible circuit board according to claim 2, which is characterized in that
The side ground is formed along the length direction of the signal wire.
4. flexible circuit board according to claim 1, which is characterized in that
The side ground is disc-shape.
5. flexible circuit board according to claim 4, which is characterized in that
The side ground is provided with multiple with separating third spacing along the length direction of the signal wire.
6. flexible circuit board according to any one of claim 1 to 5, which is characterized in that
The side ground include the first side for being contacted with the first medium layer be grounded and while be contacted with described the
The second side of second medium layer is grounded,
It is laminated with the first ground plane and the second ground plane respectively in the one side of the first medium layer and second dielectric layer,
The respective another side of the first side ground connection and second side ground connection is combined by medium of bonding sheet.
7. flexible circuit board according to claim 5, which is characterized in that
The side ground include the first side for being contacted with the first medium layer be grounded and while be contacted with described the
The second side of second medium layer is grounded,
It is laminated with the first stratum and the second stratum respectively in the one side of the first medium layer and second dielectric layer,
The respective another side of the first side ground connection and second side ground connection is combined by medium of bonding sheet,
And the diameter of the side ground is less than the width of the bonding sheet.
8. flexible circuit board according to claim 6, which is characterized in that
At least hole is formed on a certain ground plane in first ground plane and the second ground plane.
9. flexible circuit board according to any one of claims 1 to 5, which is characterized in that
It is formed with the air layer surrounded by the first medium layer, the pair of side ground and the second dielectric layer,
A certain dielectric layer that the signal wire is formed in the first medium layer and the second dielectric layer and be exposed to described
Air layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150037226A KR102337398B1 (en) | 2015-03-18 | 2015-03-18 | Flexible printed circuit board |
| KR10-2015-0037226 | 2015-03-18 | ||
| PCT/KR2016/002318 WO2016148427A1 (en) | 2015-03-18 | 2016-03-09 | Flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208317094U true CN208317094U (en) | 2019-01-01 |
Family
ID=56919234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201690000587.9U Active CN208317094U (en) | 2015-03-18 | 2016-03-09 | Flexible circuit board |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102337398B1 (en) |
| CN (1) | CN208317094U (en) |
| WO (1) | WO2016148427A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114744389A (en) * | 2022-04-14 | 2022-07-12 | 浙江大学 | Flexible circuit high-frequency transmission line based on dielectric groove and dielectric support |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102677047B1 (en) * | 2017-01-04 | 2024-06-20 | 주식회사 기가레인 | Flexible printed circuit board |
| KR101824644B1 (en) * | 2017-05-08 | 2018-02-01 | 주식회사 기가레인 | Flexible printed circuit board with narrower width and manufacturing method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100619956B1 (en) * | 2004-11-10 | 2006-09-07 | 엘지전자 주식회사 | Mobile terminal having connection apparatus for connecting between printed circuit board |
| KR101212094B1 (en) * | 2006-11-14 | 2012-12-13 | 삼성전자주식회사 | Flexible printed circuit board and electric apparatus having the same |
| KR100958268B1 (en) * | 2008-02-15 | 2010-05-19 | (주)기가레인 | printed circuit board capable of widening the width of signal transmission line without impedance miss matching |
| KR101065279B1 (en) * | 2008-04-04 | 2011-09-16 | (주)기가레인 | printed circuit board including slot pattern formed in the signal transmission line |
| KR100987191B1 (en) * | 2008-04-18 | 2010-10-11 | (주)기가레인 | printed circuit board removing bonding sheet around signal transmission line |
| KR101085726B1 (en) * | 2009-10-23 | 2011-11-21 | 삼성전기주식회사 | Rigid flexible printed circuit board and method for manufacturing of the same |
| CN102687600B (en) | 2010-12-03 | 2014-04-02 | 株式会社村田制作所 | High-frequency signal line |
| US8912581B2 (en) * | 2012-03-09 | 2014-12-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | 3D transmission lines for semiconductors |
-
2015
- 2015-03-18 KR KR1020150037226A patent/KR102337398B1/en active IP Right Grant
-
2016
- 2016-03-09 CN CN201690000587.9U patent/CN208317094U/en active Active
- 2016-03-09 WO PCT/KR2016/002318 patent/WO2016148427A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114744389A (en) * | 2022-04-14 | 2022-07-12 | 浙江大学 | Flexible circuit high-frequency transmission line based on dielectric groove and dielectric support |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160112119A (en) | 2016-09-28 |
| WO2016148427A1 (en) | 2016-09-22 |
| KR102337398B1 (en) | 2021-12-09 |
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| GR01 | Patent grant |