CN208241968U - A kind of thermal conductivity flexible circuit board plate material - Google Patents
A kind of thermal conductivity flexible circuit board plate material Download PDFInfo
- Publication number
- CN208241968U CN208241968U CN201721924185.0U CN201721924185U CN208241968U CN 208241968 U CN208241968 U CN 208241968U CN 201721924185 U CN201721924185 U CN 201721924185U CN 208241968 U CN208241968 U CN 208241968U
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- conduction silicone
- circuit board
- thermal conductivity
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model relates to thermally conductive product technical fields, more particularly to a kind of thermal conductivity flexible circuit board plate material, including copper foil layer, the second heat conduction silicone, the first glass layer and the first heat conduction silicone being successively bonded, the one side of the copper foil layer is frosting, and second heat conduction silicone is attached at the frosting.The one side of copper foil layer is frosting, attaches the second heat conduction silicone in the frosting of copper foil layer, the adhesive strength of copper foil layer and the second heat conduction silicone is improved by frosting, so that copper foil layer and the second heat conduction silicone close adhesion, improve heating conduction；First heat conduction silicone and the second heat conduction silicone have good heating conduction, and the first glass layer improves flexibility, tensile capacity and the insulation performance of the thermal conductivity flexible circuit board plate material of the utility model.
Description
Technical field
The utility model relates to thermally conductive product technical fields, and in particular to a kind of thermal conductivity flexible circuit board plate material.
Background technique
It is higher and higher to the cooling requirements of circuit element heater element with the increasingly frivolous trend of electric equipment products, and mesh
Preceding major part type circuit elements itself do not have thermally conductive function.
In order to make the operating temperature rise of power electronic devices will not be excessively high, typically now in heating device and cooling fin or metal
Heat conducting base material is added between shell surface, the flexibility of heat conducting base material, elastic characteristic can be used to cover the table of very out-of-flatness
Face, heat are transmitted on metal shell or diffuser plate from discrete device or entire circuit element, so as to improve heating electric subgroup
The efficiency and service life of part, and have the copper-based of thermally conductive function, aluminum substrate because it is rigidity, it is not able to satisfy some complicated occasions,
Such as: it is thermally conductive that circular luminaire needs circular arc type heat conducting base material to carry out.
Application No. is flexible self-adhesive heat-conduction substrate in 201210290596.4 patent of invention, is disclosed, substrate is gold
Belong to copper mesh, but this product realizes difficulty, it is at high cost, and because the rigidity of metal copper mesh greatly reduces the flexibility of substrate, insulating properties
Can be poor, line short is easily caused, a kind of improvement project is needed.
Utility model content
In order to overcome shortcoming and defect existing in the prior art, the purpose of this utility model is to provide a kind of thermally conductive soft
Property circuit board plate material, improves the flexibility and insulation performance of circuit board plate material.
The purpose of this utility model is achieved through the following technical solutions: a kind of thermal conductivity flexible circuit board plate material, including successively
The copper foil layer of fitting, the second heat conduction silicone, the first glass layer and the first heat conduction silicone, the one side of the copper foil layer are
Frosting, second heat conduction silicone are attached at the frosting.
Preferably, first heat conduction silicone is the heat conduction silicone of dopen Nano heat filling and glass fiber,
The glass fiber is uniformly distributed in the heat conduction silicone.
Preferably, the length of the glass fiber is 1-3mm, diameter 0.01-0.05mm.
Preferably, the thermal conductivity flexible circuit board plate material with a thickness of 0.1-0.4mm.
Preferably, the second glass layer is folded between first glass layer and first heat conduction silicone
With third heat conduction silicone, second glass layer be located in first heat conduction silicone and third heat conduction silicone it
Between, the third heat conduction silicone is located between first glass layer and the second glass layer.
Preferably, first glass layer and the second glass layer be it is fiberglass braided made of glass fibers
Net is tieed up, the aperture of the glass fiber mesh is 1-2mm；Second heat conduction silicone and third heat conduction silicone are that doping is received
The heat conduction silicone of rice heat filling.
Preferably, the thermal conductivity flexible circuit board plate material with a thickness of 0.25-0.5mm.
Preferably, the bottom of first heat conduction silicone is provided with release film, and the release film is fluorine plastic film.
Preferably, the surface roughness of the frosting is Ra:1~10 μm.
Preferably, the copper foil layer with a thickness of 0.018-0.1mm；The thermal coefficient of first heat conduction silicone is 1-
4W/mk, first heat conduction silicone with a thickness of 0.02-0.05mm.
