CN208283580U - Mirror lens, laser emitter, light emission component and light emitting receiving unit - Google Patents
Mirror lens, laser emitter, light emission component and light emitting receiving unit Download PDFInfo
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- CN208283580U CN208283580U CN201820108980.0U CN201820108980U CN208283580U CN 208283580 U CN208283580 U CN 208283580U CN 201820108980 U CN201820108980 U CN 201820108980U CN 208283580 U CN208283580 U CN 208283580U
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Abstract
The utility model relates to a kind of mirror lens, laser emitter, light emission component and light emitting receiving units.The purpose of the utility model is to provide a kind of mirror lens, laser emitter, light emission component and light emitting receiving unit, encapsulation difficulty is big to solve, the low problem of coupling efficiency.The technical solution of the utility model is: a kind of mirror lens, it is characterized by: it is the light penetrating object with the plane of incidence, reflecting surface and lens face, wherein condenser lens is formed on lens face, the light for injecting the light penetrating object from the plane of incidence projects light penetrating object through its reflective surface, then after condenser lens convergence.The utility model is suitable for optic communication device.
Description
Technical field
The utility model relates to a kind of mirror lens, laser emitter, light emission component and light emitting receiving units.It is applicable in
In optic communication device.
Background technique
Semiconductor laser is that the application of optical communication field most widely emits light source, with compact structure, service life
Long, the features such as stability is good.Optical device in conventional access network (GPON, EPON), since wavelength stability requirement is low, power is pre-
It is big to calculate allowance, all without thermoelectric cooler in encapsulation and use process.With the large scale deployment of 4G network, 5G network also will
Commercialization, the requirement to bandwidth are also higher and higher.Mobile network's bandwidth demand rapidly increases the base-bandwidth for needing fixed network
Support.Therefore, the technology of CWDM, DWDM start to be introduced into access net and wireless forward pass and passback field, have expanded bandwidth.
This wavelength stability to laser, chirp, it is non-linear propose higher requirement, thermoelectric cooler (TEC) is introduced in device
Excellent optical signal is obtained in part.Further, since communication wavelengths resource is limited, long wavelength (near 1600) is also gradually made
It is transmitted for signal.
The universal output power of long wavelength laser is lower, and to coupling efficiency, more stringent requirements are proposed for this.Traditional XMD and
Butterfly encapsulation light emission component is able to satisfy emitting performance requirement, but it is expensive, and extensive laying cost is larger.The patent No.
A kind of Distributed Feedback Laser component of low cost TO encapsulation is disclosed for the utility model patent of CN104810724A, inside laser
With thermoelectric cooler, chirp can inhibit.But since patch, sealing cap precision are limited, error superposition, laser goes out light
It is difficult to centering with lens, obtains high coupling efficiency when making TOSA BOSA.
Summary of the invention
Technical problem to be solved by the utility model is: in view of the above problems, a kind of mirror lens, laser are provided
Transmitter, light emission component and light emitting receiving unit, encapsulation difficulty is big to solve, the low problem of coupling efficiency.
The technical scheme adopted by the utility model is a kind of mirror lens, it is characterised in that: its be with the plane of incidence,
The light penetrating object of reflecting surface and lens face is wherein formed with condenser lens on lens face, injects the light penetrating object from the plane of incidence
Light projects light penetrating object through its reflective surface, then after condenser lens convergence.
The plane of incidence is vertical with the lens face, and angle is 45 ° between the reflecting surface and the plane of incidence and lens face.
A kind of laser emitter, it is characterised in that: use coaxial packaging structure, there is pipe cap and tube socket, set at the top of pipe cap
There is flat glass, the pipe cap and tube socket cooperatively form chamber, be equipped with thermoelectric cooler, temperature sensor, laser in chamber
Chip, backlight detection chip and the mirror lens, the condenser lens of the mirror lens towards the flat glass on pipe cap,
The plane of incidence of the chip of laser alignment mirror lens, temperature sensor are electrically connected with the control circuit of thermoelectric cooler.
The thermoelectric cooler is welded and fixed by golden tin solder with the tube socket；The chip of laser passes through golden soldering
Material be mounted on laser chip it is heat sink on, and be fixed in the thermoelectric cooler by heat-conducting glue.
The backlight detection chip by golden tin solder be mounted on detection chip it is heat sink on, and by solder with it is described
Thermoelectric cooler welding.
The temperature sensor is welded by solder and the thermoelectric cooler.
The temperature sensor uses thermistor.
A kind of light emission component, it is characterised in that: there is the laser emitter.
