CN208284497U - A kind of LED component, backlight lamp bar and backlight module - Google Patents

Abstract

The utility model relates to a kind of LED component, backlight lamp bar and backlight modules, it include: the bracket with cavity body structure, and contain at least one the seal member of groove structure, the upper surface of the bracket is arranged in the seal member and the groove of the seal member is opposite with the opening direction of the bracket, the enclosed construction of the bracket and seal member formation one；The bracket cavity bottom is provided with LED chip, and the bracket is internally provided with the packaging plastic for covering the LED chip；Filled with the fluorescence conversion layer for being mixed at least one fluorescence transformational substance at least one groove of the seal member.And the fluorescence conversion layer containing quantum dot fluorescent powder is arranged in the groove of seal member, so that the fluorescence conversion layer containing quantum dot fluorescent powder is not directly contacted with the LED chip that the frame bottom is arranged in, the heat affecting of heat that LED chip is issued to quantum dot fluorescence powder can be reduced, the reliability of device is improved.

Description

A kind of LED component, backlight lamp bar and backlight module

Technical field

The utility model relates to LED backlight field, in particular to a kind of LED component, and the back using above-mentioned LED component Light lamp bar and backlight module.

Background technique

In recent years, quanta point material is gradually taken seriously, and especially quantum dot fluorescence powder has spectrum with size adjustable, hair Light half-peak width, a series of unique optical properties such as Stokes shift is big, launching efficiency is high, by LED backlight industry Extensive concern.Currently, quantum dot fluorescence powder realizes that the mode of high colour gamut white light mainly has: (1) light is made in quantum dot fluorescence powder Membrane material is learned, light guide plate is filled in or is affixed in LCD screen, is excited by blue light or ultraviolet light backlight lamp bead, obtains high colour gamut White light；(2) glass tube is made in quantum dot fluorescence powder, is placed in screen side, excited, obtained by blue light or ultraviolet light backlight lamp bead Obtain high colour gamut white light.But when optical film material and glass tube is made in quantum dot fluorescence powder at present, being difficult to take into account can will both be measured Sub- dot fluorescent powder encapsulation wherein, while not influencing the luminescent properties of quantum dot fluorescent powder, and manufactured optical film material and glass again Fiting effect between glass pipe and LED lamp bead is poor, it is difficult to obtain excellent high colour gamut white light.For this purpose, have researcher's trial, Quantum dot fluorescence powder is directly packaged in LED lamp bead to obtain high colour gamut white light, but since quantum dot fluorescence powder is difficult to directly It is mixed with encapsulating silica gel, and quantum dot is easy to reunite at high temperature, causes device stability of photoluminescence poor.And the sealing effect of encapsulation The surface chemistry base of difference, quanta point material fails vulnerable to extraneous hydrogen-oxygen key effect, leads to device Photochromic Properties high progression. Therefore, the relieved package of quantum dot fluorescence powder becomes major issue in need of consideration during encapsulation quantum spot white light LED.

Summary of the invention

The purpose of the utility model is to provide a kind of LED components, so that quantum dot fluorescence bisque and LED chip be not straight Contact, the high temperature generated when can weaken chip operation have an impact the quantum dot in the fluorescence conversion layer.

In order to solve the above technical problems, the technical solution of the utility model is:

A kind of LED component characterized by comprising bracket and seal member with cavity body structure, the sealing Part includes at least one groove, and the seal member is arranged in the upper surface of the bracket, and the groove of the seal member with The opening direction of the bracket is opposite, and the bracket and the seal member form an enclosed construction；The frame bottom is set It is equipped with LED chip, the bracket is internally provided with the packaging plastic for covering the LED chip；It is filled out at least one described groove Filled with the fluorescence conversion layer for being mixed at least one fluorescence transformational substance.

Preferably, the light and excite the fluorescence transformational substance being mixed in the fluorescence conversion layer that the LED chip is issued The light of generation carries out light mixing and forms white light.

Preferably, the seal member is the Heat Conduction Material of high light transmission, and the packaging plastic is transparent high thermal conductivity layer.

Preferably, the seal member is the glass of high light transmission.

Preferably, at least one quantum dot fluorescence powder is mixed in the fluorescence conversion layer.