The utility model has the beneficial effects that: the thermal conductivity flexible circuit board plate material of the utility model, the one side of copper foil layer
For frosting, the second heat conduction silicone is attached in the frosting of copper foil layer, copper foil layer and the second thermal conductive silicon are improved by frosting
The adhesive strength of glue-line, so that copper foil layer and the second heat conduction silicone close adhesion, improve heating conduction；First heat conduction silicone
There is good heating conduction with the second heat conduction silicone, the first glass layer improves the thermal conductivity flexible circuit of the utility model
Flexibility, tensile capacity and the insulation performance of plate plate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model embodiment 1；
Fig. 2 is the structural schematic diagram of the utility model embodiment 2.
Appended drawing reference are as follows: 1, copper foil layer；2, the first heat conduction silicone；3, release film；4, the second heat conduction silicone；5, first
Glass layer；6, third heat conduction silicone；7, the second glass layer.
Specific embodiment
For the ease of the understanding of those skilled in the art, below with reference to examples and drawings 1-2 to the utility model make into
The explanation of one step, the content that embodiment refers to not are the restriction to the utility model.
Embodiment 1
As shown in Figure 1, a kind of thermal conductivity flexible circuit board plate material, including be successively bonded copper foil layer 1, the second heat conduction silicone
4, the first glass layer 5 and the first heat conduction silicone 2, the one side of the copper foil layer 1 are frosting, second heat conductive silica gel
Layer 4 is attached at the frosting.
In actual use, on the one side etching line road surface of the non-frosted of copper foil layer 1, copper foil extra in copper foil layer 1 is removed, is remained
First heat conduction silicone 2, for welding electronic component, is affixed on cooling fin or metal-back table as circuit by remaining copper foil on one side
Face, so that the heat of circuit element is transmitted to thermal conductivity flexible circuit board plate material in time, and from thermal conductivity flexible circuit board plate material
It is transmitted to cooling fin or metal-back heat dissipation, extends the service life of circuit element.The one side of copper foil layer 1 is frosting, in copper foil
The frosting of layer 1 attaches the second heat conduction silicone 4, improves the bonding strong of copper foil layer 1 and the second heat conduction silicone 4 by frosting
Degree, so that 4 close adhesion of copper foil layer 1 and the second heat conduction silicone, improves heating conduction；First heat conduction silicone 2 and second is led
Hot layer of silica gel 4 has good heating conduction, and the first glass layer 5 improves the thermal conductivity flexible circuit board plate material of the utility model
Flexibility, tensile capacity and insulation performance.
Because first heat conduction silicone 2 and the second heat conduction silicone 4 have mobility, thermal conductive silicon during overlaying
Glue is filled into the gap of the glass fiber mesh, and the tensile capacity of the utility model can be further enhanced, meanwhile, make described
One heat conduction silicone 2 and the second heat conduction silicone 4 are bonded together, and it is thermally conductive to improve first heat conduction silicone 2 and second
The heating conduction of layer of silica gel 4.In the prior art, copper foil passes through heat conductive silica gel, copper foil and existing metal under the effect of the pressure
Copper mesh forms access, causes short circuit, seriously affects the service life of circuit element.And the tension of first glass layer 5
Performance is strong, and good insulation preformance avoids short circuit.
In the present embodiment, first heat conduction silicone 2 is the thermally conductive of dopen Nano heat filling and glass fiber
Layer of silica gel, the glass fiber are uniformly distributed in the heat conduction silicone.The nano heat-conductive filler is nano aluminum nitride
And/or nano-graphene.Preferably, the nano heat-conductive filler is nano aluminum nitride and nano-graphene, dopen Nano nitridation
The heat conductive silica gel of aluminium and nano-graphene greatly improves the thermally conductive and insulation performance of heat conductive silica gel.In other embodiments, described
First heat conduction silicone 2 can be the heat conduction silicone of dopen Nano heat filling, and glass fiber is avoided to influence heat conductive silica gel
Heating conduction.
Nano-graphene involved in the present embodiment, nano aluminum nitride and glass fiber are the prior art, herein only
Do application.
In the present embodiment, the length of the glass fiber is 1-3mm, diameter 0.01-0.05mm.Preferably, described
The length of glass fiber be 2mm, diameter 0.03mm, the glass fiber have good flexibility and insulating properties,
Elongation is big in elastic limit and tensile strength is high, absorb impact energy it is big, can be greatly improved circuit board plate material flexibility,
Tensile capacity and insulation performance.
In the present embodiment, the thermal conductivity flexible circuit board plate material with a thickness of 0.1-0.4mm.Preferably, the thermal conductivity flexible
Circuit board plate material with a thickness of 0.2mm, the thermal conductivity flexible circuit board plate material is very thin, avoids applying and accounts in small-sized electronic product
According to the big problem in space.