A kind of light emitting receiving unit, it is characterised in that: there is the laser emitter.
The beneficial effects of the utility model are: the utility model is saturating using the reflection that reflecting mirror and condenser lens integrally combine
Mirror reduces encapsulation difficulty, improves coupling efficiency, keeps sealing cap precision unrelated with coupling efficiency, is suitable for batch production, improves production
Efficiency increases output power.
The utility model mounts thermoelectric cooler in the heat sink lower section of chip of laser, can be had for chip of laser
The heat dissipation of effect；Laser temperature control can be made within specified temperatures using thermoelectric cooler cooperation temperature sensor.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of light emission component.
Fig. 2 is the structural schematic diagram of laser emitter.
Fig. 3 is the enlarged diagram in the portion A in Fig. 2.
Fig. 4 is the index path of laser emitter.
Fig. 5 is the structural schematic diagram of light emitting receiving unit.
Specific embodiment
Embodiment 1: as shown in Figure 1, the present embodiment is a kind of light emission component TOSA, including laser emitter, sleeve
(holder) 12, welding set 13, isolator 14 and integrated contact pin 15.
As shown in Figure 2 and Figure 3, laser emitter uses coaxial packaging structure in the present embodiment, has pipe cap 10 and tube socket
1, pipe cap 10 and tube socket 1 cooperatively form chamber, are equipped with thermoelectric cooler 2, thermistor 3, chip of laser 7, backlight in chamber
Detection chip 9 and mirror lens 5, thermistor 3 are electrically connected with the control circuit of thermoelectric cooler 2.
Chip of laser 7, which passes through, constitutes laser COC, same backlight on golden tin solder attachment to laser chip heat sink 6
Detection chip 9 is mounted on composition detector C OC in detection chip heat sink 8 by golden tin solder.Thermoelectric cooler 2 passes through golden soldering
Material is welded with tube socket 1.Detector C OC and thermistor 3 are welded by solder and 2 upper surface of thermoelectric cooler；Laser
COC is fixed by heat-conducting glue and thermoelectric cooler 2 and guarantees higher heat transfer efficiency.Mirror lens is fixed by reflective mirror basis
In thermoelectric cooler 2.
Mirror lens 5 is the light penetrating object of similar triangular prism-shaped in the present embodiment, has the plane of incidence 501, reflecting surface 502 and thoroughly
Mirror surface 503 is wherein formed with condenser lens 504 on lens face, the plane of incidence 501, reflecting surface 502 and lens face 503 are respectively should
Three sides of similar triangular prism-shaped, the plane of incidence 501 is vertical with lens face 503, reflecting surface 502 and the plane of incidence 501 and lens face
Angle is 45 ° between 503.The reflecting surface of mirror lens is contacted with Reflector base 4 in this example is connected, lens face direction pipe
10 top center of cap, the plane of incidence of mirror lens 5 are corresponding with 7 position of chip of laser.
Since mirror lens 5 is using the design of reflecting mirror and condenser lens one, therefore plane can be used at the top of pipe cap 10
Glass 11 completes level Hermetic Package, and flat glass 10, without effect is converging or diverging with, reduces encapsulation 10 machine required precision of sealing cap to light beam.
As shown in figure 4, the light that chip of laser 7 is emitted in the present embodiment enters thoroughly from the plane of incidence 501 of mirror lens
Body of light, and change optical path after the reflection of the reflecting surface of mirror lens 502, then after the condenser lens 504 on lens face 503 converges
Light penetrating object is projected, the light beam projected from mirror lens is by projecting laser emitter after the flat glass 11 on pipe cap 10.
In the present embodiment between backlight detection chip 9 and chip of laser 7 at 8 degree or so, do not do accurate control, can obtain
To optimal back facet current, and reflected light will not be introduced.
To tube socket 1, thermoelectric cooler 2, thermistor 3, laser core by the way of the bonding of spun gold part in the present embodiment
Piece 7, backlight detection chip 9 are electrically connected, to reduce inductance, improve high-frequency transmission performance.
Thermistor 3 is used to the operating temperature of exploring laser light chip, and laser chip temperature change can cause temperature-sensitive electric
The variation of 4 resistance values is hindered, the variation is by the control circuit of circuit transmission to thermoelectric cooler, and control circuit is by adjusting thermoelectricity system
The operating temperature of the input current control laser emitter of cooler.
Embodiment 2: as shown in figure 5, the present embodiment is a kind of light emitting receiving unit BOSA, including square base 16, contact pin
17, welding covers the laser emitter in 18,19,45 degree of light-receiving component 20,0 degree of filter plate filter plate and embodiment 1.