Preferably, the LED chip is a blue-light LED chip, and the quantum dot fluorescence powder is quantum dot green fluorescence Powder and quantum dot red fluorescence powder.

Preferably, the seal member is provided at least two grooves, fills different colours at least two groove Fluorescence transformational substance.

Preferably, one layer of thermal insulation layer is also set up between the packaging plastic and the fluorescence conversion layer.

Preferably, the bottom thickness H of the groove is 0.2mm-1mm.

A kind of backlight lamp bar, including pcb board and at least one LED described in any of the above embodiments being arranged on pcb board Device.

Preferably, the backlight lamp bar further includes optical lens, and the optical lens is solidificated on the pcb board, and position Above the LED component.

A kind of backlight module, including at least one backlight lamp bar.

A kind of LED component, backlight lamp bar and backlight module, have the following beneficial effects:

1, a kind of LED component, backlight lamp bar and backlight module provided by the utility model will have at least one groove knot The opening of the bracket is arranged in upside down in the seal member of structure, and by the fluorescence conversion layer containing quantum dot fluorescent powder It is arranged in the groove of bracket seal member, so that the fluorescence conversion layer containing quantum dot fluorescent powder and setting are in the branch The LED chip of frame bottom is not directly contacted with, intermediate alternating floor packaging plastic, can reduce heat that LED chip is issued to quantum The heat affecting of dot fluorescent powder improves the reliability of device.

2, a kind of LED component, backlight lamp bar and backlight module provided by the utility model, the bottom of the seal member can To be provided with multiple groove structures, the different fluorescence transformational substance of filling in different grooves can be to avoid between fluorescent powder It absorbs.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of one of the utility model embodiment one LED component；

Fig. 2 is a kind of structural schematic diagram of LED component of the other embodiment in the utility model embodiment one；

Fig. 3 is the structural schematic diagram of one of the utility model embodiment two LED component；

Fig. 4 is a kind of structural schematic diagram of LED component of the other embodiment in the utility model embodiment two.

Specific embodiment

It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term " including " and/or " packet Include " when, indicate existing characteristics, operation, device, component and/or their combination." top ' " lower section " includes that contact is arranged Or the case where non-contact setting.

For technology contents, the construction feature, the objects and the effects that the utility model is described in detail, below in conjunction with implementation Mode simultaneously cooperates attached drawing to be explained in detail.

Embodiment one

As depicted in figs. 1 and 2, a kind of LED component, comprising: bracket 1 and seal member 2 with cavity body structure, it is described Seal member 2 includes at least one groove 21, and the upper surface of the bracket, and the sealing is arranged in the seal member 2 The groove 21 of part is opposite with the opening direction of the bracket 1, and the bracket 1 forms an enclosed construction with the seal member 2； 1 bottom of bracket is provided with LED chip 11, and the bracket is internally provided with the packaging plastic 12 for covering the LED chip；Institute It states at least one groove filled with the fluorescence conversion layer for being mixed at least one fluorescence transformational substance.

Specific process flow is as follows:

Firstly, the LED chip 11 attachment to be arrived to the bottom of 1 cavity of bracket, then by the packaging plastic 12 with point The form of glue covers the LED chip 11.

Secondly, the fluorescence conversion layer is filled in the groove 21 of the seal member 2 in the form of for dispensing glue.

Finally the bracket 1 and the seal member 2 are bonded by adhesive glue.

It needs to be solidified after the bonding gluing knot, the mode for solidifying adhesive glue can be UV solidification, IR solidification or thermosetting Change, the solidification glue is UV solidification glue, IR solidification glue or heat-curable glue.

The bracket 1 is highly heat-conductive material, can be AlN ceramic material or metal material, the preferred AlN of the present embodiment Ceramic material.

The LED chip 11 can be using upside-down mounting or the packaged type of formal dress, and the LED chip 11 can be one can also Be it is multiple, the LED chip 11 can be the LED chip of one or two kinds of or two or more colors of random color.

The packaging plastic 12 is arranged in the cavity of the bracket 1 and covers the LED chip 11, the packaging plastic 12 It can be arranged in a manner of for dispensing glue in the cavity of the bracket 1, the preferably described packaging plastic 12 and the bracket in the present embodiment 1 opening flushes, and the packaging plastic 12 is transparent high thermal conductivity layer, the heat generated when quickly the LED chip 11 can work Amount is conducted by bracket 1, can reduce influence of the heat aggregation to LED chip and luminescent layer.

The opening of the seal member 2 and the size of the opening of the bracket 1 match, and the seal member 2 is high saturating The Heat Conduction Material of light, the present embodiment are preferably the glass of high light transmission, as shown in Figure 1, the bottom of the groove 21 of the seal member 2 Thickness H is 0.2mm-1mm, if the thickness of 21 bottom of groove of the seal member 2 is too thick to will affect light extraction efficiency, the sealing The thickness of component notches 21 is to adjust.

The fluorescence conversion layer can be encapsulated into the groove 21 of the seal member 2 by form for dispensing glue, at other It can also be encapsulated into embodiment with other techniques in the groove 21 of the seal member 2, the thickness of the fluorescence conversion layer It can be adjusted by the thickness of adjusting grooves, thus the optical color parameters such as the luminous flux of adjusting means and colour temperature.It is described glimmering The matrix of light conversion layer can be low-temperature setting adhesive (< 80 DEG C) or optic-solidified adhesive, using low-temperature setting or the form of photocuring, It can destruction to avoid the high temperature in encapsulation process to quantum dot.

At least one is mixed in the fluorescence conversion layer to heat, water vapor sensitive fluorescence transformational substance, for example, quantum dot is glimmering Light powder, red fluorination matter fluorescent powder etc., in the present embodiment, preferably comprise at least one quantum dot fluorescence powder, quantum dot is selected from By CdSe/ZnS quantum dot, InP/ZnS quantum dot, CdSeTe/ZnS quantum dot, CuInS/ZnS quantum dot, CsPbX₃Quantum dot At least one of the combination of (X=Cl, Br, I) composition, the quantum dot fluorescence powder (being abbreviated as QD) have launch wavelength continuous Controllably, the advantages that luminous efficiency is high and half-wave width, is suitable in high colour gamut backlight display field.Therefore it can be according to reality Demand adjusts the assembled scheme of fluorescent powder or fluorescent powder polymer beads.

The light and the fluorescence transformational substance being mixed in the fluorescence conversion layer is excited to generate that the LED chip 11 is issued Light carries out light mixing and forms white light.In the present embodiment, the preferably described LED chip 11 is a blue-light LED chip, and quantum dot is green Color fluorescent powder and quantum dot red fluorescence powder.The NTSC value of backlight screen can be improved in such arranging scheme, realizes high colour gamut display effect Fruit.

The seal member 2 includes at least one groove structure, as shown in Figure 1, in the present embodiment, the seal member Bottom is provided with a groove structure, and in the present embodiment, the fluorescence conversion layer containing quantum dot fluorescent powder is arranged described close It seals in the groove 21 of component 2, is not directly contacted with the LED chip 11 that 1 bottom of bracket is arranged in, intermediate alternating floor packaging plastic 12, the heat affecting of heat that LED chip is issued to quantum dot fluorescence powder can be reduced, the reliability of device can be improved.

In other embodiments, as shown in Fig. 2, in the present embodiment, the bottom of the seal member 2 can be set more A groove structure can fill identical fluorescence transformational substance in different grooves or fill different fluorescence conversion objects Matter includes the sub- dot fluorescent powder of two amounts in fluorescence conversion layer in the present embodiment, respectively red quantum dot fluorescence powder and green Quantum dot fluorescence powder, the fluorescent powder of two kinds of colors is placed in different grooves, the fluorescent powder of different colours is placed in different It, can be to avoid the absorption between fluorescent powder in groove.

Embodiment two

A kind of LED component provided in this embodiment and the device architecture in embodiment one are essentially identical, the difference is that such as Shown in Fig. 3, Fig. 4, one layer of thermal insulation layer 3 is also set up between packaging plastic 12 described in the present embodiment and the fluorescence conversion layer.

The thermal insulation layer 3 is arranged on the upper surface of the packaging plastic 12, and the preferably described thermal insulation layer 3 is silicon oxynitride (SiON) layer.Use SiON for heat-barrier material, silicon oxynitride (SiON), it is seen that 98% or more the light transmittance in light region, thermal conductivity Difference, compactness are high, and Morse hardness is up to 9H, corrosion-resistant, high temperature resistant, anti-oxidant, can by Perhydropolysilazane (PHPS, it is inorganic poly- Close object) being heating and curing is transformed.Therefore, the heat which can be effectively isolated the generation of LED chip 11 passes to the fluorescence and turns Layer is changed, the high temperature generated when weakening chip operation has an impact the quantum dot in the fluorescence conversion layer.Increase by one at heat-insulated Layer can not only play good heat insulation, but also have good translucency.

Implement three

A kind of backlight lamp bar is also disclosed in utility model, including using at least one of above-described embodiment one or implementation two LED component.Correspondingly, as backlight lamp bar one of which preferred embodiment comprising pcb board and setting are in pcb board On at least one above-mentioned LED component, the LED component is mounted on the pcb board, in other embodiments, the backlight Lamp bar also includes optical lens, and the optical lens is solidificated on the pcb board, and is located above the LED component.Further The pcb board on be provided with connecting terminal for connecting with external power supply.

A kind of backlight module is also disclosed in the utility model, including at least one above-mentioned backlight lamp bar.

A kind of LED component, backlight lamp bar and backlight module, have the following beneficial effects:

1, a kind of LED component, backlight lamp bar and backlight module provided by the utility model will have at least one groove knot The opening of the bracket is arranged in upside down in the seal member of structure, and by the fluorescence conversion layer containing quantum dot fluorescent powder It is arranged in the groove of bracket seal member, so that the fluorescence conversion layer containing quantum dot fluorescent powder and setting are in the branch The LED chip of frame bottom is not directly contacted with, intermediate alternating floor packaging plastic, can reduce heat that LED chip is issued to quantum The heat affecting of dot fluorescent powder improves the reliability of device.

2, a kind of LED component, backlight lamp bar and backlight module provided by the utility model, the bottom of the seal member can To be provided with multiple groove structures, the different fluorescence transformational substance of filling in different grooves can be to avoid between fluorescent powder It absorbs.

Claims (12)

1. a kind of LED component characterized by comprising bracket and seal member with cavity body structure, the seal member Including at least one groove, the upper surface of the bracket, and the groove of the seal member and institute is arranged in the seal member The opening direction for stating bracket is opposite, and the bracket and the seal member form an enclosed construction；The frame bottom setting There is LED chip, the bracket is internally provided with the packaging plastic for covering the LED chip；Filling at least one described groove There is the fluorescence conversion layer for being mixed at least one fluorescence transformational substance.

2. LED component according to claim 1, which is characterized in that the light that the LED chip is issued and excitation are described glimmering The light that the fluorescence transformational substance being mixed in light conversion layer generates carries out light mixing and forms white light.

3. LED component according to claim 1, which is characterized in that the seal member is the Heat Conduction Material of high light transmission, institute Stating packaging plastic is transparent high thermal conductivity layer.

4. LED component according to claim 3, which is characterized in that the seal member is the glass of high light transmission.

5. LED component according to claim 2, which is characterized in that be mixed at least one quantum in the fluorescence conversion layer Dot fluorescent powder.

6. LED component according to claim 5, which is characterized in that the LED chip is a blue-light LED chip, described Quantum dot fluorescence powder is quantum dot green emitting phosphor and quantum dot red fluorescence powder.

7. LED component according to claim 1, the seal member is provided at least two grooves, described at least two The fluorescence transformational substance of filling different colours in groove.

8. LED component according to claim 1, which is characterized in that between the packaging plastic and the fluorescence conversion layer also One layer of thermal insulation layer is set.

9. LED component according to claim 1, which is characterized in that the bottom thickness H of the groove is 0.2mm-1mm.

10. a kind of backlight lamp bar, which is characterized in that wanted including pcb board and the claim 1 being arranged on pcb board to right Seek 9 at least one described in any item LED component.

11. backlight lamp bar according to claim 10, which is characterized in that the backlight lamp bar further includes optical lens, institute It states optical lens to be solidificated on the pcb board, and is located above the LED component.

12. a kind of backlight module, which is characterized in that including claim 10 to claim 11 it is described in any item at least one Backlight lamp bar.