In the present embodiment, the bottom of first heat conduction silicone 2 is provided with release film 3, and the release film 3 is fluorine modeling
Film.The fluorine plastic film is affixed on the bottom of first heat conduction silicone 2, and purpose is first is that the impurity such as dust are adhered in order to prevent
First heat conduction silicone 2 increases the thermal resistance of the first heat conduction silicone 2, to reduce the thermally conductive effect of the first heat conduction silicone 2
Fruit；Second is that avoid influencing the first heat conduction silicone 2 from stickiness and leakproofness, influence the first heat conduction silicone 2 and cooling fin or
The compactness of metal-back, and it is unable to give full play the conductive force of the first heat conduction silicone 2；In actual use, it will be attached to described
Fluorine plastic film in first heat conduction silicone 2 is torn, and first heat conduction silicone 2 is then attached to cooling fin or metal-back i.e.
It can.
In the present embodiment, the surface roughness of the frosting is Ra:1~10 μm.Preferably, the table of the frosting
Surface roughness is Ra:5 μm, further increases the adhesive strength of copper foil layer 1 and the second heat conduction silicone 4, so that copper foil layer 1 and the
The even closer bonding of two heat conduction silicone 4, and then heating conduction is improved, and reduce the difficulty of processing of the frosting.
In this implementation power, the copper foil layer 1 with a thickness of 0.018-0.1mm；First heat conduction silicone 2 it is thermally conductive
Coefficient is 1-4W/mk, first heat conduction silicone 2 with a thickness of 0.02-0.05mm.Preferably, the thickness of the copper foil layer 1
Degree is 0.075mm；The thermal coefficient of first heat conduction silicone 2 is 2W/mk, the thickness of first heat conduction silicone 2
For 0.05mm.
Embodiment 2
As shown in Fig. 2, the present embodiment and above-described embodiment 1 the difference is that:
The second glass layer 7 and are folded between first glass layer 5 and first heat conduction silicone 2
Three heat conduction silicones 6, second glass layer 7 be located in first heat conduction silicone 2 and third heat conduction silicone 6 it
Between, the third heat conduction silicone 6 is located between first glass layer 5 and the second glass layer 7.Second glass
Fibrous layer 7 further improves flexible tension, the insulation performance of circuit board plate material.
In the present embodiment, first glass layer 5 and the second glass layer 7 are fiberglass braided form
Glass fiber mesh, be the prior art, only do application herein.The aperture of the glass fiber mesh is 1-2mm；Described second is thermally conductive
Layer of silica gel 4 and third heat conduction silicone 6 are the heat conduction silicone of dopen Nano heat filling.Preferably, the glass fibre
The aperture of net is 1mm.
Because second heat conduction silicone 4 and third heat conduction silicone 6 have stream during overlaying circuit board plate material
The heat conductive silica gel of dynamic property, second heat conduction silicone 4 and third heat conduction silicone 6 is filled to the sky of the first glass layer 5
In gap, circuit board plate material tensile property can be further enhanced, meanwhile, make second heat conduction silicone 4 and third heat conductive silica gel
Layer 6 is bonded together, and improves the heating conduction of second heat conduction silicone 4 and third heat conduction silicone 6；Similarly, second
Glass layer 7 during overlaying, the heat conductive silica gel of the third heat conduction silicone 6 and the first heat conduction silicone 2 fill to
In the gap of second glass layer 7, further enhance circuit board plate material tensile property, meanwhile, make the third thermal conductive silicon
Glue-line 6 and the first heat conduction silicone 2 are bonded together, and improve the third heat conduction silicone 6 and the first heat conduction silicone 2
Heating conduction.
In the present embodiment, the thermal conductivity flexible circuit board plate material with a thickness of 0.25-0.5mm.Preferably, with a thickness of
0.3mm。
Above-described embodiment is the preferable implementation of the utility model, and in addition to this, the utility model can be with other sides
Formula realizes that any obvious replacement is in the protection model of the utility model without departing from the concept of the premise utility
Within enclosing.
Claims (10)
1. a kind of thermal conductivity flexible circuit board plate material, it is characterised in that: including be successively bonded copper foil layer, the second heat conduction silicone,
First glass layer and the first heat conduction silicone, the one side of the copper foil layer are frosting, the second heat conduction silicone patch
Invest the frosting；First glass layer be it is fiberglass braided made of glass fiber mesh；Described first is thermally conductive
Layer of silica gel is the heat conduction silicone of dopen Nano heat filling and glass fiber；Second heat conduction silicone is dopen Nano
The heat conduction silicone of heat filling.
2. a kind of thermal conductivity flexible circuit board plate material according to claim 1, it is characterised in that: first heat conduction silicone
Glass fiber be uniformly distributed in first heat conduction silicone.
3. a kind of thermal conductivity flexible circuit board plate material according to claim 2, it is characterised in that: first heat conduction silicone
Glass fiber length be 1-3mm, diameter 0.01-0.05mm.