Certainly, above description is not limitation of the utility model, and the utility model is also not limited to the example above, this skill
The those of ordinary skill in art field, in the scope of the utility model, variation, addition or the replacement made all should belong to this reality
With novel protection scope.
Claims (9)
1. a kind of mirror lens, it is characterised in that: it is with the plane of incidence (501), reflecting surface (502) and lens face (503)
Light penetrating object is wherein formed with condenser lens (504) on lens face (503), the light of the light penetrating object is injected from the plane of incidence (501)
Line is reflected through its reflecting surface (502), then projects light penetrating object after the condenser lens (504) convergence.
2. mirror lens according to claim 1, it is characterised in that: the plane of incidence (501) and the lens face (503)
Vertically, angle is 45 ° between the reflecting surface (502) and the plane of incidence (501) and lens face (503).
3. a kind of laser emitter, it is characterised in that: use coaxial packaging structure, there is pipe cap (10) and tube socket (1), pipe cap
(10) top is equipped with flat glass (11), and the pipe cap (10) and tube socket (1) cooperatively form chamber, is equipped with thermoelectric cooling in chamber
Device (2), temperature sensor, chip of laser (7), backlight detection chip (9) and mirror lens of any of claims 1 or 2
(5), the condenser lens (504) of the mirror lens (5) is towards the flat glass (11) on pipe cap (10), the chip of laser
(7) it is directed at the plane of incidence (501) of mirror lens (5), temperature sensor is electrically connected with the control circuit of thermoelectric cooler (2).
4. laser emitter according to claim 3, it is characterised in that: the thermoelectric cooler (2) passes through golden tin solder
It is welded and fixed with the tube socket (1)；The chip of laser (7) is mounted on laser chip heat sink (6) by golden tin solder, and
It is fixed on the thermoelectric cooler (2) by heat-conducting glue.
5. laser emitter according to claim 4, it is characterised in that: the backlight detection chip (9) passes through golden soldering
Material is mounted on detection chip heat sink (8), and is welded by solder and the thermoelectric cooler (2).
6. laser emitter according to claim 4, it is characterised in that: the temperature sensor passes through solder and institute
State thermoelectric cooler (2) welding.
7. the laser emitter according to claim 3 or 6, it is characterised in that: the temperature sensor uses thermistor
(3)。
8. a kind of light emission component, it is characterised in that: have laser emitter described in claim 3~7 any one.
9. a kind of light emitting receiving unit, it is characterised in that: have laser emitter described in claim 3~7 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820108980.0U CN208283580U (en) | 2018-01-23 | 2018-01-23 | Mirror lens, laser emitter, light emission component and light emitting receiving unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820108980.0U CN208283580U (en) | 2018-01-23 | 2018-01-23 | Mirror lens, laser emitter, light emission component and light emitting receiving unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208283580U true CN208283580U (en) | 2018-12-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820108980.0U Active CN208283580U (en) | 2018-01-23 | 2018-01-23 | Mirror lens, laser emitter, light emission component and light emitting receiving unit |
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| Country | Link |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110178065A (en) * | 2019-04-11 | 2019-08-27 | 深圳市亚派光电器件有限公司 | Light emission component and preparation method thereof |
| CN113031193A (en) * | 2021-04-06 | 2021-06-25 | 桂林芯飞光电子科技有限公司 | Visual cap sealing system and cap sealing method |
| CN113534359A (en) * | 2020-04-21 | 2021-10-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021212850A1 (en) * | 2020-04-21 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113764975A (en) * | 2020-05-27 | 2021-12-07 | 山东华光光电子股份有限公司 | Human eye safety type small-size VCSEL packaging structure and manufacturing method thereof |
-
2018
- 2018-01-23 CN CN201820108980.0U patent/CN208283580U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110178065A (en) * | 2019-04-11 | 2019-08-27 | 深圳市亚派光电器件有限公司 | Light emission component and preparation method thereof |
| CN113534359A (en) * | 2020-04-21 | 2021-10-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021212850A1 (en) * | 2020-04-21 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113764975A (en) * | 2020-05-27 | 2021-12-07 | 山东华光光电子股份有限公司 | Human eye safety type small-size VCSEL packaging structure and manufacturing method thereof |
| CN113031193A (en) * | 2021-04-06 | 2021-06-25 | 桂林芯飞光电子科技有限公司 | Visual cap sealing system and cap sealing method |
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