4. a kind of thermal conductivity flexible circuit board plate material according to claim 1, it is characterised in that: the thermal conductivity flexible circuit board
Material with a thickness of 0.1-0.4mm.
5. a kind of thermal conductivity flexible circuit board plate material according to claim 1, it is characterised in that: first glass layer
The second glass layer and third heat conduction silicone, second glass fibre are folded between first heat conduction silicone
Layer is located between first heat conduction silicone and third heat conduction silicone, and the third heat conduction silicone is located in described the
Between one glass layer and the second glass layer.
6. a kind of thermal conductivity flexible circuit board plate material according to claim 5, it is characterised in that: second glass layer
Be it is fiberglass braided made of glass fiber mesh, the aperture of second glass layer is 1-2mm；The third is thermally conductive
Layer of silica gel is the heat conduction silicone of dopen Nano heat filling.
7. a kind of thermal conductivity flexible circuit board plate material according to claim 5, it is characterised in that: the thermal conductivity flexible circuit board
Plate with a thickness of 0.25-0.5mm.
8. a kind of thermal conductivity flexible circuit board plate material according to claim 1, it is characterised in that: first heat conduction silicone
Bottom be provided with release film, the release film is fluorine plastic film.
9. a kind of thermal conductivity flexible circuit board plate material according to claim 1, it is characterised in that: the surface of the frosting is thick
Rugosity is Ra:1~10 μm.
10. a kind of thermal conductivity flexible circuit board plate material according to claim 1, it is characterised in that: the thickness of the copper foil layer
For 0.018-0.1mm；First heat conduction silicone with a thickness of 0.02-0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721924185.0U CN208241968U (en) | 2017-12-28 | 2017-12-28 | A kind of thermal conductivity flexible circuit board plate material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721924185.0U CN208241968U (en) | 2017-12-28 | 2017-12-28 | A kind of thermal conductivity flexible circuit board plate material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208241968U true CN208241968U (en) | 2018-12-14 |
Family
ID=64578653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721924185.0U Active CN208241968U (en) | 2017-12-28 | 2017-12-28 | A kind of thermal conductivity flexible circuit board plate material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208241968U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111732931A (en) * | 2020-06-29 | 2020-10-02 | 王朝鹏 | Heat-conducting adhesive silica gel |
| CN117222104A (en) * | 2023-09-28 | 2023-12-12 | 电子科技大学 | Composite medium substrate based on silicone rubber/fabric fiber and preparation method thereof |
-
2017
- 2017-12-28 CN CN201721924185.0U patent/CN208241968U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111732931A (en) * | 2020-06-29 | 2020-10-02 | 王朝鹏 | Heat-conducting adhesive silica gel |
| CN117222104A (en) * | 2023-09-28 | 2023-12-12 | 电子科技大学 | Composite medium substrate based on silicone rubber/fabric fiber and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101161735B1 (en) | Heat-radiation sheet | |
| JP2015029076A (en) | Manufacturing method of heat conductive sheet, heat conductive sheet, and heat radiation member | |
| KR20170118883A (en) | Thermal Conductive Sheet and Electronic Device | |
| CN102569223B (en) | A kind of power device insulated heat radiation structure and circuit board, power-supply device | |
| CN208241968U (en) | A kind of thermal conductivity flexible circuit board plate material | |
| CN210781834U (en) | High-heat-conductivity silicon-carbon composite buffering radiating fin | |
| CN208210413U (en) | A kind of thermal conductivity flexible board substrate | |
| JP2012004468A (en) | Method for manufacturing semiconductor module unit | |
| WO2020011045A1 (en) | Heat dissipation device | |
| CN211546404U (en) | Heat conduction silica gel sheet | |
| WO2010004662A1 (en) | Heat dissipation sheet and process for producing heat dissipation sheet | |
| CN201541414U (en) | Heat sink device | |
| CN114126326A (en) | Thermal pad, method for manufacturing the same, electronic device, and electronic apparatus | |
| CN206562400U (en) | A kind of CPU heat transmissions heat conduction foam pad | |
| CN113395875B (en) | Heat conducting component | |
| CN108384478A (en) | A kind of heat dissipation double faced adhesive tape | |
| CN209602442U (en) | Heat conductive silica gel laminated film | |
| CN217398806U (en) | High-heat-conductivity, insulating and tough double-sided adhesive tape | |
| CN210900117U (en) | High-voltage insulation heat-conducting silica gel sheet | |
| CN219752212U (en) | Composite heat-conducting silica gel pad | |
| CN212064711U (en) | Heat dissipation circuit board and display device | |
| CN211597119U (en) | Combined type heat conduction gasket with protective action | |
| CN219165040U (en) | Multilayer composite heat-conducting silica gel sheet | |
| CN209824292U (en) | High heat conduction heat dissipation graphite flake | |
| CN220156926U (en) | Multilayer composite heat conduction gasket |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |